A Pick and Place Machine waa nidaam roboti ah oo si toos ah loogu talagalay in lagu meeleeyo xawaaraha sare, qayb sax ah ee hababka wax soo saarka. Waa aalad xudun u ah khadadka wax soo saarka ee Surface Mount Technology (SMT), oo si weyn loogu isticmaalo qalabka elektiroonigga ah, baabuurta, iyo warshadaha caafimaadka si loo ururiyo qaybaha sida iska caabiyeyaasha, capacitors, iyo chips IC ee PCBs (Printed Circuit Boards).
Quudinta Qaybaha
Bixinta qaybaha:Qaybaha waxaa lagu shubaa feeders (cajalad, saxaarad, ama tuubo).
Aqoonsiga Muuqaalka:Nidaamka aragga dushiisa ayaa baadhi oo xaqiijiya jihaynta iyo tayada qaybaha.
Qaadista & Meelaynta
Soo qaadis:Cudud robotik ah oo dhididi badan leh oo leh vacuum nozzles ayaa ka soo qaada qaybo ka mid ah quudiyeyaasha.
qiyaasid:Sixitaan indho-indheyneed-waqtiga-dhabta ah waxay hagaajisaa isku-dubbaridka meelaynta (Sax ahaan ilaa ± 0.01mm).
Meelaynta & iibinta
Koritaanka:Qaybaha waxaa lagu dhejiyaa suufka PCB ee horay loo sii iibiyey.
Daawaynta:PCB-gu wuxuu u guuraa foornada dib-u-qulqulaya ee alxanka joogtada ah.
Laga soo bilaabo saxsanaanta xawaaraha sare ilaa isku halaynta aan la isku halayn karin, liiskan la soo xulay ayaa darajeeyay 10-ka mashiin ee PCB ugu fiican ee la soo qaado iyo meelaynta adduunka oo dhan, iyadoo lagu saleynayo hal-abuurnimada farsamada, dib u eegista isticmaalaha, iyo korsashada warshadaha. Haddii aad ururinayso qalabka elektaroonigga ah ee macaamiisha ah ama unugyada xakamaynta baabuurta ee adag, nidaamyadan gees-goynta ah waxay keenayaan saxnaanta meelaynta ilaa ± 5µm iyo xawaaruhu ka badan yihiin 100,000 CPH, hubinta khaladaadka wax soo saarka ee la yareeyay iyo ROI la kordhiyay.
Saxnaanta meelaynta: ± 10 microns ugu badnaan, <3 microns at repeatability
Astaamaha ugu muhiimsan ee GSM2 waxaa ka mid ah dabacsanaan sare iyo hawlgallo meeleyn xawaare sare leh, iyo sidoo kale awoodda lagu socodsiiyo qaybo badan oo isku mar ah. Qaybteeda xudunta u ah, FlexJet Head, waxay isticmaashaa tiro xayeysiis ah...
Qalabka Caalamiga ah ee FuzionOF Chip Mounter waa qalab si toos ah u shaqaynaya oo si gaar ah ugu habboon maaraynta dhul-weyn iyo substrates miisaan culus iyo kakan, qaab-gaar ah
Mashiinnada iFlex T4, T2, H1 SMT waxay u hoggaansamaan fikradda ugu dabacsan warshadaha ee "hal mishiin ee isticmaalka badan", kaas oo lagu shaqayn karo hal waddo ama laba waddo. Mashiinku wuxuu ka kooban yahay saddex qaybood, ...
Philips iFlex T2 waa hal-abuur leh, caqli badan oo teknoolajiyada korka sare ee dabacsan (SMT) xal uu bilaabay Assembléon. iFlex T2 waxay matalaysaa horumarkii tignoolajiyada ugu dambeeyay ee wax soo saarka elektiroonigga
Hitachi TCM-X200 waa mashiinka meelaynta xawaaraha sare leh oo leh qalab sare iyo saxnaanta meelaynta.
Hawlaha ugu muhiimsan iyo sifooyinka mashiinka meelaynta Hitachi TCM-X300 waxaa ka mid ah meelayn hufan, qaabeynta dabacsan iyo xakamaynta caqliga leh. Mashiinka meelaynta TCM-X300 waa qalab meelaynta waxqabadka sare leh, sui ...
Hawlaha ugu muhiimsan iyo sifooyinka mashiinka meelaynta Hitachi G4 waxaa ka mid ah waxtarka wax soo saarka sare, saxnaanta sare iyo dabacsanaanta
Hitachi GXH-3J waa mashiinka meelaynta xawaaraha sare leh, inta badan loo isticmaalo meelaynta tooska ah ee qaybaha SMT (teknoolajiyada dusha sare) ee wax soo saarka.
Hitachi GXH-3 waa mashiinka meelaynta modular-xawaaraha sare leh oo leh hawlo badan oo horumarsan iyo wax qabad tayo sare leh
Heerka Gelitaanka (Ka hooseeya $20,000)
Isticmaal Kiis: Prototyping, wax soo saarka mugga hoose (<5,000 loox/bishii).
Qaabka lagu taliyay: Neoden 4 (waxay taageertaa qaybaha 0402, 8,000 CPH).
Qiimaha Qarsoon: Isbeddelka quudiyaha gacanta ee soo noqnoqda; kharashka dayactirka ~ 15% wadarta lahaanshaha.
Dhex-ilaa-sare (50,000-200,000)
Isticmaal Kiis: Wax soo saar dhexdhexaad ah/balaadhan (50,000+ loox/bishii), qaybo kakan (QFN, BGA).
Qaabka lagu taliyay: Yamaha YSM20R (25,000 CPH, ± 25µm sax ah).
Talo-siinta ROI: Jebinta 1-2 sano gudahood wax soo saarka bishii> 100,000 loox.
Baahiyaha Wax Soo Saarka | Isku xidhka lagu taliyay | Shuruudaha Muhiimka ah |
---|---|---|
Dufcaddii Yaryar/ Dhexdhexaad (Dabacsan) | Nidaamyada dhidibada badan ee korontada | Xawaaraha: 10,000-30,000 CPH, isbeddel degdeg ah (<15 daqiiqo) |
Mug sarreeya (Hawlgalka 24/7) | Moodooyinka xawaaraha sare ee pneumatic | Xawaaraha: 80,000+ CPH, auto feeders (> 100 boosas) |
Qaybaha Yaryar (01005, 0201): Hubi ≤±15µm saxnaanta iyo 5MP+ hababka aragga.
Qaybaha aan caadiga ahayn (ku xidhayaasha, heatsinks): Dooro nozzles ballaaran (Φ10mm) iyo qalabyada gaarka ah (tusaale, JUKI RS-1R).
Qaybaha Heerkulka Sare (Gaadiidka): Hubi waafaqid nozzles dhoobada iyo algorithms-ka-hortagga kulaylka.
Xawaaraha (CPH): Dooro ku salaysan baahida wax soo saarka; Xawaaraha dhabta ah ≈70% ee qiimaha la qiimeeyay (sababta oo ah jaangooynta/quudinta).
Saxnaanta (µm): ± 25µm ee qalabka elektarooniga ah ee macaamiisha; ±5µm caafimaadka/ciidanka
Nidaamka Quudinta: 8mm-88mm waafaqid cajalad; saxaarad/quudhiyayaasha gariir ee qaybaha aan caadiga ahayn.
Nidaamka deegaanka ee Software: Barnaamijyada khadka tooska ah (soo dejinta CAD), isku dhafka MES/ERP.
Soo qaado oo dhig Maqaallada Farsamada ee Mashiinka
2025-05
Mashiinka soo-qaadista iyo goobta waa qalab kacaan ah oo keenaya saxnaanta, xawaaraha, iyo joogteynta wax-soo-saarka elektiroonigga ah ee casriga ahi waxay ku tiirsan yihiin. Haddii aad waligaa la yaabtay sida looxyada wareegyada ee taleefannada casriga ah, aaladaha caafimaadka, ama nidaamyada baabuurta ay u qiimeeyaan...
La xidhiidh khabiirka iibka
La xidhiidh kooxdayada iibka si aad u sahamiso xalal habaysan oo si fiican u daboolaya baahiyahaaga ganacsi oo aad wax uga qabato wixii su'aalo ah ee aad qabtid.