DEK 03IX is an advanced screen printing device produced by DEK (now part of ASM Assembly Systems), designed for the electronics manufacturing industry, especially for high-precision printing applications in surface mount technology (SMT) production lines.
Product Positioning
DEK 03IX is positioned as a mid-to-high-end SMT printing solution, mainly serving:
Consumer electronics manufacturers
Automotive electronics suppliers
Industrial electronics manufacturers
Communication equipment manufacturers
Medical electronic equipment manufacturers
Technical parameters
Basic specifications
Printing area: Maximum PCB size of 510mm × 460mm
Printing speed: Up to 20 seconds/cycle (depending on the complexity of the PCB)
Repeat accuracy: ±12.5μm @ Cpk≥1.0
Alignment accuracy: ±15μm @ Cpk≥1.0
Scraper pressure range: 0-20kg adjustable
Separation speed: 0.1-20mm/s adjustable
Mechanical properties
Frame size compatibility: supports 29"×29" standard screen fram
Z-axis travel: 0-6mm adjustable
θ-axis adjustment: ±5° rotation correction capability
Substrate thickness range: 0.2-6mm
Control system
Adopts advanced VisionAlign™ visual alignment system
Multi-camera high-resolution imaging system
Real-time SPC data collection and analysis function
Support SECS/GEM communication protocol
Core technology and innovative features
1. Intelligent printing technology
Real-time adaptive control system: can automatically adjust printing parameters according to solder paste characteristics
Intelligent pressure control: dynamically adjust scraper pressure to adapt to different pad designs
Automatic screen cleaning system: programmable cleaning frequency and method
2. High-precision visual system
Adopts multi-angle lighting and high-resolution CCD camera
Supports multiple mark point recognition algorithms
Sub-pixel image processing technology
Automatic focus and lighting adjustment function
3. Advanced process control
Closed-loop controlled scraper system
Real-time monitoring of printing quality
Automatic solder paste volume detection function
3D solder paste detection option (additional modules are required)
4. User-friendly design
15-inch color touch screen interface
Graphical programming environment
Formula management system
Remote diagnosis and maintenance function
System architecture
Hardware composition
Host frame: high-strength aluminum alloy structure, providing stable support
Print head system: including dual scraper device, pressure sensor and height sensor
Vision system: upper and lower dual camera configuration
Transmission system: high-precision guide rail and belt drive
Stencil fixing system: pneumatic clamping device
Substrate positioning system: programmable support pin and edge clamp
Software system
DEK Instinctiv™ V9 operating system: dedicated software based on Windows platform
Process optimization module: automatic parameter suggestion function
Data analysis tool: real-time SPC chart and trend analysis
Network connection: support factory MES system integration
Application field
Typical application
Ultra-fine pitch printing of 01005 and smaller components
Flip chip Chip) applications
Wafer-level packaging (WLCSP)
High-density interconnect (HDI) boards
Flexible circuit board (FPC) printing
Special process capabilities
Mixed technology printing (solder paste and conductive glue)
Step stencil printing
Double-sided printing process
High viscosity material printing (such as bottom filler)
Performance advantages
Production efficiency
Quick line change time (<5 minutes)
High first pass yield (FPY)
High continuous production stability
Support non-stop stencil cleaning
Quality assurance
High printing consistency
Low defect rate
Solder paste Excellent molding quality
Automatic process compensation function
Cost-effective
Low material waste
Low maintenance cost
High energy efficiency
Significant total cost of ownership (TCO) advantage
Optional items
Hardware options
3D solder paste inspection system: real-time volume measurement
Dual track transmission system: support continuous production
Nitrogen protection device: for special processes
High viscosity material kit: for special slurries
Software options
Advanced data analysis package: in-depth process analysis
Remote monitoring module: real-time equipment status view
Intelligent maintenance system: predictive maintenance function
Maintenance and Service
Daily Maintenance
Recommended Daily Cleaning Items
Weekly Checklist
Monthly Maintenance Plan
Technical Support
Global Service Network
24/7 Technical Support Hotline
Online Knowledge Base and Troubleshooting Guide
Regular Software Updates
Market Positioning and Competitive Analysis
Target Market
Medium to High Volume SMT Production Lines
Electronics Manufacturers with High Mix Production
Fields with Strict Printing Quality Requirements
Comparison with Major Competitors
Compared with similar equipment such as MPM Ultraprint 3000, Ekra X5, DEK 03IX has advantages in the following aspects:
Friendlier user interface
More flexible configuration options
Lower maintenance requirements
Better cost-effectiveness
Development trends and future upgrades
Technology evolution direction
AI-assisted process optimization
Augmented reality (AR) maintenance assistance
Deeper integration of Industry 4.0
Environmentally friendly and energy-saving design improvements
Upgrade path
Hardware modular design for easy upgrade
Good software backward compatibility
Expandable I/O interface
User evaluation and industry recognition
Typical user feedback
"Printing stability exceeds expectations"
"Line change time is greatly reduced"
"Excellent adaptability to difficult PCBs"
"Intuitive and easy-to-use operation interface"
Awards and certifications
Won multiple industry innovation awards
Complies with safety certifications such as CE and UL
Meets IPC standard requirements
Summary
DEK 03IX represents the advanced level of current SMT printing technology, and provides reliable printing solutions for electronic manufacturing through its high precision, intelligent and user-friendly design. Whether it is mass production or high-mix environment, 03IX can provide excellent performance to help users improve quality, reduce costs and improve efficiency.