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Funa Quote →Tokakasa nkola ki eya die attach ekwatagana n'ekintu kyo? Tandika ne epoxy, soft solder oba eutectic bonding, olwo geraageranya ebyuma ebitegekeddwa enkola eyo.
Amakubo ga epoxy geesigamye ku kugaba n’okufuga bond-line, ate amakubo ga soft solder ne eutectic gateeka obuzito bungi ku solder presentation, thermal control ne atmosphere. Enjawulo zino ze zisalawo enkola ki essiddwawo esaanira okwekenneenya.
Amakubo ag’okusiiga agajjudde epoxy ne ffeeza ga bulijjo ng’ebintu birina okugabibwa nga tebinnaba kuteekebwa. Ekibuuzo eky’omugaso si kyokka oba ekyuma kisobola okuteeka die, wabula oba ensengeka yaakyo ey’okugaba, okukwata emirimu n’okuwonya esobola okukuuma layini ya bond ekintu kyo kye kyetaaga.
Laba ekirungo ekikiikirira epoxy die bonder: ASMPT AD832iSoft solder projects zisinziira ku bintu ebisinga ku heated bond stage. Ekyuma kirina okwanjula solder obutakyukakyuka, okufuga thermal profile n’okukwata substrate awatali kutaataaganya kiyungo oba okuleeta obucaafu.
Laba ekiikirira soft solder die bonder: ASMPT SD8312Eutectic bonding ereeta ebbugumu, empalirizo, empewo n’okukwatagana mu cycle y’emu efugibwa. Ebiseera ebisinga ye nkola essiddwawo, okusinga erinnya ly’omusingi lyokka, erisalawo oba ekyuma kye kifo ekituufu.
Laba ekyuma ekikiikirira eutectic die bonder: ASMPT AD211 PlusTandika n’ebyuma ebiwandiikiddwa mu kiseera kino All-SMT, olwo oggulewo empapula z’omulembe ezikwatagana olabe ebifaananyi, amawulire agaliwo n’ebikwata ku kubuuza.
Epoxy, soft solder oba eutectic okulonda kuteekawo obulagirizi bw’enkola. Embeera zino ez’ebintu n’okufulumya olwo ne zitegeeza omutendera gw’okukwatagana n’ekyuma kye gulina okukakasa ku byuma ebituufu.
Die entono, okugumiikiriza okuteeka okunywevu n’okufuga okulungamya okusaba ennyo birongoosa ebyetaago by’okuteeka n’okulaba mu kkubo ery’okugatta eryalondeddwa.
Fiducials, die presentation, substrate variation n’obwetaavu bw’okukebera bitegeeza ebibuuzo by’okutegeera n’okufuga enkola olw’okuddamu okwetegereza ekyuma.
Engeri die ne substrates gye ziyingira mu nkola etegeeza okutikka, indexing, workholding ne tooling ebirina okubaawo ku quoted unit.
Embeera z’okufulumya eby’okulabirako, ebitabuddwa n’obungi ziteekawo ebisuubirwa eby’enjawulo ku kukyukakyuka, obujulizi bw’enzirukanya n’okukwata okugatta.
Flip chip ekozesa ekkubo ly’ebyuma ery’enjawulo nga lirina bump alignment, force, temperature ne interconnect control. Kikebere ng’oyita mu kiti ekiweereddwayo okusinga okukitwala nga die attach eya bulijjo.
Ebigambo bino bitera okukozesebwa okusiba ekifa kya semikondokita ku substrate, lead frame, carrier oba package. Ekkubo ly’ebyuma ettuufu likyasinziira ku nkola y’okugattako n’ensengeka eyeetaagisa ku kintu.
Platforms ezimu zisobola okuwagira process family ezisukka mu emu, naye ekyo tekitegeeza nti buli kyuma kitegekeddwa ku byonna ebisatu. Kebera omutwe gw’okusiba oguteekeddwamu, ebintu n’enkola y’ebbugumu, awamu n’ebikozesebwa ebikwatagana, pulogulaamu n’ensengeka y’okukwata.
Okusalawo kisinziira ku kutabula ebintu, obungi obusuubirwa, emirundi gy’okukyusaamu, enkola y’okukwata n’obwetaavu bw’okugatta. Omukutu ogw’obuzito omungi guyinza okukulembeza obudde bw’enzirukanya n’okukola otomatiki eyeetongodde, ate omukutu ogukyukakyuka guyinza okuba omulungi ku bintu ebitabuddwa, enkulaakulana oba enkyukakyuka mu kuteekawo enfunda eziwera.
Tokoma ku linnya lya model oba ku mutwe gwa bonding. Kakasa enkola essiddwawo, pulogulaamu, enkwata, ebikozesebwa, embeera y’ekyuma n’obuwanvu bw’okutuusa, kubanga omukutu ogusaanira guyinza okuba nga gukyalina okuddamu okusengekebwa nga tennasobola kuddukanya kintu kyo.
Gabana sayizi yo eya die, carrier oba substrate, attach material, enkola y’okukwata n’ekifulumizibwa ekigendererwa. Tujja kwetegereza ebyuma ebiriwo, okuzuula abasinga okubeera okumpi n’okulaga ensonga z’okusengeka ezikyalina okukakasibwa.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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