Ebikozesebwa mu nkola ya Semiconductor Electroplating System Raider® Edge ECD

Enkola ya Applied Materials’ Raider® Edge ECD eyimiridde ng’ekipimo mu kisaawe ky’okuteeka amasannyalaze (ECD) munda mu kukola semikondokita. Ekiva mu kugatta tekinologiya oluvannyuma lwa Applied Materials okugula Semitool, enkola eno ekozesebwa nnyo mu nkola ez’omulembe ez’okupakinga n’okuyunga ku ddaala lya wafer, eyawulwamu olw’okukyukakyuka kwayo okw’amaanyi, okuyita ennyo, n’okufuga enkola okw’enjawulo.

**Okuteeka Enkola mu kifo**

**Kkampuni:** Ebikozesebwa mu kukola, Inc.

**Engeri y’ebintu:** Raider® Edge ECD

**Ekika ky'Ebyuma:** Enkola y'okuteeka amasannyalaze mu bisenge ebingi eya Single-Wafer Electrochemical

**Amakulu mu byafaayo:** "Industry Benchmark" emanyiddwa mu kisaawe kya tekinologiya w'okusiiga wafer emu. Kikiikirira omulembe ogw’okuna ogw’ebikozesebwa bya ECD ebya wafer emu; eyasooka, enkola ya Raider GT, mu kusooka yategekebwa okuwagira enkulaakulana ya tekinologiya wa chip ow’emilembe esatu.

**Emisingi Emikulu**

Okuteekebwa kw’amasannyalaze kuzingiramu okukozesa akasannyalazo okukendeeza ku ayoni z’ebyuma ku ngulu wa wafer, bwe kityo ne kikola firimu ennyimpi eyeetongodde. Enkola ya Raider Edge ECD esukka ku kussaako ebyuma ebyangu; okuyita mu nkola ey’okufuga ennungi, esobozesa enkola eno okutuuka ku butuufu ku ddaala lya atomu. Ekirala, enkola eno ewagira emitendera egy’enjawulo egy’okulongoosa mu mazzi, gamba ng’okukuba wafer etching n’okuyonja.

**Ebirimu n'Ebirungi**

Amaanyi gaayo tegali mu busobozi bwayo bwokka okukola emirimu gy’okusiiga egy’omutindo, wabula ekisinga obukulu mu kukyukakyuka kwayo okw’enjawulo, okufuga enkola entuufu, n’okukola dizayini ey’obwengula ennyo.

**Ekifaananyi/Enkizo** | **Ennyonyola enzijuvu**

**Okukyukakyuka mu nkola** | Asobola okukola ku sayizi za wafer ez’enjawulo, omuli mm 150, mm 200, ne mm 300; ewagira emitendera mingi egy’okulongoosa amazzi ku wafers, omuli okuteeka ebyuma, etching, n’okuyonja.

**Obuwagizi bw'ebintu ebigazi** | Awagira okuteekebwa kw’ebyuma n’alooyi ez’enjawulo, gamba ng’ekikomo, nikele, zaabu, bbaati-ffeeza, aloyi za magineeti, ne zaabu-ebbaati eutectic solders. Era ewagira multi-layer stack etching ku bintu eby’enjawulo nga CZT ne AlN.

**Okufuga enkola ey'omulembe** | Ekozesa ensengekera ya anode eya zooni eziwera okutuuka ku kusiiga okwa kimu, ne ku layeri z’ensigo ezigonvu ennyo oba eziziyiza. Ku wafers za mm 300, enhanced chamber reactor yaayo esobola okutereeza dynamically density ya current okukakasa nti deposition uniformity.

**Ebiyita waggulu & Ebisale ebitono** | "Teachless" precision automation emalawo obudde bw'okuyimirira obukwatagana n'okupima mu ngalo, ate tekinologiya wa ion membrane ayongera ku bulamu bw'okunaaba mu ddagala, ekivaamu ssente entono ennyo ez'okukola. Okugatta ku ekyo, ekigere kyayo ekitono kitumbula bulungi obusobozi bw’okufulumya okutwalira awamu. **Okugaziya Tekinologiya ow’obwannannyini:** Enkola yaayo eyasooka, enkola ya Raider GT, yawagira ebisenge ebiwera mukaaga eby’okusiiga era ng’ewaayo modulo z’okusiiga oba ez’okupima ez’okwesalirawo, wamu n’ebisenge ebigatta wafer edge, bevel, ne backside cleaning.

**Ebitundu by'okusaba**

**Advanced Packaging & Interconnects:** Ekozesebwa okujjuza ekikomo interconnect mu kukola chip, okukakasa void-free okujjuza; era ekozesebwa okuteeka empagi z’ekikomo, ebikonde bya solder (nga mw’otwalidde ne solder-free solder), ne layers eziddamu okugabanya (RDL) mu kupakinga kwa wafer-level.

**Okukola ebyuma eby’enjawulo:** Ekozesebwa mu kuteeka ebyuma mu layeri nnyingi mu byuma nga MEMS ne sensa; egaba okujjuza ekikomo eky’omutindo ogwa waggulu eri TSVs (Through-Silicon Vias) ne TGVs (Through-Glass Vias).

**Power & Compound Semiconductors:** Ekozesebwa okuteeka ekikomo ekinene mu byuma by’amaanyi, wamu n’okukola ebyuma eby’emabega ebitali bya situleesi ku wafers ennyimpi.

**Enkola endala ez’enjawulo:** Esobola okuteeka zaabu ng’ayita mu layini oba okuyonja wafers z’endabirwamu ng’ekozesa ebirungo ebikolebwa mu ozone; asobola okukola multi-layer stack etching —okusukka obusobozi bw’okukuba etching obw’ennono obwa UBM (Under Bump Metallization).

**Ebikwata ku by'ekikugu**

**Obuwagizi bwa sayizi ya Wafer:** 150mm, 200mm, 300mm

**Omuwendo gwa Plating Modules:** Base models ziwagira modules eziwera; ebika eby’omulembe bisobola okusuza abantu 6.

**Plating Uniformity:** Okukulembera mu makolero (data entongole teweereddwa).

**Ebintu ebiwagirwa:** Cu (Ekikomo), Au (Zabu), SnAg (Tin-Silver), Ni (Nickel), aloy za magineeti, AuSn (Gold-Tin Eutectic), n’ebirala.

**Obusobozi bw’enkola:** Awagira okuteekebwa kw’ekikomo ekinene okutuuka ku 100μm, okujjuza ensengekera za High Aspect Ratio (HAR), n’okujjuza ennyiriri ezirina Critical Dimensions (CD) entono okusinga 22nm.

**Omutendera gw’okukola mu ngeri ey’obwengula:** Enzimba ey’ebisenge ebingi ekolebwa mu ngeri ey’otoma mu bujjuvu, eyesigamiziddwa ku bibinja; awagira enkola z’okukola mu ngeri ey’obwengula mu makolero nga SECS/GEM; ekwatagana ne SMIF ne FOUP wafer transfer pods.

Okugerageranya ne ACM ULTRA ECP ap-p

Nga omuzannyi omukulu mu kisaawe ky’ebyuma ebikuba semikondokita, enkola eno eteekeddwa mu kifo kya njawulo nnyo ku ACM Research ULTRA ECP ap-p —ekyokulabirako kye wabuuzizzaako emabegako. Okulonda wakati w’ebibiri ku nkomerero kisinziira ku byetaago byo eby’enkola ebitongole.

**Ebipimo by'okugeraageranya** | **Ebikozesebwa mu kukola Raider Edge ECD** | **Okunoonyereza kwa ACM ULTRA ECP app-p**

**Tekinologiya Omukulu** | Essira aliteeka ku kusiiga okw’obutuufu obw’amaanyi ku wafers emu | Tekinologiya w’okumenya ebyuma ebiwanvu (horizontal plating) ku bintu ebikozesebwa ku ddaala lya panel

**Ekitundu ekigendererwamu** | 150mm – 300mm wafers | Ebipande bya mm 510 x mm 515

**Ebirungi Ebikulu** | Omutindo gw’amakolero; okukula mu tekinologiya ow’ekika ekya waggulu; eddirisa ly'enkola egazi | Aziba ekituli mu makolero; kisobozesa okufulumya ebintu mu bungi mu ngeri etali ya ssente nnyingi ku mutendera gwa panel

**Essira ly'enkola** | Essira lissa essira ku kugatta okutaliimu buzibu n’enkola z’okuyunga mu maaso | Ekoleddwa mu ngeri ey’enjawulo ku Fan-Out Panel-Level Packaging (FOPLP)

Amaanyi amatuufu aga Raider Edge ECD gali mu nkulaakulana yaayo: mu kusooka tekinologiya akozesebwa okuyunga ekikomo ku 22nm node, ekyuse n’efuuka ekifo eky’enjawulo ennyo ekisobola okuwagira enkola ez’enjawulo ez’enjawulo —okuva ku bintu bya magineeti okutuuka ku kupakinga okw’omulembe —bwe kityo ne kiraga obusobozi bwayo obw’amaanyi.