ASM dek printing machine 265

DEK printer 265 is a high-performance fully automatic solder paste printer launched by DEK (now ASM Assembly Systems). It is widely used in SMT (surface mount technology) production lines and is designed for high-precision PCB (printed circuit board) solder paste printing. It is suitable for consumer electronics, automotive electronics, communication equipment and other fields.

2. Core advantages

High-precision printing

Adopting advanced visual alignment system (such as 2D/3D SPI detection), it can achieve ±15μm printing accuracy, meeting the needs of fine components such as 01005 and 0.3mm pitch BGA.

High production efficiency

High-speed printing (up to 300mm/s) and fast line change (supporting automatic program switching) to improve the UPH (unit hourly production capacity) of the production line.

Strong stability

Closed-loop control system and real-time pressure adjustment technology to ensure printing consistency.

High flexibility

Supports a variety of process requirements (solder paste, glue, red glue, etc.) and different PCB sizes (up to 510×460mm).

User-friendly

Humanized HMI interface (such as Windows-based operating software), supports remote monitoring and data analysis.

3. Working principle

Substrate positioning

PCB enters the printing position through the conveyor track, is fixed by the clamping mechanism, and the visual system (CCD camera) identifies the mark point alignment.

Steel mesh bonding

The steel mesh and PCB are bonded by vacuum adsorption or mechanical clamping to ensure no gap.

Solder paste printing

The scraper (metal or polyurethane material) pushes the solder paste at a set pressure and angle, and prints it through the steel mesh opening to the PCB pad.

Demolding and detection

The steel mesh is separated from the PCB (the demoulding speed is adjustable), and some models are equipped with 3D solder paste detection function.

4. Key Specifications

Item Parameters

Maximum PCB size 510×460mm

Printing accuracy ±15μm (Cpk≥1.0)

Printing speed 50-300mm/s (adjustable)

Scraper pressure 5-20kg (programmable)

Stencil thickness support 0.1-0.3mm

Power supply requirements 220VAC/50-60Hz, 1.5kW

Air source pressure 0.5-0.7MPa

5. Main features

Intelligent scraper system

Pressure, speed, and angle can be programmably controlled to adapt to different solder paste characteristics.

Advanced cleaning function

Multi-mode steel mesh cleaning such as dry wipe, wet wipe, vacuum adsorption, etc. to reduce residue.

Modular design

Easy to maintain and upgrade (such as scraper module and camera module can be quickly replaced).

Data traceability

Support MES system docking to record printing parameters and quality data.

VI. Common faults and maintenance ideas

1. Printing deviation

Possible reasons:

Mark point recognition error (pollution or insufficient light).

Stencil or PCB positioning is not firm.

Solution steps:

Clean the mark point and adjust the camera light source.

Check whether the air pressure of the clamping mechanism is normal.

2. Solder paste pull tip/insufficient solder

Possible reasons:

Demolding speed is too fast or the steel mesh tension is insufficient.

Scraper pressure is uneven or the solder paste temperature is insufficient.

Solution steps:

Reduce the demoulding speed (recommended 0.1-0.5mm/s).

Calibrate the scraper level and check the solder paste viscosity.

3. Stencil blockage

Possible reasons:

Solder paste is dry or the cleaning frequency is insufficient.

Solution steps:

Increase the wet wiping frequency (once every 5-10 prints).

Replace solder paste with better fluidity.

4. Machine alarm (air pressure/servo failure)

Possible causes:

Air leakage or servo drive overheating.

Solution steps:

Check whether the air source pressure is stable.

Clean the servo motor cooling fan.

VII. Maintenance recommendations

Daily maintenance

Clean the residual solder paste on the track, steel mesh and scraper.

Check the air pressure gauge and filter.

Periodic maintenance

Lubricate the linear guide and lead screw every month.

Calibrate the visual system and scraper pressure sensor.

VIII. Summary

DEK 265 has become the core equipment of the SMT production line with its high precision, high stability and intelligent functions. Through standardized operation and preventive maintenance, the failure rate can be significantly reduced and the printing yield can be improved. For complex failures, it is recommended to contact us for repair using original spare parts.

If more detailed parameters or specific problem solutions are required, specific application scenarios can be provided for further analysis.