DEK printer 265 is a high-performance fully automatic solder paste printer launched by DEK (now ASM Assembly Systems). It is widely used in SMT (surface mount technology) production lines and is designed for high-precision PCB (printed circuit board) solder paste printing. It is suitable for consumer electronics, automotive electronics, communication equipment and other fields.
2. Kärnfördelar
High-precision printing
Adopting advanced visual alignment system (such as 2D/3D SPI detection), it can achieve ±15μm printing accuracy, meeting the needs of fine components such as 01005 and 0.3mm pitch BGA.
High production efficiency
High-speed printing (up to 300mm/s) and fast line change (supporting automatic program switching) to improve the UPH (unit hourly production capacity) of the production line.
Strong stability
Closed-loop control system and real-time pressure adjustment technology to ensure printing consistency.
High flexibility
Supports a variety of process requirements (solder paste, glue, red glue, etc.) and different PCB sizes (up to 510×460mm).
User-friendly
Humanized HMI interface (such as Windows-based operating software), supports remote monitoring and data analysis.
3. Arbetsprincip
Substrate positioning
PCB enters the printing position through the conveyor track, is fixed by the clamping mechanism, and the visual system (CCD camera) identifies the mark point alignment.
Steel mesh bonding
The steel mesh and PCB are bonded by vacuum adsorption or mechanical clamping to ensure no gap.
Solder paste printing
The scraper (metal or polyurethane material) pushes the solder paste at a set pressure and angle, and prints it through the steel mesh opening to the PCB pad.
Demolding and detection
The steel mesh is separated from the PCB (the demoulding speed is adjustable), and some models are equipped with 3D solder paste detection function.
4. Viktiga specifikationer
Objektparametrar
Maximum PCB size 510×460mm
Printing accuracy ±15μm (Cpk≥1.0)
Printing speed 50-300mm/s (adjustable)
Scraper pressure 5-20kg (programmable)
Stencil thickness support 0.1-0.3mm
Power supply requirements 220VAC/50-60Hz, 1.5kW
Air source pressure 0.5-0.7MPa
5. Main features
Intelligent scraper system
Pressure, speed, and angle can be programmably controlled to adapt to different solder paste characteristics.
Advanced cleaning function
Multi-mode steel mesh cleaning such as dry wipe, wet wipe, vacuum adsorption, etc. to reduce residue.
Modulär design
Easy to maintain and upgrade (such as scraper module and camera module can be quickly replaced).
Data traceability
Support MES system docking to record printing parameters and quality data.
VI. Vanliga fel och underhållsidéer
1. Printing deviation
Möjliga orsaker:
Mark point recognition error (pollution or insufficient light).
Stencil or PCB positioning is not firm.
Lösningssteg:
Clean the mark point and adjust the camera light source.
Check whether the air pressure of the clamping mechanism is normal.
2. Solder paste pull tip/insufficient solder
Möjliga orsaker:
Demolding speed is too fast or the steel mesh tension is insufficient.
Scraper pressure is uneven or the solder paste temperature is insufficient.
Lösningssteg:
Reduce the demoulding speed (recommended 0.1-0.5mm/s).
Calibrate the scraper level and check the solder paste viscosity.
3. Stencil blockage
Möjliga orsaker:
Solder paste is dry or the cleaning frequency is insufficient.
Lösningssteg:
Increase the wet wiping frequency (once every 5-10 prints).
Replace solder paste with better fluidity.
4. Machine alarm (air pressure/servo failure)
Möjliga orsaker:
Air leakage or servo drive overheating.
Lösningssteg:
Check whether the air source pressure is stable.
Clean the servo motor cooling fan.
VII. Maintenance recommendations
Dagligt underhåll
Clean the residual solder paste on the track, steel mesh and scraper.
Check the air pressure gauge and filter.
Periodic maintenance
Lubricate the linear guide and lead screw every month.
Calibrate the visual system and scraper pressure sensor.
VIII. Sammanfattning
DEK 265 has become the core equipment of the SMT production line with its high precision, high stability and intelligent functions. Through standardized operation and preventive maintenance, the failure rate can be significantly reduced and the printing yield can be improved. For complex failures, it is recommended to contact us for repair using original spare parts.
If more detailed parameters or specific problem solutions are required, specific application scenarios can be provided for further analysis.