universal pick kunye nendawo machine Fuzion

Iinkcukacha ze-Universal Instruments Universal Fuzion Chip Mounter zimi ngolu hlobo lulandelayo:

Ukuchaneka kokubekwa kunye nesantya:

Ukuchaneka kokubekwa: ± 10 micron ukuchaneka okuphezulu, <3 micron ukuphindaphinda.

Isantya sokubeka: Ukuya kuthi ga kwi-30K cph (ii-wafers ezingama-30,000 ngeyure) kwizicelo zokunyuka komphezulu kunye nokuya kuthi ga kwi-10K cph (ama-wafers angama-10,000 ngeyure) yokupakishwa okuphezulu.

Ukuqhubekeka kweSakhono kunye noMda weSicelo:

Uhlobo lweChip: Ixhasa uluhlu olubanzi lweetshiphusi, iichips flip, kunye noluhlu olupheleleyo lweesayizi ze-wafer ukuya kuthi ga kwi-300 mm.

I-Substrate Type: Ingabeka kuyo nayiphi na i-substrate, kuquka ifilimu, i-flex, kunye neebhodi ezinkulu.

Uhlobo lwe-Feeder: Iintlobo ngeentlobo ze-feeders zingasetyenziswa, kubandakanywa i-wafer feeders enesantya esiphezulu.

Iimpawu zobuGcisa kunye neMisebenzi:

I-High-Precision Servo Driven Pick Heads: I-14 echanekileyo ephezulu (i-sub-micron X, Y, Z) i-servo-driven pick heads.

Ulungelelwaniso lombono: I-100% yokukhetha umbono kunye nokulungelelanisa ukufa.

Inyathelo elinye lokutshintshela: Inyathelo elinye le-wafer-to-mount switching.

Ukusetyenzwa kwesantya esiphezulu: Iiplatifti zewafer ezimbini ukuya kuthi ga kwi-16K ngeyure (flip chip) kunye ne-14,400 yewafers ngeyure (akukho flip chip).

Ukusetyenzwa kwesayizi enkulu: Ubungakanani bobungakanani be-substrate yokusetyenzwa yi-635mm x 610mm, kwaye ubukhulu besayizi ye-wafer yi-300mm (i-intshi eziyi-12).

I-Versatility: Ixhasa ukuya kwii-52 iintlobo zeetshiphusi, utshintsho lwesixhobo oluzenzekelayo (i-nozzle kunye nezikhonkwane ze-ejector), kunye nobukhulu obuvela kwi-0.1mm x 0.1mm ukuya kwi-70mm x 70mm.

Ezi nkcukacha zibonisa ukusebenza okuphezulu kwe-Universal Fuzion die mounter ngokubhekiselele kokuchaneka, isantya kunye namandla okusebenza, alungele iindidi ze-chip kunye ne-substrate, kunye nokuguquguquka okuphezulu kunye nokuguquguquka.