asm Siemens d1 smt pick and place machine

Siemens SIPLACE D1 is a high-speed, high-precision modular placement machine suitable for medium and high-volume electronic manufacturing (such as consumer electronics, automotive electronics, communication equipment, etc.). It uses advanced motion control technology and vision systems to efficiently and accurately place various SMD components (such as resistors, capacitors, ICs, etc.).

Brand Background:

Siemens SIPLACE series now belongs to ASM Assembly Systems (under the ASMPT Group), but the equipment still uses the "SIPLACE" brand.

The D1 series is one of Siemens' classic placement machines, known for its high speed, high flexibility and stability.

2. Working Principle

2.1 Basic Workflow

PCB Positioning: The PCB enters the machine through a conveyor belt and is fixed by a clamping device.

Component Picking: The placement head picks up components from the feeder.

Visual Calibration: High-resolution cameras (ICM/FCM) detect component position, angle and size deviation.

Precision Placement: The linear motor drives the placement head to accurately place the component at the specified position on the PCB.

Cyclic operation: Repeat the above process until the whole board is mounted.

2.2 Core technology

Linear motor drive: nanometer positioning accuracy (±25μm @3σ).

Flying centering (Fly Vision): components are calibrated during movement to increase mounting speed.

Intelligent feeding system: supports multiple feeding methods (belt, tube, disk).

3. Core advantages

Advantage Description

High-speed mounting The maximum speed can reach 50,000 CPH (depending on the configuration).

High precision Mounting accuracy ±25μm, supporting 01005 tiny components.

Modular design Different mounting heads (such as 12 heads, 16 heads) and feeder numbers can be configured.

Intelligent optimization SIPLACE Pro software automatically optimizes the mounting path to reduce line change time.

Wide compatibility Supports 01005 ~ 30mm×30mm components to adapt to complex PCB designs.

4. Main features

4.1 Hardware features

Placement head: multi-nozzle design (such as 12-nozzle head), supports fast switching.

Feeding system: can be expanded to 200+ feeders, compatible with 8mm~56mm tape.

Vision system:

ICM (Integrated Camera Module): used for component calibration.

FCM (Fiducial Camera Module): used for PCB reference point identification.

Motion control: linear motor + grating ruler, ensuring high speed and high precision.

4.2 Software features

SIPLACE Pro: provides programming, optimization, and monitoring functions.

Intelligent line change: supports fast program switching and reduces downtime.

Data analysis: records placement data for quality traceability.

5. Typical Specifications

Item Parameters

Placement Speed 30,000~50,000 CPH

Placement Accuracy ±25μm @3σ

Component Range 01005 ~ 30mm×30mm

PCB Size Minimum 50mm×50mm, Maximum 510mm×460mm

Feeder Capacity Maximum 200+ (depending on configuration)

Control System SIPLACE Pro

6. Common Faults and Solutions

6.1 Component Pickup Failure

Possible Causes:

Nozzle Blockage/Wear

Insufficient Vacuum Pressure

Feeder Position Offset

Solution:

Clean or replace the nozzle.

Check the vacuum pump and air pipe for leaks.

Recalibrate the feeder.

6.2 Placement Offset

Possible Causes:

Visual Calibration Error

PCB Positioning Inaccurate

Nozzle Z-axis Height Setting Error

Solution:

Clean the camera and recalibrate the vision system.

Check the PCB clamping device and reference point recognition.

Adjust the Z-axis height parameter.

6.3 Equipment alarm (such as "motor overload")

Possible reasons:

Mechanical jamming (dirty guide rails/screws)

Driver failure

Solution:

Clean and lubricate moving parts.

Restart the device. If the alarm still sounds, contact the manufacturer for repair.

6.4 Software error (such as "Program cannot be loaded")

Possible reasons:

Program file damage

System conflict

Solution:

Restart the software or device.

Restore the backup program or reinstall the system.

7. Maintenance and care recommendations

Daily maintenance:

Clean the suction nozzle and camera lens.

Check whether the vacuum pressure is normal.

Weekly maintenance:

Lubricate the guide rails and screws.

Check the feeder stepper motor.

Regular calibration:

Perform monthly precision calibration of the placement head and visual system.

8. Applicable industries

Consumer electronics: mobile phones, tablets, laptops

Automotive electronics: ECU, sensors

Industrial control: industrial control motherboard, PLC

Communication equipment: 5G modules, optical modules

9. Summary

Siemens SIPLACE D1 is a high-performance placement machine suitable for high-precision, high-mix electronic manufacturing. Its modular design, intelligent optimization software and stable performance make it the core equipment of SMT production line.

Key suggestions:

Regular maintenance can reduce the failure rate.

For complex problems, please contact our technical support.

For more detailed technical parameters or troubleshooting guides, please refer to SIPLACE D1 User Manual or consult the equipment supplier.