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xhLoad
Present the device through the installed input module and package-specific tooling.
Turret Test Handler for Small Packages
ASMPT FT2018 Test Handler
Look beyond headline throughput and review the complete test cell.
The FT2018 combines high-speed turret handling, parallel test capability, six-sided vision and tape-and-reel options for small semiconductor packages. For a buyer, the real question is whether the listed machine can handle the package, connect with the required tester and contact hardware, and deliver the intended output format.
Reference image and published platform information only. Current availability, installed test stations, tester interface, packing modules, software and machine condition must be confirmed for the individual unit.
Current Product Record
ASMPT FT2018 Used and Refurbished Equipment
Open the product page to review the published machine record. Availability, year, installed test sites, tester interface, input and output modules, included accessories and refurbishment scope should be confirmed before quotation.
Machine identity
Installed test sites
Tester interface
Input and output modules
From Device Input to Tested and Packed Output
The FT2018 coordinates device handling, electrical-test presentation, vision inspection, result-based sorting and final packing in one production route.
FT2018 coordinates the device route
Align
Orient and position the package before the device reaches the contact station.
Test
Coordinate the handler with the tester, contactor and active test-site strategy.
Inspect
Use the installed vision functions to inspect device surfaces and orientation.
Sort
Route pass, fail or classified devices according to the test result and recipe.
Pack
Complete the selected tape, reel or other output process with the required checks.
Buyer perspective: the platform can suit the package size and still require different sockets, tester interfaces, test-site counts, nozzles, tape modules or software before it can run the intended product.
Key FT2018 Specifications for Early Screening
These values identify the published platform level. They do not confirm the measured output, active options or condition of a specific used machine.
50,000+ UPHPublished at 30 ms test time
18 NozzlesPublished FT2018 turret configuration
Up to 8Parallel test stations
Six SidesPublished vision inspection direction
1 × 1–6 × 6 mm²Published device-size range
1,620 × 1,260 × 2,170 mmPublished machine dimensions
Where Throughput Is Won or Lost
A fast turret is only one part of the production result. The device program, usable test sites, contact stability and output process determine whether the machine can deliver useful accepted units per hour.
T
Test Time
Start with the electrical program. A 30 ms reference does not describe every product. Longer test time may increase the value of parallel stations if the tester and interface support them.
8
Active Test Sites
Installed and usable are different questions. Confirm the number of fitted stations, tester resources, interface mapping and whether the project can use the intended parallel strategy.
C
Contact Stability
Retest can remove the benefit of speed. Package planarity, socket condition, alignment, force and maintenance history all affect effective output.
R
Final Packing Route
The output module must fit the product. Tape width, pocket format, sealing requirements, post-seal inspection and reel-change options should be included in the machine review.
Where the FT2018 Sits in the Complete Test Cell
The FT2018 is the mechanical and handling center of the test cell. Package conversion hardware sits upstream, while the contactor, interface and ATE complete the electrical-test path. For a broader comparison, review the turret test handler category.
Package and Conversion Hardware
Package dimensions, orientation, nozzles, nests, guides, input media and product-specific change parts define how the device reaches the handler.
ASMPT FT2018
Pickup, turret indexing, alignment, presentation to the active test sites, six-sided inspection, result-based sorting and the installed output modules.
Contactor, Interface and ATE
Socket or contactor, interface board, test-site mapping, tester resources, electrical program and result communication complete the test cell. Review the available semiconductor tester resources separately.
What the quotation should separate: the FT2018 handler, package-specific conversion hardware, sockets or contactors, interface boards, tester resources, the customer test program and any output tooling or services.
01
Package and Change Parts
Share the package drawing, dimensions, thickness, surface sensitivity and input form.
What we reviewNozzles, nests, guides, orientation hardware, contact-force needs, input modules and the available package-specific change parts.
02
Tester Interface and Active Sites
Define the tester model, test time, target site count and intended simultaneous or sequential strategy.
What we reviewInstalled test positions, contact hardware, interface records, communication, tester mapping and which sites can actually support the project.
03
Vision, Contact and Output Configuration
Explain the inspection criteria, orientation, package-protection concerns and required output format.
What we reviewCamera and lighting setup, six-sided inspection, contact-control options, installed output modules, software and included tooling.
Start With the Information You Have
From Package Details to a Quotation You Can Compare
A useful first discussion does not require a complete handler specification. A package drawing, tester reference and production target are enough to organize the next machine-level questions.
Device PackagePackage type, dimensions, thickness, drawing and handling sensitivity.
Test RequirementTester model, test time, target site count, test temperature and interface.
Input and OutputLoading route, tape width, pocket format, reel and sealing requirement.
Acceptance DirectionPower-on, dry cycle, representative package run or agreed demonstration.
Not sure the FT2018 is the right direction? Compare the wider turret-handler category, browse available test handlers, or review the semiconductor tester side of the test cell.
ASMPT FT2018 Questions
What device sizes can the ASMPT FT2018 handle?
The published device-size range is approximately 1 × 1 mm² to 6 × 6 mm². Actual suitability also depends on thickness, shape, surface sensitivity, nozzle configuration, contact hardware and the installed machine options.
Does every FT2018 include eight test stations?
No. The platform supports up to eight parallel test stations, but the installed quantity and usable test strategy must be confirmed on the individual machine together with the tester interface and available resources.
Can a used FT2018 be expected to achieve 50,000+ UPH?
The published reference is 50,000+ UPH at a 30 ms test time. Actual accepted output depends on test duration, active sites, contact yield, inspection requirements, package handling, input and output configuration and machine condition.
What information is enough to begin an FT2018 review?
A package drawing, tester model, approximate test time, required site count, input and output route and target throughput are enough to begin. Machine year, serial number, software, modules, tooling and condition can then be checked against the available record.
Review the Test Cell Before You Commit to the Handler
Share the package, tester and output requirements. We will use the available FT2018 product and machine information to clarify the likely fit, missing configuration points and the scope worth pricing.
