Umatshini wokuhlola we-SAKI 3D spi smt solder 3Si-MS2

I-SAKI 3Si-MS2 yinkqubo yokuhlola i-solder ye-3D ephezulu echanekileyo eyenzelwe imigca yemveliso ye-SMT yanamhlanje. Isebenzisa iteknoloji ye-imaging ye-3D ye-multi-spectral ukuze ibone ngokuzenzekelayo umthamo, ukuphakama, kunye nokumila kwe-solder paste emva kokuprinta naphambi kwe-SMT, ukukhusela ngokufanelekileyo iziphene ze-soldering kunye nokuphucula isivuno sokudlula (FPY). Isetyenziswa ikakhulu kulawulo lwenkqubo yomgangatho weePCB eziphezulu ezinje ngeebhodi zomama zefowuni ephathwayo, ii-elektroniki zemoto, kunye neeseva.

2. Umgaqo weteknoloji engundoqo

📌 Itekhnoloji yokucinga ye-3D

Ukusebenzisa i-laser triangulation + imo ebonisa ukukhanya okucwangcisiweyo kabini:

Ukuskena ngeLaser (Laser Triangulation)

Umgca we-laser ochanekileyo ochanekileyo uhlola indawo yokunamathisela i-solder, ibamba ukukhanya okubonakalisiweyo ngekhamera yeCCD, kwaye ibala i-Z-axis data yobude.

Ukuchaneka kwe-±1.5μm (i-axis ye-Z), ilungele i-ultra-fine pitch components (01005)

Intelekelelo yokukhanya okucwangcisiweyo (Isibane esicwangcisiweyo)

Intelekelelo yokukhanya kwemigca emininzi, iphucula isakhono sokubuyisela ikhonto ye3D yeepads ezintsonkothileyo (ezifana neBGA, QFN)

Sombulula ingxaki "yesithunzi" sokuskena ngelaser kwincam engumnqantsa

📌 Inkqubo yokufumanisa ngobukrelekrele

Ukubekwa kwe-PCB → ukuskena okubonakalayo okuninzi → imodeli ye-3D → uhlalutyo lwesiphene se-AI → ingxelo yedatha ye-SPC

3. Iimpawu zokusebenza ezingundoqo

🔹 1. Ubhaqo olupheleleyo lweparameter yesolder

Izinto zokukhangela Ukuchaneka komlinganiselo Ukubaluleka kwenkqubo

Umthamo (Umthamo) ±3% Qinisekisa inkonkxa eyaneleyo ukunqanda ukusoda okubandayo okanye inkonkxa eyaneleyo

Ubude (Ubude) ± 1.5μm Lawula i-solder paste ukudilika kwaye uthintele ibhulorho

Ummandla: ± 5μm Chonga ioffset yoshicilelo okanye ukuvaleka kwestensile

Ubume: Uthelekiso lwecontour ye-3D Khangela iziphene zokubumba ezifana nencam yokutsala kunye nokudakumba

🔹 2. Izakhono zokubona iziphene ezikwinqanaba eliphezulu

Ujongo lwesiphene oluqhelekileyo:

✅ Ukuncamathisela okungonelanga

✅ Ukudibanisa

✅ Ukungalungelelanisi kakuhle

✅ Ukucotha/ukuncipha

✅ Ungcoliseko lweStencil

Ukubona indawo eyodwa:

✔ Imbuyekezo yomahluko wokutyeba kwistencil

✔ Incama yesolder yokuchongwa kwengcebiso yepitch entle ye-QFN

🔹 3. Uhlalutyo lwedatha ekrelekrele

Ulawulo lwangempela lwe-SPC: Ukuvelisa ngokuzenzekelayo iingxelo ze-CPK/PPK ukujonga ukuzinza kwenkqubo yokushicilela

Impendulo evaliweyo: Lungisa ngokuzenzekelayo iiparamitha zomshicileli (ezifana noxinzelelo lwe-scraper kunye nesantya)

4. Iinkcukacha ze-Hardware kunye noqwalaselo

📌 Inkqubo yokubona

Iiparamitha zaMacandelo

Umthombo weLaser 650nm i-laser ebomvu, i-scan frequency 20kHz

Ukukhanya okucwangcisiweyo okubonakalayo okuBlue LED ukukhanya komgca, isisombululo 5μm

Ikhamera ye-5 yezigidi ze-pixel enesantya esiphezulu se-CMOS, isantya sefreyimu ye-120fps

Inkqubo yomthombo wokukhanya Iringi ye-LED + indibaniselwano yokukhanya kwe-coaxial, iindlela ezi-8 zokukhanyisa ezilungelelanisiweyo

📌 Ukusebenza koomatshini

IiNkcazo zeProjekthi

Isantya sokubona Ubuninzi 45cm²/s (imowudi enesantya esiphezulu)

PCB ubukhulu uluhlu 50mm×50mm ~ 510mm×460mm

Ubuncinci bento yokubona 01005 (0.4mm×0.2mm)

Phinda ukuchaneka X / Y: ± 3μm, Z: ± 1.5μm

Inkqubo eshukumayo Ukuqina okuphezulu kwe-motor linear, i-acceleration 1.5G

📌 Iqonga lesoftware

Inkqubo yokusebenza ye-SAKI VisionPro

Ujongano lwenkqubo yomzobo, inkxaso yokulinganisa ngaphandle kweintanethi (OLP)

Umsebenzi wokuzifundela we-AI: ukulungelelaniswa okuzenzekelayo kokubona umda

Ifomathi yemveliso yengxelo: PDF/Excel, inkxaso yeetemplates zesiko

5. Iinzuzo eziphambili zemveliso

✅ Ibhalansi yokuchaneka kunye nesantya

Ukuchaneka kwe-Z-axis ± 1.5μm, ngelixa igcina isantya sokubhaqa se-45cm²/s, i-20% ngokukhawuleza kunezixhobo ezifanayo.

Ukutshintsha okuzenzekelayo kweendlela ezimbini zokuskena (i-laser + ukukhanya okucwangcisiweyo), kuthathelwa ingqalelo zombini ukusebenza kakuhle kunye nokuchaneka.

✅ Iqondo eliphezulu lobukrelekrele

I-algorithm yokufunda nzulu: ukuhlelwa ngokuzenzekelayo kweentlobo zesiphene, izinga le-alamu yobuxoki <2%

Ukukhanya okuguquguqukayo: phelisa umbala we-PCB / ukuphazamiseka okubonakalayo

6. Iimeko zesicelo eziqhelekileyo

📱 Ii-elektroniki zabathengi

I-motherboard yefowuni ephathwayo: ukufunyanwa kwe-solder paste yoshicilelo lwe-0.3mm pitch izixhobo ze-CSP

Ibhokisi yokutshaja i-earphone ye-TWS: ulawulo lwevolyum yeepads ezincinci (0.2mm ubukhulu)

🚗 Iimoto ze-elektroniki

Imodyuli ye-ADAS: qinisekisa izinga lokuzaliswa kwe-solder ye-BGA> 90% (ihambelana ne-IPC Class 3)

Umboniso ongaphakathi kwemoto: ibhodi ye-FPC eguquguqukayo yokuhlola umgangatho wokushicilela

🖥️ Izixhobo zemizi-mveliso

I-socket ye-CPU yeseva: ukufunyanwa kwe-coplanarity yeepads ezinkulu

Imodyuli ye-PA yesiseko se-5G: i-solder paste yokulawula ukubunjwa kwezinto eziphezulu ze-frequency

7. Izinto eziluncedo xa kuthelekiswa neemveliso ezikhuphisanayo

Dimension SAKI 3Si-MS2 eqhelekileyo 3D SPI 2D SPI

Itekhnoloji yokufumanisa I-Laser + imo ecwangcisiweyo yokukhanya kabini Ukuskena kwelaser enye Imeyikiso yePlanethi kuphela

Ukuchaneka kwe-Z-axis ± 1.5μm ± 3 ~ 5μm Ayikwazi ukulinganisa

Isantya yi-45cm²/s Ngokwesiqhelo yi-30 ~ 35cm²/s Ngokukhawuleza kodwa kunomda kumsebenzi

Ukuqondwa kwesiphene Ukuhlelwa kwe-AI ye-20+ iziphene I-algorithm esisiseko (iintlobo ezi-5-10) Uhlalutyo lwekhonto kuphela

8. Isishwankathelo

I-SAKI 3Si-MS2 ibonelela ngemveliso ye-SMT yoxinaniso oluphezulu kunye ne-multi-spectral ye-3D yokucinga + uhlalutyo lobukrelekrele be-AI:

Uthintelo lwenkqubo: thintela ngaphezu kwe-95% yeziphene ze-solder paste ngaphambi kokupakisha

Ukuxhotyiswa kwedatha: i-SPC yexesha langempela iqhuba inkqubo yoshicilelo

Ukulungelelaniswa okuguquguqukayo: ubhaqo olupheleleyo lokugubungela ukusuka kwi-01005 ukuya kwi-BGA enkulu