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xhTilmaamaha Qalabka Caalamiga ah ee Universal Fuzion Chip Mounter waa sida soo socota:
Saxnaanta Meelaynta iyo Xawaaraha:
Xaqiijinta Meelaynta: ± 10 micron saxnaanta ugu badan, <3 micron ku celcelin.
Xawaaraha Meelaynta: Ilaa 30K cph (30,000 wafers saacaddii) ee codsiyada korka korka ah iyo ilaa 10K cph (10,000 wafers saacaddii) ee baakadaha horumarsan.
Kartida Habaynta iyo Baaxadda Codsiga:
Nooca Chip: Waxay taageertaa jajabyo kala duwan oo ballaaran, jajabyo rogan, iyo cabbir buuxa oo wafer ah ilaa 300 mm.
Nooca Substrate: Waxa lagu dhejin karaa substrate kasta, oo ay ku jiraan filim, dabacsanaan, iyo looxyo waaweyn.
Nooca Quudinta: Noocyo kala duwan oo quudiye ah ayaa la isticmaali karaa, oo ay ku jiraan feedhiyeyaasha xawaaraha sare leh.
Tilmaamaha Farsamada iyo Hawlaha:
Saxeexa Sare ee Servo Driven Precision Heads: 14 saxan sare ah (mikroroon-hoosaad X, Y, Z) madax-doorasho-servo-driven.
Is-waafajinta Aragga: 100% hore u-door aragga iyo toosinta dhinta.
Bedelka hal-tallaabo: Hal-tallaabo wafer-to-uge beddelidda.
Habaynta xawliga sare leh: Dual wafers oo leh ilaa 16K wafers saacaddii (chip flip) iyo 14,400 wafers saacadiiba (aan lahayn chip flip).
Habaynta cabbirka weyn: Cabbirka farsamaynta substrate-ka ugu badan waa 635mm x 610mm, iyo cabbirka wafer-ka ugu badan waa 300mm (12 inji).
Kala duwanaansho: Waxay taageertaa ilaa 52 nooc oo chips ah, beddelka aaladda tooska ah (nozzle iyo biinanka ejector), iyo cabbirrada u dhexeeya 0.1mm x 0.1mm ilaa 70mm x 70mm.
Tilmaamahani waxay muujinayaan waxqabadka sare ee Universal Fuzion die mounter marka loo eego saxnaanta, xawaaraha iyo awooda farsamaynta, ku haboon noocyada kala duwan ee chip iyo substrate, iyo dabacsanaan sare
