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I-ASM AD838 die bonder esetyenzisiweyo ingabonakala iphelele kwikowuteshini kwaye isenokubangela ukulibaziseka okukhulu emva kokunikezelwa.Iingxaki ezinobungozi obukhulu zihlala zingabonakali kwifoto yemveliso: ii-nozzles ezingekhoyo, ukuphathwa kwe-wafer engaphelelanga, izixhobo zokuthwala ezingafanelekanga, ukulinganiswa kombono ongaqinisekiswanga, isoftware engaxhaswayo, ii-backups ezingafumanekiyo, okanye uvavanyo lokwamkelwa kwefektri olubonisa kuphela ukuba umatshini unokuvula.
Ingaba esi sibonelelo sichazwa njengeI-ASM AD838 die bond, iUmatshini wokubopha iidayi we-AD838, iI-ASM ibhondi, okanye jikeleleumatshini wokubopha nge-die, ixabiso lokwenyani lemveliso lixhomekeke kulwakhiwo oluchanekileyo lweyunithi enikezelwayo. Igama leqonga yindawo yokuqala yokujonga.
Esi sikhokelo sokuthenga sichaza iitshekhi ezili-12 ekufuneka zigqitywe ngamaqela obunjineli kunye nokuthengwa kwempahla ngaphambi kokuba avume i-ASM AD838 die bonder esetyenzisiweyo yokuthunyelwa, ukufakwa kunye nokufaneleka kwemveliso.
Ngamafutshane: Yintoni Ekufuneka Ihlolwe Ngaphambi Kokuthenga I-ASM AD838 Die Bonder Esetyenzisiweyo?
Ngaphambi kokuba uthenge umatshini we-die bonding osetyenzisiweyo we-ASM AD838, qinisekisa ubuwena bomatshini ngqo, useto lwe-wafer kunye nolawulo lomphathi, ulungiselelo lwentloko yebhondi, uluhlu lwezixhobo, iimodyuli zenkqubo yezinto, imeko yombono, imeko yomlawuli kunye nesoftware, ubungqina bokuhlaziywa, ububanzi be-FAT, iimfuno zokusetyenziswa, isicwangciso senxalenye eseleyo kunye neendleko zeprojekthi iyonke.
Musa ukuvuma umatshini we-AD838 kuba imeko yangaphandle ibonakala icocekile.
Musa ukucinga ukuba zonke iimatshini ze-AD838-family zine-wafer efanayo, i-carrier, i-tooling okanye i-process capacity.
Musa ukucinga ukuba ii-nozzles okanye izixhobo zokuqala ziyahambelana nendlela entsha yokudaya okanye ye-substrate.
Musa ukuyiphatha ividiyo yentshukumo engenanto njengobungqina bokusebenza okukulungeleyo inkqubo.
Kutheni i-ASM AD838 Nameplate inganelanga?
Kwizixhobo ze-semiconductor ezisetyenzisiweyo, ipleyiti yegama lomatshini ichonga usapho lweqonga, kodwa ayiqinisekisi ukuba inkqubo enikezelwayo inokuxhasa usetyenziso olucetywayo. Umatshini we-ASM AD838 unokwahluka kwenye iyunithi ye-AD838 ekuphatheni i-wafer, ukuphatha umthwali, ukuseta intloko yebhondi, iimodyuli zenkqubo yezinto, uqwalaselo lwekhamera, iphakheji yezixhobo, ukuvelisa abalawuli kunye nendawo yesoftware.
Oku kubaluleke ngakumbi xa umthengi etshintsha i-die bonder ekhoyo okanye elungiselela indlela entsha yokuhlanganisa i-LED, i-photonics, i-optoelectronics okanye i-semiconductor. Umatshini owawulungiselelwe imveliso ethile ngaphambili unokufuna izixhobo ezintsha, izixhobo, ukuseta isoftware okanye iimodyuli zezinto ngaphambi kokuba uxhase enye imveliso.
Umgaqo wokuthenga:Thenga uqwalaselo oluqinisekisiweyo, kungekuphela nje igama lemodeli ye-ASM AD838.
Iitsheki ezili-12 ngaphambi kokuba uthenge i-ASM AD838 Die Bonder esetyenzisiweyo
1. Qinisekisa iModeli echanekileyo, iVariant kunye neNombolo yothotho
Qala ngepleyiti yegama lomatshini, inombolo yeserial, unyaka wokuveliswa apho ukhoyo kwaye ugqibezele ukuchongwa kwemodeli. Musa ukucinga ukuba i-AD838, i-AD838L, i-AD838L-Plus kunye ne-AD838L-G2 ziinkcazo ezitshintshanayo.
Cela iifoto ezicacileyo zepleyiti yegama, umphandle womatshini, indawo yokucubungula, intloko yebhondi, indawo yokuphatha i-wafer, ikhabhinethi yokulawula kunye nazo zonke izixhobo ezibandakanyiweyo. Umatshini obonakalayo kufuneka uhambelane nesicatshulwa esibhaliweyo.
Uyilo oluchanekileyo lwemodeli
Inombolo yeserial kunye neerekhodi zobunikazi bomatshini
Ukuveliswa kwemveliso okanye ukuveliswa komlawuli
Iimodyuli zenkqubo ezifakiweyo
Izixhobo ezibandakanyiweyo, izinto zokondla, izixhobo kunye nezixhobo
2. Tshatisa umatshini neNkqubo yokuncamathisela i-Intended Die Attachment
Ngaphambi kokuba uvavanye imeko yomatshini, chaza indlela yenkqubo ekujoliswe kuyo. Cacisa ukuba usetyenziso lusebenzisa i-epoxy die attach, i-dispensing, i-stamping, i-flip-chip handling, i-LED die placement, i-photonics assembly, i-carrier-based placement, i-wafer-level pickup okanye olunye ulandelelwano oluthile lwesicelo.
Umbuzo obalulekileyo awukokuba umatshini unako na ukubeka idayisi. Umbuzo obalulekileyo kukuba ingaba ulungiselelo olunikezelwayo lunokugqibezela na uthotho olufunekayo ukusuka kumthombo wedayi ukuya ekulungisweni kwezinto, ukulandwa, ukulungelelaniswa, ukubekwa, ukuhlolwa kunye nokukhutshwa kwenkunkuma.
3. Ukujonga kwakhona iWafer, iRing kunye nokuphathwa kwezinto
Ukuphathwa kwe-wafer yenye yezona ndawo zibalulekileyo zoqwalaselo kwi-ASM AD838 die bonder. Qinisekisa ubungakanani be-wafer exhaswayo, isitayile sefreyimu ye-wafer, imeko yeringi, ukuhambelana kwe-expander, uqwalaselo lwe-die source kunye nezixhobo zokulayisha okanye zokukhulula ezikhoyo.
Ukuba le nkqubo isebenzisa iitreyi, iipakethi zewaffle, iGel-Pak®, iikharityhulam, iistrips, iinqanawa okanye izibambi ezenziwe ngokwezifiso, cela uluhlu oluneenkcukacha lweemodyuli zokuphatha. Izixhobo zokuphatha izinto ezingekhoyo zinokulibazisa ukufakwa nokuba umatshini ngokwawo usebenza.
4. Qinisekisa ukuba i-Carrier, i-Substrate kunye ne-Fixture ziyahambelana
I-substrate okanye i-carrier efumanayo ibaluleke njengomthombo we-die. I-AD838 esetyenzisiweyo ingabandakanya izixhobo zobukhulu be-substrate okanye isitayile se-fixture kodwa hayi enye.
Ngaphambi kokuba uthenge, qinisekisa ubungakanani, ubukhulu, izinto ezisetyenzisiweyo, indlela yokufumana indawo, imfuneko yokufudumeza kunye nokuzinza komzimba kwe-substrate ekujoliswe kuyo. Thelekisa ezi mfuno kunye nezixhobo zokuthwala ezifakiweyo, iipleyiti zokufakelwa, izigaba ze-substrate kunye neereferensi zokulungelelanisa.
5. Hlola iiBond Head kunye neeTool Interfaces
Uqwalaselo lwentloko yebhondi lumisela indlela umatshini ayikhetha ngayo, ayibeka ngayo kwaye ayibeka ngayo idayisi. Cela inkcazo ebhaliweyo yentloko efakiweyo, isibambi sesixhobo, ujongano lwe-nozzle, inkqubo yokukhupha, ukuseta okunxulumene namandla, iindlela zokufudumeza kunye nayo nayiphi na imisebenzi yokujikeleza okanye yokubeka ekhethekileyo.
Umatshini usenokugqitywa ngoomatshini ngelixa ungekho izixhobo zokuthatha izinto ezibalulekileyo kwinkqubo, imilomo yokubeka, iinaliti zokukhupha okanye izixhobo zokulinganisa ezifunekayo kwimveliso ekujoliswe kuyo.
Uhlobo lwentloko yebhondi kunye nemeko yokusebenza
Isibambi sesixhobo kunye nojongano lwe-nozzle
Isixhobo sokuthatha kunye nesixhobo sokukhupha
Izixhobo zokuqhuba inkqubo yokufudumeza okanye yobushushu apho kufanelekileyo
Izalathiso zokulinganisa ezibandakanyiweyo kunye nezixhobo zokuseta
6. Qinisekisa iiModyuli zoKukhupha, zokuSitampu okanye zoLungiselelo lweZinto
Iinkqubo ezininzi zokubopha iidayi zifuna okungaphezulu nje kokubekwa. Umatshini unokufuna ukukhupha, ukunyathela, ukuphathwa kweglu, ukujika, ukudipha, ukufudumeza okanye omnye umsebenzi wokulungisa izinto.
Cela uqinisekiso lokuba zeziphi iimodyuli ezifakiweyo, nokuba ziyasebenza na kwaye ziyahambelana nendlela yezinto ezifunekayo. Iqonga elinokubeka iidayi lisenokungafaneleki ukuba inxalenye yokulungiselela izinto zenkqubo ayikho okanye ayihambelani.
7. Jonga Ukubona, Ikhamera kunye Nobuchule Bokulungelelanisa
Iikhamera ezifakiweyo azibonisi ngokuzenzekelayo ukuba umatshini unokuxhasa umsebenzi wokulungelelanisa ithagethi. Ukusebenza kombono kuxhomekeke kwi-optics, ukukhanya, umbono wentsimi, ukugxila, isoftware, imeko yokulinganisa kunye neempawu zomzimba ze-die kunye ne-substrate.
Cela umthengisi ukuba abonise ukufunyanwa komfanekiso, ukuqatshelwa kwesalathiso kunye nolandelelwano lokulungelelaniswa oluphindaphindwayo. Apho kunokwenzeka, sebenzisa iisampuli ezimele idayisi, i-substrate okanye i-alignment ngexesha lokuhlolwa.
8. Ulawulo lokuHlola, iPC kunye nokuBuyiselwa kweSoftware
Umatshini usenokuvula ngesiqhelo kodwa ungabi nazo ii-backups ezisebenzisekayo, iifayile zokhetho, inkxaso yomlawuli, iifayile zeparameter, imidiya yokubuyisela okanye amaxwebhu obuchwephesha. Oku kudala umngcipheko omkhulu ngexesha lokufakwa kunye nokusombulula iingxaki kamva.
Cela ulwazi malunga nePC yemizi-mveliso, izixhobo zokulawula, amakhadi entshukumo, uqwalaselo lwe-I/O, isoftware yomatshini, ukhetho olusebenzayo, ii-backups ezikhoyo, imbali ye-alamu kunye nenkqubo yokubuyisela.
9. Buza ukuba yintoni kanye kanye equkwa "kuHlaziywe"
Ilizwiihlaziyiwekunokuthetha nantoni na ukususela ekucoceni ubuhle ukuya ekubuyiselweni koomatshini okubhaliweyo, ukulinganiswa, ukutshintshwa kwezinto ezigugileyo, ukulungiswa komlawuli, ukubuyiselwa kwesoftware kunye novavanyo lokusebenza.
Cela isikopu sokuhlaziya esibhaliweyo esichaza oko kuhlolwe, kwacocwa, kwalungiswa, kwatshintshwa, kwalinganiswa kwaye kwavavanywa. Buza nokuba yintoni engabandakanywanga kwisikopu.
10. Chaza uvavanyo lokwamkelwa kwefektri yokwenyani
I-FAT eluncedo kufuneka iqinisekise okungaphezulu kokuqalisa komatshini kunye nokuhamba kwe-axis engenanto. Kufuneka kuvunyelwane ngayo ngaphambi kokuthunyelwa kwaye kufuneka ibonise ulungelelwaniso lokwenyani oluqukwe kwikowuteshini.
| Indawo ye-FAT | Oko Kufanele Kuqinisekiswe |
|---|---|
| Ubume bomatshini | Imodeli, inombolo yeserial, iimodyuli ezifakiweyo, izixhobo ezifakiweyo kunye nezixhobo ezifakiweyo zihambelana nesicatshulwa. |
| Ukhuseleko kunye nokuQalisa | Izitophu zongxamiseko, iingcango zokhuseleko, ii-alamu, ii-interlocks, umbane kunye nolandelelwano lokuqalisa komatshini. |
| Intloko yeNtshukumo kunye neBond | Ukuya e-axis, ukuhamba eqongeni, ukuhamba kwentloko yebhondi, ukufakwa kwezixhobo kunye nemisebenzi esisiseko yokubuyisela. |
| Umbono kunye noLungelelaniso | Umgangatho womfanekiso wekhamera, ukukhanya, ukuqondwa kwesalathiso kunye nempendulo esisiseko yokulungelelanisa. |
| Ukuphathwa kwezinto | Iqulethe i-wafer, itreyi, i-carrier, i-substrate okanye iimodyuli ze-fixture phantsi kolandelelwano oluvunyiweyo. |
| Isoftware kunye nokudluliselwa | Ukufikelela kumlawuli, imeko yesoftware, iifayile zogcino, amaxwebhu kunye noluhlu lokugqibela loqwalaselo lomatshini. |
11. Qinisekisa iiMfuno zoFakelo kunye neZixhobo zoNcedo
Musa ukulinda de kufikelelwe ukuze uqinisekise umbane, umoya ocinezelweyo, i-vacuum, i-exhaust, ukufikelela kwinethiwekhi, indawo yokucoca, indawo yokufaka, ukulayisha umgangatho kunye nokufikelela ekuthunyelweni.
Cela ubungakanani bomatshini, iinkcukacha zokusetyenziswa, imizobo yokufakela, ubukhulu bokupakisha kunye nemiyalelo yokuphakamisa okanye yokumisa efunekayo ngaphambi kokuba uvume ukuthunyelwa.
12. Bala iindleko zeProjekthi iyonke, kungekuphela nje ngexabiso lomatshini
Ixabiso lokuthenga i-ASM die bonder esetyenzisiweyo yinxalenye enye yeendleko zeprojekthi. Izixhobo, izixhobo zokulungisa, ukuthunyelwa, i-inshurensi, ukufakwa, izixhobo ezingasetyenziswanga, ukubuyiswa kwesoftware, ukulinganiswa, inkxaso yobunjineli, izixhobo zovavanyo kunye nexesha lokufaneleka zinokutshintsha kakhulu uhlahlo-lwabiwo mali lokwenyani.
Iyunithi enexabiso eliphezulu eneemodyuli zokuphatha ezifanelekileyo, izixhobo ezibhaliweyo, imeko yomlawuli oqinisekisiweyo kunye ne-FAT enentsingiselo inokuba lutyalo-mali olunomngcipheko omncinci kunomatshini ongabizi kakhulu onezixhobo ezingafunekiyo ezibalulekileyo kwinkqubo.
Iiflegi ezi-7 eziBomvu kwiSipho se-ASM AD838 Die Bonder esisetyenzisiweyo
Akukho nombolo ye-serial okanye ukuchonga imodeli okungacacanga.
Iifoto azihambelani noqwalaselo lomatshini obhaliweyo.
Akukho zixhobo, i-nozzle okanye izixhobo ezifumanekayo.
Akukho nkcazelo ecacileyo yokuphatha i-wafer, i-carrier okanye i-substrate.
Ubungqina kuphela yividiyo yentshukumo engalayishwanga.
Akukho datha yesoftware, ulwazi lomlawuli okanye amaxwebhu afakiweyo.
Isikali se-FAT asicacanga okanye asihambelani neemodyuli zenkqubo ezicatshulweyo.
Ingcebiso Yokugqibela Yokuthenga
I-ASM AD838 die bonder esetyenzisiweyo inokuba lutyalo-mali olusebenzayo xa uqwalaselo lomatshini oluchanekileyo luhambelana nendlela ecetywayo yokuncamathisela i-die kwaye iprojekthi ibandakanya izixhobo ezicacileyo, isoftware, ukuhlolwa kunye nesicwangciso se-FAT.
Ngaphambi kokuba uvume intlawulo okanye ukuthunyelwa, qinisekisa ubuwena bomatshini, ukuphathwa kwe-wafer, ukuphathwa kwe-substrate, intloko yebhondi, izixhobo, iphakheji yombono, imeko yomlawuli, ububanzi bokulungiswa kunye nemigangatho yovavanyo lokwamkelwa. Oku kunciphisa umngcipheko wokuthenga iqonga elifanelekileyo elinoqwalaselo olungafanelekanga olufakelweyo.
Izixhobo ezinxulumene ne-ASM Die Bonder
Imibuzo Ebuzwa Rhoqo Malunga Nokuthenga i-ASM AD838 Die Bonder Esetyenzisiweyo
Ngaba zonke ii-ASM AD838 die bonds zenziwe ngendlela efanayo?
Hayi. Oomatshini be-ASM AD838 abasetyenzisiweyo banokwahluka kwindlela yokuphatha i-wafer, iimodyuli zokuthwala, ukuseta intloko yebhondi, izixhobo, iphakheji yombono, ihardware yenkqubo, ukuvelisa abalawuli kunye noqwalaselo lwesoftware.
Yintoni ekufuneka ihlolwe kuqala kumatshini wokubopha iidayi we-AD838 osetyenzisiweyo?
Qala ngemodeli echanekileyo, inombolo yeserial, uqwalaselo olubonakalayo, iimodyuli zokuphatha ezibandakanyiweyo, intloko yebhondi, isitokhwe sezixhobo, imeko yomlawuli kunye namaxwebhu afumanekayo.
Ngaba ividiyo enikwa umatshini yanele ngaphambi kokuba uthenge i-ASM die bonder?
Hayi. Ividiyo evulayo ingabonisa umsebenzi osisiseko, kodwa ayiqinisekisi ukuhambelana kwezixhobo, ukuphathwa kwezinto, ukulungelelaniswa kombono, ukulungela inkqubo okanye ukubuyiselwa kwesoftware.
Kutheni izixhobo zokuqala ze-AD838 zibalulekile?
Izixhobo zokuqala zingabaluleka kuba ii-nozzles, izixhobo zokukhupha, izixhobo zokulungisa kunye neereferensi zokulinganisa zinokuba zezobukhulu bedayi, ifomathi ye-substrate okanye indlela yenkqubo. Kufuneka zijongwe ngokubhekisele kwisicelo esicetywayo.
Yintoni ekufuneka iqukwe luvavanyo lokwamkelwa kwefektri lwe-ASM AD838?
I-FAT eluncedo kufuneka iquke ukuqinisekiswa kobume bomatshini, ukuhlolwa kokhuseleko, intshukumo, ukusebenza kwentloko yebhondi, uphononongo lombono, ukuphathwa kwezinto, ukuqinisekiswa kwezixhobo, imeko yesoftware kunye nolandelelwano lwenkqubo emeleyo xa kukho izixhobo ezifanelekileyo.
Ngaba umatshini we-ASM AD838 osetyenzisiweyo ungafakwa ngaphandle kweekopi zesoftware?
Ukufakela kunokwenzeka, kodwa umngcipheko weprojekthi uyanda ngaphandle kokugcinwa kweefayile, imidiya yokubuyisela, iiparameter zomatshini, iifayile zokhetho kunye namaxwebhu obuchwephesha.
Yeyiphi eyona ndleko ifihliweyo kwiprojekthi ye-AD838 esetyenzisiweyo?
Iindleko eziqhelekileyo ezifihlakeleyo ziquka izixhobo ezingekhoyo, izixhobo zokulungisa, iimodyuli zokuphatha, ukubuyiswa kolawulo, iindawo ezingasetyenziswayo, inkxaso yokufakela, ukulinganiswa, ixesha lobunjineli kunye nokulibaziseka kweziqinisekiso.
Ngaba ufuna uphononongo loqwalaselo lwe-ASM AD838?
Yabelana ngeefoto zomatshini, ulwazi olulandelelanayo, ubungakanani bedayi, ifomathi ye-wafer okanye yenkampani, iinkcukacha zesiseko, indlela yezinto ezisetyenzisiweyo, izixhobo ezikhoyo kunye neemeko zemveliso ekujoliswe kuzo. Uvavanyo oluluncedo luqala ngemfuneko yenkqubo yokwenyani kunye noqwalaselo lomatshini onikezelwayo.
