ave okutuuka ku 70% ku SMT Parts – Mu Stock & Ready to Ship
Funa Quote →BESI DATACON 8800 ye famire ya platform ekozesebwa okukola emirimu gya automated flip-chip ne die bonding. Omulimu gwayo ogw’omugaso gusinziira ku nsengeka entuufu eya FC QUANTUM oba CHAMEO, modulo z’okukwata eziteekeddwawo, ebikozesebwa mu kulaba, ebikozesebwa mu nkola, n’ekkubo ly’ekipapula eririna ebisaanyizo.
Ku byuma ebikozesebwa oba ebiddaabiriziddwa, erinnya lya pulatifomu lye ntandikwa yokka. Ekyuma ekiweereddwa kirina okwekebejjebwa okusinziira ku nsengeka yaakyo entuufu, embeera, ebikozesebwa ebiriwo, embeera ya pulogulaamu, n’okusaanira enkola y’okufulumya egenderere.
BESI DATACON 8800 kitegeeza ekibinja ky’ebifo eby’okukuŋŋaanya semikondokita okusinga okutegeeza ekyuma kimu eky’okusiba ekifa ekya universal. Mu maka, ensengeka za FC QUANTUM ne CHAMEO zeekenneenyezebwa olw’ebyetaago eby’enjawulo ebya flip-chip, multi-chip, fan-out, n’okupakinga eby’omulembe.
Enjawulo eyo nsonga nga weetegereza ekyuma kya DATACON ekikozesebwa. Yuniti bbiri ezitwala erinnya lye limu erya DATACON 8800 zisobola okwawukana ennyo mu nteekateeka y’omutwe gwa bond, okukwata wafer oba tray, enkola y’okulaba, obusobozi bw’abasitula, okukozesa ebikozesebwa mu nkola, okukola software, n’enkola z’okugatta layini.
Kakasa omutindo omutuufu, eby’okulonda ebiteekeddwa, ebyuma ebiwanvu, ekkubo ly’okukola n’obusobozi bw’okugezesa nga tonnakwata yuniti ya DATACON 8800 ng’okukyusaamu oba okulongoosa okufulumya okusaanira.
Enkyusa za DATACON 8800 ez’enjawulo zikoleddwa okwetoloola enkola ez’enjawulo ezikulembeza. Matrix wansi nkola ya kulonda, so si kwewozaako nti buli busobozi obuwandiikiddwa buteekebwa ku buli kyuma ekikozesebwa.
Okukola okufulumya, okulonda kwa hardware, modulo z’enkola n’ebikozesebwa ebiriwo bisobola okukyusa obusobozi obw’omugaso obw’enkola ya DATACON 8800.
| DATACON 8800 Enkyukakyuka | Obulagirizi bw’enkola eya bulijjo | Ebitundu by'okusengeka okukakasa | Essira ly’okuddamu okwetegereza ebyuma ebikozesebwa |
|---|---|---|---|
| FC QUANTUM hSHigh-throughput mass-okuddamu okukulukuta flip-chip platform. | Okukuŋŋaanya kwa Flip-Chip okw’obunene obw’amaanyiWeekenneenye sayizi ya die, ensengeka ya wafer, okutambula kwa substrate, obwetaavu bw’okuteeka n’obwetaavu bw’okukebera oluvannyuma lwa bond. | Enkola y’okulonda n’okuteekaKakasa ensengeka ya kkamera, okuteekawo entuuyo, enkwata ya wafer, abasitula substrate, enteekateeka ya fluxing n’enkola eziteekeddwamu. | Okukakasa enzirukanya n’amakungulaWeekenneenye embeera y’entambula, enkola y’okulaba, ebikozesebwa ebiriwo, embeera y’omufuzi n’ebyava mu kukebera nga okozesa ebintu ebikiikirira. |
| FC QUANTUM egenda mu maasoMass-reflow flip-chip platform nga erina ebikozesebwa mu nkola n’okufuga amakungula. | Ebisaanyizo by’enkola ya Flip-ChipWeekenneenye enzimba ya package egenderere, enkwata ya flux, ebisuubirwa mu kwekebejja n’engeri y’okufulumya egenderere. | Module z’enkolaKakasa bond force range, camera package, post-bond inspection, okukwata ebintu ne installed process hardware. | Sofutiweya n’okupimaKakasa embeera ya controller, embeera y’okulonda, ebiwandiiko by’okupima, enkola z’okufulumya n’obunene bw’omulimu gw’okuddaabiriza oguliwo. |
| FC QUANTUM advX nga bwe kiriFlip-chip platform positioned for a wide application range n'okufulumya mu bungi obw'amaanyi. | Okukyukakyuka mu kukola ebintuWeekenneenye oba ensengeka eweereddwa ekwatagana n’ekkubo lyennyini erya die, substrate, carrier n’okukwata ekyetaagisa layini. | Package ya AutomationKakasa okutambula kw’ebintu, okwanjula wafer, enteekateeka y’emmere, enkolagana ya layini, emirimu gy’okukebera n’ebyetaago by’okukyusa ekyuma. | Okujjuza OkusengekaKakasa modulo ki, entuuyo, ebinyweza n’ebikozesebwa ebibeera mu mubiri n’ekyuma ekiweereddwa. |
| CHAMEO yagenda mu maasoMulti-chip flip-chip platform ekwatagana ne FO-WLP ne face-up oba face-down package workflows. | Multi-Chip ne Fan-Out Okuddamu okwetegerezaWeekenneenye enkwata y’abasitula, okulungamya die, ebyetaago by’enkola ya substrate oba wafer-level, okuwulikika kw’olutalo n’ebyetaago by’okukebera. | Ebikozesebwa Ebikwata ku PackageKakasa ensengeka y’omutwala, ekipapula ky’ebikozesebwa, ekkubo ly’okukwata, obusobozi bw’okulaba n’okukwatagana n’enteekateeka y’ekipapula egenderere. | Okukwatagana kw'okusabaKakasa nti ensengeka eweereddwa yakolebwa ku kkubo ly’enkola lye limu okusinga okulowooza nti yuniti za CHAMEO zonna zikyusibwakyusibwa. |
| CHAMEO ultra nga kwogasse ne ACEnsengeka ey’omulembe ekwatagana n’enkola z’emirimu ez’okugatta okugatta (hybrid-bonding) n’okugatta (hybrid-density integration). | Enkulaakulana y’okupakinga eby’omulembeWeekenneenye obuyonjo, okukwatagana, okupima, okuteekateeka ebintu n’ebyetaago by’okukulaakulanya enkola ng’enkola y’emirimu enzijuvu. | Ebikozesebwa mu nkola ey’enjawuloKakasa enzimba entuufu ey’okukwatagana, enkola y’okulaga amaaso, ebikozesebwa, pulogulaamu n’enkola-okuwagira enkola. | Si Standard ReplacementTogeraageranya nsengeka eno butereevu ne die bonder eya bulijjo nga tolina kwekenneenya kwa yinginiya mu bujjuvu ku kkubo ly’enkola. |
Okukwatagana okutuufu kw'enkola kisinziira ku nsengeka etekeddwa. Kozesa ekkubo ly’okuzimba ekipapula n’okugattako okufunza ekifo ky’omuntu eyeesimbyewo nga tonnageraageranya bibalo bya sipiidi oba obutuufu ebifulumiziddwa.
Enkola y’okuteeka, okuyita n’omuwendo gw’obwannannyini bikulu bwokka ng’ekyuma kisobola okumaliriza enkola egenderere n’ebintu ebyetaagisa n’ebikozesebwa.
Weekenneenye enkola y’okulaga die, obunene bwa wafer, enkola ya substrate oba strip, enkola ya fluxing, camera field of view, post-bond inspection requirement ne target cycle profile.
Kakasa oba ekyuma kya DATACON ekiteeseddwa kiwagira omutendera gw’okufa ogwetaagisa, ensengeka y’okuteekebwa, ensengeka y’omutwala, geometry y’ekipapula, okulungamya okukwata n’ekkubo ly’okukebera.
Weekenneenye enkwata ya face-up oba face-down, okutebenkera kw’abasitula, enneeyisa y’olutalo, enteekateeka y’ekipapula, ebikozesebwa mu nkola, ebyetaago by’okulaba n’enkola y’ebisaanyizo ku nsengeka entuufu.
Geraageranya yuniti eweereddwa n’ekkubo ly’okufulumya erissiddwako: okukwatagana kw’ebikozesebwa, data y’ebyuma, ebikozesebwa, enkolagana ya layini, sipeeya, enkola y’emirimu gy’omukozi n’ebikozesebwa ebiwagira ebiriwo.
Ekyuma kya DATACON 8800 kisaana okwekenneenya ng’ensengeka y’okufulumya enzijuvu. Omuddirirwa gwa platform ogw’erinnya teguddamu oba yuniti entongole erina modules, tooling, software options n’embeera ezeetaagisa ku package route yo.
DATACON die bonder ekozesebwa eyinza okuba eky’obugagga eky’omugaso mu kukola nga ensengeka y’ekyuma, embeera ya yuniti, ebikozesebwa n’ekkubo ly’ebisaanyizo byekenneenyezebwa nga tebannasindikibwa —so si oluvannyuma lw’okugiteeka.
Saba ebifaananyi ebiriwo kati, olukalala lw’okusengeka, ebikwata ku bikozesebwa ebiriwo, amawulire agakwata ku kugezesa emirimu, data y’amasannyalaze n’obuwanvu obutegeerekese obw’okuddaabiriza.
Kakasa erinnya ly'ekyokulabirako mu bujjuvu, omulembe gw'okufulumya, okusengeka ennamba z'omuddiring'anwa ne modulo z'enkola enkulu eziteekeddwawo.
Weekenneenye embeera y’omutwe gwa bond, entambula ya linear, okutambula ku siteegi, bbeeri, enkola ya cable, enkola z’obukuumi n’ebyafaayo by’okuddaabiriza.
Kakasa kkamera, optics, ekitangaala, embeera y’okupima, modulo z’okukebera n’okubaawo kw’ebitundu ebikyusibwa.
Kakasa fuleemu za wafer, trays, carriers, feeders, nozzles, fixtures, substrate tooling n’ebikozesebwa byonna ebikwata ku package.
Kakasa embeera ya controller, PC hardware, software environment, recovery media, installed options n'okubeerawo kw'ebiwandiiko eby'ekikugu.
Lambulula ebyetaago by’okugezesa sampuli, emisingi gy’okukkiriza, enkola y’okupakinga, embeera z’okussaako, ebyetaago by’ebikozesebwa n’obunene bw’obuyambi oluvannyuma lw’okussaako.
Emiwendo wansi gijuliziddwa mu lujjudde ku nsengeka ya FC QUANTUM hS yokka. Tezirina kutwalibwa nga generic DATACON 8800 specifications oba nga okukakasa unit ssekinnoomu ekozesebwa.
Okukola okufulumya, enkola eziteekeddwawo, ebikozesebwa n’embeera y’ekyuma bisobola okukyusa ebanga erikozesebwa n’enkola ya yuniti entongole.
| Obutuufu bw’okuteeka | ±4 μm ku 3 sigma |
|---|---|
| Amaanyi ga Bond | 0.5 N okutuuka ku 5 N |
| Die Size | mm 1 okutuuka ku mm 14 |
| Die Obugumu | 70 μm okutuuka ku mm 2 |
| Sayizi ya Wafer | Wafers za yinsi 8 okutuuka ku yinsi 12 ku wafer frame za yinsi 8 oba 12 |
| Ebika bya Substrate | Singulated substrates mu maato, strips, leadframes ne wafers mu carriers |
| Working Range | Yinsi 13 × yinsi 8 |
| Ekiwandiiko ekijuliziddwa mu kuyita mu nkola | Okutuuka ku 16,000 UPH, okusinziira ku kusaba |
Ebyuma bya DATACON 8800 bisaana okusunsulwa ng’ekkubo ly’enkola, ensengeka y’ekyuma n’enkola ey’okukwata eyeetaagisa bikwatagana n’ensengeka eweebwa.
Totwala nameplate ya DATACON 8800 ng’obukakafu nti ebyuma bisaanira buli die attach oba flip-chip application.
Ebibuuzo bino bikwata ku kukebera okw’omugaso okutera okuba okw’omugaso nga tonnageraageranya, kugula oba kuddaabiriza kyuma kya DATACON 8800 die bonding.
BESI DATACON 8800 ye famire ya semikondokita okukuŋŋaanya platforms ezikozesebwa mu flip-chip, multi-chip n’enkola z’emirimu ez’okupakinga ez’omulembe ezirondeddwa. Obusobozi bw'enkola entuufu businziira ku nsengeka ya FC QUANTUM oba CHAMEO entongole n'enkola eziteekeddwawo.
Kiyinza okwekenneenyezebwa ng’ekitundu ku nkola zombi ez’okukola die attach ne flip-chip assembly. Ennyonyola entuufu esinziira ku nsengeka y’ekyuma, ekkubo ly’enkola, ensengeka y’ebipapula, enkola y’okukwata ebintu n’ebikozesebwa ebiteekeddwamu.
Ensengeka za FC QUANTUM zikwatagana ne mass-reflow flip-chip production platforms, ate CHAMEO configurations zeekenneenyezebwa ku multi-chip, fan-out n’enkola z’emirimu ez’okupakinga ez’omulembe ezirondeddwa. Okugerageranya okwennyini kulina okukolebwa ku ddaala lya model ne configuration.
Yee, naye obuwanvu bw’okuddaabiriza bulina okunnyonnyolwa okwetoloola embeera ya makanika, enkola y’entambula, omutwe gwa bond, modulo z’okulaba, controller, embeera ya software, enkola z’obukuumi, modulo z’okukwata n’ebikozesebwa ebiriwo.
Kakasa enkyusa entuufu ey’omukutu, eby’okulonda ebiteekeddwa, ensengeka y’okukwata, omutwe gwa bond, enkola y’okulaba, embeera y’omufuzi, embeera ya pulogulaamu, ebikozesebwa ebiriwo, ebyafaayo by’okupima, amawulire agakwata ku kugezesebwa okukola n’obunene bw’obuyambi.
Nedda.Okusaanira kwa Fan-out, multi-chip ne hybrid-bonding kisinziira ku CHAMEO entuufu oba ensengeka endala ey’enjawulo, wamu n’ebikozesebwa mu nkola, okukwatagana kw’amaaso, ebikozesebwa n’ebisaanyizo ebyetaagisa.
Nedda.Emiwendo egyafulumiziddwa gikwata ku nsengeka. Nga tonnaba kukozesa specification ku nteekateeka y’okufulumya, kakasa model, installed options, process hardware, tooling, software generation n’embeera ya unit ewereddwa.
Okuwa ekifaananyi ky’ekipapula, ebipimo by’okufa, obuwanvu bw’ekifa, okutambula kw’ebintu, ensengeka ya wafer oba tray, ekika kya substrate, ekkubo ly’enkola, ekifulumizibwa ekigendererwa, ekyetaagisa okuteeka, ebikozesebwa ebiriwo n’ebiziyiza byonna ebiriwo mu layini.
Gabana ekifaananyi kya package, die ne substrate format, ekkubo ly’enkola eryetaagisa, target output n’ebikwata ku kyuma byonna ebiriwo. Kino kisobozesa okwekenneenya oba ensengeka ya DATACON 8800 eweereddwa esaanira okutuukiriza ebisaanyizo ku layini yo ey’okufulumya.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
EN
id
sk
sr
sv
it
pt
bn
ms
be
nl
fr
th
vi
ru
ja
ko
de
hy
az
bs
bg
my
cs
da
dv
el
et
fil
fi
ga
gl
gn
he
hi
km
hr
hu
is
kn
rw
lo
lv
lt
lb
lg
mi
mt
ne
no
ny
or
om
per
pl
ro
sa
so
es
sw
ta
tr
uk
ur
cy
xh