Umshicileli wesikrini we-ASM DEK 03I

I-DEK 03I yimveliso emiselweyo yoshicilelo lokungena oluzenzekelayo ngokupheleleyo, eyenzelwe iibhetshi ezincinci neziphakathi kunye nodidi oluphezulu lwendibano yombane. Ngokusebenza koshicilelo oluzinzileyo kunye nokusebenza kweendleko ezigqwesileyo, isetyenziswa kakhulu kubathengi be-elektroniki, i-automotive electronics, ukukhanya kwe-LED kunye nezinye iindawo, ezilungele ngakumbi:

Imigca yemveliso ye-SMT encinci naphakathi

Iziko lobungqina be-R&D

Iimeko ezininzi zokutshintsha ngokukhawuleza

II. Iimpawu eziphambili kunye neeparitha zobugcisa

Iimpawu zobuchwephesha DEK 03I iiparamitha ezineenkcukacha

Ubuninzi bendawo yokushicilela 584mm×584mm

Ukuchaneka koshicilelo ±25μm @3σ

Isantya soshicilelo 100-400mm/s (esinokulungiswa)

Steel mesh ukuqhelaniswa nobungqingqwa 0.1-0.3mm

Ubuninzi be-substrate ububanzi 0.4-6.0mm

Inkqubo yokulungelelaniswa kwe-2MP yeCCD yombono (kubandakanywa nokubekwa kwelaser)

Inkqubo ye-Scraper Ii-scraper ezimbini ezizenzekelayo zokutshintsha (uxinzelelo oluphezulu lwe-15kg)

Iimfuno zonikezelo lwamandla Isigaba sesithathu se-AC 380V/2.5kVA

III. Umgaqo ongundoqo wokusebenza

1. Inkqubo yoshicilelo

Indawo ye-PCB: i-vacuum adsorption + i-edge clamp fixation (indawo yokuchaneka ±0.01mm)

Ulungelelwaniso olubonakalayo: Inqaku leCCD lokuqaphela AMANQAKU (FOV 20mm×20mm)

Ukuzaliswa kwe-Solder paste: i-scraper ityhala intlama ye-solder kwi-engile ye-30-60 °

Ulawulo lwe-Demolding: ngobuchule lungisa isantya sokwahlukana (0.1-3mm/s)

2. Iinkqubo ezisezantsi ezingundoqo

Ulawulo lwentshukumo: i-servo motor + ukuchaneka isikrufu sokukhokela (phinda ukuchaneka kwendawo ± 5μm)

Ulawulo loxinzelelo: ulawulo lwe-loop evaliweyo yoxinzelelo lwe-scraper (ukulungiswa kwe-50-500g / cm²)

Imbuyekezo yobushushu kunye nokufuma: ukubekwa esweni kwangexesha lokwenyani kwiiparamitha zokusingqongileyo kunye nohlengahlengiso oluzenzekelayo

Okwesine, iinzuzo ezingundoqo ezintlanu

Ukusebenza kweendleko eziphezulu

Iindleko zokuthenga ngama-20% ngaphantsi kuneemodeli ezifanayo

Ukusetyenziswa kwamandla <2.5kW/h (imowudi yokonga amandla inokunciphisa i-30%)

Uzinzo olugqwesileyo

Amacandelo aphambili (isikrufu sokukhokela, umzila kaloliwe) sebenzisa uphawu lweTHK/NSK

MTBF>10,000 iiyure

Ukusebenza ngobukrelekrele

Umzobo wesikrini sokuchukumisa (uxhasa ujongano lwesiTshayina kunye nesiNgesi)

Umsebenzi wenkumbulo yefomula (inokugcina iinkqubo ezili-100+)

Ukuziqhelanisa nokuguquguquka

Ukuguqulwa kwemodeli kugqitywe kwimizuzu eyi-15

Ixhasa iindidi ngeendidi zokuncamathelisa i-solder ezifana nokungacoceki/ukuhlambeka kwamanzi

Ushicilelo oluchanekileyo

Ubuncinane obunokuprintwa 0402 pad

I-Solder Cola ukunxaxha kobukhulu <± 10%

V. Iimeko zesicelo esiqhelekileyo

Smartphone: 0.4mm pitch BGA yoshicilelo

I-Automotive electronics: ibhodi yomqhubi we-LED yobukhulu obukhulu

Ulawulo lwamashishini: ipleyiti yobhedu engqindilili (6mm) yoshicilelo

Izixhobo zonyango: ukushicilelwa kwebhodi yesivamvo micro

VI. Isicwangciso somjikelo wobomi obupheleleyo

1. Iinkcukacha zogcino lwemihla ngemihla

Izinto zogcino Umjikelo wokuSebenza okusemgangathweni

Ukucoca i-scraper Yonke iishifti Sebenzisa ilaphu elingenathuli + nokucoca i-IPA

Umnatha wentsimbi ufunyaniswa ngeVeki Umlinganiselo wemitha yoxinzelelo (≥35N/cm²)

Isikhokelo sikaloliwe sokuthanjiswa Ngenyanga Faka igrisi yeSKF LGHP2

Ukuhlolwa kweVacuum generator Uvavanyo lwekota lweVacuum (≥-80kPa)

2. Uluhlu lwamalungu angundoqo

I-Scraper blade (i-DEK yasekuqaleni iyacetyiswa, ubomi malunga namaxesha angama-500,000)

Vacuum nozzle (umgangatho/ubukhulu obukhulu)

Ilensi yokhuseleko lwekhamera yeCCD

Servo motor encoder

3. Itheyibhile yomjikelo wokuCalibration

Izinto zokuCalibration Cycle Tool

Ukuchaneka kolungelelwaniso olubonakalayo inyanga ye-1 ipleyiti yokulinganisa esemgangathweni (kubandakanywa nemigca eyi-0.1mm)

Scraper parallelism iinyanga ezi-3 Laser interferometer

Inqanaba leqonga iinyanga ezi-6 Inqanaba lombane (0.01° ukuchaneka)

VII. Isikhokelo sokuxilongwa kwempazamo enzulu

1. Uhlalutyo lomthi onempazamo (uthatha i-printing offset njengomzekelo)

Unobangela onokwenzeka:

Ukungahambi kakuhle kolungelelwaniso olubonakalayo (45%)

I-PCB ibeka ukukhululeka (30%)

Uxinzelelo lwemesh yentsimbi engonelanga (15%)

Abanye (10%)

Inkqubo yoxilongo:

Qwalasela inqanaba lokuqaphela inqaku le-MAK (kufuneka libe yi-≥99.5%)

Vavacuum adsorption force (esemgangathweni ≥-65kPa)

Umlinganiselo wentsimbi yomnatha woxinzelelo (indawo esembindini ≥30N/cm²)

2. Ukuphatha iimpazamo ezintlanu eziqhelekileyo

Impazamo 1: I-alarm ye-E205 (ukusilela kolungelelwaniso olubonakalayo)

Amanyathelo okuphatha:

Coca ilensi yeCCD (sebenzisa intonga yokucoca ekhethekileyo)

Lungisa amandla omthombo wokukhanya (kucetyiswa 70-80%)

NONE

Impazamo yesi-2: Uncamathiselo lwe-Solder lutsale incam

Unobangela weengcambu:

Isantya esigqithileyo sokudiliza (imali ye-60%)

I-viscosity ye-solder paste engaqhelekanga (i-accounting ye-30%)

Isisombululo:

Uhlengahlengiso lweParameter

1. Ukunciphisa isantya sokudiliza ukuya kwi-0.5mm / s

2. Ukwandisa uxinzelelo lwe-scraper (kucetyiswa + 10%)

3. Jonga ixesha lokufudumeza incama ye-solder (idinga ≥4h)

Impazamo yesi-3: Uxinzelelo lwe-scraper olungaqhelekanga

Ukulungisa ingxaki ngokukhawuleza:

Jonga iingcingo zesivamvo soxinzelelo

Ukulinganisa indawo yoxinzelelo lwe-zero (kufuneka yenziwe kwindawo yokothulwa)

Uvavanyo lwe-servo motor yangoku (umgangatho 1.5A±0.2)

Impazamo yesi-4: Ukuvuza kweVacuum

Amanyathelo othintelo:

Jonga umbhobho wokutywina qho ngeveki

Faka indawo yesihluzi sevacuum rhoqo ngenyanga

Impazamo yesi-5: Ukumisa inkqubo

Unyango olungxamisekileyo:

Gcina inkqubo yangoku

Yenza uvavanyo lwenkumbulo emva kokuba uqalise kwakhona (umyalelo: *#MEMTEST)

Hlaziya inkqubo ye-firmware (kufuneka uqhagamshelane emva kokuthengisa)

VIII. Indlela yokuphucula iteknoloji

1. Iinketho zokuphucula izixhobo

Iphakheji yophuculo olubonakalayo: 2MP→5MP ikhamera (ukuchaneka kunyuswe ukuya ku ±15μm)

Inkqubo ye-Intelligent scraper: Yongeza umsebenzi wempendulo yoxinzelelo lwexesha langempela

2. Indlela yokuphucula isoftware

Uguqulelo olusisiseko→Uguqulelo oluphucukileyo:

Yongeza umsebenzi wokubona uncamathiselo lwe-solder ye-3D

Inkxaso yohlalutyo lwedatha ye-SPC

3. Isisombululo sokudibanisa umgca wemveliso

Ubumbeko oludityanisiweyo:

I-DEK 03I + SIPLACE SX2 → yenza umgca wokuvelisa odibeneyo

(I-UPH inokufikelela amanqaku angama-45,000)

IX. Inkxaso yesigqibo sokuthengwa kweempahla neenkonzo

1. Uhlalutyo lweendleko-inzuzo

Iprojekthi ye-DEK 03I Imveliso yoKhuphiswano A uthelekiso oluluncedo

Ixabiso elinye lokushicilela ¥0.15 ¥0.22 32% ngaphantsi

Ixesha lokutshintsha umgca 8min 15min 47% ngokukhawuleza

Isivuno sokushicilela 99.2% 98.5% 0.7% ngaphezulu

2. Iingcebiso zokukhetha

Inguqulelo eqhelekileyo: ilungele abasebenzisi abanohlahlo lwabiwo-mali olulinganiselweyo (malunga ne-¥350,000)

Uguqulelo olukwinqanaba eliphezulu: olucetyiswayo kubathengi bee-elektroniki zemoto (malunga ne-¥480,000)

X. Isishwankathelo kunye nembonakalo

I-DEK 03I igcina indawo yayo ehamba phambili kwimarike yenqanaba lokungena ngokuyila iimodyuli kunye nolawulo loxinzelelo olukrelekrele. Ukuchaneka kwayo ± 25μm yoshicilelo kunye ne-400mm / s yoshicilelo olukhawulezayo oluphezulu lulungelelanisa ukusebenza kakuhle kunye nomgangatho. Ngokuphehlelelwa kweqonga lefoton lesizukulwana esitsha seDEK, abasebenzisi be-03I banokuphucula ngaphandle komthungo ukuya kwizisombululo zoshicilelo ezikrelekrele.