DEK 03I ye nkola ya mutindo gw’ebyuma ebikuba ebitabo eby’omutendera oguyingira mu bujjuvu, ebikoleddwa mu bitundu ebitono n’ebya wakati n’okukuŋŋaanya ebyuma eby’enjawulo eby’enjawulo. Olw’okukola obulungi mu kukuba ebitabo n’okukola obulungi ku nsaasaanya, ekozesebwa nnyo mu byuma ebikozesebwa, ebyuma by’emmotoka, amataala ga LED n’emirimu emirala, naddala nga gisaanira:
Layini z’okufulumya SMT entonotono n’eza wakati
Ekifo ekikebera R&D
Enkola z’okukyusa amangu ez’enjawulo eziwera
II. Core specifications ne parameters ez’ekikugu
Ebiraga eby’ekikugu DEK 03I ebipimo ebikwata ku nsonga eno mu bujjuvu
Ekitundu ekisinga obunene eky’okukuba ebitabo 584mm×584mm
Obutuufu bw’okukuba ebitabo ±25μm @3σ
Sipiidi y’okukuba ebitabo 100-400mm/s (etereezebwa)
Ekyuma akatimba obuwanvu adaptation 0.1-0.3mm
Obugumu bwa substrate buba 0.4-6.0mm
Enkola y’okukwatagana 2MP CCD okulaba (nga mw’otwalidde n’okuteeka layisi mu kifo)
Enkola y’okusenya Ebisenya bibiri nga bikyusa otomatiki (puleesa esinga obunene kkiro 15)
Ebyetaago by’amasannyalaze AC 380V/2.5kVA eya phase ssatu
III. Omusingi omukulu ogw’okukola
1. Enkola y’okukuba ebitabo
PCB positioning: vacuum adsorption + edge clamp fixation (okuteeka mu kifo ekituufu ±0.01mm)
Okulaganya okulaba: Okutegeera CCD OK point (FOV 20mm×20mm)
Okujjuza solder paste: scraper esika solder paste ku angle ya 30-60°
Demolding control: okutereeza mu magezi sipiidi y’okwawula (0.1-3mm/s)
2. Enkola entonotono ezikulu
Okufuga entambula: servo motor + precision lead screw (okuddamu okuteeka mu kifo obutuufu ±5μm)
Enzirukanya ya puleesa: okufuga okw’olukoba oluggaddwa ku puleesa y’okusenya (okutereezebwa 50-500g/cm2)
Okuliyirira ebbugumu n’obunnyogovu: okulondoola mu kiseera ekituufu ebipimo by’obutonde n’okutereeza mu ngeri ey’otoma
Eky’okuna, ebirungi bitaano ebikulu
Omulimu gwa ssente nnyingi
Omuwendo gw’okugula guli wansi ebitundu 20% okusinga ku bikozesebwa ebifaanagana
Enkozesa y’amasoboza <2.5kW/h (engeri y’okukekkereza amaanyi esobola okukendeeza ebitundu 30%)
Okutebenkera okulungi ennyo
Ebitundu ebikulu (lead screw, guide rail) bikozesa ekika kya THK/NSK
MTBF>essaawa 10,000
Okukola mu ngeri ey’amagezi
Graphical touch screen (ewagira enkolagana y’Oluchina n’Olungereza)
Enkola ya Formula memory (esobola okutereka pulogulaamu 100+)
Okutuukagana n’embeera mu ngeri ekyukakyuka
Okukyusa model kuggwa mu ddakiika 15
Awagira ebika bya solder paste eby’enjawulo nga no-clean/water-washable
Okukuba ebitabo mu ngeri entuufu
Ekitono ennyo ekiyinza okukubibwa 0402 pad
Solder paste obuwanvu bw'okukyama <±10% .
V. Ensonga eza bulijjo ez’okukozesa
Essimu ey’omu ngalo: 0.4mm pitch BGA printing
Ebyuma ebikozesebwa mu mmotoka: bboodi ya ddereeva eya LED eya sayizi ennene
Okufuga amakolero: okukuba ebitabo ekipande ekinene eky’ekikomo (6mm).
Ebikozesebwa mu by’obujjanjabi: micro sensor board okukuba ebitabo
VI. Enteekateeka y’okuddaabiriza enzirukanya y’obulamu mu bujjuvu
1. Ebikwata ku ndabirira ya buli lunaku
Ebintu eby’okuddaabiriza Cycle Omutindo gw’emirimu
Okwoza scraper Buli shift Kozesa olugoye olutaliimu nfuufu + IPA cleaning
Okuzuula okusika omuguwa kw’akatimba k’ekyuma Okupima mita y’okusika omuguwa buli wiiki (≥35N/cm2) .
Guide rail lubrication Buli mwezi Siiga giriisi ya SKF LGHP2
Okukebera jenereta ya vacuum Okugezesebwa kwa Vacuum buli luvannyuma lwa myezi esatu (≥-80kPa) .
2. Olukalala lwa sipeeya ebikulu
Scraper blade (DEK original recommended, obulamu bwa mirundi nga 500,000)
Vacuum nozzle (sayizi ya mutindo/ennene) .
CCD camera ekuuma lenzi
Enkoda ya mmotoka ya Servo
3. Emmeeza y’enzirukanya y’okupima
Ebintu ebipima Cycle Tool
Obutuufu bw’okulaganya okulaba omwezi 1 Standard calibration plate (nga mw’otwalidde ne layini za mm 0.1)
Scraper parallelism emyezi 3 Laser interferometer
Omutendera gwa pulatifomu emyezi 6 Omutendera gw’ebyuma (0.01° obutuufu)
VII. Ekitabo ekikwata ku kuzuula ensobi mu bujjuvu
1. Okwekenenya omuti gw’ensobi (okutwala offset y’okukuba ebitabo ng’ekyokulabirako) .
Ebiyinza okuvaako ensonga eno:
Obutabeera bulungi mu kukwatagana kw’amaaso (45%) .
Okusumululwa kw’okuteeka PCB mu kifo (30%) .
Okusika omuguwa kw’akatimba k’ekyuma okutamala (15%) .
Abalala (10%) .
Enkola y’okuzuula obulwadde:
Kebera omuwendo gw’okutegeera obubonero bwa MARK (gulina okuba ≥99.5%) .
Gezesa empalirizo y’okusikiriza empewo (omutindo ≥-65kPa) .
Pima okusika omuguwa kw’akatimba k’ekyuma (ensonga wakati ≥30N/cm2) .
2. Enkwata y’ensobi ttaano eza bulijjo
Ensobi 1: Alamu ya E205 (okulemererwa okulaganya okulaba) .
Emitendera gy’okukwata:
Okwoza lenzi ya CCD (kozesa omuggo ogw’enjawulo ogw’okwoza) .
Teekateeka amaanyi g’ensibuko y’ekitangaala (ekisemba 70-80%) .
Okulongoosa ensengeka z’obubonero bwa MARK (gaziya ekifo ky’okunoonya ne 10%)
Ensobi 2: Solder paste okusika ensonga
Ekikolo ekivaako kino:
Sipiidi ya demolding esukkiridde (ekola ebitundu 60%) .
Viscosity ya solder paste etali ya bulijjo (ekola ebitundu 30%) .
Okugonjoola:
Okutereeza parameter
1. Kendeeza ku sipiidi y’okuggya omudumu okutuuka ku 0.5mm/s
2. Okwongera ku puleesa y’okusenya (ekisemba +10%) .
3. Kebera obudde bwa solder paste okuddamu okubuguma (obwetaavu ≥4h) .
Ensobi 3: Puleesa y’okusenya etali ya bulijjo
Okugonjoola ebizibu mu bwangu:
Kebera waya za sensa ya puleesa
Calibrate pressure zero point (kyetaaga okukolebwa mu mbeera etatikkiddwa) .
Gezesa servo motor current (omutindo 1.5A±0.2)
Ensobi 4: Okukulukuta kwa vacuum
Ebikolwa eby’okuziyiza:
Kebera seal ya nozzle buli wiiki
Kikyuseemu vacuum filter buli mwezi
Ensobi 5: Enkola ya freeze
Obujjanjabi obw’amangu:
Backup program eriwo kati
Duka okugezesa okujjukira oluvannyuma lw'okuddamu okutandika (ekiragiro: *#MEMTEST)
Okulongoosa firmware y'enkola (kyetaaga okutuukirira oluvannyuma lw'okutunda)
VIII. Ekkubo ly’okulongoosa tekinologiya
1. Enkola z’okulongoosa Hardware
Ekipapula ky'okulongoosa okulaba: 2MP→5MP camera (obutuufu bweyongedde okutuuka ku ±15μm)
Enkola ya scraper ey’amagezi: Yongera ku mulimu gw’okuddamu puleesa mu kiseera ekituufu
2. Ekkubo ly’okulongoosa pulogulaamu za kompyuta
Enkyusa enkulu→Enkyusa ey'omulembe:
Okwongerako omulimu gw’okuzuula solder paste ogwa 3D
Okuwagira okwekenneenya data ya SPC
3. Ekigonjoola eky’okugatta layini z’okufulumya
Ensengeka ekwatagana:
DEK 03I + SIPLACE SX2 → zikola layini y’okufulumya enzito
(UPH esobola okutuuka ku bubonero 45,000)
IX. Obuwagizi bw’okusalawo ku kugula ebintu
1. Okwekenenya omuwendo n’emigaso
Project DEK 03I Ekintu ekivuganya A Okugeraageranya enkizo
Okukuba ebitabo omulundi gumu kugula ¥0.15 ¥0.22 32% wansi
Obudde bw'okukyusa layini 8min 15min 47% mangu
Amakungula g’okukuba ebitabo 99.2% 98.5% 0.7% gasingako
2. Ebiteeso ku kulonda
Standard version: esaanira abakozesa abalina embalirira entono (nga ¥350,000)
Enkyusa ey’omulembe: esengekeddwa eri bakasitoma b’ebyuma by’emmotoka (nga ¥480,000)
X. Mu bufunze n’endowooza
DEK 03I ekuuma ekifo kyayo eky’okukulembera mu katale k’okuyingira ng’eyita mu dizayini ya modulo n’okufuga puleesa mu ngeri ey’amagezi. Obutuufu bwayo obw’okukuba ±25μm n’okukuba ebitabo ku sipiidi ya 400mm/s bikwatagana bulungi n’obulungi n’omutindo. Olw’okutongoza omukutu gwa DEK ogw’omulembe omupya ogwa Photon, abakozesa 03I basobola okulongoosa awatali kuzibuwalirwa okutuuka ku nkola ez’amagezi ez’okukuba ebitabo.