What is a BESI DATACON 8800 machine?

BESI DATACON 8800 is a family of semiconductor assembly platforms used across flip-chip, multi-chip and selected advanced packaging workflows. The exact process capability depends on the specific FC QUANTUM or CHAMEO configuration and installed options.

Is DATACON 8800 a die bonder or a flip-chip machine?

It can be evaluated as part of both die attach and flip-chip assembly workflows. The correct description depends on the machine configuration, process route, package structure, material handling method and installed tooling.

What is the difference between FC QUANTUM and CHAMEO?

FC QUANTUM configurations are associated with mass-reflow flip-chip production platforms, while CHAMEO configurations are evaluated for multi-chip, fan-out and selected advanced packaging workflows. The actual comparison must be made at model and configuration level.

Can a used DATACON 8800 be refurbished?

Yes, but the refurbishment scope should be defined around the condition of the mechanics, motion system, bond head, vision modules, controller, software environment, safety systems, handling modules and available tooling.

What should be checked before purchasing a used DATACON 8800?

Confirm the exact platform version, installed options, handling configuration, bond head, vision system, controller condition, software status, available tooling, calibration history, functional test information and support scope.

Does every DATACON 8800 support fan-out or hybrid bonding?

No. Fan-out, multi-chip and hybrid-bonding suitability depends on the exact CHAMEO or other specialised configuration, along with the process hardware, optical alignment, tooling and qualification requirements.

Are published DATACON 8800 specifications valid for every machine?

No. Published values are configuration-specific. Before using a specification for production planning, confirm the model, installed options, process hardware, tooling, software generation and condition of the offered unit.

What information is needed for a DATACON 8800 recommendation?

Provide the package drawing, die dimensions, die thickness, material flow, wafer or tray format, substrate type, process route, target output, placement requirement, available tooling and any existing line constraints.

Iiplatifomu ze-BESI ze-Attach & Flip Chip

BESI DATACON 8800 Die Bonder Platform Guide

I-BESI DATACON 8800 lusapho lweqonga olusetyenziselwa imisebenzi ye-flip-chip kunye ne-die bonding ezenzekelayo. Indima yayo esebenzayo ixhomekeke kuqwalaselo oluchanekileyo lwe-FC QUANTUM okanye i-CHAMEO, iimodyuli zokuphatha ezifakiweyo, i-hardware yombono, izixhobo zenkqubo, kunye nendlela yephakheji efanelekile.

Kwizixhobo ezisetyenzisiweyo okanye ezihlaziyiweyo, igama leqonga lilo kuphela indawo yokuqala. Umatshini onikezelwayo kufuneka uhlolwe ngokusekwe kwisimo sawo sokwenyani, imeko yawo, izixhobo ezikhoyo, imeko yesoftware, kunye nokufaneleka kokuhamba kwemveliso okucetywayo.

Ukuhamba komsebenzi we-Flip-Chip kunye ne-Multi-Chip Uvavanyo oluKhethekileyo loBume Izixhobo Ezisetyenzisiweyo Ezisebenzayo

Ukubonisana kwi-Intanethi Cela uHlolo loBume

Nika umzobo wephakheji, ubungakanani bedayi, ukuhamba kwezinto, imveliso ekujoliswe kuyo kunye nezixhobo ezikhoyo zokuvavanya umatshini oluncedo ngakumbi.

BESI DATACON 8800 die bonder platform in a semiconductor manufacturing environment

Uvavanyo lweQonga Vavanya uqwalaselo oluchanekileyo ngaphambi kokukhetha umatshini we-DATACON 8800.

Isishwankathelo seQonga lokuNxibelelanisa iDie Attach Automated semiconductor die bonding equipment for DATACON platform evaluation

Yintoni i-BESI DATACON 8800?

Igama le-DATACON 8800 alichazi umatshini omnye osisigxina

I-BESI DATACON 8800 ibhekisa kwiqela leeplatifomu zendibano ze-semiconductor endaweni yeenkcukacha zomatshini omnye we-die bonding. Ngaphakathi kusapho, ulungelelwaniso lwe-FC QUANTUM kunye ne-CHAMEO luvavanywa kwiimfuno ezahlukeneyo ze-flip-chip, i-multi-chip, i-fan-out, kunye neemfuneko eziphambili zokupakisha.

Loo mahluko ubalulekile xa kujongwa umatshini we-DATACON osetyenzisiweyo. Iiyunithi ezimbini ezinegama elifanayo le-DATACON 8800 zinokuhluka kakhulu kwindlela yokulungiselela intloko yebhondi, ukuphathwa kwe-wafer okanye itreyi, inkqubo yombono, amandla okuthwala, izixhobo zenkqubo, ukuveliswa kwesoftware, kunye neendlela zokudibanisa umgca.

Umgaqo wokukhetha osebenzayo

Qinisekisa imodeli echanekileyo, ukhetho olufakelweyo, uluhlu lwesixhobo, indlela yenkqubo kunye nokukwazi ukuvavanya ngaphambi kokuba uphathe iyunithi ye-DATACON 8800 njengento efanelekileyo yokutshintsha okanye yokuphucula imveliso.

Jonga izixhobo zeDATACON 8800 ezikhoyo Hlola iiPlatforms zeBonder

Iinguqu zePlatform

Uqwalaselo lwe-DATACON 8800 kunye neNdlela yabo yoVavanyo oluQhelekileyo

Iinguqulelo ezahlukeneyo ze-DATACON 8800 ziyilwe ngokwezinto eziphambili zenkqubo ezahlukeneyo. I-matrix engezantsi yisakhelo sokukhetha, ayingombango wokuba zonke izixhobo ezidwelisiweyo zifakiwe kuyo yonke imashini esetyenzisiweyo.

Qinisekisa iyunithi ebonelelwayo kuqala.

Ukuveliswa kwemveliso, ukhetho lwehardware, iimodyuli zenkqubo kunye nezixhobo ezikhoyo zinokutshintsha amandla asebenzayo enkqubo yeDATACON 8800.

Uhlobo lweDATACON 8800	Isikhokelo seNkqubo esiQhelekileyo	Iindawo zoQwalaselo eziQinisekiswayo	Ingqwalasela yoHlolo lweZixhobo eziSetyenzisiweyo
I-FC QUANTUM hSIqonga le-flip-chip elinomthamo ophezulu wokukhupha amandla amaninzi.	Indibano yeFlip-Chip enomthamo ophezuluVavanya ubungakanani bedayi, ifomathi ye-wafer, ukuhamba kwe-substrate, imfuneko yokubekwa kunye neemfuno zokuhlolwa emva kwebhondi.	Inkqubo yokukhetha nokubekaQinisekisa ubume bekhamera, ukuseta i-nozzle, ukuphathwa kwe-wafer, abathwali be-substrate, ulungiselelo lwe-flux kunye neendlela ezifakiweyo.	Ukuqinisekiswa koMjikelo kunye neNzuzoHlola imeko yentshukumo, ukusebenza kombono, izixhobo ezikhoyo, imeko yomlawuli kunye neziphumo zovavanyo usebenzisa izixhobo ezimeleyo.
I-FC QUANTUM iqhubekileIqonga le-flip-chip eliphinda liphume ngobuninzi elineempawu zenkqubo kunye nolawulo lwemveliso.	Isiqinisekiso seNkqubo yeFlip-ChipVavanya uyilo lwephakheji olucetywayo, ukuphathwa kwe-flux, ulindelo lokuhlolwa kunye neprofayili yemveliso ekujoliswe kuyo.	Iimodyuli zeNkquboQinisekisa uluhlu lwamandla ebhondi, iphakheji yekhamera, ukuhlolwa emva kwebhondi, ukuphathwa kwezinto kunye nezixhobo zenkqubo ezifakiweyo.	Isoftware kunye noLungisoQinisekisa imeko yomlawuli, imeko yokhetho, iirekhodi zokulinganisa, iindlela zokupheka imveliso kunye nobubanzi bomsebenzi wokuhlaziya okhoyo.
I-FC QUANTUM advXIqonga le-flip-chip libekwe kwindawo yokusetyenziswa ngokubanzi kunye nemveliso ephezulu.	Ukuguquguquka kweMvelisoVavanya ukuba ulungiselelo olunikezelwayo luyahambelana na nendlela yokwenyani yokudaya, i-substrate, indlela yokuthwala kunye nendlela yokuphatha efunekayo kumgca.	Iphakheji yokuZenzekelayoQinisekisa ukuhamba kwezinto, ukubonakaliswa kwe-wafer, ulungiselelo lwe-feeder, ujongano lomgca, imisebenzi yokuhlolwa kunye neemfuno zokutshintsha isixhobo.	Ukugqibelela koqwalaseloQinisekisa ukuba zeziphi iimodyuli, ii-nozzles, izixhobo kunye nezixhobo ezifakwe ngqo kumatshini onikezelwayo.
I-CHAMEO iqhubekileIqonga le-flip-chip elinee-chip ezininzi elinxulunyaniswa ne-FO-WLP kunye neendlela zokusebenza zephakheji ezijonge phezulu okanye ezijonge phantsi.	Uphononongo lweMulti-Chip kunye neFan-OutVavanya ukuphathwa komthwali, ukujongwa kwendlela yokuhambisa amanzi, iimfuno zenkqubo ye-substrate okanye ye-wafer, uvakalelo lwe-warpage kunye neemfuno zokuhlolwa.	Izixhobo Ezithile KwiphakhejiQinisekisa ifomathi yenkampani, iphakheji yezixhobo, indlela yokuphatha, amandla okubona kunye nokuhambelana noyilo lwephakheji olucetywayo.	Ukufaniswa kwesiceloQinisekisa ukuba uqwalaselo olunikiweyo lwenzelwe indlela yenkqubo efanayo endaweni yokucinga ukuba zonke iiyunithi zeCHAMEO ziyatshintshana.
I-CHAMEO ultra kunye ne-ACUqwalaselo oluphambili oluhambelana ne-hybrid-bonding kunye nemisebenzi yokudibanisa enoxinano oluphezulu.	Uphuhliso oluPhambili lokuPakishaVavanya ucoceko, ulungelelwaniso, i-metrology, ukulungiswa kwezinto kunye neemfuno zophuhliso lwenkqubo njengomsebenzi opheleleyo.	Izixhobo zeNkqubo eziKhethekileyoQinisekisa uyilo oluchanekileyo lokubopha, inkqubo yokulungelelanisa i-optical, izixhobo, isoftware kunye nephakheji yokuxhasa inkqubo.	Ayisiyonto Eqhelekileyo YokutshintshaMusa ukuthelekisa olu qwalaselo ngokuthe ngqo ne-die bonder eqhelekileyo ngaphandle kophononongo olupheleleyo lobunjineli bendlela yenkqubo.

Inkqubo ye-DATACON Die Bonder Fit

Apho uMatshini we-BESI DATACON Die Bonding Unokuvavanywa khona

Ukulingana kwesicelo esifanelekileyo kuxhomekeke kulungiselelo olufakiweyo. Sebenzisa indlela yokwakha iphakheji kunye nendlela yokuncamathisela ukunciphisa iqonga elikhethiweyo ngaphambi kokuthelekisa amanani esantya ashicilelweyo okanye okuchaneka.

Ukufaneleka kwenkqubo kuza ngaphambi kokufaneleka kophawu.

Ukusebenza kokubekwa, ukwenziwa kunye nexabiso lobunini kubaluleke kakhulu xa umatshini ekwazi ukugqiba inkqubo ebekiweyo ngezixhobo ezifunekayo kunye nezixhobo.

Indibano yeFlip-Chip ephinda ibuyele kwiMass-Reflow

Vavanya indlela yokubonisa idayisi, ubungakanani be-wafer, ifomathi ye-substrate okanye ye-strip, indlela yokujikeleza, indawo yokujonga ikhamera, imfuneko yokuhlolwa kwe-post-bond kunye neprofayili yomjikelo wethagethi.

Ukupakisha iitshiphusi ezininzi

Qinisekisa ukuba umatshini we-DATACON ocetywayo uyayixhasa na indlela efunekayo yokulandelelana kweedayi, indlela yokubeka, ifomathi yokuthwala, ijiyometri yephakheji, indlela yokuphatha kunye nendlela yokuhlola.

Ukuhamba komsebenzi kwiFan-Out kunye neWafer-Level

Hlola indlela yokuphatha ubuso okanye ubuso, uzinzo lomthwali, indlela yokuziphatha kwe-warpage, uyilo lwephakheji, izinto zenkqubo, iimfuno zombono kunye nendlela yokufaneleka ukuze ufumane uqwalaselo oluchanekileyo.

Ukutshintshwa koMgca weLifa okanye okhoyo

Thelekisa iyunithi ebonelelwayo nendlela yokuvelisa efakiweyo: ukuhambelana kwezixhobo, idatha yesixhobo, izixhobo zokusebenza, ujongano lomgca, iindawo ezingasetyenziswayo, umsebenzi womqhubi kunye nezixhobo zenkxaso ezikhoyo.

Semiconductor die bonder configuration review with precision handling and vision modules

Uhlolo loMatshini we-BESI DATACON

Iindawo Ezintandathu Zokumisela Ezilawula Ubuchule Obusebenzayo

Umatshini we-DATACON 8800 kufuneka uhlolwe njengolungiselelo olupheleleyo lwemveliso. Uthotho lweqonga eliqhelekileyo aluphenduli ukuba iyunithi ethile ineemodyuli, izixhobo, ukhetho lwesoftware kunye nemeko efunekayo kwindlela yakho yephakheji.

Uyilo lweentloko zebhondi, uluhlu lwamandla kunye noyilo lokubekwa
Iikhamera zokubona, imisebenzi yokukhanyisa kunye nokulungelelanisa
Iimodyuli zokuphatha i-wafer, itreyi, umcu, ifreyimu yentsimbi okanye umthwali
Ukucoca, ukuhambisa, ukulungiselela izinto kunye nezixhobo zokuhlola
Umlawuli, inkqubo yokuhamba, inguqulelo yesoftware kunye nesimo sokhetho
Ii-nozzles, izixhobo, izixhobo zenkqubo kunye neendlela zokudibanisa imigca

Uvavanyo olusetyenzisiweyo noluhlaziyiweyo

Yintoni Ekufuneka Ihlolwe Ngaphambi Kokuthenga I-DATACON 8800 Esetyenzisiweyo?

I-DATACON die bonder esetyenzisiweyo inokuba yimpahla yemveliso esebenzayo xa uqwalaselo lomatshini, imeko yeyunithi, izixhobo kunye nendlela yokufaneleka ihlolwa ngaphambi kokuthunyelwa—hayi emva kokufakwa.

Cela ubungqina, hayi izinto ozicingelayo.

Cela iifoto zangoku, uluhlu loqwalaselo, iinkcukacha zezixhobo ezikhoyo, ulwazi lovavanyo olusebenzayo, idatha yombane kunye nobubanzi obuchaziweyo bokuhlaziywa.

Ubume bomatshini obuchanekileyo

Qinisekisa igama elipheleleyo lemodeli, ukuveliswa kwemveliso, uqwalaselo lweenombolo zeserial kunye neemodyuli eziphambili zenkqubo ezifakiweyo.

Imeko Yoomatshini Nokuhamba

Jonga imeko yentloko yebhondi, intshukumo ethe tye, uhambo lwesiteji, iibheringi, uthutho lwentambo, iinkqubo zokhuseleko kunye nembali yolondolozo.

Inkqubo yoMbono noHlolo

Qinisekisa iikhamera, i-optics, ukukhanya, imeko yokulinganisa, iimodyuli zokuhlola kunye nokufumaneka kwezinto ezitshintshayo.

Iphakheji yokuphatha kunye neZixhobo

Qinisekisa iifreyimu ze-wafer, iitreyi, izinto zokuthwala, izinto zokondla, ii-nozzles, izixhobo, izixhobo ze-substrate kunye nazo naziphi na izixhobo ezihambelana nephakheji.

Imeko yoMlawuli kunye neSoftware

Qinisekisa imeko yomlawuli, izixhobo zekhompyutha, indawo yesoftware, imidiya yokubuyisela, iindlela ezifakiweyo kunye nokufumaneka kwamaxwebhu obuchwephesha.

Isicwangciso seMfanelo kunye neNkxaso

Chaza iimfuno zovavanyo lwesampulu, iikhrayitheriya zokwamkelwa, indlela yokupakisha, iimeko zokufakela, iimfuno zoncedo kunye nobubanzi benkxaso emva kokufakwa.

Isalathiso Esithile Soqwalaselo

Iinkcukacha zeReferensi ezipapashwe yiDATACON 8800 FC QUANTUM hS

Amaxabiso angezantsi ayindlela yokubonisa uluntu kuphela kwi-FC QUANTUM hS configuration. Akufanele aphathwe njengeenkcazo ze-DATACON 8800 eziqhelekileyo okanye njengoqinisekiso lweyunithi esetyenzisiweyo nganye.

Qinisekisa umatshini obonelelwayo.

Ukuveliswa kwemveliso, iindlela ezifakiweyo, izixhobo kunye nemeko yomatshini kunokutshintsha uluhlu olusebenzisekayo kunye nokusebenza kweyunithi ethile.

Ukuchaneka kokubekwa	±4 µm kwi-3 sigma
Amandla eBond	0.5 N ukuya ku-5 N
Ubungakanani beDie	1 mm ukuya kwi-14 mm
Ubukhulu bokufa	70 µm ukuya kwi-2 mm
Ubungakanani beWafer	Iiwafers eziziisentimitha ezisi-8 ukuya kwezili-12 kwiifreyimu zewafer eziziisentimitha ezisi-8 okanye eziziisentimitha ezili-12
Iintlobo zeSubstrate	Ii-substrates ezifakwe kwiinqanawa, imicu, ii-leadframes kunye nee-wafers kwiinqwelo
Uluhlu Lokusebenza	Iisentimitha ezili-13 × iisentimitha ezi-8
Isalathiso sokuPhuma	Ukuya kuthi ga kwi-16,000 UPH, kuxhomekeke kwisicelo

Xa i-DATACON 8800 ifanelekile ukuvavanywa

Izixhobo zeDATACON 8800 zifanelekile ukudweliswa xa indlela yenkqubo, ifomathi yesixhobo kunye nendlela yokuphatha efunekayo ihambelana noqwalaselo olunikezelwayo.

Lo matshini unesimo esibhaliweyo esihambelana nendlela yephakheji ekujoliswe kuyo.
Iimodyuli zokuphatha i-wafer, itreyi, i-carrier okanye i-substrate ezifunekayo ziyabandakanywa.
Izixhobo ezikhoyo zinokuxhasa ubungakanani bedayi kunye neepakeji ezicetywayo.
Iyunithi inokuvavanywa okanye iqinisekiswe ngenye indlela ngokweekhrayitheriya zokwamkelwa ezichaziweyo.
Ulawulo, umbono, izixhobo zenkqubo kunye nokulungelelaniswa kwenkxaso ziluncedo kwezorhwebo.

Ixesha lokumisa nokuqinisekisa ngaphambi kokuba uthenge

Musa ukuphatha i-nameplate ye-DATACON 8800 njengobungqina bokuba isixhobo sifanelekile kuzo zonke izixhobo zokufakela okanye zokufaka i-flip-chip.

Umatshini onikezelwayo awunalo uluhlu oluqinisekisiweyo loqwalaselo okanye ingxelo yemeko yangoku.
Izixhobo zenkqubo ezifunekayo, iimodyuli zokuphatha okanye ukhetho lwesoftware azikho.
Iphakheji ekujoliswe kuyo ifuna indlela ekhethekileyo engakaqinisekiswanga kwisimo esibonelelwayo.
Akukho bungqina bufumanekayo bokusebenza kwekhamera, intshukumo, ukuhlolwa okanye umlawuli.
Iimfuneko zokufakelwa, izixhobo zokusebenza, izixhobo ezingasetyenziswayo okanye umda wenkxaso azikacaciswa.

Imibuzo yoBugcisa kunye nokuThenga

BESI DATACON 8800 Die Bonder FAQ

Le mibuzo igubungela uhlolo olusebenzayo oluhlala lubalulekile ngaphambi kokuthelekisa, ukuthenga okanye ukuhlaziya umatshini we-DATACON 8800 die bonding.

Yintoni umatshini we-BESI DATACON 8800?

I-BESI DATACON 8800 yintsapho yamaqonga okuhlanganisa e-semiconductor asetyenziswa kwi-flip-chip, kwi-multi-chip nakwimisebenzi yokupakisha ekhethiweyo ephucukileyo. Amandla enkqubo achanekileyo axhomekeke kuqwalaselo oluthile lwe-FC QUANTUM okanye i-CHAMEO kunye neendlela ezifakiweyo.

Ingaba i-DATACON 8800 yi-die bonder okanye yi-flip-chip machine?

Ingavavanywa njengenxalenye yemisebenzi yokuhlanganisa i-die attach kunye ne-flip-chip. Inkcazo echanekileyo ixhomekeke kuqwalaselo lomatshini, indlela yenkqubo, ulwakhiwo lwephakheji, indlela yokuphatha izinto kunye nezixhobo ezifakiweyo.

Yintoni umahluko phakathi kweFC QUANTUM kunye neCHAMEO?

Uqwalaselo lwe-FC QUANTUM lunxulunyaniswa namaqonga okuvelisa i-flip-chip e-mass-reflow, ngelixa uqwalaselo lwe-CHAMEO luvavanywa kwii-chip ezininzi, i-fan-out kunye neendlela zokusebenza eziphambili zokupakisha ezikhethiweyo. Uthelekiso lokwenyani kufuneka lwenziwe kwinqanaba lemodeli kunye noqwalaselo.

Ngaba i-DATACON 8800 esetyenzisiweyo ingahlaziywa?

Ewe, kodwa umda wokuhlaziya kufuneka uchazwe ngokwemeko ye-mechanics, inkqubo yokuhamba, intloko yebhondi, iimodyuli zombono, umlawuli, imeko-bume yesoftware, iinkqubo zokhuseleko, iimodyuli zokuphatha kunye nezixhobo ezikhoyo.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-DATACON 8800 esetyenzisiweyo?

Qinisekisa inguqulelo yeqonga echanekileyo, ukhetho olufakiweyo, uqwalaselo lokuphatha, intloko yebhondi, inkqubo yombono, imeko yomlawuli, imeko yesoftware, izixhobo ezikhoyo, imbali yokulinganisa, ulwazi lovavanyo olusebenzayo kunye nobubanzi benkxaso.

Ngaba yonke i-DATACON 8800 iyayixhasa i-fan-out okanye i-hybrid bonding?

Hayi. Ukufaneleka kokubopha ngefeni, iitshiphusi ezininzi kunye ne-hybrid kuxhomekeke kwi-CHAMEO echanekileyo okanye olunye uqwalaselo olukhethekileyo, kunye neemfuno ze-process hardware, ulungelelwaniso lwe-optical, izixhobo kunye neemfuno ze-qualification.

Ngaba iinkcukacha ze-DATACON 8800 ezipapashiweyo ziyasebenza kumatshini ngamnye?

Hayi. Amaxabiso apapashiweyo axhomekeke kuqwalaselo. Ngaphambi kokusebenzisa iinkcukacha zokucwangcisa imveliso, qinisekisa imodeli, iinketho ezifakiweyo, i-process hardware, izixhobo, ukuveliswa kwesoftware kunye nemeko yeyunithi ebonelelwayo.

Loluphi ulwazi olufunekayo kwingcebiso ye-DATACON 8800?

Nika umzobo wephakheji, ubungakanani bedayi, ubukhulu bedayi, ukuhamba kwezinto, ifomathi ye-wafer okanye yetreyi, uhlobo lwesiseko, indlela yenkqubo, imveliso ekujoliswe kuyo, imfuneko yokubeka, izixhobo ezikhoyo kunye nayo nayiphi na imida yomgca ekhoyo.

Ngaba ufuna uphononongo loqwalaselo lweDATACON 8800?

Yabelana ngomzobo wephakheji, ifomathi yedayi kunye ne-substrate, indlela yenkqubo efunekayo, imveliso ekujoliswe kuyo kunye nazo naziphi na iinkcukacha zomatshini ezikhoyo. Oku kwenza kube nokwenzeka ukuvavanya ukuba uqwalaselo lwe-DATACON 8800 olunikezelwayo lufanelekile na kumgca wakho wemveliso.

Ukubonisana kwi-Intanethi