asm ad838 die bonder

Uthotho lwe-AD838 lwe-ASMPT luluhlu lwe-die bonder olwaziwayo ngokubanzi, olukhawulezayo, noluchanekileyo; luye lwaba yimodeli yakudala, ngakumbi kwicandelo lokupakisha le-LED. Nangona kukho iimodeli ezintsha ezihlala zivela, luhlala lukhetho oluthandwayo kubavelisi abaninzi—ingakumbi xa bevavanya ukusebenza kakuhle kweendleko okanye ukwandisa amandla emveliso.

Isishwankathelo seModeli yothotho lwe-AD838

I-AD838 ayilohlobo olunye kodwa luluhlu. Ukuqonda iintlobo ezithile kunceda ekufaniseni ngokuchanekileyo izixhobo neemfuno.

Iimpawu AD838 AD838L-G2 AD838L-Plus

Imeko yeMveliso Ayiqhubeki Imodeli entsha; ngoku iyaveliswa Imodeli entsha; ngoku iyaveliswa

Iindawo zoSetyenziso Ii-IC eziqhelekileyo, izixhobo ezizimeleyo, njl. I-LED ethile I-LED ethile; ibandakanya amandla e-Flip Chip

Ukuchaneka kokubekwa ±3μm ±10μm ±15μm (ukhetho lokuseta ngokuchanekileyo okuphezulu)

I-UPH (Umphumo) Kuxhomekeke kwinkqubo Ukuya kuthi ga kwi-14,000 iiyunithi/iyure Uyilo lwentloko yokubopha oluphezulu (olunelungelo elilodwa lomenzi)

Ubungakanani beDie 0.1mm – 10mm 0.15mm – 2.03mm Ayichazwanga ngqo

Ubungakanani beSubstrate/Panel Ayichazwanga ngqo Ubude 60–300mm, Ububanzi 60–100mm Ubuninzi. 300mm x 100mm

Ukuphathwa Okuncamathelayo Ixhasa intlama yesilivere, i-epoxy, i-DAF Ukusasazwa kabini (kuxhasa ukusasazwa kwamachaphaza kunye nomgca) Ayichazwanga ngqo

Qaphela: Iiparameter ezifana ne-UPH (iiyunithi ngeyure) kunye nokuchaneka zinokwahluka ngokusekwe kwiimeko zenkqubo kunye neenkcukacha ze-die/substrate. Idatha engentla imele amaxabiso aqhelekileyo kwaye yeyereferensi kuphela.

Iiteknoloji eziphambili kunye neengongoma eziphambili zokusebenza

Ukuchaneka Okuphezulu kunye nokuGuquka: Esi sixhobo sinikezela ngokuchaneka okuphezulu kokubekwa kwe-±3μm @ 3σ. Inkqubo yaso yokulungelelanisa umbono ilawulwa yisoftware, ivumela uqwalaselo oluguquguqukayo olusekelwe kwiimo ezahlukeneyo zedayi, iipolarities, kunye neepatheni zesekethe.

Ukuhambelana kweNkqubo eQolileyo: Iyahambelana nezinto ezahlukeneyo zokuncamathelisa, kubandakanya intlama yesilivere, i-epoxy, kunye ne-DAF (i-Die Attach Film). Le nkqubo isebenzisa itekhnoloji yokukhupha izinto ezimbini, kwaye iimodeli ezifana nothotho lwe-AD838L zikwaxhasa ukupakishwa kwe-Flip Chip ephezulu. Iimpawu zokhuseleko eziqinisekisa uzinzo lwenkqubo: Ezi zixhobo zixhotyiswe ngeendlela ezininzi zokhuseleko—ezifana nezinzwa zoxinzelelo, ukhuseleko lobushushu obugqithisileyo, kunye nee-alamu ezivakalayo nezibonakalayo—ukuqinisekisa ukusebenza okuthembekileyo kwexesha elide.

Izicelo eziPhambili kunye neXabiso leMarike

Ukugubungela ngokubanzi usetyenziso olusezantsi: I-AD838 kunye neendidi zayo zixhasa uluhlu olubanzi lweefomathi zokupakisha, kubandakanya i-QFN, i-TQFP, kunye ne-PLCC. Kwicandelo le-LED, usetyenziso luqala kwi-Chip-Scale Packages (CSP), ii-COB LED, kunye ne-ceramic substrates ukuya kwi-RGB packaging, ngelixa lukwafikelela kwiiteknoloji eziphambili ezifana ne-SiP (System-in-Package), i-MCM (Multi-Chip Module), i-BGA (Ball Grid Array), kunye ne-CSP (Chip-Scale Package).

Ubuninzi bemali kwimarike kunye nexabiso eliqinileyo eliseleyo: Uthotho lwe-AD838 luhlala lusebenza kakhulu kwimarike yesibini; ukukhangela i-"ASM AD838" kuvelise uluhlu oluninzi lokuthenga nokuthengisa. Iiyunithi ebezisebenza kangangeminyaka engaphezu kweshumi zisasebenza kwimveliso esebenzayo kunye nokujikeleza.

Ukuvuthwa kobuchwepheshe kunye nabasebenzi abanezakhono: Iminyaka yokusetyenziswa ngokubanzi ikhuthaze iqela elikhulu labasebenzi abanezakhono ekusebenzeni nasekugcinweni kwe-AD838. Kukho inqwaba yeencwadi zokusebenza kunye nezifundo zobugcisa ezifumaneka kwimarike, nto leyo eyenza kube lula ukuthunyelwa kunye nokugcinwa.

Lilonke, ngenxa yetekhnoloji yayo evuthiweyo, ukuguquguquka okumangalisayo, kunye nemarike yesibini esebenzayo, uthotho lwe-AD838 luhlala lukhetho olunomtsalane kwimigca yemveliso yokupakisha.