i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Izixhobo zokubopha intambo ze-semiconductor sisixhobo esibalulekileyo sokupakisha iitship, ukudibanisa ii-electrode ze-chip ngokwasemzimbeni kwiifreyimu ze-lead okanye ii-substrates ngeentambo zesinyithi ezicolekileyo kakhulu—ezifana negolide, i-aluminium, okanye ubhedu. Le nkqubo yokuvelisa i-microelectronics eyinkimbinkimbi idibanisa amandla e-ultrasonic, uxinzelelo, kunye nobushushu ukuze kufezekiswe ukuchaneka okunamandla kwinqanaba le-micron kunye nokudluliselwa kwesignali yombane okuzinzileyo. Inkqubo yokubopha intambo ngokuyintloko isebenzisa iindlela zokubopha i-wedge kunye ne-ball bonding, ixhomekeke kakhulu kwiinkqubo ezisezantsi eziphambili kubandakanya iyunithi yokulawula ukuhamba okuchanekileyo, ijeneretha ye-ultrasonic, kunye nenkqubo yombono we-microscopic ukuxhasa ububanzi beentambo ukusuka kwi-18 ukuya kwi-100μm.
Njengomthengisi wezoshishino oqeqeshiweyo, i-GEEKVALUE ibonelela ngekhathalogu epheleleyo yeeMashini zeBonder zeWire ezintsha, ezisetyenzisiweyo nezihlaziyiweyo zokupakisha i-Semiconductor kunye neMicroelectronics Manufacturing. Ngenxa yoluhlu lwethu olubanzi lweebhrendi eziphambili kwihlabathi liphela (ezifana ne-K&S kunye ne-ASM) kunye nokuhlolwa kobunjineli obunezinyathelo ezisi-8 kunye ne-SOP yokuhlaziya, izixhobo zethu ze-wire bonding zibonelela ngemilinganiselo yeendleko-yokusebenza engenakunqotshwa, ukuthembeka okugqwesileyo, kunye nokuguquguquka kwesicelo ukuhlangabezana neemfuno eziphezulu zeefektri zokupakisha zehlabathi zanamhlanje.
I-KAIJO FB-x26 ngumatshini wokubopha ucingo olushushu olusebenza ngokuzenzekelayo olusebenza kwindawo ebanzi, oluchanekileyo noluzenzekelayo oluqaliswe yi-KAIJ...
Jonga isitokhwe kunye nexabiso
I-KAIJO FB-i28 yintambo yokubopha eshushu ye-ultrasonic esebenza ngesantya esiphakathi ukuya phezulu, echanekileyo kakhulu, ezenzekelayo ngokupheleleyo kwi-thermal ultrasonic wire bonding...
Jonga isitokhwe kunye nexabiso
I-KAIJO FB-e20N yi-welding ye-thermo-ultrasonic ball welding/wedge ekhawulezayo kakhulu, echanekileyo kakhulu, ezenzekelayo ngokupheleleyo...
Jonga isitokhwe kunye nexabiso
I-ASM Wire Bonder AB550 yi-high performance ultrasonic bonder bonder enemisebenzi emininzi ephezulu kunye neempawu
Jonga isitokhwe kunye nexabiso
I-ASM Eagle Aero Reel to Reel ngumatshini wokubopha intambo osebenza kakuhle owenzelwe ukupakisha kunye nokuvavanya i-semiconductor...
Jonga isitokhwe kunye nexabiso
Iimpawu●Ubuchule bokubopha ucingo oluncinci, olukhethekileyo kwiimveliso zokupakisha eziphambili●Umatshini wokuwelda ojikelezayo ochanekileyo kakhulu...
Jonga isitokhwe kunye nexabiso
Iimpawu● Uphuculo lwe-30% UPH●Usetyenziso olusekelwe kwintambo yobhedu eqhelekileyo●Ibhola yesolder ye-22μm●Izakhono zobungcali, ibhola yesolder ingaba...
Jonga isitokhwe kunye nexabiso
Iimpawu● Ubuchule bokubopha ucingo olukhawulezayo● 1588 (imigca eli-128) umthamo weyure: imigca engama-21,500+ ● Iinombolo eziphindwe kabini ezinemilo esibhozo...
Jonga isitokhwe kunye nexabiso
Iimpawu●Inkqubo yokubopha ucingo olukhawulezayo oluhambelana ne-LED ●Uyilo olutsha lwehardware, kulula ukuyigcina ●Isisombululo esiphezulu se-weld...
Jonga isitokhwe kunye nexabiso
Iimpawu Ukusebenza kakuhle kakhulu●I-UPH inyuswe ukuya kuthi ga kwi-30%●Kwizicelo zendabuko zentambo yobhedu●Ubungakanani bebhola ukuya kuthi ga kwi-22 μm●P...
Jonga isitokhwe kunye nexabiso
I-Eagle AERO sisixhobo sokuvelisa i-semiconductor esibonisa iteknoloji evuthiweyo kunye nokusetyenziswa okubanzi.
Jonga isitokhwe kunye nexabiso
Uthotho lwe-ICONN oluvela kwi-K&S (Kulicke & Soffa) lucingo oluzenzekelayo olusebenzisa i-wire bonder oluneteknoloji evuthiweyo kunye ne-p...
Jonga isitokhwe kunye nexabiso
I-K&S IConn PLUS yintambo yokubopha eyaziwayo, ezenzekelayo ngokupheleleyo, ephakathi ukuya phezulu kwiphakheji ye-semiconductor...
Jonga isitokhwe kunye nexabiso
Umatshini wokubopha iingcingo we-KS MAXUM PLUS ngumatshini wokubopha iingcingo ozenzekelayo ngokupheleleyo, osetyenziselwa ikakhulu ukuwelda i-lead yangaphakathi...
Jonga isitokhwe kunye nexabiso
I-KS Wire Bonder 8028PPS ngumatshini wokubopha intambo ozenzekelayo ngokupheleleyo, osetyenziswa kakhulu kwicandelo lezixhobo zokupakisha ze-LED. ...
Jonga isitokhwe kunye nexabiso
I-KAIJO-FB900 ngumatshini wokubopha ucingo lwegolide ozenzekelayo ngokupheleleyo, osetyenziselwa ikakhulu ukubopha ucingo lwegolide kwimveliso yokupakisha ye-LED...
Jonga isitokhwe kunye nexabisoIinjineli zethu ezingoochwephesha zibonelela ngenkxaso epheleleyo kuzo zonke iimatshini zokubopha iintambo. Ukususela ekufakweni ukuya ekulungisweni, siqinisekisa ukuba umgca wakho wemveliso usebenza ngokufanelekileyo nangokuthembekileyo.
Ukufakelwa kwindawo okanye kude kunye nokulinganiswa ngokuchanekileyo koomatshini bonder be-wire ukuhlangabezana neemfuno zakho zemveliso.
Ukugcinwa rhoqo kunye nokusombulula iingxaki ngobuchule ukuze kuncitshiswe ixesha lokungasebenzi kunye nokwandisa ixesha lokusebenza kwezixhobo.
Iinjineli zethu zinceda ukuphucula inkqubo yakho yokubopha ucingo ukuphucula isivuno, ukunciphisa iziphene, kunye nokuphucula ukusebenza kakuhle kwemveliso.
Uncedo lobuchwephesha olukhawulezileyo ngevidiyo, ifowuni, okanye uqhagamshelo olukude ukuze kusonjululwe ngokukhawuleza naziphi na iingxaki zokusebenza.
Ukufikelela ngokukhawuleza kwiindawo ezibalulekileyo kunye nezinye izinto ezitshintshiweyo ukuze ugcine i-wire bonder yakho isebenza ngaphandle kokuphazamiseka.
Uqeqesho lobuchwephesha kubaqhubi kunye neengcali ukuqinisekisa ukusetyenziswa ngokuchanekileyo kunye nokugcinwa kwazo zonke iimatshini.
Ukujikajika kwimarike yezixhobo ze-semiconductor kufuna ukulinganisela ukusebenza okuphezulu kunye nolawulo olungqongqo lweendleko. I-GEEKVALUE ivala lo msantsa ngokubonelela ngee-wire bonders ezintsha nezihlaziyiweyo ezicwangciswe ngokuchanekileyo ezidityaniswe kakuhle kwimigca yakho yokupakisha, zixhaswa luhlengahlengiso oluqinisekisiweyo kunye nobonelelo oluthembekileyo lwezixhobo zexesha elide.
Funda nzulu→
Izicelo ezahlukeneyo zokubopha intambo zifuna amaqonga oomatshini ahlukeneyo. I-GEEKVALUE inceda abathengi ukuba bafanise izixhobo ezifanelekileyo ngokusekelwe kwindlela yokubopha, izinto zokubopha intambo, ubungakanani bemveliso kunye nohlahlo-lwabiwo mali.
Yenzelwe ukupakishwa kwe-semiconductor ephezulu, imveliso ezinzileyo kunye nomgangatho ohambelanayo wokubopha.
Ukhetho oluguquguqukayo lwemveliso ephakathi, iiprojekthi zobunjineli kunye nokuveliswa kwemveliso exutyiweyo.
Ifanelekile kwi-R&D, iilebhu, i-prototyping, uvavanyo lweesampuli kunye nemisebenzi yokubopha engabizi kakhulu.
Isetyenziswa kakhulu kwi-bonding yegolide neyobhedu kwi-IC packaging nakwi-microelectronics.
Isetyenziswa rhoqo kwi-aluminium wire, izixhobo zamandla, ii-RF modules kunye nezicelo zokubopha ezithembeke kakhulu.
Yakhelwe izixhobo zombane, iimodyuli zeemoto kunye neemfuno zokubopha ucingo oluqinileyo.
Ukubopha ngocingo kudala unxibelelwano lombane phakathi kwe-semiconductor die kunye nephakheji. Le nkqubo ifuna indawo echanekileyo, amandla okubopha azinzileyo kunye nolawulo lweluphu oluphindaphindwayo.
Lungisa idayisi, iphakheji, isiseko okanye ifreyimu yelothe ukuze ibotshelelwe.
Faka igolide, ubhedu okanye ucingo lwe-aluminiyam kwisixhobo sokubopha.
Yenza ibhondi yokuqala kwi-die pad ye-semiconductor.
Lawula ubude bentambo, imilo kunye nendlela yokujikeleza.
Qhagamshela ucingo kwi-package lead okanye kwi-substrate pad.
Jonga amandla ebhondi, imo yeluphu kunye nomgangatho woqhagamshelo lombane.
Ii-wire bonders zisetyenziswa kakhulu kwi-semiconductor, microelectronics kunye namashishini okupakisha aphucukileyo.
I-IC, i-CPU, imemori kunye nokuhlanganiswa kwephakheji ephucukileyo.
Uqhagamshelo lombane kwiipakethe zesekethe ezidibeneyo.
Imveliso ye-LED chip bonding, izibane kunye ne-display module.
Iimodyuli ze-IGBT, MOSFET, SiC, GaN kunye ne-power semiconductor.
Iisensors, izixhobo ezincinci kunye neemodyuli ze-elektroniki ezichanekileyo.
Izixhobo zeRF, iimodyuli ezingenazingcingo kunye nezixhobo zonxibelelwano.
I-ECU, ii-sensors, iimodyuli zolawulo kunye ne-elektroniki ezithembeke kakhulu.
Iimodyuli ze-optical, izixhobo ze-laser kunye nezixhobo ze-photonic.
Oomatshini bethu bokulungisa iintambo zocingo abahlaziyiweyo bavavanywa ngokupheleleyo, balinganiswa, kwaye bahlolwa ziinjineli ezinamava ukuqinisekisa ukusebenza okuthembekileyo. Gcina ukuya kuthi ga kwi-70% xa kuthelekiswa noomatshini abatsha ngaphandle kokubeka umgangatho esichengeni.
Yonke imashini ehlaziyiweyo ivavanywa ngokuqatha ukuqinisekisa ukusebenza rhoqo kunye nokuthembeka.
Iinjineli ezingoochwephesha zihlola zonke izinto ezibalulekileyo ukuze zihlangabezane nemigangatho yoshishino lwe-semiconductor.
Fumana ii-wire bonders ezikumgangatho ophezulu ngexabiso eliphantsi kunexabiso lezixhobo ezintsha, ezifanelekileyo kwimigca yemveliso emincinci okanye eyandayo.
Sinikezela ngokuhanjiswa kwihlabathi liphela ngepakeji ekhuselekileyo kunye nokuthunyelwa ngokukhawuleza, ngesiqhelo kwiintsuku ezi-3-7.
Izixhobo ezingasetyenziswayo kunye nezinto ezitshintshayo ziyafumaneka ukuze imveliso yakho iqhubeke kakuhle.
Iinjineli zethu zibonelela ngesikhokelo kwindawo okanye kude ukuqinisekisa ukuseta kunye nokulinganisa okufanelekileyo.
Ngaphambi kokuba uthenge i-wire bonder, abathengi kufuneka bajonge amandla oomatshini, indlela yokubopha, ukuhambelana kwezinto ze-wire kunye nokufumaneka kwenkxaso yexesha elide.
I-GEEKVALUE inceda abathengi behlabathi ukusombulula ukufunyanwa kwezixhobo, ulawulo lweendleko, isantya sokuhanjiswa kunye nemingeni yokusebenza kwexesha elide. Asithengisi oomatshini kuphela - sikunceda ukunciphisa umngcipheko wokuthenga kunye nokuphucula ukulungela imveliso.
Fumana isicatshulwa seWire BonderIimpawu ezininzi ze-wire bonder kunye neemeko zomatshini ziyafumaneka.
Iindlela zokuthenga eziguquguqukayo ngokweebhajethi ezahlukeneyo kunye neemfuno zemveliso.
Imeko yomatshini ingajongwa ngaphambi kokuba uthunyelwe kwamanye amazwe.
Ukupakisha impahla kwamanye amazwe kunye nenkxaso yezothutho kubathengi behlabathi liphela.
Inkxaso yezixhobo zexesha elide zokusebenza kwezixhobo ze-semiconductor.
Ukubonisana ngobuchwephesha malunga nokukhethwa kwezixhobo kunye nokuthelekiswa kwemveliso.
Sinikezela ngoomatshini abatsha, abasetyenzisiweyo, nabahlaziyiweyo bee-wire bonder ezivela kwiimpawu eziphambili zezixhobo ze-semiconductor. Iqela lethu linokukunceda ufumane iimodeli ezifanelekileyo, lijonge imeko yomatshini, kwaye linike inkxaso yobugcisa kwiimfuno zemveliso.
Ifanelekile kwiintambo zegolide, ukupakishwa kwe-LED, imveliso ye-SMD LED, kunye nokusetyenziswa okuzinzileyo kweentambo zexesha elide.
Izisombululo ze-wire bonder ezizenzekelayo zokupakisha i-semiconductor, i-IC assembly, kunye nemigca yemveliso ephucukileyo.
Oomatshini bokufaka iintambo abanokuthenjwa bokudibanisa ii-microelectronics, ukupakishwa kwee-semiconductor, kunye nemveliso ephezulu.
Izixhobo zokubopha ezichanekileyo zokupakisha okuphucukileyo, izixhobo zeRF, iisekethe ezixutyiweyo, kunye nezicelo ezikhethekileyo.
Imibuzo eqhelekileyo abathengi abayibuzayo ngaphambi kokuba bathenge izixhobo ze-wire bonder ezitsha, ezisetyenzisiweyo okanye ezihlaziyiweyo.
I-wire bonder ngumatshini wokupakisha we-semiconductor osetyenziselwa ukudala unxibelelwano lombane phakathi kwedayi kunye nephakheji kusetyenziswa ucingo lwesinyithi olucolekileyo.
I-wire bonding isetyenziselwa ukupakisha i-IC, i-LED assembly, izixhobo ze-MEMS, ii-RF modules, ii-power semiconductors kunye nee-electronics zeemoto.
Sinikezela ngee-wire bonders ezizenzekelayo, ii-ball bonders, ii-wedge bonders, ii-heavy wire bonders kunye nezixhobo ze-wire bonding ezilungisiweyo.
Ewe, sinikezela ngee-wire bonders ezihlolwe ngokupheleleyo, ezivavanyiweyo nezilungisiweyo ezisebenza kakuhle kwimigca yemveliso.
I-ball bonding isebenzisa ucingo lwegolide okanye lobhedu ekupakisheni i-IC; i-wedge bonding isebenzisa ucingo lwe-aluminiyam kwizixhobo zamandla kunye nezicelo ezithembekileyo kakhulu.
Izixhobo zentambo eziqhelekileyo ziquka ucingo lwegolide, ucingo lobhedu, ucingo lwe-aluminiyam kunye nocingo olunzima olusetyenziselwa ukusetyenziswa kwe-power semiconductor.
Iibondi ezintsha zentambo zilungele imveliso enkulu yexesha elide; ezo zihlaziyiweyo zibonelela ngexabiso eliphantsi, ukuhanjiswa ngokukhawuleza kunye nokusebenza okuthembekileyo.
Ewe, sinikezela ngokupakisha kwamanye amazwe, uthutho lobuchwephesha kunye nokuhanjiswa kwihlabathi liphela kuzo zonke iimatshini zokubopha iintambo.
Sinikezela ngokufakela, ukulinganisa, uqeqesho kunye nenkxaso yexesha elide emva kokuthengisa kwezixhobo zokubopha ucingo.
Cinga ngendlela yokubopha, uhlobo lwentambo, ukusetyenziswa, ukuchaneka, i-UPH, uhlahlo lwabiwo-mali, ukuhanjiswa kunye nenkxaso yobugcisa emva kokuthengisa.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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