A Pick and Place Machine is an automated robotic system designed for high-speed, precise component placement in manufacturing processes. It is a core device in Surface Mount Technology (SMT) production lines, widely used in electronics, automotive, and medical industries to assemble components like resistors, capacitors, and IC chips onto PCBs (Printed Circuit Boards).
Component Feeding
Component supply：Components are loaded into feeders (tape, tray, or tube).
Visual Identity：An onboard vision system scans and verifies component orientation and quality.
Pick-Up & Positioning
Pickup：A multi-axis robotic arm with vacuum nozzles picks components from feeders.
calibration：Real-time optical correction adjusts placement coordinate (Accuracy up to ±0.01mm).
Placement & Soldering
Mounting：Components are placed onto pre-soldered PCB pads.
Curing：The PCB moves to a reflow oven for permanent soldering.
From high-speed precision to unmatched reliability, this curated list ranks the 10 best PCB pick and place machines globally, based on technical innovation, user reviews, and industry adoption. Whether you’re assembling compact consumer electronics or robust automotive control units, these cutting-edge systems deliver placement accuracy down to ±5µm and speeds exceeding 100,000 CPH, ensuring minimized production errors and maximized ROI.
Placement accuracy: ±10 microns at maximum, < 3 microns at repeatability.Placement speed: up to 30K cph (30,000 pieces per hour) for surface mount applications, up to 10K cph (10,000 pieces per hour) for advanced pack...
The main features of the GSM2 include high flexibility and high speed placement operations, as well as the ability to process multiple components simultaneously. Its core component, the FlexJet Head, uses a number of adv...
The Universal Instruments FuzionOF Chip Mounter is a high-performance automated chip mounter that is particularly suitable for handling large-area and heavy-weight substrates and complex, special-shaped component assembl...
iFlex T4, T2, H1 SMT machines adhere to the industry's most flexible "one machine for multiple uses" concept, which can be operated on a single track or on two tracks. The machine contains three modules,...
Philips iFlex T2 is an innovative, intelligent and flexible surface mount technology (SMT) solution launched by Assembléon. iFlex T2 represents the latest technological advancement in the electronics manufacturing ind...
Hitachi TCM-X200 este o mașină de plasare de mare viteză, cu automatizare ridicată și precizie de plasare.
The main functions and features of Hitachi TCM-X300 placement machine include efficient placement, flexible configuration and intelligent control. TCM-X300 placement machine is a high-performance placement equipment, sui...
Principalele funcții și caracteristici ale mașinii de plasare Hitachi G4 includ eficiență ridicată a producției, precizie ridicată și flexibilitate
Hitachi GXH-3J este o mașină de plasare de mare viteză, utilizată în principal pentru plasarea automată a componentelor în producția SMT (surface mount technology).
Hitachi GXH-3 este o mașină de plasare modulară de mare viteză, cu multe funcții avansate și performanțe de înaltă eficiență
Entry-Level (Under $20,000)
Use Case: Prototyping, low-volume production (<5,000 boards/month).
Recommended Model: Neoden 4 (supports 0402 components, 8,000 CPH).
Hidden Costs: Frequent manual feeder changes; maintenance costs ~15% of total ownership.
Mid-to-High Range (50,000–200,000)
Use Case: Medium/large-scale production (50,000+ boards/month), complex components (QFN, BGA).
Recommended Model: Yamaha YSM20R (25,000 CPH, ±25µm accuracy).
ROI Tip: Breakeven within 1-2 years for monthly output >100,000 boards.
| Production Needs | Recommended Configuration | Key Requirements |
|---|---|---|
| Small/Medium Batch (Flexible) | Electric multi-axis systems | Speed: 10,000–30,000 CPH, quick changeover (<15 mins) |
| High-Volume (24/7 Operation) | Pneumatic high-speed models | Speed: 80,000+ CPH, auto-feeders (>100 slots) |
Miniature Components (01005, 0201): Ensure ≤±15µm accuracy and 5MP+ vision systems.
Irregular Components (connectors, heatsinks): Opt for wide nozzles (Φ10mm) and custom fixtures (e.g., JUKI RS-1R).
High-Temperature Parts (automotive): Verify compatibility with ceramic nozzles and anti-thermal-drift algorithms.
Speed (CPH): Choose based on output needs; actual speed ≈70% of rated value (due to calibration/feeding).
Accuracy (µm): ±25µm for consumer electronics; ±5µm for medical/military.
Feeder System: 8mm–88mm tape compatibility; trays/vibratory feeders for irregular parts.
Software Ecosystem: Offline programming (CAD import), MES/ERP integration.
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