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siemens asm siplace chip mounter hs60

siemens asm siplace chip mounter hs60

Siemens SIPLACE HS60 is an ultra-high-speed modular placement machine launched by Siemens Electronic Assembly System, which belongs to the SIPLACE classic high-speed series model

ລັດ: ໃຊ້ ໃນຫ້ອງການ: ຜູ້ຈັດກ່ຽວກັບ:
ຂໍ້ມູນລາຍລະອຽດ

Siemens SIPLACE HS60 is an ultra-high-speed modular placement machine launched by Siemens Electronic Assembly Systems, belonging to the SIPLACE classic high-speed series. The equipment is designed for high-volume electronic manufacturing, especially for:

ເຄື່ອງ​ເອ​ເລັກ​ໂຕຣ​ນິກ​ການ​ບໍ​ລິ​ໂພກ (ໂທລະ​ສັບ​ມື​ຖື​, ແທັບ​ເລັດ​)

Automotive electronics (car entertainment systems)

Communication equipment (routers, switches)

Home appliance control panels

II. Core technology principles

1. High-speed motion system

Dual cantilever independent operation: 2 independent cantilever synchronous operation to achieve efficient parallel placement

Rotary tower placement head: 12 nozzle rotary head design, maximum speed of 60,000CPH

Linear magnetic levitation drive: X/Y axis uses linear motor drive, acceleration of 3.5G

2. Vision positioning system

Flying centering technology: complete component identification and positioning during the placement process

Dual camera system:

High-resolution global camera (for PCB positioning)

High-precision local camera (for component identification)

3. Feeding system

Intelligent feeder platform:

Support 8mm~56mm tape feeder

Automatic tape tension control

Feeder automatic identification

III. Core specifications and parameters

ຂໍ້ມູນຈໍາເພາະຂອງພາລາມິເຕີ

Placement accuracy ±50μm @ 3σ

Placement speed 60,000 CPH (theoretical maximum)

Component range 0402~24×24mm (height 12.7mm)

Feeder capacity Up to 72 8mm tape feeders

Board size 50×50mm~457×356mm

Power requirement 400VAC 3 phase 7kVA

IV. Core advantages

1. Ultra-high speed

Industry-leading 60k CPH placement speed

0.06 seconds/chip placement cycle

Dual cantilever working together

2. Stable and reliable

Rugged industrial-grade mechanical structure

<1000ppm placement defect rate

Automatic error-proofing system

3. Cost-effective

Low placement cost per point

Quick return on investment (usually <18 months)

Low maintenance design

V. Equipment features

1. Innovative placement head

Rotating tower design: 12 nozzles rotate continuously

Intelligent nozzle selection: automatically select the best nozzle

Vacuum control system: independently controlled vacuum channel

2. Vision system

Flying centering technology reduces pause time

Dual camera system improves recognition accuracy

Automatic lighting adjustment

3. Feeding system

Quick feeder replacement design

Tape status monitoring

Lack of material warning function

VI. Functional modules

1. Placement control system

Motion trajectory optimization algorithm

Component database management

Program optimization function

2. Quality assurance system

First piece inspection function

Placement process monitoring

Data recording function

3. Production management system

Equipment status monitoring

Production efficiency statistics

Fault record analysis

VII. Precautions for use

1. Environmental requirements

Temperature: 20±3℃

Humidity: 40-70%RH

Vibration: <0.5G (stable foundation required)

2. Daily operation

Perform quick calibration before starting the machine every day

Clean the nozzle regularly (recommended every 4 hours)

Use original consumables (nozzles, feeders, etc.)

3. ບໍາລຸງຮັກສາ

Item Cycle Content

Nozzle inspection Daily Check for wear and cleaning

Guide lubrication Weekly Maintenance with special lubricating oil

Camera calibration Monthly Use standard calibration board

Comprehensive inspection Quarterly Performed by professional engineers

VIII. Common faults and solutions

1. Fault: Poor nozzle pickup

ສາເຫດທີ່ເປັນໄປໄດ້:

Nozzle blockage

Insufficient vacuum

Wrong component thickness setting

ການແກ້ໄຂ:

Clean or replace nozzle

Check vacuum system

Remeasure component thickness

2. Fault: Component recognition error

ສາເຫດທີ່ເປັນໄປໄດ້:

Camera lens contamination

Improper lighting setting

Wrong component data

ການແກ້ໄຂ:

Clean camera lens

Adjust lighting parameters

Check component database

3. Fault: Motion system alarm

ສາເຫດທີ່ເປັນໄປໄດ້:

Mechanical collision

Servo drive abnormality

Insufficient guide rail lubrication

ການແກ້ໄຂ:

Check the mechanical structure

Restart the servo system

Lubricate the linear guide

IX. Maintenance ideas

1. Systematic troubleshooting

Observe the phenomenon: record the alarm code and equipment status

Analyze the possible causes: refer to the manual to determine the scope of the fault

Step by step elimination: check from simple to complex

2. Key component inspection sequence

Suction nozzle and vacuum system

Feeder status

Visual system

Motion mechanism

ລະບົບ ການຄວບຄຸມ

3. Professional support

Use SIPLACE diagnostic software

Contact Siemens technical support

Replace spare parts with original parts

10. Market Positioning

Preferred Equipment for Mass Production

Mainstream for Consumer Electronics Manufacturing

High-Speed Model with High Cost-Effectiveness

11. Summary

Siemens SIPLACE HS60 SMT Machine is the ideal choice for mass electronics manufacturing with:

Industry-leading 60k CPH speed

Stable SMT quality

Economical and efficient operating costs

It is the ideal choice for mass electronics manufacturing. Through standardized daily maintenance and scientific troubleshooting, the equipment can be ensured to operate stably for a long time, providing reliable guarantee for high-quality electronics manufacturing.

ASM HS60

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