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Okukwatagana kw'ebyava mu kusengeka wafer

Ebyetaago bya Wafer Dicing n’okulonda ebyuma

Tandika ne wafer, obugazi bw’oluguudo, obuziba bw’okusala, edge-quality target n’okukulukuta oluvannyuma lw’okusala dicing, olwo geraageranya ensengeka y’okusala dicing enkola y’okufulumya mu butuufu yeetaaga.

Nnyonnyola Ebyava mu Kusala Browse Ebisala Ebisala

Core Okusala Brief

Nnyonnyola Okusala n’Ekiteekwa Okuwangaala

Wafer dicing efuna obuwanguzi bwokka nga die eyawuddwamu esigadde nga ekozesebwa mu kwekebejja, okugikwata n’okugikuŋŋaanya. Tandika okuva ku kivaamu ekyetaagisa, olwo okivvuunule mu kyuma, ekyuma, okulaba, okukwata emirimu n’okuyonja ebyetaagisa.

01 / Oluguudo

Kuuma Ekisala Munda Mu Lane

Obugazi bw’enguudo, geometry ya die n’obubonero bw’okulaganya bye bisalawo obungi bw’omugongo gw’ekifo (positional margin) oguliwo mu kiseera ky’okusala.

Weekenneenye okutegeera okulaba, obutuufu bw’ekisiki, obuwanvu bw’ekyuma n’obusobozi bw’okukebera kerf ku kyuma kyennyini.

02 / Empenda

Kuuma Die Edge ne Backside

Wafers ennyimpi, ezikutuka oba ezikwata ku situleesi zisobola okulaga okukutuka ku ludda olw’okungulu, okukutuka kw’emabega oba enjatika entonotono ne bwe kiba nti ekkubo erisaliddwa liteekeddwa bulungi.

Gyaakanya spindle, ekkubo lya blade, feed window, mounting support n’embeera y’okunyogoza n’ensengeka ya wafer.

03 / Obuziba

Tuuka ku Buziba obw’Okwawula obwetaagisa

Okusala mu bujjuvu, okusala ekitundu, okusala emidumu n’okusala mu mutendera biteeka ebyetaago eby’enjawulo ku kufuga okusala-obuziba, okutegeka spindle n’okuwagira workpiece.

Kakasa oba ekitundu ekijuliziddwa kisobola okuwagira enkola y’okusala etegekeddwa okusinga okwesigama ku famire y’ekyokulabirako yokka.

04 / Okugabanya

Sumulula Buyonjo mu Mutendera oguddako

Ebisasiro, amazzi agasigaddewo, embeera ya tape n’entambula ya die oluvannyuma lw’okusala bikosa okwekebejja, okugaziwa, okulonda n’okusiba die.

Kebera ekkubo erirongoosa, ekyuma ekikala, okukwata fuleemu n’ekkubo ly’oluvannyuma lw’okusala dicing lirimu n’ekyuma oba layini y’okufulumya.

Ebikozesebwa mu kiseera kino

Ebikozesebwa mu Dicing Saw ku byetaago by'okusala Wafer

Ggulawo empapula z’ekyuma oluvannyuma lw’okunnyonnyola ekivudde mu kusala. Oluvannyuma kakasa spindle, table, vision, software, handling modules n’embeera ya unit yennyini okusinziira ku mbeera ezeetaagisa ey’oku luguudo, obuziba, edge n’okukwasa.

NeonTech NDS-4200 ekyuma ekisala dicing
NeonTech NDS-4200 ye saw ya precision dicing ekola mu bujjuvu nga ekoleddwa ku wafers za yinsi 8 (200mm). Nga mulimu g...
Laba Ebikwata ku Ekyuma
DISCO Dicing Saw DAD324
DAD324 ekozesa MCU ey’omutindo ogwa waggulu okulongoosa sipiidi y’emirimu gya pulogulaamu n’embiro y’okuddamu okukola. Embazzi ya X, Y, ne Z...
Laba Ebikwata ku Ekyuma
ekyuma ekisala wafer za disiko DAD3241
DISCO-DAD3241 ye slicer ey’omutindo ogwa waggulu eya automatic slicer esaanira okusala ebyetaago by’ebintu eby’enjawulo nga erina producti...
Laba Ebikwata ku Ekyuma
DISCO Saw ya Dicing ekola mu bujjuvu DFD6341
Enkula y’ebyuma: obugazi bwa mita 1.180, obuziba bwa mita 1.080, obuwanvu bwa mita 1.820. Obuzito bw’ebyuma: kkiro nga 1.500. ...
Laba Ebikwata ku Ekyuma

Tewali byuma biragiddwa mu kiseera kino mu kiti kino. Weereza ebikwata ku wafer, ekivaamu ekyetaagisa eky’okusala n’embeera y’ebyuma by’oyagala olwo okugaba kwa dicing saw okuliwo kusobole okukeberebwa.

Omuko gw'ekyokulabirako gufunza okunoonya, naye tegukakasa bivudde mu kusala.Spindle, chuck table, vision, cleaner, software, accessories n’obujulizi obuliwo obw’okukebera bikyalina okukeberebwa ku unit entongole.

Ekyetaagisa Ekyetaagisa

Fuula Ekyava mu Kusala mu Byetaago by’Ebyuma

Ekigendererwa si kutondawo nsengeka ya nkola empanvu. Ebibinja bisatu eby’amawulire bitera okumala okufunza ekitundu ky’emirimu, enkola y’okusala n’ensengeka y’okufulumya ebisaanira okwongera okwekenneenya.

Ekintu ekikolebwa n’Obuwagizi

Wafer, Fuleemu ne Tape

Gabana wafer diameter, obuwanvu, material, frame format n'embeera ya tape. Ebintu bino bikosa chuck, vacuum, loader, obuziba bw’okusala n’obuwagizi obwetaagisa mu kiseera ky’okwawula.

Sala Ekkubo n'Omutindo

Street, Die ne Edge Target

Waayo obugazi bw’oluguudo, sayizi ya die, ekyetaagisa okusala mu bujjuvu oba ekitundu n’embeera y’empenda erina okukuumibwa. Kino kifunza obulagirizi, spindle, okulaba n’okukebera obulagirizi.

Okufulumya n’okugabanya

Okufulumya, Okwoza n’Okusitula

Voliyumu esuubirwa, okutabula ebintu, obwetaavu bw’okuyonja n’okukola okuddako biyamba okuzuula otomatiki, omuwendo gwa spindle emu oba bbiri, okugatta obulungi n’okukwata fuleemu.

Ebyuma Ebiriraanyewo

Kuuma Omutendera gwa Dicing nga Guyungiddwa

Okuwagira wafer nga tonnasala n’okufuga ebisigadde oluvannyuma lw’okusala bisobola okukyusa embeera y’okufa esembayo. Kozesa empapula zino ezifulumiziddwa ng’omulimu gw’okukwatagana gusukka essala yennyini.

Nga Tonnaba kukola Dicing

Ekintu ekiyitibwa Wafer Mounter

Weekenneenye okukozesa tape, okutikka fuleemu n’obuyambi bwa thin-wafer nga omutindo gw’okussaako gukosa okutebenkera kw’okusala.

Browse Ebifo Ebisimba Wafer

Ekika ky’Ebyuma

Ebyuma Ebisala Dicing

Ddayo mu kiti ekikulu ng'omulimu guli broad model browsing oba ekyuma ekiriwo kati.

Browse Ekitundu Ekikulu

Oluvannyuma lw’okukola Dicing

Ekyuma ekiyonja Wafer

Weekenneenye ebyuma eby’okwoza, okunaaba n’okukaza ng’ebisasiro oba obunnyogovu bisobola okukosa okwekebejja n’okukuŋŋaanya wansi.

Browse Ebiyonja Wafer

Okwetaaga okugeraageranya amakubo ag’enjawulo ag’ebyuma bya semiconductor?Kozesa enkola ya...Ebyuma Ebikola Dicing ya Semiconductoromuko nga okusalawo kutandika ne silikoni, SiC, MEMS, ebyuma ebirabika, ebipapula oba ebipande okusinga ekiva mu kusala wafer ekitongole.

Ebibuuzo Ebikwata ku Wafer Dicing

Ebibuuzo Ebikwata ku Wafer Dicing Ebikwata ku Machine Fit

Eby’okuddamu bino bissa essira ku byetaago by’okusala-ebivuddemu n’okutuukagana kw’ebyuma okusinga okuddamu enkola y’okusala wafer mu bujjuvu.

Wafer dicing kye kimu ne wafer singulation?

Ebigambo bino bitera okukozesebwa okwawula wafer erongooseddwa mu dies ssekinnoomu. Okusala wafer ne die singulation nabyo bigambo bya bulijjo ebikwatagana nabyo. Okusalawo kw’ebyuma kukyasinziira ku bintu, ensengeka ya wafer, enkola y’okusala, ekiruubirirwa ky’omutindo n’okutambula kw’okufulumya.

Mawulire ki agasinga okuba ag’omugaso nga tonnalonda saw ya dicing?

Tandika n’ebintu bya wafer, diameter, obuwanvu, frame ne tape format, obugazi bw’oluguudo, die size, cut depth, edge-quality target, expected output and the required post-dicing handoff.

Saw y’emu esobola okudduka full cut, half cut ne step cut?

Platform eyinza okuwagira enkola z’okusala ezisukka mu emu, naye ekyuma ekigere kyetaaga enteekateeka entuufu eya spindle, axes, depth-control functions, blade system, software and workholding configuration.

Kiki ekirina okukeberebwa ku kyuma ekikozesa wafer dicing?

Kakasa yuniti eriko ennamba z’omuddiring’anwa, embeera ya spindle n’emmeeza, okulaba n’okukwatagana, software, loader, cleaner, accessories, utilities, embeera ya alamu n’obujulizi obw’okukebera oba okugezesa obuliwo ku kyuma ekyo.

Fuula Ebyetaago Byo eby'okusala mu Dicing Saw Shortlist

Gabana ekintu kya wafer, dayamita, obuwanvu, obugazi bw’oluguudo, sayizi ya die, ekika ky’okusala, ekigendererwa eky’omutindo gw’empenda, ensengeka ya fuleemu n’okufuluma okusuubirwa. Tujja kugeraageranya ebyuma ebiriwo n’ekyava mu kusala ekyo era tulage ebifo ki eby’okusiba, emmeeza, okulaba, okuyonja n’okukwata ebikyalina okukakasibwa.

Saba Olukalala Olumpi olwa Dicing Saw Weekenneenye Ebyuma Ebiriwo Kati