asm Siemens d1 smt pick kwaye ubeke umatshini

I-Siemens SIPLACE D1 ngumatshini wokubekwa kwemodyuli okhawulezayo, ochanekileyo olungele ukwenziwa kombane ophakathi kunye nomthamo omkhulu (njengezinto zombane zabathengi, i-automotive electronics, izixhobo zonxibelelwano, njl.). Isebenzisa iteknoloji yokulawula ukunyakaza okuhamba phambili kunye neenkqubo zombono ngokufanelekileyo nangokuchanekileyo ukubeka amacandelo ahlukeneyo e-SMD (njengama-resistors, capacitors, ICs, njl.).

Imvelaphi yeBrand:

Uchungechunge lwe-Siemens SIPLACE ngoku lukwi-ASM Assembly Systems (phantsi kweQela le-ASMPT), kodwa izixhobo zisasebenzisa i-brand "SIPLACE".

Uthotho lwe-D1 ngomnye woomatshini bokubekwa be-Siemens beklasikhi, eyaziwa ngesantya esiphezulu, ukuguquguquka okuphezulu kunye nokuzinza.

2. UmGaqo wokuSebenza

2.1 Ukuhamba komsebenzi okusisiseko

Ukuma kwePCB: I-PCB ingena kumatshini ngebhanti lokuhambisa kwaye ilungiswe ngesixhobo sokubambelela.

Ukuchongwa kwecandelo: Intloko yokubeka ithatha amacandelo kwi-feeder.

Ukulinganisa okubonakalayo: Iikhamera eziphakamileyo eziphezulu (ICM / FCM) zifumanisa indawo yecandelo, i-angle kunye nobukhulu bokutenxa.

Ukubekwa okuchanekileyo: Imoto yomgca iqhuba intloko yokubeka ukuze ibeke ngokuchanekileyo icandelo kwindawo echaziweyo kwi-PCB.

Ukusebenza ngebhayisekile: Phinda le nkqubo ingentla ide ifakwe yonke ibhodi.

2.2 Itekhnoloji engundoqo

Linear motor drive: nanometer positioning ukuchaneka (±25μm @3σ).

Flying centering (Fly Vision): amacandelo alungelelaniswa ngexesha lentshukumo ukunyusa isantya sokunyuka.

Inkqubo yokutya ehlakaniphile: ixhasa iindlela ezininzi zokutya (ibhanti, ityhubhu, idiski).

3. Iinzuzo eziphambili

Inkcazelo eluncedo

Ukunyuka kwesantya esiphezulu Isantya esiphezulu sinokufikelela kwi-50,000 CPH (kuxhomekeke kuqwalaselo).

Ukuchaneka okuphezulu Ukunyuka ukuchaneka ± 25μm, ukuxhasa amacandelo amancinci angama-01005.

Uyilo lwemodyuli Iintloko ezahlukeneyo zokukhwela (ezifana neentloko ezili-12, iintloko ezili-16) kunye namanani e-feeder angaqwalaselwa.

Ukongezelelwa ngobukrelekrele SIPLACE isoftware yePro ikhulisa ngokuzenzekelayo indlela yokunyuka ukunciphisa ixesha lokutshintsha umgca.

Ukuhambelana okubanzi Ixhasa 01005 ~ 30mm×30mm amacandelo ukulungelelanisa uyilo PCB ezinzima.

4. Iimpawu eziphambili

4.1 Iimpawu ze-Hardware

Intloko yokubeka: uyilo lwe-nozzle emininzi (njengentloko ye-nozzle eyi-12), ixhasa ukutshintsha ngokukhawuleza.

Inkqubo yokutya: inokwandiswa ukuya kwi-200+ feeders, ehambelana ne-8mm ~ 56mm tape.

Inkqubo yombono:

I-ICM (Imodyuli yeKhamera eDityanisiweyo): isetyenziselwa ukulungelelaniswa kwecandelo.

I-FCM (iModyuli yeKhamera eFiducial): isetyenziselwa ukuchongwa kwendawo yesalathiso ye-PCB.

Ulawulo lweMotion: i-linear motor + irula yokugawula, iqinisekisa isantya esiphezulu kunye nokuchaneka okuphezulu.

4.2 Iimpawu zeSoftware

I-SIPLACE Pro: ibonelela ngenkqubo, ukulungelelanisa, kunye nemisebenzi yokubeka iliso.

Ukutshintsha komgca okrelekrele: ixhasa ukutshintshwa kwenkqubo ekhawulezayo kunye nokunciphisa ixesha lokuphumla.

Uhlalutyo lwedatha: irekhodi yokubekwa kwedatha yokulandeleka komgangatho.

5. IiNkcazelo eziqhelekileyo

Iiparamitha zento

Isantya sokubeka i-30,000 ~ 50,000 CPH

Ukuchaneka kokubekwa ±25μm @3σ

Uluhlu lwecandelo 01005 ~ 30mm×30mm

Ubungakanani bePCB Ubuncinci 50mm×50mm, Ubuninzi 510mm×460mm

Umthamo we-Feeder Ubuninzi 200+ (kuxhomekeke kuqwalaselo)

Inkqubo yolawulo SIPLACE Pro

6. Iimpazamo eziqhelekileyo kunye nezisombululo

6.1 Ukungaphumeleli kokuthathwa kweCandelo

Izinto ezinokuba ngunobangela:

Ukuvala uMbhobho/Ukunxiba

Uxinzelelo lweVacuum olunganelanga

Isikhundla se-Feeder Offset

Isisombululo:

Coca okanye ubuyisele umbhobho.

Qwalasela impompo yokufunxa kunye nombhobho womoya ukuba awuvuzi na.

Lungisa kwakhona umxhesho.

6.2 Ukubekwa kwi-offset

Izinto ezinokuba ngunobangela:

Imposiso yoLungiso olubonakalayo

Ukuma kwePCB akuchanekanga

Umbhobho we-Z-axis woBude bempazamo yokuSeta

Isisombululo:

Coca ikhamera kwaye uhlengahlengise inkqubo yombono.

Jonga isixhobo sokubambelela se-PCB kunye nenqaku lesalathisi.

Lungisa iparamitha yobude be-Z-axis.

6.3 I-alam yezixhobo (ezifana ne-"motor overload")

Izizathu ezinokwenzeka:

I-Mechanical jamming (iintsimbi zesikhokelo ezimdaka/izikrufu)

Ukusilela komqhubi

Isisombululo:

Coca kwaye uthambise iindawo ezihambayo.

Qala kwakhona isixhobo. Ukuba i-alam isakhala, qhagamshelana nomvelisi ukuze uyilungise.

6.4 Impazamo yeSoftware (efana ne "Program ayikwazi kulayishwa")

Izizathu ezinokwenzeka:

Umonakalo wefayile yeNkqubo

Ungquzulwano lwenkqubo

Isisombululo:

Qala ngokutsha isoftware okanye isixhobo.

Buyisela inkqubo yogcino okanye ubuyisele inkqubo.

7. Iingcebiso zesondlo kunye nenkathalo

Ulondolozo lwemihla ngemihla:

Coca umbhobho wokufunxa kunye nelensi yekhamera.

Jonga ukuba uxinzelelo lwe vacuum luqhelekileyo.

Ulondolozo lweveki:

Thambisa iileyili zesikhokelo kunye nezikrufu.

Jonga i-motor ye-feeder stepper.

Ulungelelwaniso lwarhoqo:

Yenza ulungelelwaniso oluchanekileyo lwenyanga lwentloko yokubeka kunye nenkqubo ebonakalayo.

8. Amashishini asebenzayo

Ii-elektroniki zabathengi: iiselfowuni, iitafile, iilaptops

Iimoto ze-elektroniki: ECU, abenzi boluvo

Ulawulo lwamashishini: i-motherboard yolawulo lweshishini, i-PLC

Izixhobo zonxibelelwano: Iimodyuli ze-5G, iimodyuli ze-optical

9. Isishwankathelo

I-Siemens SIPLACE D1 ngumatshini wokubeka umgangatho ophezulu ofanelekileyo ngokuchanekileyo, umxube ophezulu wokuvelisa i-elektroniki. Uyilo lwayo lweemodyuli, isoftware yokuphucula ingqiqo kunye nokusebenza okuzinzile kuyenza ibe sisixhobo esingundoqo somgca wokuvelisa we-SMT.

Iingcebiso eziphambili:

Ukugcinwa rhoqo kunokunciphisa izinga lokungaphumeleli.

Ngeengxaki ezinzima, nceda uqhagamshelane nenkxaso yethu yobugcisa.

Ukufumana iinkcukacha ezithe vetshe zeeparitha zobugcisa okanye izikhokelo zokusombulula ingxaki, nceda ubhekisele kwi-SIPLACE D1 Incwadi Yomsebenzisi okanye uqhagamshelane nomthengisi wezixhobo.