Mühlbauer test handler DS Merlin 60000

Key Specifications at a Glance

Key Dimensions of the DS Merlin 60000

UPH (Output Per Hour): Up to 55,000 chips (tape/reel/flip mode), supporting various other configurations

Applicable Chip Size: Minimum 0.2mm x 0.4mm, thickness only 80μm

Main Applications: Chip sorting: Wafer-to-Tape, Wafer-to-Panel, etc.

Process Support: Supports flip chip and non-flip processes

Placement Accuracy: ±30 μm

Core Technology Details

Patented Dual-Wheel Pick & Place System

The DS Merlin 60000 breaks away from the traditional die bonder design using multiple independent bonding heads, adopting a new structure that integrates the die ejector and pick & place wheel into one unit. At its core is a patented pick-and-place system incorporating two rotating wheels. This innovation reduces redundant movement, enabling precise and rapid self-aligned transport, key to achieving record-breaking production speeds.

100% 6-Side Automated Optical Inspection (AOI)

Unlike the industry's conventional "full-speed sorting followed by sampling inspection" approach, the DS Merlin 60000 can still perform 100% comprehensive inspection of all six sides of each chip at its maximum speed of 55,000 UPH. Its vision system is equipped with a camera of at least 4 megapixels, capable of detecting defects as small as 5-10μm, and supports multiple inspection modes including visible light, infrared (IR), and laser groove. This ensures increased throughput while maintaining reliable quality.

High-Efficiency Automation and Changeover

Automatic Self-Calibration (ASAS): Automatically measures and records the position and size of each chip on the wafer, and automatically corrects the transport path accordingly, completely replacing traditional manual settings. Optional ARC (Automatic Reel Changer) allows for tape changes without stopping the machine.

Simple and intuitive operation: The optimized human-machine interface (HMI) makes programming and learning new products faster.

Main application scenarios: The DS Merlin 60000 is particularly suitable for applications requiring extremely high-volume production at the lowest unit cost, and is the primary equipment for the following applications:

Consumer electronics core components: Smartphone sensors, power management chips (PMIC), RFID/NFC chips, etc.

LED and display drivers: Sorting of large quantities of Mini-LED chips.

Automotive electronics: Standardized control chips for a large number of body controls, window regulators, etc.

Internet of Things (IoT): Sensors, Bluetooth/Wi-Fi modules, etc.

**Core Advantages**

This equipment serves as the centerpiece of mass production lines, thanks primarily to the following key features:

**Record-Breaking Throughput:** Featuring a unique dual-wheel pick-and-place system and optimized material flow, it processes microchips at speeds of up to 55,000 UPH—setting the industry benchmark for speed within its class. Compared to previous models, documented records indicate that the manufacturing costs for the equipment's core modules can be reduced by 20%.

**Reliable Quality Control:** It performs 100% full inspection of all six sides of each chip—even at ultra-high speeds—thereby ensuring high yield rates in mass production environments.

**Comprehensive Process Support:** It supports a wide variety of material formats—including Flip, Non-Flip, Tape & Reel, and Wafer/Panel—and is compatible with carrier tape de-taping processes, effectively meeting diverse production requirements.

**Automated Line Changeover & Industry 4.0 Ready:** Its automated self-calibration system enables seamless and rapid product changeovers. When paired with the optional MB PALAMAX® software, it also facilitates 100% complete traceability of materials and production data.

**Low Total Cost of Ownership (CoO):** Compared to previous models, its innovative design and lower unit-level material consumption costs allow for a faster Return on Investment (ROI).

**Extensive Market Validation:** With over 450 units installed worldwide, the system has earned the widespread trust of customers across the globe.

**Summary**

The design philosophy behind the MB DS Merlin 60000 is remarkably pure: to push throughput speeds to the absolute limit while uncompromisingly maintaining quality standards. It is not a general-purpose machine designed for laboratory-grade precision or for high-mix, low-volume production; rather, it is a "King of Production Efficiency"—optimized specifically for single-product, high-volume manufacturing scenarios. For semiconductor assembly and testing enterprises requiring ultra-large-scale production at the lowest possible unit cost, the DS Merlin 60000 stands as an undeniably compelling benchmark for both efficiency and cost-effectiveness.