ASMPT DEK horizon 03ix smt umshicileli wesikrini

I-DEK 03IX sisixhobo sokuprinta sesikrini esiphezulu esiveliswe yi-DEK (ngoku iyinxalenye ye-ASM Assembly Systems), eyenzelwe ushishino lokuvelisa i-electronics, ingakumbi usetyenziso oluchanekileyo oluphezulu lokushicilela kwi-surface mount technology (SMT) imigca yokuvelisa.

Ukuma kweMveliso

I-DEK 03IX ibekwe njengesisombululo soshicilelo se-SMT esiphakathi ukuya-phezulu, ikakhulu sisebenza:

Abavelisi bezinto zombane zabathengi

Ababoneleli ngezixhobo zombane zemoto

Abavelisi bezinto zombane zeshishini

Abavelisi bezixhobo zonxibelelwano

Abavelisi bezixhobo zombane zonyango

Iiparamitha zobugcisa

Iinkcukacha ezisisiseko

Indawo yoshicilelo: Ubukhulu bePCB ubukhulu be-510mm × 460mm

Isantya sokushicilela: Ukuya kuthi ga kwimizuzwana engama-20/umjikelo (kuxhomekeke kubunzima bePCB)

Phinda ukuchaneka: ±12.5μm @ Cpk≥1.0

Ukuchaneka kolungelelwaniso: ±15μm @ Cpk≥1.0

Uluhlu loxinzelelo lwe-scraper: 0-20kg ukulungiswa

Ukwahlula isantya: 0.1-20mm / s adjustable

Iimpawu zoomatshini

Ukuhambelana kobungakanani besakhelo: ixhasa i-29"×29" ifremu yesikrini esiqhelekileyo

Uhambo lwe-Z-axis: 0-6mm adjustable

Ukulungelelaniswa kwe-θ-axis: ± 5 ° ukukwazi ukulungisa ukujikeleza

Ubuninzi be-substrate: 0.2-6mm

Inkqubo yokulawula

Yamkela inkqubo yolungelelwaniso oluphambili lweVisionAlign™

Iikhamera ezininzi ezinesisombululo esiphezulu se-imaging system

Ixesha langempela lokuqokelela idatha ye-SPC kunye nomsebenzi wokuhlalutya

Inkxaso ye-SECS/GEM yonxibelelwano lweprotocol

Itekhnoloji engundoqo kunye neempawu ezintsha

1. Ubuchwephesha bokushicilela obukrelekrele

Inkqubo yokulawula i-adaptive yexesha langempela: inokulungelelanisa ngokuzenzekelayo iiparamitha zoshicilelo ngokweempawu ze-solder paste

Ukulawulwa koxinzelelo olukrelekrele: uhlengahlengiso ngokuguquguqukayo uxinzelelo lwe-scraper ukuziqhelanisa noyilo lweepadi ezahlukeneyo

Inkqubo yokucoca isikrini ngokuzenzekelayo: ukucwangciswa kwexesha lokucoca kunye nendlela

2. Inkqubo ebonakalayo echanekileyo ephezulu

Yamkela ukukhanya kwee-angle ezininzi kunye nekhamera yeCCD enesisombululo esiphezulu

Ixhasa ii-algorithms zokuqaphela amanqaku amaninzi

Itekhnoloji yokulungisa imifanekiso engaphantsi kwepixel

Ugxininiso oluzenzekelayo kunye nomsebenzi wokulungiswa kokukhanyisa

3. Ulawulo lwenkqubo oluphezulu

Inkqubo evaliweyo ye-scraper elawulwayo

Ixesha lokwenene lokuhlola umgangatho woshicilelo

Umsebenzi wokufumanisa umthamo we-solder ngokuzenzekelayo

Ukhetho lokubona uncamathiselo lwe-3D yesolder (iimodyuli ezongezelelweyo ziyafuneka)

4. Uyilo olusebenziseka lula

15-intshi umbala touch screen ujongano

Ubume benkqubo yomzobo

Inkqubo yolawulo lwefomula

Ukuxilongwa okude kunye nomsebenzi wokulondoloza

Uyilo lwenkqubo

Ukuqulunqwa kwe-Hardware

Isakhelo sokusingatha: ulwakhiwo oluphezulu lwe-aluminium alloy, ukubonelela ngenkxaso ezinzileyo

Inkqubo yentloko yokuprinta: kubandakanywa i-device ye-scraper emibini, inzwa yoxinzelelo kunye nenzwa yokuphakama

Inkqubo yombono: uqwalaselo lwekhamera ephezulu nasezantsi

Inkqubo yokuhanjiswa: uloliwe ochanekileyo ochanekileyo kunye nebhanti

Inkqubo yokulungisa i-stencil: isixhobo se-pneumatic clamping

Inkqubo yokubeka i-substrate: iphini yenkxaso ecwangcisiweyo kunye ne-edge clamp

Inkqubo yesoftware

Inkqubo yokusebenza yeDEK Instinctiv™ V9: isoftwe ezinikeleyo esekwe kwiqonga leWindows

Imodyuli yokuphucula inkqubo: umsebenzi wesiphakamiso separameter ezenzekelayo

Isixhobo sokuhlalutya idatha: itshathi ye-SPC yexesha langempela kunye nohlalutyo lwentsingiselo

Uqhagamshelo lwenethiwekhi: inkxaso yenkqubo ye-MES yenkxaso yefektri

Indawo yosetyenziso

Usetyenziso oluqhelekileyo

Ukuprintwa kwepitch ecolekileyo ye-01005 kunye nezixhobo ezincinci

Flip chip Chip) izicelo

Ukupakishwa komgangatho weWafer (WLCSP)

Iibhodi ze-High-density interconnect (HDI).

ibhodi yesekethe Flexible (FPC) yoshicilelo

Izakhono zenkqubo ekhethekileyo

Ukuprintwa kwetekhnoloji exutyiweyo (i-solder paste kunye neglue eqhubayo)

Inyathelo lokushicilela ngestencil

Inkqubo yoshicilelo olunamacala amabini

Ukuprintwa kwezinto eziphezulu ze-viscosity (ezifana nokuzaliswa kwezantsi)

Iinzuzo zokusebenza

Ukusebenza kakuhle kwemveliso

Ixesha lokutshintsha umgca okhawulezayo (<5 imizuzu)

Isivuno sokuqala sokupasa okuphezulu (FPY)

Uzinzo oluphezulu oluqhubekayo lwemveliso

Inkxaso yokucoca i-stencil engayekiyo

Ukuqinisekisa umgangatho

Ukuhambelana kokushicilela okuphezulu

Izinga lesiphako esisezantsi

I-Solder paste Umgangatho ogqwesileyo wokubumba

Umsebenzi wembuyekezo yenkqubo ezenzekelayo

Isebenza kakuhle emalini

Inkunkuma yezinto eziphantsi

Iindleko zokulungisa eziphantsi

Ukusebenza kwamandla aphezulu

Iindleko ezipheleleyo zobunini (TCO) inzuzo

Izinto ozikhethayo

Iinketho ze-Hardware

Inkqubo yokuhlola i-solder ye-3D yokunamathisela: ukulinganisa umthamo wexesha langempela

Inkqubo yothumelo lweengoma ezimbini: inkxaso yemveliso eqhubekayo

Isixhobo sokukhusela i-nitrogen: kwiinkqubo ezikhethekileyo

Ikhithi yezinto eziphezulu ze-viscosity: kwii-slurries ezikhethekileyo

Iinketho zesoftware

Iphakheji yokuhlalutya idatha ephezulu: uhlalutyo olunzulu lwenkqubo

Imodyuli yokubeka iliso ekude: imboniselo yexesha lokwenyani lemeko yesixhobo

Inkqubo yokulondoloza ehlakaniphile: umsebenzi wokulondoloza kwangaphambili

ULondolozo kunye neNkonzo

ULondolozo lweMihla

Izinto ezicetyiswayo zokuCoca iMihla yonke

Uluhlu lokukhangela lweveki

Isicwangciso sokuGcinwa kweNyanga

Uxhaso lobuchwepheshe

Inethiwekhi yeNkonzo yeHlabathi

I-24/7 yomnxeba weNkxaso yobuGcisa

Isiseko soLwazi kwi-Intanethi kunye nesiKhokelo sokuJonga iingxaki

Uhlaziyo lweSoftwe rhoqo

Ukuma kweMarike kunye noHlalutyo loKhuphiswano

Imakethi ejongiwe

IiNgcaciso zeMveliso ze-SMT eziPhakathi ukuya kwePhezulu

Abavelisi be-Electronics abaneMveliso yoMxube oPhezulu

Imimandla eneeMfuno zoMgangatho woShicilelo olungqongqo

Ukuthelekisa nabakhuphisana abaKhulu

Xa kuthelekiswa nezixhobo ezifanayo ezifana neMPM Ultraprint 3000, Ekra X5, DEK 03IX ineengenelo kule miba ilandelayo:

Ujongano lomsebenzisi olunobuhlobo

Iinketho zoqwalaselo ezibhetyebhetye ngakumbi

Iimfuno zokugcinwa okuphantsi

Ukusebenza kakuhle kweendleko

Iindlela zophuhliso kunye nohlaziyo lwexesha elizayo

Umkhombandlela wokuzivelela kwetekhnoloji

Inkqubo encediswa yi-AI

Inyani eyongeziweyo (AR) uncedo lolondolozo

Indibaniselwano enzulu yoShishino 4.0

Uphuculo loyilo oluhambelana nokusingqongileyo kunye nokonga amandla

Phucula indlela

I-Hardware uyilo lwemodyuli yokuphucula lula

Ukuhambelana kwesoftware elungileyo

Ujongano lwe-I/O olunokwandiswa

Uvavanyo lomsebenzisi kunye nokuqatshelwa kweshishini

Ingxelo yomsebenzisi eqhelekileyo

"Uzinzo loshicilelo lungaphezulu kobekulindelekile"

"Ixesha lokutshintsha umgca lincitshiswe kakhulu"

"Ukuziqhelanisa okugqwesileyo kwiiPCB ezinzima"

"Intuitive kwaye kulula ukuyisebenzisa interface yokusebenza"

Amabhaso kunye neziqinisekiso

Iphumelele iimbasa ezininzi zeshishini

Ithobela iziqinisekiso zokhuseleko ezifana ne-CE kunye ne-UL

Ihlangabezana neemfuno ezisemgangathweni ze-IPC

Isishwankathelo

I-DEK 03IX imele inqanaba eliphezulu lobuchwephesha boshicilelo be-SMT yangoku, kwaye ibonelela ngezisombululo zoshicilelo ezithembekileyo zokwenziwa kombane ngoyilo lwayo oluchanekileyo, olukrelekrele nolusebenziseka lula. Ingaba imveliso yobuninzi okanye i-high-mix environment, i-03IX inokubonelela ngokusebenza okugqwesileyo ukunceda abasebenzisi ukuphucula umgangatho, ukunciphisa iindleko kunye nokuphucula ukusebenza kakuhle.