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YandisaFAQ yoMatshini we-SMT
YandisaNgaba wakha wazibuza ukuba umatshini wokupakisha usebenza ngokukhawuleza kangakanani? Ngomnye weyona mibuzo ixhaphakileyo abantu abayibuzayo xa bejonga kwizisombululo zokupakisha ezizenzekelayo. Ke, masingene kuyo kwaye sibone ukuba yintoni echaphazela isantya sezi...
Xa usiva igama elithi "umatshini wokupakisha ozenzekelayo", unokucinga ukuba irobhothi yekamva ihlanganisa ngokukhawuleza kwaye ipakishe iimveliso. Ngelixa ingeyiyo i-sci-fi ngokupheleleyo, oomatshini bokupakisha abazenzekelayo baye baguqula ...
Ukukhetha umatshini wokubekwa we-SMT ofanelekileyo kufuna ukuba kuthathelwe ingqalelo le miba ilandelayo: Sula imveliso
Sinika izixhobo zomgca ezigqibeleleyo ezaziwayo ezaziwayo ezaziwayo. Name
I-SAKI 3Si-LS3EX yinto ephezulu yokusebenza ye-3D ye-solder yokuhlola izixhobo zokuhlola (SPI, i-Solder Paste Inspection), eyenzelwe i-SMT ephezulu echanekileyo (i-teknoloji ye-surface mount) imigca yokuvelisa.
Isetyenziselwa umgca wemveliso we-SMT emva kokuprinta nangaphambi kokuba ubambe iiparitha ezine-dimensional ezintathu ezifana nomthamo we-solder paste, ubude, imilo, njl.
Ukuhlolwa kwe-X-reyi ephezulu-echanekileyo anamacala amathathu kwindibano ye-PCB (PCBA), ngakumbi kumalungu e-solder efihliweyo kunye neziphene zesakhiwo zangaphakathi ezifana ne-BGA, CSP, QFN.
Ukuhlolwa kwe-PCB ngokukhawuleza kumbindi kunye nomva wesiphelo semigca yemveliso ye-SMT (emva kwe-reflow soldering), kugxininise ekusebenzeni kweendleko eziphezulu kunye nezinga lokubhaqa elizinzile.
Uhlobo: Ukuchaneka okuphezulu kwe-3D izixhobo zokuhlola okuzenzekelayo (AOI)
Isetyenziselwa ukuchaneka okuphezulu kwemigangatho emithathu yokuhlola umgangatho emva kwendibano ye-PCB kwi-SMT (iteknoloji yokunyuka komgangatho) imigca yokuvelisa ukuqinisekisa ukuba i-solder joints, ukunyuswa kwecandelo, njl.
Itekhnoloji yokufumanisa: Itekhnoloji ye-3D ye-stereo imaging, edityaniswe nomthombo wokukhanya we-multi-angle kunye nekhamera enesisombululo esiphezulu.
I-SAKI BF-10D sisixhobo sokuhlola esizenzekelayo se-2D esichanekileyo (i-AOI) esasungulwa ngu-SAKI waseJapan, eyenzelwe i-PCB ye-ultra-precision (njenge-IC substrate, i-FPC, ibhodi ye-HDI ephezulu)
I-SAKI BF-TristarⅡ ithatha "ukuchaneka okuphezulu + ukusebenza kakuhle okuphezulu + ubukrelekrele" njengondoqo wayo, kunye nokudityaniswa okutsha kwenkqubo yokubona izinto ezininzi.
Yandisa ubuchule kunye namava eGeekvalue ukunyusa uphawu lwakho luye kwinqanaba elilandelayo.
Qhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
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