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xhICONN Platform
A production-oriented automatic wire bonding platform used for semiconductor package interconnection, programmable looping, vision alignment and controlled first- and second-bond formation.
K&S Copper Wire Bonding Equipment
K&S ICONN ProCu PLUS ELA Wire Bonder
Source used and refurbished K&S ICONN ProCu PLUS ELA wire bonders for copper wire semiconductor packaging and extended large-area leadframe applications. Review the machine configuration, ProCu5 process platform, material-handling setup and available test evidence before confirming equipment compatibility.
Model Overview
What Is the K&S ICONN ProCu PLUS ELA?
The K&S ICONN ProCu PLUS ELA is part of the ICONN copper wire bonding platform developed for automatic semiconductor package assembly.
The machine combines the ProCu PLUS process generation with an extended large-area material-handling configuration for leadframes, substrates or package matrices that require a wider processing envelope than a standard machine.
The model name alone does not confirm the installed bondable area.
Verify the serial number, indexer, clamp, heater block, software and
upgrade history before matching the equipment to a package.
ProCu PLUS Generation
ProCu PLUS introduced upgraded copper bonding subsystems and the ProCu5 process family for demanding copper wire applications.
ELA Configuration
ELA identifies the extended large-area route. Actual package width, indexing range and tooling compatibility depend on the specific machine build and installed handling modules.
Used Equipment Matching
A useful equipment comparison must include machine condition, process history, software, bond head, gas delivery, EFO, indexer, clamps, heater blocks and included accessories.
Copper Bonding Platform
ProCu5 Process Controls for Copper Wire Production
Copper wire bonding requires more than replacing gold wire with copper wire. Free-air-ball formation, cover gas, EFO conditions, ultrasonic response, bond force and process portability must work as one controlled system.
ProCu5 Copper Process
The ProCu PLUS family was introduced with the ProCu5 process generation to improve copper wire process control for advanced semiconductor packaging requirements.
Gas Delivery and EFO Control
Copper free-air-ball quality depends on the condition and calibration of the electronic flame-off system, gas delivery, nozzles, regulators and process settings.
Programmable Process Parameters
Bond force, ultrasonic energy, timing, search height, loop shape and second-bond parameters must be matched to the wire, capillary, pad structure and package.
Golden Process Management
Process library functions support the storage, review and reuse of qualified copper bonding recipes, subject to the software version and installed machine options.
Model Family Comparison
ICONN ProCu PLUS Standard, LA and ELA Configurations
The standard, large-area and extended large-area names describe different processing envelopes and material-handling arrangements. They should not be treated as interchangeable machines.
Comparison
Configuration
Standard platform
ProCu PLUS
Large area
ProCu PLUS LA
Extended large area
ProCu PLUS ELA
Published positioning
Standard copper wire bonding platform.
Factory large-area configuration.
Extended large-area upgrade or configured machine route.
Published bondable area
80 mm standard area, with an upgrade path identified in the original product release.
87 mm factory-configured bondable area.
Verify from the serial number, option list and installed machine hardware.
Material handling
Standard package and leadframe handling configuration.
Wider package or matrix handling requirements.
Extended leadframe, substrate or matrix handling subject to the installed indexer.
Before purchasing
Confirm model, year, software and standard tooling.
Confirm LA indexer, clamp, heater block and actual area.
Confirm ELA designation, upgrade records, range, tooling and package drawing.
Do not publish an unverified ELA bondable-area number. Machines may have
different upgrade histories, indexers, clamps and software
configurations even when the exterior model label appears similar.
Application Matching
Where an ICONN ProCu PLUS ELA May Fit
The ELA platform is most relevant when the process requires copper wire bonding together with an extended material-handling envelope.
Final compatibility should be established from the actual package drawing, wire specification, matrix size, bond locations, index direction and tooling requirements.
Send a Package DrawingLarge Matrix Leadframes
Package formats requiring wider indexing, dedicated clamp geometry or extended bond locations beyond a standard handling setup.
Copper Wire IC Packaging
Semiconductor assembly processes using copper wire and controlled free-air-ball formation for integrated circuit interconnection.
Fine-Pitch Package Assembly
Package structures requiring stable vision alignment, controlled bond placement, repeatable loop formation and qualified tooling.
Capacity Expansion
Additional production capacity for facilities already operating compatible K&S platforms, process libraries and package tooling.
Copper Process Transfer
Equipment projects involving the transfer of an existing qualified copper bonding process to another compatible machine.
Legacy Equipment Replacement
Replacement or backup equipment projects where the target machine must match existing package, tooling and production requirements.
Configuration Verification
Information to Confirm on the Actual Machine
Used wire bonders should be evaluated from their installed configuration rather than from a general family brochure. Request photos, option lists and operating evidence for the specific serial number.
01 Model, Serial Number and Year Confirm the complete machine identity rather than relying on a shortened sales title.
Request clear photos of the machine nameplate, serial number, manufacturing year and any LA or ELA identification. Compare this information with the software screen and option list.
02 Indexer and Bondable Area The installed handling system determines whether the target leadframe can physically run.
Check the indexer type, rail width, transport range, matrix orientation, input and output interface, clamp opening and verified bondable area.
03 Clamp, Heater Block and Tooling Package compatibility depends on tooling geometry as well as machine travel.
Confirm the included clamp, heater block, window clamp, track parts, capillary holder and product-specific tooling. Determine whether new tooling must be manufactured.
04 Bond Head and Ultrasonic System Mechanical and ultrasonic condition directly affects process portability.
Review bond-head movement, transducer condition, ultrasonic output, force control, Z-axis response, wire clamp operation and maintenance history.
05 EFO and Gas Delivery System Copper ball formation requires a stable and correctly configured protective gas environment.
Inspect EFO operation, gas regulators, valves, nozzles, flow control, tubing and alarms. Request demonstration evidence when copper wire production is a critical requirement.
06 Vision, Software and Computer Hardware condition alone does not confirm a production-ready machine.
Confirm the camera image, lighting, pattern recognition, software revision, licenses, process files, computer status, storage backup and communication interfaces.
Used Equipment Inspection
Pre-Shipment Verification for a Used Wire Bonder
Inspection should document what the machine can demonstrate in its current condition and what still requires installation, tooling or process qualification at the destination factory.
A dry run is useful for mechanical verification, but it is not the same as a qualified production acceptance test using the customer's wire, capillary, package and recipe.
Power-On and Error Review
Check startup condition, system alarms, controller communication, safety circuits and available diagnostic records.
Axis and Motion Testing
Review XY and Z movement, homing, indexer transport, clamp motion and abnormal noise or vibration.
Vision and Lighting Check
Confirm camera images, lighting channels, focus, pattern recognition and alignment response.
EFO, Gas and Pneumatics
Test electronic flame-off operation, gas components, valves, regulators, pressure stability and pneumatic leakage.
Bond Head and Wire Clamp
Examine bond-head response, transducer condition, wire feeding, wire clamp movement and capillary interface.
Software and Backup
Record software versions, licenses, computer condition, process files, manuals and available system backups.
Equipment Sourcing Process
From Machine Request to Export Shipment
A configuration-based sourcing process reduces the risk of purchasing a machine that cannot support the required package, tooling or copper bonding setup.
Define the Target
Send the model, package drawing, wire specification, required condition, quantity and destination.
Match the Configuration
Compare available machines by year, serial number, ELA status, indexer, tooling, software and accessories.
Review Test Evidence
Review machine photos, startup video, motion testing, vision, indexer, EFO, gas and dry-run evidence.
Prepare for Delivery
Confirm refurbishment scope, backup, included tooling, packing, shipping method and destination installation requirements.
Technical FAQ
K&S ICONN ProCu PLUS ELA FAQ
These questions address the model name, copper process, extended large-area configuration and used-equipment verification.
What is the K&S ICONN ProCu PLUS ELA?
It is an automatic thermosonic ball wire bonder in the ICONN ProCu PLUS copper bonding family. The ELA designation identifies an extended large-area configuration intended for package and material-handling requirements beyond the standard platform.
What does ELA mean on the ICONN ProCu PLUS?
ELA means Extended Large Area. The precise bondable area, indexer arrangement and supported package format should be verified from the serial number, machine configuration, software and installed handling hardware.
What is the difference between ICONN ProCu and ProCu PLUS?
Both are designed around copper wire bonding, while the ProCu PLUS generation introduced upgraded subsystems and the ProCu5 process family. Actual capability still depends on the installed options and machine condition.
Can the machine bond gold wire as well as copper wire?
Wire material capability must be confirmed from the installed bond head, EFO system, gas delivery, software, capillary, wire kit and process history. Do not assume every copper-configured machine supports every gold or alloy wire process.
What should be checked before buying a used ICONN ProCu PLUS ELA?
Confirm the exact model, year, serial number, bondable area, indexer, clamp, heater block, bond head, transducer, EFO, gas system, vision system, software, computer, tooling and operating evidence.
Is the ELA configuration suitable for every package?
No. Package width alone is not enough. Leadframe geometry, matrix format, indexing direction, clamp design, heater block, bond locations and process recipe must all match the equipment.
Can a used K&S ICONN ProCu PLUS ELA be refurbished?
Refurbishment may include cleaning, mechanical inspection, axis testing, pneumatic checks, vision verification, EFO and gas checks, indexer testing, computer backup and extended dry-run testing, depending on machine condition.
What information is needed for a quotation?
Send the target model, preferred year and condition, wire material, wire diameter, package or leadframe drawing, matrix width, required indexer, destination country and any tooling or demonstration requirements.
Request a K&S ICONN ProCu PLUS ELA Configuration Review
Send the model requirement, wire material, package drawing, leadframe width, preferred condition, tooling needs and destination. We will compare available equipment by serial number, indexer, process configuration and test status.
