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Test Handler Machine
ASM Pacific Technology Turret Wafer Level Test System SUNBIRD
SUNBIRD provides an efficient, reliable and flexible wafer testing solution for the semiconductor industry through innov...
Machine Structure & Configuration
Test Handler Machines: Structure, Modules and Configuration
A test handler machine is a coordinated automation platform built around the physical path of the semiconductor device. Its infeed, motion, temperature-control, contact, inspection, sorting and output modules must work together with the IC package, semiconductor tester and production process. Review current machines and the installed hardware that determines whether a platform can be converted for another package or test line.
A Typical Test Handler Machine Is Divided into Functional Zones
The sequence and installed hardware vary by machine architecture.
These are the physical areas buyers normally need to identify
before comparing configurations.
01 / INFEED
Load the Device
Tray, tube, bowl, strip, film frame or another input system.
02 / ORIENT
Identify and Align
Vision, rotation, marking and device-orientation stations.
03 / THERMAL
Condition the Device
Ambient, hot, cold or controlled-temperature handling hardware.
04 / TEST SITE
Present to Contact
Motion, force, socket, contactor and tester-interface modules.
05 / SORT
Route by Result
Bin mapping, reject handling and optional inspection or marking.
06 / OUTPUT
Return to Media
Tray, tube, reel, carrier or another downstream packaging format.
Current Equipment
Available Test Handler Machines
Browse the machines currently assigned to this category. A platform may support several package or temperature options, but the usable configuration depends on the installed infeed, conversion kit, thermal system, test-site hardware, software and output modules.
Test Handler Machine
ASM MS100 Plus test handler
As an upgraded version of the MS100, the ASM MS100 Plus is also a device for chip sorting and arrangement based on wafer...
Test Handler Machine
ISMECA test handler NY20
The ISMECA NY20 (now owned by Cohu) is a 20-station rotary ultra-high-speed semiconductor testing and sorting machine
Test Handler Machine
ASMPT sorting machine MS90
ASM sorting machine MS90 is a device designed for lamp bead sorting, with efficient and accurate sorting functions. This...
Mechanical Layout
The Device Path Determines How the Machine Is Built
Two machines may both be described as semiconductor test handlers while using different motion systems, footprints and package-conversion hardware. The correct mechanical layout is the one that moves the target device reliably through the required contact, inspection and output sequence.
LINEAR MOTION
Pick-and-Place Machine
TRAY / INPUT
→
ROBOT
→
TEST SITE
→
OUTPUT
Controlled robotic transfer moves devices between defined stations. Buyers should inspect axes, nozzles, nests, tray elevators, contact force and test-site alignment.
ROTARY INDEX
Turret Test-and-Finish Machine
INFEED
→
→
TAPE / BIN
Devices are indexed through several stations around a rotary platform. The condition of the turret, pick heads, indexing mechanism, vision and finishing modules is central to machine evaluation.
TRACK MOTION
Gravity or Tube-Fed Machine
TUBE
→
TRACK
→
CONTACT
→
BINS
Track geometry and controlled device movement guide compatible packages to the contact site. Package dimensions, lead shape, friction, thermal expansion and jam-free transport become critical mechanical checks.
CARRIER INDEX
Strip or Film-Frame Machine
STRIP / FRAME
→
INDEX
→
MULTI-SITE
→
MAP / OUTPUT
Devices remain in a strip, substrate or frame during testing. The machine must match the carrier dimensions, pitch, indexing method, contact interface and post-test mapping.
Machine Anatomy
Installed Hardware Defines the Real Machine Capability
A brochure normally describes the platform family, but an operating test handler is defined by the modules installed on the individual machine. These are the areas to inspect before assuming that the equipment can run another IC package, tester interface or temperature program.
Infeed and Media Handling
Tray elevators, tubes, bowls, tracks, strips and film frames determine how devices enter the machine and whether their orientation can be maintained.
Robots, Turrets and Transfer Axes
Servo axes, bearings, belts, encoders, pick heads, vacuum paths and rotary mechanisms affect placement accuracy, cycle stability and mechanical wear.
Orientation and Inspection
Cameras, lighting, optics and software recipes may verify device orientation, package marks, edges, lead condition or position before and after test.
Heating, Cooling and Soak
Thermal chambers, plates, airflow, chillers, heaters, dry-air and nitrogen systems influence temperature stability, recovery time and actual throughput.
Test Site and Force Control
The test head, HIFIX or docking interface, contactor, socket, site count and force mechanism must align mechanically with the semiconductor tester.
Bin, Marking and Output Modules
Electrical results must be mapped to trays, tubes, reels, bins or reject positions, while optional marking, inspection and traceability depend on the installed modules.
Package Changeover
Changing the Product Usually Requires More Than a New Recipe
Running a new IC package on an existing test handler normally involves mechanical, electrical, thermal and software changes. The machine model alone does not confirm that the required conversion parts, test interface or software options are included.
Request the installed change-kit and interface part numbers before
treating a used test handler machine as ready for another package.
Confirm the Physical Package
Review the package dimensions, body thickness, leads or balls, weight, orientation marks and input or output media used by the production line.
Replace Product-Specific Handling Parts
Tracks, nests, trays, nozzles, precisors, guides, pockets, rails or carrier tooling may need to change with the semiconductor device.
Match the Test Interface
Check the socket or contactor, HIFIX, docking direction, test-site count, contact force and connection to the existing semiconductor tester.
Rebuild Vision, Thermal and Sorting Settings
Orientation, inspection thresholds, temperature control, soak sequence, bin mapping and output handling must be configured for the new product.
Calibrate and Run Conversion Samples
Confirm pickup, movement, contact, temperature, tester communication, output position and package-damage risk before production release.
Inspect the Machine as a Mechanical System, Not Only as a Model Number
Used and refurbished test handler machines can differ substantially in wear, installed options, calibration status and included conversion hardware.
Axes, Turret, Tracks and Pick Heads
Check repeatability, vibration, abnormal noise, backlash, belt and bearing condition, collision history and available service records.
Pickup Stability and Air Circuits
Inspect vacuum generators, valves, tubing, regulators, cylinders, leakage and the stability of device pickup and release.
Chiller, Heater and Temperature Control
Confirm the installed modules, operating range, refrigerant or gas requirements, alarms, sensors and calibration status.
Docking, HIFIX, Contactor and Force
Verify which interface components are included and whether they match the intended tester, test head, socket and site layout.
PC, PLC, Motion, Software and Licenses
Confirm software versions, option licenses, recipe backups, industrial PC condition, communication protocols and available manuals.
Change Kits, Tooling and Spare Parts
List all included nozzles, tracks, trays, nests, sensors, cables, boards and product-specific conversion components.
Factory Integration
A Suitable Test Handler Must Also Fit the Production Floor
Before shipment or line planning, confirm the practical installation conditions around the machine. Footprint and utility requirements can change with the thermal equipment, input and output modules, tester docking arrangement and service-access requirements.
Floor and Access
Machine dimensions, weight, maintenance clearance, door width, lifting points and rigging plan.
Electrical
Voltage, phase, frequency, power capacity, grounding and transformer requirements.
Air and Vacuum
Compressed-air quality, pressure, flow, dry air, nitrogen and external vacuum requirements.
Thermal Utilities
Chiller, cooling water, exhaust, refrigerant, LN₂ or other temperature-control support.
Tester Connection
Semiconductor tester model, test-head position, docking direction, communication and interlock signals.
Data and Automation
Recipe management, bin data, barcode, MES, host communication and traceability requirements.
Continue the Project
Related Test Equipment and Support
Use these pages when you need the parent test-handler directory, semiconductor final-test context, electrical test equipment or replacement components.
PARENT CATEGORY
→
FINAL TEST
→
ELECTRICAL TEST
→
PARTS & TOOLING
→
IC HANDLING
→
Test Handler Machine Directory
Return to the main category to browse test handler types, current machines and related equipment pages.
Semiconductor Test Handler Systems
Review how handler equipment supports packaged semiconductor final test, temperature conditioning and device sorting.
Semiconductor Tester
Explore equipment that generates electrical stimulus, measures device response and returns the result used for sorting.
Test Handler Parts and Semiconductor Accessories
Find selected boards, motors, sensors, nozzles and replacement components for supported handler platforms.
IC Test Handler Equipment
Continue to equipment and selection content focused on packaged IC handling and final-test applications.
Machine Questions
Test Handler Machine FAQ
Questions focused on physical machine structure, package conversion, installation and used-equipment evaluation.
What modules are normally included in a test handler machine?
A machine may include input-media handling, orientation, vision, robotic or track movement, thermal conditioning, one or more test sites, sorting and output modules. The exact arrangement depends on the machine architecture and installed options.
Can one test handler machine run different package sizes?
Often yes, but another package may require different tracks, trays, nests, nozzles, guides, vision settings, sockets, contactors and test-site parameters. Confirm both the supported package range and the conversion parts included with the machine.
What is a test handler machine change kit?
A change kit is the set of product-specific mechanical and interface components used to convert a handler for another package or media format. Depending on the machine, it may include tracks, nests, nozzles, precisors, tray components, rails, pockets or carrier tooling.
What should be inspected on a used test handler machine?
Inspect motion and indexing condition, vacuum and pneumatic circuits, thermal modules, test-site force and alignment, tester interface, software and licenses, safety functions, maintenance history, conversion tooling and included spare parts.
Does a test handler machine include the semiconductor tester?
The handler and semiconductor tester are normally separate systems. The handler moves and conditions the device, while the tester performs the electrical measurement. The quotation should state whether the tester, test head, HIFIX, contactor, socket and interface cables are included.
What factory information is needed before installation?
Confirm machine dimensions and weight, the access route, electrical supply, compressed air, vacuum, cooling or thermal utilities, exhaust, tester docking, network communication and the service clearance required around the machine.
Review the Actual Test Handler Machine Before Planning a Conversion
Send the machine model, IC package, semiconductor tester, thermal requirement and production format. We can help identify the installed modules, conversion hardware and integration points that still need confirmation.
