ali ndi 70% pa Magawo a SMT - Mu Stock & Okonzeka Kutumiza
Pezani Quote →Ma bond a die a ASM AD838, BESI, ndi K&S amasankhidwa kuti apange zinthu zosiyanasiyana zofunika kwambiri popanga ma semiconductor. AD838 nthawi zambiri imayesedwa kuti igwirizane ndi mizere yokhazikika ya die pomwe malo obwerezabwereza komanso kukhazikika kwa magwiridwe antchito ndizofunikira kwambiri; machitidwe a BESI nthawi zambiri amaganiziridwa kuti akwaniritse zofunikira pakulongedza; nsanja za K&S nthawi zambiri zimayesedwa pomwe kusinthasintha kwa njira, kuyanjana kwa mizere yomwe ilipo, kapena kuwongolera ndalama ndikofunikira.
Kuyerekeza komwe kuli pansipa kukuyang'ana kukhazikika kwa kupanga, kuthekera koyika, kuyenerera kwa njira, malire ogwiritsira ntchito, ndi zofunikira pa umwini wa ntchito zopaka ma semiconductor.
Chofunika kwambiriwogwirizanitsaKuyerekeza kumayamba ndi phukusi ndi zofunikira pa ndondomeko, osati chizindikiro chomwe chili pa chimango cha makina. Kukula kwa die, mawonekedwe a substrate, zinthu zomangira, kulolerana kwa malo, kutulutsa kofunikira, ndi kasinthidwe ka zinthu zonse zimakhudza ngati nsanjayo ndi yoyenera mzere winawake wopanga.
ASM AD838 nthawi zambiri imayesedwa kuti igwiritsidwe ntchito poika zinthu zomangira zomwe zimabwerezedwa, magwiridwe antchito odalirika, komanso kupitiriza kupanga zinthu zomwe zimasungidwa ndizofunikira kwambiri. BESI imakhudza mitundu yosiyanasiyana ya ukadaulo womangira zinthu zomangira, kuphatikizapo machitidwe omwe amagwiritsidwa ntchito popanga ma chip ambiri, ma flip-chip olondola, ndi ntchito zapamwamba zopaka. K&S iyenera kuyesedwa poyerekeza ndi njira yeniyeni komanso njira yosonkhanitsira, chifukwa gawo lake la semiconductor assembly limagwiritsa ntchito ukadaulo wosiyanasiyana wolumikizirana m'malo mwa gulu limodzi lokha.
Musamaone AD838, nsanja ya BESI, ndi nsanja ya K&S ngati njira zina zodziyimira zokha. Kuyerekeza kodalirika kuyenera kupangidwa pamlingo wa chitsanzo ndi njira mutatsimikizira kapangidwe ka phukusi, njira yogwiritsira ntchito die, zinthu zomangira, ndi mbiri yopangira yomwe mukufuna.
Tsatanetsatane wa kapangidwe kameneka umatsimikizira ngati makinawo ndi oyenera mwaukadaulo, ogwira ntchito m'mabizinesi, komanso ngati angagwiritsidwe ntchito bwino akayikidwa.
Zipangizo za ASM AD838, BESI, ndi K&S siziyenera kuonedwa ngati njira zina zodziyimira zokha. Kuyerekeza kofunikira kumayamba ndi njira yolumikizirana ndi die, kapangidwe ka phukusi, njira yogwiritsira ntchito zinthu, zofunikira pakuyika, ndi cholinga chopangira osati dzina la wopanga yekha.
Matrix yomwe ili pansipa yapangidwa kuti ithandize magulu a uinjiniya ndi ogula zinthu kuzindikira mafunso aukadaulo omwe ayenera kutsimikiziridwa musanasankhe kasinthidwe ka die bonder.
Kapangidwe ka mutu wa bond, njira zowonera, kagwiritsidwe ntchito ka wafer kapena thireyi, njira yoperekera, kutentha, momwe zida zimagwirira ntchito, ndi chithandizo chopezeka chingasinthe kwambiri ngati makinawo ndi oyenera kupanga.
Gwiritsani ntchito dongosololi kuyerekeza kuyenerera kwa njira, kuphatikiza kupanga, ndi zofunikira za umwini musanapange chisankho chogula.
| Malo Owunikira | Nsanja ya ASM AD838 | BESI Mapulatifomu Othandizira | Mapulatifomu Opangira Mapaketi a K&S Die Attach / Advanced Packaging |
|---|---|---|---|
| Mulingo Wofananiza Wolondola Yambani ndi makina enieni, zida, ndi kasinthidwe kokhazikika. | Tsimikizani Kukonza kwa AD838 Tsimikizirani mtundu wa mutu wa bond, phukusi la masomphenya, makonzedwe a chakudya, kusamalira substrate, ndi njira zomwe zilipo. | Tsimikizani Banja la Zogulitsa Dziwani ngati nsanja yomwe ikuperekedwayo yakonzedwa kuti igwirizane ndi epoxy, solder yofewa, flip-chip, multi-chip, kapena njira ina yogwirira ntchito. | Tsimikizani Njira Yosonkhanitsira Dziwani ngati dongosolo lomwe likuperekedwali lapangidwira kulumikiza zinthu mofewa, thermo-compression bonding, power assembly, kapena njira ina yogwiritsira ntchito. |
| Funso Loyamba la Njira Fotokozani momwe die iyenera kumangiriridwa ndi zomwe phukusi lomalizidwa liyenera kukwaniritsa. | Kupanga Die Attach Fit Unikani momwe zinthu zikuyenderana ndi kunyamula zinthu, kulumikiza, kulumikiza zinthu, zomatira kapena zomangira, komanso zomwe zingagwiritsidwe ntchito. | Kuyenerera kwa Njira Unikani ngati nsanja yomwe mwasankha ikugwirizana ndi ukadaulo wofunikira komanso njira yopangira phukusi. | Kuyenerera Kwapadera kwa Ntchito Unikani mosamala njira yogwirira ntchito pamene pali njira zopakira zinthu zapamwamba, kulumikiza zida zamagetsi, kulumikiza zida, kapena njira zapadera zolumikizirana. |
| Kuwunikanso Malo ndi Kulinganiza Zonena zolondola ziyenera kuyang'aniridwa nthawi zonse malinga ndi momwe zinthu zilili pakupanga. | Kulinganiza Masomphenya ndi Nthawi Yozungulira Tsimikizirani kulekerera malo oyikamo malinga ndi kukula kwenikweni kwa die, mtundu wa substrate, momwe zinthu zilili, ndi nthawi yofunikira yopangira. | Kulondola kwa Mtundu wa Nsanja Tsimikizirani ngati makina omwe mwasankhawo ndi abwino kwambiri kuti agwirizane ndi die attach mwachangu, malo olondola kwambiri, kulinganiza flip-chip, kapena kugwiritsa ntchito ma chip ambiri. | Kugwiritsa Ntchito Zida ndi Kudalira Njira Tsimikizirani luso loyika zinthu pamodzi ndi kasinthidwe ka mutu wa bond, kakonzedwe ka masomphenya, momwe zida zimagwirira ntchito, komanso zofunikira pa kagwiritsidwe ntchito kake. |
| Kusamalira Zinthu ndi Maphukusi Unikani momwe ma dies, substrates, leadframes, strips, trays, kapena ma wafers amalowera ndi kutuluka mu dongosolo. | Kuwunikanso Kugwirizana kwa Mizere Tsimikizirani mtundu wa zinthu zomwe zimathandizidwa, kukula kwa substrate, njira yolembera, gwero la die, ndi zofunikira pa mawonekedwe odziyimira pawokha. | Ndemanga Yosinthasintha kwa Phukusi Tsimikizani ngati kasinthidwe ka dongosolo kakugwirizana ndi kukula kwa wafer komwe kukufunika, mawonekedwe a substrate, mawonekedwe a die, ndi kayendedwe ka zinthu zopangira. | Ndemanga ya Zida Zogwiritsira Ntchito Tsimikizirani zida zomwe zingagwiritsidwe ntchito pa njira inayake, njira yowonetsera zinthu, njira yosamutsira zinthu, ndi zofunikira zilizonse zapadera zowunikira kapena kulumikizana. |
| Kuphatikiza Kupanga Unikani momwe zidazo zikugwirizana ndi mzere waukulu wa zopangira zinthu za backend. | Kukhazikika kwa Mzere Wokhazikika Kawirikawiri zimakhala zofunikira kwambiri pamene njira yogwirizana yomwe ilipo kale imadalira zida zodziwika bwino, njira zogwirira ntchito, ndi zinthu zothandizira. | Kuthekera Kokulitsa Njira Kawirikawiri amawunikidwa pamene njira yopangira zinthu ikuphatikizapo zinthu zambiri zomangira, flip-chip, multi-chip, kapena zofunikira pakupanga zinthu zapamwamba. | Kugwirizana kwa Kuyenda kwa Msonkhano Kawirikawiri zimawunikidwa komwe gawo lolumikizirana liyenera kulumikizana ndi msonkhano wapadera, kulumikizana, chipangizo chamagetsi, kapena ntchito zapamwamba zolongedza. |
| Ndemanga ya Umwini ndi Chithandizo Mtengo wogulira wokha sufotokoza mtengo weniweni wogwiritsira ntchito wa bonder yogwiritsidwa ntchito kapena yokonzedwanso. | Unikani Thandizo Lokhazikitsidwa Yang'anani mwayi wopeza zinthu zina, momwe mapulogalamu ndi oyang'anira alili, mbiri ya calibration, zikalata zomwe zilipo, ndi kuchuluka kwa kukonzanso. | Unikaninso Thandizo Lolunjika pa Njira Yang'anani kupezeka kwa zida, chidziwitso cha pulogalamuyo, zinthu zofunika kugwiritsa ntchito, zosowa za njira zogwirira ntchito, ndi kuthekera koyankha ntchito. | Unikani Thandizo Logwirizana ndi Ukadaulo Onetsetsani ngati zida zoyenera zogwiritsira ntchito, chidziwitso cha njira, zida zosinthira, ndi chithandizo cha uinjiniya zikupezekabe panjira yomwe mukufuna. |
| Choyambitsa Chabwino Kwambiri Chogulira Dziwani vuto lomwe limapangitsa kuti nsanja ikhale yodalirika pa ntchito yanu. | Kufunika Kogwirizana Kopanga Kokhazikika Choyenera kuganizira pamene makinawo akugwirizana kwambiri ndi njira yokhazikika yolumikizirana ndipo kupitiriza kupanga ndiko chinthu chofunikira kwambiri. | Kufunika kwa Njira Yokulirapo Yoyenera kuganiziridwa pamene kupanga phukusi kapena zofunikira pakupanga zikugwirizana ndi nsanja yokhala ndi ukadaulo wofunikira. | Chofunikira Chapadera cha Msonkhano Yoyenera kuganiziridwa pamene ntchito yomwe mukufuna kugwiritsa ntchito ikugwirizana bwino ndi cholumikizira cha makina, kulongedza kwapamwamba, kapena kuthekera kopangira magetsi. |
Chisankho champhamvu kwambiri nthawi zambiri chimapangidwa mutatsimikizira zojambula za phukusi, miyeso ya die, zinthu zomangira, UPH yolunjika, kulolerana kwa malo, kufunikira kwa automation, ndi momwe makina akugwirira ntchito.
Fotokozani ngati pulojekitiyi ikufuna epoxy die attach, solder attach, flip-chip placement, thermo-compression bonding, kapena njira ina yosonkhanitsira.
Gwirizanitsani makinawo ndi kukula kwenikweni kwa die, mtundu wa substrate, kayendedwe ka zinthu, cholinga cha kuzungulira, zofunikira pakuwunika, ndi kayendedwe ka ntchito ka wogwiritsa ntchito.
Pa zida zomwe zagwiritsidwa ntchito kapena zokonzedwanso, tsimikizirani zolemba zautumiki, momwe zida zilili, kuchuluka kwa ma calibration, zotsatira za mayeso, zida zomwe zilipo, ndi chithandizo chokhazikitsa.
Magulu a uinjiniya ndi ogula ayenera kuyerekeza zida zolumikizirana pogwiritsa ntchito njira yeniyeni yogwirira ntchito, kapangidwe ka phukusi, njira yowonetserana, zida zolumikizirana, kulolerana kwa malo, zotsatira zomwe zaperekedwa, ndi kuthekera kwa ntchito ya kapangidwe kamene kaperekedwa m'malo mogwiritsa ntchito dzina la wopanga yekha.
Kapangidwe ka ASM AD838 kapena AD838L nthawi zambiri kamayesedwa kuti adziwe momwe ntchito zogwirizira zidakhalira pomwe kupitiliza kwa njira, zida zogwirizana, komanso magwiridwe antchito obwerezabwereza ndizofunikira. Mapulatifomu a BESI ayenera kuwunikidwanso poyerekeza ndi ukadaulo wofunikira wa die attach, monga epoxy attach, soft solder, multi-chip handling, flip-chip, kapena processing Advanced Packaging. Zipangizo za K&S ziyenera kuwunikidwa malinga ndi njira yeniyeni yopangira, makamaka ngati pali ma packaging apamwamba, power assembly, clip attach, kapena legacy die attach configurations.
Kuyerekeza kooneka bwino kukuwonetsa madera omwe nthawi zambiri amafunikira kuwunikanso kwaukadaulo: kupitiriza kupanga, kuchuluka kwa ntchito, zofunikira pakulongedza, kusinthasintha kwa kasinthidwe, ndi kukonzekera chithandizo pambuyo poyika. Kuyenerera komaliza kumadalira momwe makinawo alili, phukusi la zida, zotsatira za kuyenerera kwa njira, ndi momwe chipangizocho chilili.
Tchatichi cholinga chake ndi kuzindikira madera omwe ayenera kuwunikira bwino musanasankhe mawonekedwe enieni a ASM AD838, BESI, kapena K&S.
Mapu owoneka bwino ayenera kuthandizira kuwunikanso zida mwadongosolo, osati m'malo mwa kutsimikizira njira kapena kutsimikizira kwaukadaulo wa kapangidwe kake.
Unikani ngati kasinthidwe komwe kakuperekedwa kakugwirizana ndi kayendedwe ka die attach komwe kalipo, njira zodziwika bwino zogwirira ntchito, zida zoyikika, zida zosinthira zomwe zilipo, ndi zinthu zothandizira zodziwika bwino.
Tsimikizirani ngati zipangizozo zingathandize njira yolumikizira yofunikira, gwero la die, mawonekedwe a substrate, zinthu zolumikizira, kapangidwe ka phukusi, ndi njira yopangira yomwe mukufuna.
Dziwani ngati pulojekitiyi ikufuna kuyika molondola kwambiri, kusonkhanitsa ma chip ambiri, kulinganiza ma flip-chip, kulumikiza kwa thermo-compression, kulumikiza kwa hybrid, kapena njira ina yapamwamba yopangira ma paketi.
Tsimikizirani mphamvu ya mutu wa bond, njira zowonera, kusamalira wafer kapena thireyi, njira yoperekera, zofunikira pa kutentha, kupezeka kwa zida, ndi ma interface odziyimira pawokha.
Pa zida zomwe zagwiritsidwa ntchito kapena zokonzedwanso, onaninso zolemba zowunikira, momwe wowongolera alili, mbiri yautumiki, mwayi wopezera zida zina, kuchuluka kwa kukonzanso, zida zogwirira ntchito, ndi chithandizo chokhazikitsa.
Kusiyana kwakukulu kwa uinjiniya sikuti ndi mbiri ya kampani kapena ziwerengero zofalitsidwa. Ndi momwe makina enaake amagwirira ntchito mkati mwa njira yolumikizirana ndi die, kuphatikizapo kuwonekera kwa die, kusamalira substrate, zinthu zomangira, njira yowonera, momwe zida zimagwirira ntchito, kutentha, komanso kufunikira kwa nthawi yopangira.
Pulatifomu ikhoza kukhala ndi luso lochita zinthu papepala koma siingakhale yoyenera ngati kasinthidwe komwe kaperekedwa sikaphatikizapo mutu wofunikira wa bond, njira yogwiritsira ntchito wafer, kukhazikitsa kogawa, chodyetsa zinthu, ntchito yowunikira, kapena zida zopangira.
Kuyerekeza kothandiza kwambiri kumachitika mutatsimikizira zojambula za phukusi, kukula kwa die, zinthu zolumikizira, kulolerana kwa malo, UPH yolunjika, kuyenda kwa zinthu, ndi chithandizo chaukadaulo chomwe chilipo cha chipangizo chomwe chikuwunikidwacho.
ASM AD838 kapenaAD838LKapangidwe kake nthawi zambiri kamawunikidwa komwe kayendedwe ka die attach kamene kakufuna kufananizidwa ndi kagwiritsidwe ka zinthu zomwe zayikidwa, mutu wa bond, phukusi la masomphenya, mawonekedwe a substrate, ndi zida zomwe zilipo.
Kugwirizana kwamphamvu nthawi zambiri kumapezeka pamene kupitiriza kupanga kuli kofunika: njira zogwirira ntchito zokhazikika, zida zosinthira zogwirizana, maphikidwe odziwika bwino a njira, chithandizo chowunikira chomwe chilipo, ndi malo enieni okonzanso chipangizo chomwe chikuperekedwa.
Zipangizo zachitsuloiyenera kuwunikidwanso pamlingo wa malonda ndi banja chifukwa gawo lake la die attach limafotokoza njira zosiyanasiyana, kuphatikizapo epoxy die attach, soft solder, multi-chip assembly, flip chip, thermo-compression bonding, ndi nsanja zolumikizirana za hybrid.
Funso la uinjiniya ndi lakuti ngati nsanja yomwe ikuperekedwayi idapangidwira kapangidwe ka phukusi ndi njira yogwirira ntchito, osati ngati dzina la BESI lokha likuyimira m'malo mwachindunji a die bonder yomwe ilipo.
Zipangizo za K&Siyenera kuyesedwa malinga ndi njira yeniyeni yolumikizirana ya semiconductor yomwe ikukhudzidwa. Kutengera ndi nsanja, kuwunika kungakhudze kufa kwa ma attachment, clip attach, thermo-compression bonding, ma packaging apamwamba, power-device assembly, kapena kasinthidwe koyikika kale.
Ndikofunikira kutsimikizira ngati makinawo apangidwira njira yofanana yolumikizirana ndi mzere wopangira womwe mukufuna. Dongosolo lopangidwa mozungulira njira yapadera yolumikizirana kapena njira yolumikizira magetsi siliyenera kuyerekezeredwa lokha ndi kasinthidwe kachizolowezi ka die attach.
Mapulogalamu ogwiritsira ntchito ma semiconductor ayenera kugawidwa m'magawo malinga ndi njira yolumikizira ndi kapangidwe ka ma phukusi m'malo mwa chizindikiro cha mtundu wamba. Banja lomwelo la malonda likhoza kukonzedwa mosiyana kuti ligwirizane ndi epoxy, solder attach, flip-chip placement, multi-chip assembly, power-device packaging, kapena njira zapadera zolumikizirana.
Makina ayenera kuonedwa kuti ndi oyenera pokhapokha njira yogwirira ntchito, zida zogwirira ntchito, njira yolumikizirana, kuthekera koyika, kayendedwe ka zinthu, ndi momwe amathandizira zitatsimikiziridwa motsutsana ndi pulogalamu yopangidwira kupanga.
Koyenera pamene njirayo imagwiritsa ntchito njira yotsimikizika yolumikizira ma die ndipo chofunika kwambiri ndikusunga zotuluka zokhazikika ndi ma die handling ogwirizana, ma substrate handling, ma glue kapena solder process control, komanso njira zogwirira ntchito zomwe zingabwerezedwe.
Kapangidwe ka AD838 kangakhale kofunikira ngati zosankha zake zomwe zayikidwa zikugwirizana kwambiri ndi njira yomwe ilipo yopangira ndipo zida zomwe zilipo zitha kuthandizira mtundu wofunikira wa phukusi.
Kukhazikitsa chipangizo chamagetsi nthawi zambiri kumafuna kuwunikanso bwino kukula kwa die, zinthu zomangira, zofunikira pa kutentha, mawonekedwe a leadframe kapena substrate, komanso momwe makina amagwirira ntchito pa phukusi lomaliza.
Machitidwe opangidwira kusungunula kofewa, guluu woyendetsa, cholumikizira cholumikizira, kapena njira zina zamagetsi ziyenera kuyerekezeredwa ndi phukusi lenilenilo ndi njira yotenthetsera.
Ntchito izi zimafuna zambiri kuposa malo oyambira oikapo die. Kuwunika kungaphatikizepo momwe die imayendera, kapangidwe ka bump kapena interconnect, kulondola kwa ma agnition pansi pa mikhalidwe yopangira, kupotoka kwa substrate, flux kapena glue handling, ndi zofunikira zowunikira.
Mabanja a BESI ndi K&S azinthu akhoza kukhala ndi nsanja zogwirizana ndi njira zotere, koma kasinthidwe ka dongosolo lenileni kayenera kutsimikiziridwa musanayerekezere.
Mapulogalamu okhudzana ndi thermo-compression bonding, hybrid bonding, high-density interconnects, stacked die, kapena ma multi-die module ovuta amafunika kuwunikanso njira yodzipereka m'malo moyerekeza mwachindunji ndi die bondi wamba.
Chisankhocho chiyenera kuganizira nthawi yonse ya ndondomekoyi, mbiri ya kutentha, mphamvu yolumikizirana, kukonzekera kwa zinthu, metrology, cholinga chopezera phindu, ndi dongosolo lothandizira uinjiniya.
Cholumikizira choyenera ndi makina omwe amatha kumaliza ntchito yomwe akufuna nthawi zonse mkati mwa zenera lofunikira lopangira, pomwe amakhalabe ochirikiza pambuyo poyika. Kuyerekeza mtundu kumakhala kothandiza pokhapokha njira yaukadaulo itafotokozedwa.
Tsimikizirani ngati polojekitiyi ikufuna epoxy attach, eutectic kapena soft-solder attach, conductive glue, flip-chip placement, thermo-compression bonding, clip attach, kapena njira ina yapadera yosonkhanitsira.
Tsimikizirani kukula kwa die, makulidwe a die, mawonekedwe a wafer kapena thireyi, mawonekedwe a substrate kapena leadframe, kuyika mzere wolozera, njira yosamutsira zinthu, ndi kufunikira kopereka, kutentha, kuyeretsa, kapena kuyang'anira.
Unikani mutu weniweni wa bond, phukusi la masomphenya, ma module ogwiritsira ntchito, zida, njira yotenthetsera, mawonekedwe odziyimira pawokha, momwe mapulogalamu alili, ndi zosankha zomwe zilipo pamakina omwe alipo.
Yerekezerani zomwe zikuyembekezeredwa, kufunikira kwa kusintha kwa ntchito, zosowa zokonza, mwayi wopeza zinthu zina, kuchuluka kwa ntchito zomwe zakonzedwa, kuchuluka kwa ntchito zomwe zaperekedwa, kuchuluka kwa ntchito zomwe zaperekedwa, komanso mtengo wonse wa umwini.
Ganizirani za kapangidwe ka ASM AD838 pamene kakugwirizana kwambiri ndi njira yokhazikika yolumikizira ma die attach ndipo kupitiriza kupanga ndiye chinthu chofunikira kwambiri. Ganizirani za nsanja ya BESI pamene phukusi lofunikira ndi njira yolumikizira zikugwirizana ndi banja laukadaulo lomwe likuwunikidwa. Ganizirani za nsanja ya K&S pamene kasinthidwe ka zida zenizeni zimathandizira cholumikizira cha ma die, ma CD apamwamba, cholumikizira cha clip, thermo-compression, kapena njira yofananira yolumikizira.
Makina odziwa bwino ntchito yawo akhoza kukhala osagwiritsidwa ntchito bwino ngati makina omwe aperekedwa, makina ogwiritsira ntchito, momwe makinawo alili, kapena chithandizo chomwe chilipo sichikugwirizana ndi zomwe akufuna kupanga.
Ziwerengero za malo, zopempha za nthawi yozungulira, ndi mndandanda wa phukusi lothandizidwa ziyenera kuwunikidwanso motsatira kukula kwenikweni kwa die, momwe zinthu zilili, mtundu wa substrate, zenera la ndondomeko, ndi cholinga chopanga chomwe chikufunika ndi polojekitiyi.
Makina awiri ochokera kwa opanga osiyanasiyana amatha kugwira ntchito zosiyanasiyana ngakhale onse awiri atafotokozedwa kuti ndi zida zolumikizirana. Kusintha mwachindunji kuyenera kuganiziridwa kokha pambuyo potsimikizira njira ndi kasinthidwe.
Pazida zomwe zagwiritsidwa ntchito kapena zokonzedwanso, momwe zinthu zilili ndi owongolera, makanika, ma module owonera, ma feeder, mitu ya ma bond, machitidwe achitetezo, zolemba zowerengera, ndi zida zina zomwe zilipo zingakhale zofunika monga momwe kapangidwe ka nsanja yoyambirira kanalili.
Musanatumize, tsimikizirani zida zomwe zilipo, zitsanzo za zinthu, njira yoyesera, njira zovomerezeka, zofunikira pakuyika, zosowa zamagetsi ndi zofunikira, komanso kuchuluka kwa chithandizo chaukadaulo mukamaliza kuyiyika.
Mafunso otsatirawa akuyankha mavuto omwe nthawi zambiri amafunika kufotokozedwa bwino asanayerekezere ma configurations enaake a semiconductor die bonding.
Pokhapokha ngati makina enieniwo apangidwira njira yofanana yolumikizira ndi mtundu wa phukusi. Kuyerekeza kuyenera kuphatikizapo kukula kwa die, mawonekedwe a substrate, zinthu zomangira, njira yogwirira ntchito, zofunikira pakuyika, mulingo wodziyimira pawokha, zida, ndi momwe chipangizocho chilili.
Ayi. Kuyenerera kumadalira kapangidwe kake, kuphatikizapo mutu wa bond, momwe zinthu zimagwiritsidwira ntchito, mawonekedwe a substrate, mawonekedwe a masomphenya, zida, njira yogwirira ntchito, ndi zofunikira pa mzere wopangira womwe mukufuna.
Tsimikizirani kasinthidwe kolondola, mtundu wa zinthu zothandizira, gwero la die, momwe mutu wa bond ulili, makina owonera, ma module odziyimira pawokha, zida zomwe zilipo, momwe zimagwiritsidwira ntchito, mwayi wopezera zinthu zina, ndi kuchuluka kwa kukonzanso.
Ayi. BESI ili ndi magulu osiyanasiyana a zida zosiyanasiyana zolumikizira ndi kulongedza. Nsanja yeniyeniyo iyenera kufananizidwa ndi njira yofunikira, monga epoxy attach, soft solder, flip chip, multi-chip assembly, thermo-compression, kapena hybrid bonding.
Tsimikizani njira yolumikizirana yomwe mukufuna komanso momwe makina anu amakhazikitsidwira. Kutengera ndi nsanja, njira yoyenera ikhoza kukhala yolumikizirana ndi die attach, clip attach, thermo-compression bonding, power-device attachment, advanced packaging, kapena njira yakale yoyikira.
Palibe chimodzi mwa zinthuzi chomwe chiyenera kuyesedwa chokha. Kulekerera kofunikira kwa malo kuyenera kuchitika nthawi zonse pa nthawi yomwe mukufuna, momwe zinthu zilili, momwe zinthu zilili, momwe zinthu zilili, komanso kuchuluka kwa zinthu zomwe zapangidwa.
Chiwopsezo chachikulu ndi kusalingana kwa njira zogwirira ntchito pamodzi ndi kukonzekera kosakwanira kwa chithandizo. Makina angawoneke oyenera mpaka zida zomwe sizikupezeka, mapulogalamu osathandizidwa, zida zamakaniko zosweka, zida zosinthira zomwe sizikupezeka, kapena zolemba zosakwanira zowerengera zikhudza kuyika ndi kuyenerera.
Perekani zojambula za phukusi, miyeso ya die, makulidwe a die, zinthu zomangira, mawonekedwe a substrate kapena leadframe, UPH yolunjika, kulolerana kwa malo, zinthu zomwe zilipo, zofunikira zokha, ndi zoletsa zilizonse zomwe zilipo pakugwiritsa ntchito zida kapena njira.
Chifukwa chiyani anthu ambiri amasankha kugwira ntchito ndi GeekValue?
Mtundu wathu ukufalikira kuchokera ku mzinda kupita ku mzinda, ndipo anthu osawerengeka andifunsa, "Kodi GeekValue ndi chiyani?" Zimachokera ku masomphenya osavuta: kupatsa mphamvu luso lachi China ndi luso lamakono. Uwu ndi mzimu wodzitukumula mosalekeza, wobisika pakufunafuna kwathu tsatanetsatane komanso chisangalalo chopitilira zomwe tikuyembekezera pakubweretsa kulikonse. Mmisiri waluso komanso kudzipereka uku sikungolimbikira kwa omwe adayambitsa, komanso tanthauzo ndi kutentha kwa mtundu wathu. Tikukhulupirira kuti muyambira pano ndikutipatsa mwayi wopanga ungwiro. Tiyeni tigwire ntchito limodzi kuti tipange chozizwitsa chotsatira cha "zero defect".
ChenLumikizanani ndi katswiri wazogulitsa
Lumikizanani ndi gulu lathu lazamalonda kuti mufufuze mayankho omwe amagwirizana bwino ndi bizinesi yanu ndikuyankha mafunso aliwonse omwe mungakhale nawo.
© Ufulu Onse Ndiwotetezedwa. Thandizo laukadaulo:TiaoQingCMS
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