ASM SIPLACE isixhobo sokubeka imephu yomatshini 03076118

Umatshini wokubekwa kwe-ASM Isixhobo se-MAPPING sisixhobo sesoftware esiphuhliswe ngokukodwa kwi-ASM (Assembléon/Siemens) uchungechunge lwezixhobo zokubeka umphezulu, ezisetyenziselwa ukubeka ngokuchanekileyo kunye nokulinganisa izikhundla zokubekwa kwamacandelo. Esi sixhobo sisebenzisa iteknoloji yokulungiswa kwemifanekiso echanekileyo ukufezekisa imephu echanekileyo yeebhodi zePCB, amacandelo kunye nezikhundla zokubeka, ukuqinisekisa ukuba umatshini wokubeka unokubeka ngokuchanekileyo amacandelo kwindawo eyilelwe.

2. Imisebenzi engundoqo

Inqaku lokukhangela kunye nokulungelelaniswa

Chonga ngokuzenzekelayo iFiducial kwi-PCB Mark (indawo yereferensi)

Buyekeza ukutenxa kwisikhundla ngexesha lokwenziwa kwePCB kunye nokubamba

Ixhasa ukuchongwa kweemilo zeengongoma ezininzi kunye nemathiriyeli

Imephu yendawo yecandelo

Ukuchongwa okuchanekileyo okuphezulu kwendawo yecandelo kwi-feeder

Buyekeza ukutenxa kwindawo yofakelo lwefeeder

Chonga icandelo polarity icala

Ukunyuswa kokulungiswa kwendawo

Lungisa ngamandla ulungelelwaniso lokuxhoma ngokwendawo yokwenyani yePCB

Buyekeza impazamo yendawo ebangelwa yi-PCB deformation thermal

Umsebenzi wokulungisa ozimeleyo wepaneli ezininzi

Imephu yobude be-3D

Umlinganiselo wobude becandelo kunye nembuyekezo

PCB warpage ukubhaqwa kunye nembuyekezo

Umlinganiselo wokuncamathisela kwi-Solder (ezinye iimodeli eziphambili)

III. Iimpawu zobugcisa

Inkqubo yokubonwa echanekileyo ephezulu

Ukusebenzisa ikhamera yeCCD enesisombululo esiphezulu (idla ngokuba yi-5-20μm isisombululo)

Inkqubo yokukhanyisa izibane ezininzi (ukukhanya kwe-coaxial, ukukhanya okusecaleni, ukukhanya kweringi, njl.

I-algorithm yokwenziwa kwemifanekiso ekwinqanaba eliphezulu

Intelligent imbuyekezo algorithm

Imbuyekezo yehlabathi ngokusekwe kwindlela yezikwere ezincinci

Itekhnoloji yembuyekezo yendawo yendawo

Imbuyekezo yeTemperature Drift

Ukukwazi ukusebenza ngokufanelekileyo

Xhasa ukusetyenzwa ngokuhambelana kweekhamera ezininzi

Itekhnoloji yokulinganisa ngokukhawuleza (<1 isibini/inqaku)

Isakhono esikhulu sokucwangcisa idatha (ixhasa inani elikhulu leePCB ezinephaneli)

IV. Ukuhamba komsebenzi

Ukulungiselela kwangaphambili

Ngenisa iifayile zoyilo zeGerber/PCB

Cwangcisa iiparamitha zendawo yereferensi

Chaza ummandla wemephu kunye neemfuno zokuchaneka

Inkqubo yokwenza imaphu ezenzekelayo

Ukuskena indawo yesalathiso ye-PCB yehlabathi

Indawo yesalathiso yendawo echanekileyo

Ukufumana indawo yecandelo

Uhlalutyo lwedatha kunye nokubalwa kwembuyekezo

Ukuqinisekiswa kwesiphumo

Ukulinganisa kokubeka okubonakalayo

Ukuqinisekiswa kweqhekeza lokuqala

Idatha yembuyekezo ephuma kumatshini wokubekwa

V. Iinzuzo zesicelo

Ukuphucula ukuchaneka kokubekwa

Inokuphucula ukuchaneka kokubeka nge-30-50%

Ukunciphisa iingxaki ezisemgangathweni ezibangelwa kukutenxa kwindawo

Ukuphucula ukusebenza kakuhle kwemveliso

Nciphisa ixesha lokulungisa ngesandla

Nciphisa izinga lokungaphumeleli kweqhekeza lokuqala

Inkxaso yokutshintsha komgca okhawulezayo

Ukuphucula amandla enkqubo

Xhasa amacandelo epitch ye-ultra-fine (01005, 0.3mm BGA, njl.)

Lungisa kuyilo lwePCB yoxinaniso oluphezulu

Phatha iibhodi eziguquguqukayo kunye neebhodi ezikhethekileyo

Ukunciphisa iindleko zemveliso

Nciphisa inkcitho yezinto eziphathekayo

Ukunciphisa izinga lokusebenza kwakhona

Yandisa ubomi bezixhobo

VI. Iimeko zosetyenziso oluqhelekileyo

Iimveliso ze-elektroniki ezichanekileyo

Ifowuni ephathwayo, i-motherboard yethebhulethi

Izixhobo ezinxitywayo

Ibhodi ye-High-density interconnect (HDI).

Ibhetshi encinci yemveliso eyahlukeneyo

Umbane we-aerospace

Izixhobo zonyango

Iimoto ze-elektroniki

Iimfuno zenkqubo eyodwa

Inkqubo yokuzalisa ezantsi

Iphakheji ye-3D yokupakisha

Ukubekwa kwecandelo elimilise okweSepcial

VII. Iimodeli eziphambili kwiimarike

ASM SIPLACE series izixhobo ezixhasayo

SIPLACE IMAPphu ePro

NDIYAYITHANDA

SIPLACE 3D IMAPING

Izixhobo zophuhliso lomntu wesithathu

I-CAMALOT YOMPHAKATHI Suite

Inkqubo yeNgcali yokuMaphu ye-SMT

Viscom iMap Series

VIII. IiNdlela zoPhuhliso lwexesha elizayo

I-AI Technology Integration

Imbuyekezo eLungisayo eSekelwe kwiMfundo eNzulu

Intelligent Isiphene Prediction

Ukuzilungiselela Izicwangciso zeParameter

Umzi-mveliso 4.0 Umanyano

Ukudityaniswa okunzulu kunye neNkqubo ye-MES

Uhlalutyo lwedatha yefu kunye nokuPhuculwa

Ukusetyenziswa kweDigital Twin Technology

Multi-Function Integration

Idityaniswe ne-SPI kunye neMisebenzi ye-AOI

Imbuyekezo yexesha elililo kwi-Intanethi

Umsebenzi woLondolozo oluqikelelweyo

Njengenkqubo engundoqo yokuncedisa kwimveliso ye-SMT yanamhlanje, i-ASM yokubeka umatshini we-MAPPING isixhobo iphuhlisa ukusuka kwisixhobo esilula sokumisa kunye nokulinganisa kwisisombululo esibanzi sokudibanisa ukubeka iliso komgangatho, ukuphuculwa kwenkqubo kunye nokulawulwa kwemveliso, ukubonelela ngenkxaso ebalulekileyo yobugcisa ekuphuhliseni ishishini lokuvelisa i-elektroniki ngokubhekiselele kwingqiqo kunye nokuguquguquka.