universal okulonda n'okuteeka ekyuma Fuzion

Ebikwata ku Universal Instruments Universal Fuzion Chip Mounter bye bino wammanga:

Obutuufu bw’okuteeka n’Obwangu:

Obutuufu bw’okuteeka: ±10 micron obutuufu obusinga obunene, < 3 micron repeatability.

Sipiidi y’okuteeka: Okutuuka ku 30K cph (wafers 30,000 buli ssaawa) ku nkola eziteekebwa ku ngulu ate okutuuka ku 10K cph (wafers 10,000 buli ssaawa) ku kupakinga okw’omulembe.

Obusobozi bw’okukola n’obunene bw’okukozesebwa:

Ekika kya Chip: Kiwagira chips ez’enjawulo, flip chips, ne wafer sizes ezijjuvu okutuuka ku mm 300.

Ekika kya Substrate: Kisobola okuteeka ku substrate yonna, omuli film, flex, n’embaawo ennene.

Ekika ky’ekiliisa: Ebiliisa eby’enjawulo bisobola okukozesebwa, omuli n’eby’okuliisa wafer eby’amaanyi.

Ebintu eby’ekikugu n’emirimu:

Emitwe gya Pick egya Servo egy’obutuufu obw’amaanyi: Emitwe gya pick 14 egy’obutuufu obw’amaanyi (sub-micron X, Y, Z) egya servo-driven.

Vision Alignment: 100% nga tonnalonda okulaba n’okufa.

Okukyusa omutendera gumu: Okukyusa wafer-to-mount mu mutendera gumu.

Okukola ku sipiidi ey’amaanyi: Enkola za wafer bbiri nga zirina wafers eziwera 16K buli ssaawa (flip chip) ne wafers 14,400 buli ssaawa (tewali flip chip).

Okulongoosa mu sayizi ennene: Sayizi esinga okulongoosa substrate eri mm 635 x mm 610, ate sayizi ya wafer esinga obunene eri mm 300 (yinsi 12).

Okukola emirimu mingi: Ewagira ebika bya chips ebiwera 52, okukyusa ebikozesebwa mu ngeri ey’otoma (nozzle ne ejector pins), ne sayizi okuva ku 0.1mm x 0.1mm okutuuka ku 70mm x 70mm.

Ebiwandiiko bino biraga omulimu ogw’oku ntikko ogwa Universal Fuzion die mounter mu butuufu, sipiidi n’amaanyi g’okukola, esaanira ebika bya chip ne substrate eby’enjawulo, era ng’erina okukyukakyuka okw’amaanyi n’okukola ebintu bingi