What are the core technological upgrades of the K&S ICONN PLUS over the legacy ICONN model?

The K&S ICONN PLUS integrates advanced ProX loop control software and upgraded XY voice-coil motor drivers. This configuration dramatically improves fine-pitch bonding resolution down to ultra-fine pitch limits, providing superior looping consistency for low-loop profiles compared to standard legacy ICONN platforms.

Does the refurbished K&S ICONN PLUS fully support low-cost copper (Cu) and silver (Ag) wire bonding?

Yes, the ICONN PLUS platform features specialized gas delivery hardware and advanced ultrasonic power grid calibrations optimized for high-reliability Copper (Cu) and Silver (Ag) wire processes, alongside standard Gold (Au) ball bonding applications.

What engineering inspection protocols are executed before shipping a used K&S wire bonder?

Every refurbished K&S wire bonding machine undergoes cross-axis calibration, ultrasonic transducer impedance analysis, pattern recognition system (PRS) optical calibration, and a continuous dry-run bonding loop test to ensure OEM positioning accuracy standards.

What parameters should semiconductor packaging lines provide when requesting an ICONN PLUS quotation?

Buyers should submit their target package type (e.g., QFN, BGA, Leadframe), preferred wire material and diameter range (e.g., 0.8 mil to 2.0 mil), specific indexer handling configurations, destination country, and voltage layout configurations.

I-K&S ICONN PLUS Wire Bonder

I-K&S ICONN PLUS ngumatshini wokubopha ibhola we-thermo-sonic ozenzekelayo ngokupheleleyo osetyenziswa kwiinkqubo zokupakisha ze-semiconductor zokudibanisa iingcingo kwiisekethe ezidibeneyo. Yenzelwe usetyenziso lwe-fine-pitch bonding kwaye ixhasa ii-leadframes ze-IC ezinoxinano oluphezulu ezisetyenziswa kwi-advanced microelectronic assembly.

Lo matshini usetyenziswa kakhulu kwiindawo zokwenza ii-semiconductor apho kufuneka khona i-wire bonding echanekileyo kwizixhobo ze-IC, ii-power semiconductors, ii-sensors, kunye nezinye izinto ze-microelectronic. Uxhasa igolide kunye nobhedu.ukubopha ucingokuxhomekeke kulungiselelo lwenkqubo kunye nokuseta izixhobo.

I-K&S ICONN PLUS liqonga le-K&S wire bonder elenzelwe iinkqubo zokubopha iintambo ngokuzenzekelayo kwiindawo zemveliso ezinomthamo omkhulu.

I-K&S ICONN PLUS Ibhondi yeBhola eZenzekelayo Ukubopha iFine Pitch Wire Ukufunyanwa kwezinto okuhlaziyiweyo

Cela iKoteshini ekhawulezileyo

K&S ICONN PLUS automatic semiconductor wire bonder layout

Uluhlu lwempahla oluqinisekisiweyo olusele lunabanikazi

Imodeli: Kulicke kunye neSoffa ICONN PLUS | Imeko: Iyasebenza / Ilungele Izixhobo Ezilungiselelwe Wena

Uzinzo lweMveliso enomthamo ophezulu

Izisombululo ze-K&S ICONN PLUS Sourcing eziPhambili

IUmatshini wokubopha ucingo we-K&S ICONN PLUSImele njengomgangatho weshishini lokunxibelelana kweentambo ze-microelectronic ezikhawulezayo. Le platifomu yenziwe yiKulicke & Soffa, inika ukuchaneka okuchanekileyo kokubekwa kwe-XY kunye nokuhambelana okugqithisileyo, okwenza ukuba ibe yinto eqhelekileyo kuzo zonke izibonelelo ze-OSAT zehlabathi kwisekethe edibeneyo (IC) kunye nokwandiswa kwemveliso ye-optoelectronic.

Ukufumana i-K&S ICONN PLUS wire bonder evuselelweyo neqinisekisiweyo kwenza ukuba imigca yokuhlanganisa ikwazi ukukhulisa umthamo ngokukhawuleza, iphathe iinkcukacha ze-alloy yentsimbi ye-copper (Cu) okanye yesilivere (Ag) ethambileyo, kwaye idlule amaxesha amade okwenziwa ngumvelisi ngelixa iqinisekisa imbuyekezo ephuculweyo kutyalo-mali (ROI).

Iingenelo zoBunjineli obuPhambili

Uphuculo lweNkqubo yeProX:Ii-algorithms ze-looping eziphuculweyo zivumela uqwalaselo lweendlela zesakhiwo kwiipateni ze-matrix ze-substrate ezixineneyo, ezicolekileyo kakhulu.
Ucingo lweCopper kunye neSilver olukwaziyo:Ixhotyiswe ngeenkqubo ezingqongqo zokuhambisa umbane ezijongene negesi egqumayo ukuthintela i-oxidation ngexesha lokwenziwa kwebhola yobhedu.
Umlinganiselo weCapEx osezantsi:Fumana itekhnoloji yokuhlanganisa i-backend semiconductor eyaziwayo ngexabiso eliphantsi kakhulu kunelifunekayo koomatshini abatsha.
I-Ecosystem yeeSpares ezitshintshiselanayo:Ingena ngokulula kwiindawo zokupakisha ezisebenzayo esele ziqhuba i-K&S ICONN okanye i-Maxμm footprints endala, nto leyo enciphisa iindleko zoqeqesho kwakhona lomqhubi.

Ukuhlanganiswa Okulungele Imveliso

Khulisa iMvuno yeBonding ngamaQonga aQinisekisiweyo

Ukufumana izixhobo ze-semiconductor zangasemva kufuna uxanduva olucacileyo loomatshini. Sinciphisa ukungqubana kwekhonkco lokubonelela ngokwenza uvavanyo lombane olunezigaba ezininzi, olusebenzisa umoya, kunye nolwendawo kuzo zonke iimodyuli ze-K&S bonding, ukuqinisekisa ukuhlanganiswa kwegumbi lokucoca ngaphandle kobunzima xa kufika.

Ukubopha iibhola ezisemgangathweni kwishishini

Yakhelwe phezu kohlobo oluphambili lwesakhiwo sikaKulicke & Soffa, i-ICONN PLUS wire bonder inika ukuqina koomatshini kunye nolawulo lwe-transducer olufunekayo kwiimatrices ze-leadframe ezibukhali kakhulu.

Ukuzenzekelayo okuphezulu kwe-UPH

Susa imida yokusebenza kwabantu. Isoftware yokubeka umbono ephucukileyo ihlaziya iireferensi zokulungelelanisa ngexesha langempela, inyusa ii-indexes zeeyunithi ngeyure (UPH) kunye nobuchule bomgca.

Ukhuseleko lweDynamic CapEx

Ziphephe iimali eziphezulu zokufumana izinto ezivela kwifektri kunye neenketho zamaxabiso abiza kakhulu. Ukukhangela izixhobo ezivuselelweyo eziqinisekisiweyo kuvumela iinkampani zokupakisha ukuba zifumane ngokukhawuleza iibhidi zeprojekthi entsha yokuvelisa.

Ukudibanisa ngokuthe ngqo igumbi lokucoca

Igcina isoftware epheleleyo, ukuloga idatha, kunye nokuhambelana kwamacandelo kwiigridi zokupakisha ezikhoyo. Abaqhubi benza utshintsho ngaphandle kokuphazamiseka kwemveliso.

Detailed close-up of K&S ICONN PLUS wire bonder capillary assembly

Amandla okuPakisha aSebenza ngeendlela ezahlukeneyo

Iiprofayili zeSicelo seMicroelectronic esijolise kwiTarget

Ngenxa yesisombululo sayo sempendulo esiphezulu kunye neprofayili yamandla ecwangcisiweyo, i-ICONN PLUS iyakwazi ukuziqhelanisa ngokufanelekileyo kwiimatrices ezahlukeneyo ezintsonkothileyo ze-encapsulation. Sinceda abathengi ekuqinisekiseni uyilo lwe-clamp oluqhelekileyo, iintlobo ze-indexer, kunye neeparameter zobungakanani be-heat-block ngaphambi kokuba kusetyenziswe izinto zokuthumela ngaphandle.

Iindibano zeLeadframe zeSekethe eDibeneyo ePhakamileyo (IC)
I-Advanced Fine-Pitch Optoelectronic kunye ne-LED Matrix Encapsulation
Iimodyuli zeMveliso yeCandelo eliDiscrete kunye neNkqubo-kwi-Package (SiP)
IiSensors zeMEMS kunye noHlanganiso lweBhodi yeMicroelectronic yezonyango
Iiyunithi zezixhobo zokuLungisa umgca wegumbi lokucoca kunye nezixhobo ezingasetyenziswanga

Iimpawu zoMgangatho woBugcisa

Ukufunyanwa kwezixhobo zoBuchule kunye noQinisekiso loBugcisa

Sigxile ekuqinisekiseni oomatshini be-backend semiconductor kunye ne-logistics yamazwe ngamazwe. Kuyo yonke imibuzo ye-K&S ICONN PLUS, sigxile ekuboneleleni ngokusobala ngokupheleleyo kwesimo somzimba kunye nokulungelelaniswa koqwalaselo lwezixhobo.

01Ukuphindaphinda okungqongqo kwe-axis kunye nokuhlolwa kwe-transducer yamanqaku amaninzi

02Iifoto ezipheleleyo zoomatshini bomzimba kunye neevidiyo ezisetyenziswa ngokumileyo

03Ukulungiswa kwezixhobo ngokwezifiso kunye neengxoxo zokulungisa iipleyiti ze-clamp

04Iibhokisi zokuthumela ngaphandle ezivaliweyo nezinomoya omninzi kunye ne-inshurensi yezothutho lwamazwe ngamazwe

Ukufunyanwa Okucwangcisiweyo

Umbhobho wokwenza uphando kubaphathi beMithombo

Ukuze ukhawulezise ukuqinisekiswa kunye nemisebenzi yokufanisa, nceda ucacise iintlobo ze-alloy ojolise kuzo kunye nejometri zephakheji yemveliso xa uqalisa umbuzo wakho wezixhobo.

Ngenisa iJiyomethri

Chaza iphimbo le-leadframe ojolise kuyo, iinkcukacha zezinto zentambo, kunye neempawu zomthamo.

Ukumaphuza Umthombo

Iqela lethu liqinisekisa ukufumaneka kweendawo zokugcina impahla ezisebenzayo, uhlobo lwakudala loomatshini, kunye nokuhambelana kweenketho.

Ukuqinisekiswa koPhicotho

Hlaziya iividiyo ezipheleleyo zokuxilonga, ii-matrices ze-optical, kunye noluhlu loqwalaselo.

Thumela ngaphandle

Iibhokisi zokhuni ezikhuselekileyo ezenziwe ngokwezifiso, ii-vacuum wraps ezithintela ukufuma, kunye ne-global port logistics routing.

Uthelekiso lweZakhiwo

Iiplatfomu ze-K&S ICONN PLUS vs. Legacy K&S ICONN

Ngelixa iqonga eliqhelekileyo le-ICONN liseka ukuhambelana kwesiseko se-thermosonic ball bonding,Ibhondi yentambo ye-K&S ICONN PLUSizisa uphuculo oluyilwe ngobunjineli kumanyathelo okubeka i-XY kunye nempendulo yamandla e-ultrasonic. Ukuhlanganiswa kokuphathwa kwe-ProX loop ephucukileyo kuvumela izixhobo zokupakisha ukuba zisebenzise ububanzi be-wire obuncinci ngokukhuselekileyo ngesantya esiphezulu ngaphandle kokunciphisa imigca yemveliso eqhubekayo.

IiMetriki zoBunjineli	I-ICONN eqhelekileyo ye-K&S	I-K&S ICONN PLUS ephuculweyo
Imvulophu yeNkqubo	Ii-arrays zokupakisha ze-IC eziqhelekileyo	Iifreyimu ze-lead eziphucukileyo nezixineneyo
Ukubeka Isisombululo seDrive	Ukulandelela impendulo yesiseko se-servo	Imephu yokuchaneka kwekhoyili yelizwi ye-sub-micron
Iprofayili ye-Wire Alloy	Yenzelwe ikakhulu intambo yeGolide (Au)	Uqwalaselo oluphambili lweCopper (Cu) kunye neSilver (Ag)
I-Looping Software Matrix	Iiphakheji zoqwalaselo oluqhelekileyo lwe-looping	Uyilo lweprofayili ye-ProX high-density multi-bend loop

Iinkcukacha zoBunjineli

Iiparamitha zoMatshini woQhagamshelo lweeNtambo ze-K&S ICONN PLUS

Ngenxa yokuba iipakethe zokhetho ezibonakalayo zitshintsha ubukhulu bofakelo kunye neemetrikhi zobonelelo lomoya, qinisekisa ukuba iiparameter zokuhambelana noqwalaselo ziyahambelana ngaphambi kokuthunyelwa ngokusesikweni kweekhreyithi.

Inkqubo yoQhagamshelo oluPhambili Injini yokubopha ibhola ye-thermo-sonic ezenzekelayo ngokupheleleyo yenziwe ngee-sensors ezidibeneyo zempendulo yamandla kwiimatrices zokupakisha ezithambileyo.

Ukuziqhelanisa ne-alloy Ilinganiswe ukuze ikwazi ukucubungula iGolide (Au) ephucukileyo, iCopper (Cu) ethembekileyo kakhulu, kunye neengcingo zeSilver (Ag) ezikhethekileyo ngaphandle kokuphazamiseka.

Uluhlu loMda woMda wePitch Iyakwazi ukwenza iiprofayili zebhondi yepitch ecolekileyo kakhulu ukuya kwi-chip-on-film ecolekileyo (i-COF) kunye neenkcazo zefreyimu ye-leadframe enoxinano oluphezulu.

Iinkqubo zokuphatha izinto Ixhasa iifreyimu ezahlukeneyo zomthwalo wesandla okanye ii-indexers ezizenzekelayo zemodyuli ngokuxhomekeke kwiimfuno zokutshintshwa kwelothi.

Ulawulo loHlaziyo Yonke imashini ivavanywa ngamanqaku amaninzi, ijongwa ukuvuza kwenkqubo ye-vacuum, kunye nokulinganisa okuqhubekayo kwe-loop.

Ukhuseleko lwezoThutho Ihanjiswa kwiipakethe zomthi ezihambelana ne-ISPM-15 zamazwe ngamazwe kunye neendlela zokukhusela umhlwa ukuze uhambo olukhuselekileyo lolwandle luhambe ngendlela ekhuselekileyo.

Ukufikelela Ngokuthe Tye Kwimithombo

Ngaba ujonge i-K&S ICONN PLUS Wire Bonder ethembekileyo?

Nxibelelana neqela lethu lobuchwephesha ngeenkcukacha zakho zephakheji kunye nendawo ekujoliswe kuyo ukuze ufumane iingxelo zokufumaneka kwesitokhwe kunye noluhlu olucacileyo lwamaxabiso.

Nxibelelana neNgcali yoNcedo

Imibuzo Ebuzwa Rhoqo yoBugcisa

Imibuzo Ebuzwa Rhoqo Malunga ne-K&S ICONN PLUS Sourcing

Iyintoni inzuzo yenkqubo ye-ProX looping kwi-K&S ICONN PLUS?

Inkqubo yeProX ibonelela ngeendlela zokusebenzisa iingcingo ezilawulwa yisoftware eziphambili. Oku kuvumela iinjineli zokupakisha ukuba ziyile iimilo ze-loop eziphantsi kakhulu kunye neengcingo ezigobileyo ezininzi ezinozinzo oluphezulu loomatshini, nto leyo ethintela ukugoba kweengcingo okanye iishothi kwiipakethe ze-IC ezininzi ezifinyeziweyo.

Umatshini uphatha njani i-wire oxidation ngexesha lokubopha i-copper (Cu) wire?

Uqwalaselo lwe-K&S ICONN PLUS wire bonder luquka inkqubo ekhethekileyo yokuhambisa igesi eyenza indawo yokukhusela (esebenzisa igesi yokwenza) ejikeleze i-capillary. Oku kuthintela i-oxygen engqongileyo ukuba ingabangela i-copper ball oxidation ngexesha lenkqubo ye-electronic flame-off (EFO).

Ngaba umgca wemveliso osebenzayo unokudibanisa iinxalenye ze-spare phakathi kweeyunithi eziqhelekileyo ze-ICONN kunye ne-ICONN PLUS?

Nangona itshasi yoomatshini kunye nolwakhiwo oluphambili lwabelana ngemilinganiselo efanayo, izinto ezininzi ze-elektroniki zangaphakathi, iziqhoboshelo ze-matrix yekhamera, kunye neemodyuli zomqhubi webhodi ephambili zikhethekile kwiqonga le-ICONN PLUS. Nceda ujonge uluhlu lokuhambelana nabasebenzi bethu bobuchwephesha.

Zithini iimfuno ezibalulekileyo ze-CDA kunye nombane wokufakelwa kwegumbi lokucoca?

Esi sixhobo sifuna amandla ombane azinzileyo kunye nemigca yomoya ococekileyo (CDA) ecocekileyo kakhulu enolawulo loxinzelelo oluqhubekayo lomoya. Utshintsho olungaphantsi kweenkcukacha zomenzi lunokubangela iimpazamo kwimigca yesensa ye-vacuum sensor ye-bond-head, nto leyo ebangela iimpazamo zokuthathwa okanye ukuphinda kuhlolwe indawo.

Isango le-RFQ

Cela isicatshulwa sobunjineli se-K&S ICONN PLUS

Ngenisa iinkcukacha zakho zokuvelisa apha ngezantsi. Iqela lethu lokufumana izixhobo ze-semiconductor liza kujonga ukufumaneka kwendawo yokugcina izinto ephilayo, ukuhambelana koqwalaselo, kunye nemida yamaxabiso ezinto ukuze liphendule zingadlulanga iiyure ezili-12 zokusebenza.

I-K&S ICONN PLUS esetyenzisiweyo neqinisekisiweyo ehlaziyiweyo
Inkxaso yokuthunga i-Custom Indexer kunye ne-Clamp Plate
Uhlolo lwe-Dry-Run Bonding oluqhubekayo ngaphambi kokuthunyelwa
Ukupakishwa kweLogistics yeGlobal Back-End Cleanroom Logistics

Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha

Qhagamshelana nengcali yokuthengisa

Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.

Isicelo sokuthengisa

Silandele

Hlala uqhagamshelene nathi ukuze ufumane izinto ezintsha zamva nje, izibonelelo ezikhethekileyo, kunye nokuqonda okuya kuphakamisa ishishini lakho ukuya kwinqanaba elilandelayo.