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पिक एण्ड प्लेस मेसिन

A Pick and Place Machine is an automated robotic system designed for high-speed, precise component placement in manufacturing processes. It is a core device in Surface Mount Technology (SMT) production lines, widely used in electronics, automotive, and medical industries to assemble components like resistors, capacitors, and IC chips onto PCBs (Printed Circuit Boards).

Pick and place machine how It works

  1. Component Feeding

  • Component supply：Components are loaded into feeders (tape, tray, or tube).

  • Visual Identity：An onboard vision system  scans and verifies component orientation and quality.

  • Pick-Up & Positioning

    • Pickup：A multi-axis robotic arm with vacuum nozzles picks components from feeders.

    • calibration：Real-time optical correction adjusts placement coordinate (Accuracy up to ±0.01mm).

  • Placement & Soldering

    • Mounting：Components are placed onto pre-soldered PCB pads.

    • Curing：The PCB moves to a reflow oven for permanent soldering.


    pick and place machine

    Top 10 Best PCB Pick and Place Machines in the World

    From high-speed precision to unmatched reliability, this curated list ranks the 10 best PCB pick and place machines globally, based on technical innovation, user reviews, and industry adoption. Whether you’re assembling compact consumer electronics or robust automotive control units, these cutting-edge systems deliver placement accuracy down to ±5µm and speeds exceeding 100,000 CPH, ensuring minimized production errors and maximized ROI.

    By speed:

    By Brand:

    How to Choose the Best Pick and Place Machine?

    1. Budget and Cost Analysis

    • Entry-Level (Under $20,000)

      • Use Case: Prototyping, low-volume production (<5,000 boards/month).

      • Recommended Model: Neoden 4 (supports 0402 components, 8,000 CPH).

      • Hidden Costs: Frequent manual feeder changes; maintenance costs ~15% of total ownership.

    • Mid-to-High Range (50,000–200,000)

      • Use Case: Medium/large-scale production (50,000+ boards/month), complex components (QFN, BGA).

      • Recommended Model: Yamaha YSM20R (25,000 CPH, ±25µm accuracy).

      • ROI Tip: Breakeven within 1-2 years for monthly output >100,000 boards.

    2. Production Scale and Performance Matching

    Production NeedsRecommended ConfigurationKey Requirements
    Small/Medium Batch (Flexible)Electric multi-axis systemsSpeed: 10,000–30,000 CPH, quick changeover (<15 mins)
    High-Volume (24/7 Operation)Pneumatic high-speed modelsSpeed: 80,000+ CPH, auto-feeders (>100 slots)

    3. Component Complexity and Compatibility

    • Miniature Components (01005, 0201): Ensure ≤±15µm accuracy and 5MP+ vision systems.

    • Irregular Components (connectors, heatsinks): Opt for wide nozzles (Φ10mm) and custom fixtures (e.g., JUKI RS-1R).

    • High-Temperature Parts (automotive): Verify compatibility with ceramic nozzles and anti-thermal-drift algorithms.

    4. Prioritizing Technical Specifications

    1. Speed (CPH): Choose based on output needs; actual speed ≈70% of rated value (due to calibration/feeding).

    2. Accuracy (µm): ±25µm for consumer electronics; ±5µm for medical/military.

    3. Feeder System: 8mm–88mm tape compatibility; trays/vibratory feeders for irregular parts.

    4. Software Ecosystem: Offline programming (CAD import), MES/ERP integration.

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