i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Ii-ASM AD838, BESI, kunye nee-K&S die bonders zikhethwa kwiinjongo ezahlukeneyo zokwenziwa kwee-semiconductor. I-AD838 ivavanywa ngokubanzi kwiindlela ezimiselweyo zokufaka ii-die attachment apho ukubekwa okuphindaphindwayo kunye nokuzinza kokusebenza kubalulekile; Iinkqubo ze-BESI zihlala ziqwalaselwa kwiimfuno eziphambili zokupakisha; Amaqonga e-K&S ahlala evavanywa apho ukuguquguquka kwenkqubo, ukuhambelana kwemigca ekhoyo, okanye ulawulo lweendleko kubalulekile.
Uthelekiso olungezantsi luhlola uzinzo lwemveliso, amandla okubeka, ukufaneleka kwenkqubo, imida yesicelo, kunye nokuqwalaselwa kobunini obusebenzayo kwimisebenzi yokupakisha ye-semiconductor.
InentsingiseloibhondiUthelekiso luqala ngemfuneko yephakheji kunye nenkqubo, kungekhona ibheji kwisakhelo somatshini. Ubungakanani bedayi, ifomathi yesiseko, izinto ezincamathiselweyo, ukunyamezela indawo, imveliso efunekayo, kunye noqwalaselo lokuphathwa kwezinto zonke zichaphazela ukuba iqonga lifanelekile na kumgca othile wemveliso.
I-ASM AD838 idla ngokuvavanywa kwimisebenzi yokuncamathisela i-die esekwe apho ukubekwa okuphindaphindwayo, ukusebenza komjikelo okuthembekileyo, kunye nokuqhubeka kwemveliso okuzinzileyo zezona zinto ziphambili. I-BESI igubungela uluhlu olubanzi lweetekhnoloji zokuncamathisela i-die, kubandakanya iinkqubo ezisetyenziselwa ii-chip ezininzi, i-flip-chip echanekileyo, kunye nemisebenzi yokupakisha ephucukileyo. I-K&S kufuneka ihlolwe ngokuchasene nemodeli echanekileyo kunye nendlela yokuhlanganisa, kuba ipotifoliyo yayo yokuhlanganisa i-semiconductor ibandakanya iitekhnoloji ezahlukeneyo zokudibanisa endaweni yodidi olunye lokutshintsha ngqo.
Musa ukuphatha i-AD838, iqonga le-BESI, kunye neqonga le-K&S njengeendlela ezizenzekelayo ezifana nezifanayo. Uthelekiso oluthembekileyo kufuneka lwenziwe kwinqanaba lemodeli kunye nenkqubo emva kokuqinisekisa uyilo lwephakheji, indlela yokuphatha idayisi, izinto zokubopha, kunye neprofayili yemveliso ekujoliswe kuyo.
Ezi nkcukacha zemveliso zimisela ukuba umatshini ufanelekile na ngokwetekhnoloji, uyasebenza kwezorhwebo, kwaye unokuxhaswa na emva kokufakwa.
Izixhobo ze-ASM AD838, BESI, kunye ne-K&S akufuneki ziphathwe njengeendlela ezizenzekelayo ezifana nezifanayo. Uthelekiso olunentsingiselo luqala ngenkqubo yokuncamathisela idayisi ecetywayo, ukwakhiwa kwephakheji, indlela yokuphatha izinto, imfuneko yokubeka, kunye nenjongo yemveliso endaweni yegama lomenzi kuphela.
Le matrix ingezantsi yenzelwe ukunceda amaqela obunjineli kunye nokuthengwa kwempahla achonge imibuzo yobugcisa ekufuneka iqinisekiswe ngaphambi kokukhetha uqwalaselo oluthile lwe-die bonder.
Uyilo lwentloko yebhondi, iindlela zokubona, ukuphathwa kwe-wafer okanye itreyi, indlela yokukhupha, inkqubo yobushushu, imeko yezixhobo, kunye nenkxaso yenkonzo ekhoyo inokutshintsha kakhulu ukuba umatshini ufanelekile na kumgca wemveliso.
Sebenzisa esi sikhokelo ukuthelekisa ukulingana kwenkqubo, ukuhlanganiswa kwemveliso, kunye neemfuno zobunini ngaphambi kokuba wenze isigqibo sokuthenga.
| Indawo yoVavanyo | Iqonga le-ASM AD838 | Iiplatifomu zeBESI eziqhotyoshelweyo | Iiplatfomu zeK&S Die Attach / Advanced Packaging |
|---|---|---|---|
| Inqanaba lokuthelekisa elichanekileyo Qala ngomatshini ochanekileyo, izixhobo, kunye noqwalaselo olufakiweyo. | Qinisekisa uBumbeko lwe-AD838 Qinisekisa uhlobo lwentloko yebhondi, iphakheji yombono, ulungiselelo lwe-feeder, ukuphathwa kwe-substrate, kunye neendlela ezikhoyo zenkqubo. | Qinisekisa usapho lweMveliso Chonga ukuba iqonga elicetywayo lenzelwe na i-epoxy attach, i-soft solder, i-flip-chip, i-multi-chip, okanye enye indlela yenkqubo. | Qinisekisa indlela yokuhlanganisa Qinisekisa ukuba inkqubo ecetywayo yenzelwe ukuba i-die attachment, i-thermo-compression bonding, i-power assembly, okanye enye inkqubo ethile yesicelo. |
| Umbuzo weNkqubo ePhambili Chaza indlela ekumele ifakwe ngayo idayisi kunye noko kufuneka kufezekiswe yiphakheji egqityiweyo. | Imveliso yokuncamathisela i-Die Fit Hlola ukuhambelana ne-die pickup ecetywayo, ulungelelwaniso, ulandelelwano lokuncamathisela, izinto zokuncamathisela okanye zokubopha, kunye nemveliso ekujoliswe kuyo. | Ukulingana koLuhlu lweNkqubo Hlola ukuba iqonga elikhethiweyo liyahambelana na netekhnoloji yokudibanisa efunekayo kunye nendlela yophuhliso lwephakheji. | Ukufaneleka Okuthile Kwesicelo Hlola indlela yenkqubo ngononophelo apho kubandakanywa khona ukupakisha okuphucukileyo, ukuhlanganiswa kwezixhobo zamandla, ukuqhoboshelwa kwekliphu, okanye amanyathelo akhethekileyo okudibanisa. |
| Uhlolo lokubekwa kunye nokulungelelaniswa Amabango okuchaneka kufuneka ahlolwe rhoqo phantsi kweemeko zemveliso ezicetywayo. | Umbono kunye neBhayisekile kunye neXesha loMjikelo Qinisekisa ukunyamezelana kokubekwa kubungakanani bokwenyani bedayi, uhlobo lwesiseko, imeko yezinto ezisetyenzisiweyo, kunye nomjikelo wemveliso ofunekayo. | Ukuchaneka ngokweNhlobo yePlatform Qinisekisa ukuba inkqubo ekhethiweyo ilungiselelwe na i-high-speed die attach, indawo echanekileyo, ukulungelelaniswa kwe-flip-chip, okanye ukuphathwa kwe-multi-chip. | Ukuxhomekeka kwiZixhobo kunye neNkqubo Qinisekisa amandla okubeka kunye noqwalaselo lwentloko yebhondi, ukuseta umbono, imeko yezixhobo, kunye neemfuno zokuphatha inkqubo ethile. |
| Ukuphathwa kwezinto kunye neephakheji Hlola indlela iidayi, ii-substrates, ii-leadframes, ii-strips, iitreyi, okanye ii-wafers ezingena kwaye ziphuma ngayo kwinkqubo. | Uhlolo lokuHlangana koMgca Qinisekisa ifomathi yezinto ezixhaswayo, ubungakanani be-substrate, indlela yokwenza i-indexing, umthombo we-die, kunye neemfuno zomdibaniso we-automation. | Uhlolo lokuGuquka kwePakeji Qinisekisa ukuba uqwalaselo lwenkqubo luyayixhasa na ubungakanani be-wafer obufunekayo, ifomathi ye-substrate, i-die geometry, kunye nokuhamba kwezinto zemveliso. | Uhlolo lweZixhobo zeSicelo Qinisekisa ukusetyenziswa kwezixhobo ezithile kwinkqubo, indlela yokubonisa, indlela yokudlulisela izinto, kunye nazo naziphi na iimfuno zovavanyo olukhethekileyo okanye zonxibelelwano. |
| Ukuhlanganiswa kweMveliso Vavanya indlela ezihambelana ngayo izixhobo kumgca obanzi wemveliso yasemva. | Ukuqhubeka koMgca oMisiweyo Idla ngokuba yeyona nto ibalulekileyo apho inkqubo ekhoyo ehambelanayo sele ixhomekeke kwizixhobo eziqhelekileyo, iinkqubo zokusebenza, kunye nezixhobo zenkxaso. | Ukwandiswa kweNkqubo okunokwenzeka Ihlala ivavanywa xa isicwangciso semveliso siquka iimfuno ezibanzi zokuncamathisela, i-flip-chip, i-multi-chip, okanye iimfuno eziphambili zokupakishwa. | Ukuhambelana Kokuhamba Komhlangano Ihlala ivavanywa apho inqanaba lokuncamathisela idayi kufuneka liqhagamshelane nendibano ekhethekileyo, uqhagamshelo, isixhobo samandla, okanye imisebenzi yokupakisha ephucukileyo. |
| Uhlolo lobunini kunye nenkxaso Ixabiso lokuthenga lodwa alichazi iindleko zokusebenza zokwenyani ze-die bonder esetyenzisiweyo okanye ehlaziyiweyo. | Hlola iNkxaso eSekwe kwiSiseko esiFakiweyo Jonga ukufikelela kwinxalenye eseleyo, imeko yesoftware kunye nomlawuli, imbali yokulinganisa, amaxwebhu akhoyo, kunye nobubanzi bokuhlaziya. | Inkxaso yoHlolo oluQokelelweyo lweNkqubo Jonga ukufumaneka kwezixhobo, ulwazi lwesicelo, izinto ezifunekayo ezisetyenzisiweyo, iimfuno zokufaneleka kwenkqubo, kunye nokukwazi ukuphendula kwinkonzo. | Hlaziya Inkxaso Ethile Yobuchwephesha Jonga ukuba izixhobo ezifanelekileyo zokufaka isicelo, ulwazi lwenkqubo, iindawo ezingasetyenziswayo, kunye nenkxaso yobunjineli zihlala zifumaneka na kwindlela ekucetywayo ukuba yenziwe. |
| Eyona nto iphambili ekuThengeni Chonga imeko eyenza iqonga libe lelorhwebo nelobuchwephesha elithembekileyo kwiprojekthi yakho. | Imfuneko yeMveliso ehambelanayo ezinzileyo Ifanelekile ukuqwalaselwa xa uqwalaselo lomatshini luhambelana ngokusondeleyo nenkqubo yokuncamathisela idayethi esele imiselwe kwaye ukuqhubeka kwemveliso yeyona nto iphambili. | Imfuneko yeNkqubo eBanzi Ifanelekile ukuqwalaselwa xa uphuhliso lwephakheji okanye iimfuno zemveliso zivumela iqonga elinoluhlu olufunekayo lwetekhnoloji yokudibanisa iidayi. | Imfuneko ethile yokuhlanganisa Ifanelekile ukuqwalaselwa xa isicelo esicetywayo sihambelana ngokucacileyo nesixhobo somatshini sokuncamathisela, ukupakishwa okuphambili, okanye amandla okuhlanganisa amandla. |
Isigqibo sokukhetha esiqinileyo sidla ngokwenziwa emva kokuqinisekisa umzobo wephakheji, ubungakanani bedayi, izinto zokubopha, i-UPH ekujoliswe kuyo, ukunyamezelana kokubekwa, imfuneko yokwenza izinto ngokuzenzekelayo, kunye nemeko yokwenyani yomatshini onikezelwayo.
Chaza ukuba ingaba iprojekthi ifuna i-epoxy die attach, i-solder attach, i-flip-chip placement, i-thermo-compression bonding, okanye enye indlela yokuhlanganisa.
Tshatisa umatshini nobukhulu bokwenyani bedayi, ifomathi yesiseko, ukuhamba kwezinto, injongo yomjikelo, imfuneko yokuhlolwa, kunye nomsebenzi womqhubi.
Kwizixhobo ezisetyenzisiweyo okanye ezihlaziyiweyo, qinisekisa iirekhodi zenkonzo, imeko yezixhobo, ububanzi bokulinganisa, iziphumo zovavanyo, izixhobo ezikhoyo, kunye nenkxaso yokufakela.
Amaqela obunjineli kunye nokuthengwa kwempahla kufuneka athelekise izixhobo zokubopha nge-die bonding ngendlela yenkqubo yokwenyani, ukwakhiwa kweepakeji, indlela yokubonisa nge-die, izinto zokubopha nge-bonding, ukunyamezelana kokubekwa, imveliso ekujoliswe kuyo, kunye nokusebenza kakuhle koqwalaselo olunikezelwayo endaweni yegama lomenzi kuphela.
Uqwalaselo lwe-ASM AD838 okanye i-AD838L luhlala luvavanywa kwimisebenzi yokuncamathisela idayi esekwe apho ukuqhubeka kwenkqubo, izixhobo ezihambelanayo, kunye nokusebenza kwemveliso okuphindaphindwayo kubalulekile. Amaqonga e-BESI kufuneka ahlolwe ngokuchasene netekhnoloji yokuncamathisela idayi efunekayo, efana nokuncamathisela i-epoxy, i-soft solder, ukuphathwa kweetshiphusi ezininzi, i-flip-chip, okanye imisebenzi yokupakisha ephucukileyo. Izixhobo ze-K&S kufuneka zivavanywe ngokwendlela ethile yokuhlanganisa, ngakumbi apho kubandakanyeke ukupakishwa okuphucukileyo, ukuhlanganiswa kwamandla, ukuncamathisela ikliphu, okanye uqwalaselo lwedayi edumileyo.
Uthelekiso olubonakalayo lubonisa iindawo ezihlala zifuna uphononongo lobuchwephesha olusondeleyo: ukuqhubeka kwemveliso, uluhlu lwenkqubo, iimfuno eziphambili zokupakisha, ukuguquguquka koqwalaselo, kunye nokulungela inkxaso emva kokufakwa. Ukufaneleka kokugqibela kuxhomekeke kwiinkcukacha zomatshini ezichanekileyo, iphakheji yezixhobo, iziphumo zokufaneleka kwenkqubo, kunye nemeko yeyunithi ebonelelwayo.
Itshathi yenzelwe ukuchonga ukuba zeziphi iindawo zovavanyo ekufuneka zifumane uphononongo olusondeleyo ngaphambi kokukhetha uqwalaselo oluthile lwe-ASM AD838, BESI, okanye i-K&S.
Imephu ebonakalayo kufuneka ixhase uphononongo lwezixhobo olucwangcisiweyo, ingathathi indawo yokuqinisekiswa kwenkqubo okanye ukuqinisekiswa kobunjineli kwinqanaba loqwalaselo.
Hlola ukuba uqwalaselo olucetywayo luyahambelana na nendlela ekhoyo yokufakela i-die attach, iinkqubo zokusebenza eziqhelekileyo, izixhobo ezifakiweyo, iindawo ezisele ezikhoyo, kunye nezixhobo zenkxaso ezaziwayo.
Qinisekisa ukuba izixhobo zingayixhasa na indlela yokuncamathisela efunekayo, umthombo wedayi, ifomathi yesiseko, izinto zokubopha, uyilo lwephakheji, kunye nendlela yokuvelisa ecetywayo.
Qinisekisa ukuba iprojekthi ifuna ukubekwa ngokuchanekileyo, ukuhlanganiswa kweetshiphu ezininzi, ukulungelelaniswa kweetshiphu, ukubopha kwe-thermo-compression, ukubopha kwe-hybrid, okanye enye inkqubo yokupakisha ephucukileyo.
Qinisekisa amandla entloko yebhondi, iindlela zokubona, ukuphathwa kwe-wafer okanye itreyi, indlela yokukhupha, iimfuno zenkqubo yobushushu, ukufumaneka kwezixhobo, kunye neendlela zokwenza izinto ngokuzenzekelayo.
Kwizixhobo ezisetyenzisiweyo okanye ezihlaziyiweyo, jonga iirekhodi zokulinganisa, imeko yomlawuli, imbali yenkonzo, ukufikelela kwinxalenye eseleyo, umda wokuhlaziya, izixhobo zenkqubo, kunye nenkxaso yokufakela.
Umahluko ophambili wobunjineli asikodumo lophawu okanye amanani okubekwa ashicilelweyo. Yindlela uqwalaselo oluthile lomatshini olusebenza ngayo ngaphakathi kwendlela yokuncamathisela idayisi ecetywayo, kubandakanya ukubonakaliswa kwedayi, ukuphathwa kwesiseko, izinto zokubopha, indlela yokubona, imeko yezixhobo, inkqubo yobushushu, kunye neemfuno zomjikelo wemveliso.
Iqonga lisenokuba nakho ngokwetekhnoloji ukwenza inkqubo ephepheni kodwa lingabi lolona lufanelekileyo ukuba ulungiselelo olunikiweyo alubandakanyi intloko yebhondi efunekayo, ukhetho lokuphatha i-wafer, ukuseta ukusasaza, i-feeder yezinto, umsebenzi wokuhlola, okanye izixhobo zokuvelisa.
Uthelekiso oluluncedo kakhulu lwenziwa emva kokuqinisekisa umzobo wephakheji, ubungakanani bedayi, izinto zokuncamathisela, ukunyamezelana kokubekwa, i-UPH ekujoliswe kuyo, ukuhamba kwezinto, kunye nenkxaso yobugcisa ekhoyo yeyunithi ehlolwayo.
I-ASM AD838 okanyeAD838LUqwalaselo luhlala luvavanywa apho ukuhamba kwe-die attachment okucetywayo kunokufaniswa nokuphathwa kwezinto ezifakiweyo, intloko yebhondi, iphakheji yombono, ifomathi ye-substrate, kunye nezixhobo ezikhoyo.
Eyona ndlela ifanelekileyo idla ngokufumaneka apho ukuqhubeka kwemveliso kubalulekile: iinkqubo zokusebenza ezimiselweyo, iindawo ezingasetyenziswayo ezihambelanayo, iindlela zokupheka zenkqubo ezaziwayo, inkxaso yokulinganisa ekhoyo, kunye nobubanzi bokuhlaziya obusebenzayo beyunithi enikezelwayo.
Izixhobo zesinyithiIfanele ihlolwe kwinqanaba lemveliso nosapho kuba ipotifoliyo yayo ye-die attach igubungela iindlela ezahlukeneyo zenkqubo, kubandakanya i-epoxy die attach, i-soft solder, i-multi-chip assembly, i-flip chip, i-thermo-compression bonding, kunye namaqonga e-hybrid bonding.
Umbuzo wobunjineli kukuba ingaba iqonga elicetywayo lenzelwe uyilo lwephakheji olufunekayo kunye nendlela yenkqubo, endaweni yokuba igama le-BESI lodwa limele indawo ethe ngqo ye-die bonder ekhoyo.
Izixhobo ze-K&Skufuneka ihlolwe ngokwendlela ethile yokuhlanganisana kwe-semiconductor echaphazelekayo. Ngokuxhomekeke kwiqonga, uvavanyo lunokunxibelelana ne-die attachment, i-clip attach, i-thermo-compression bonding, i-advanced packaging, i-power-device assembly, okanye i-legative installed configuration.
Kubalulekile ukuqinisekisa ukuba umatshini wenzelwe inkqubo efanayo yokuncamathisela nomgca wemveliso ekujoliswe kuwo. Inkqubo eyilwe ngokujikeleza indlela ekhethekileyo yokudibanisa okanye yokuhlanganisa amandla akufuneki ithelekiswe ngokuzenzekelayo noqwalaselo lwesiqhelo lokuncamathisela.
Ii-aplikeshini ze-semiconductor packaging kufuneka zahlulwe ngokwenkqubo yokuncamathisela kunye nokwakhiwa kwepakeji endaweni yelebhile yophawu oluqhelekileyo. Usapho olufanayo lwemveliso lunokulungiswa ngokwahlukileyo kwi-epoxy attach, i-solder attach, i-flip-chip placement, i-multi-chip assembly, i-power-device packaging, okanye iinkqubo zokudibanisa ezikhethekileyo.
Umatshini kufuneka uthathwe njengofanelekileyo kuphela emva kokuba indlela yawo yokuphatha, izixhobo, indlela yokubopha, amandla okubeka, ukuhamba kwezinto, kunye nemeko yenkxaso iqinisekisiwe ngokuchasene nenkqubo yemveliso ecetywayo.
Ifanelekile apho inkqubo isebenzisa ulandelelwano oluqinisekisiweyo lwe-die attachment kwaye eyona nto iphambili kukugcina imveliso izinzile kunye nokuphathwa kwe-die okuhambelanayo, ukuphathwa kwe-substrate, ulawulo lwenkqubo yokuncamathelisa okanye ye-solder, kunye neenkqubo zokusebenza eziphindaphindwayo.
Uqwalaselo lwe-AD838 lunokuba lufanelekile xa ukhetho olufakelweyo luhambelana kakhulu nendlela ekhoyo yokuvelisa kwaye izixhobo ezikhoyo zinokuxhasa ifomathi yephakheji efunekayo.
Ukuhlanganiswa kwezixhobo zombane kudla ngokufuna ukuphononongwa ngokusondeleyo kobukhulu bedayi, izinto zokubopha, iimfuno zobushushu, ifomathi yefreyimu okanye yesiseko, kunye nokuziphatha koomatshini kwiphakheji yokugqibela.
Iinkqubo ezenzelwe i-soft solder, i-conductive adhesive, i-clip attach, okanye ezinye iinkqubo ze-power-package kufuneka zithelekiswe ngokuthelekisa imfuneko yephakheji kunye nendlela yobushushu.
Ezi zicelo zifuna okungaphezulu kokubekwa kwedayi elula. Uvavanyo lungabandakanya ukujongwa kwedayi, ulwakhiwo lwe-bump okanye i-interconnect, ukuchaneka kokulungelelaniswa phantsi kweemeko zemveliso, i-substrate warpage, ukuphathwa kwe-flux okanye i-adhesive, kunye neemfuno zokuhlola.
Iintsapho zemveliso ze-BESI kunye ne-K&S zinokubandakanya amaqonga afanelekileyo kwiindlela ezinjalo, kodwa ulungelelwaniso oluchanekileyo lwenkqubo kufuneka luqinisekiswe ngaphambi kokuba kuthelekiswe.
Izicelo ezibandakanya i-thermo-compression bonding, i-hybrid bonding, i-high-density interconnects, i-stacked die, okanye ii-multi-die modules ezintsonkothileyo zifuna uphononongo lwenkqubo oluzinikeleyo endaweni yokuthelekisa ngokuthe ngqo ne-die bonder eqhelekileyo.
Isigqibo kufuneka siqwalasele iwindow epheleleyo yenkqubo, iprofayili yobushushu, uluhlu lwamandla okubopha, ukulungiswa kwezinto, i-metrology, ithagethi yokukhupha, kunye nesicwangciso senkxaso yobunjineli.
I-die bonder efanelekileyo ngumatshini onokugqiba inkqubo ecetywayo rhoqo ngaphakathi kwefestile yemveliso efunekayo, ngelixa uhlala uxhaswa emva kokufakwa. Uthelekiso lwebhrendi luluncedo kuphela emva kokuba indlela yobugcisa ichaziwe.
Qinisekisa ukuba iprojekthi ifuna i-epoxy attach, i-eutectic okanye i-soft-solder attach, i-conductive adhesive, i-flip-chip placement, i-thermo-compression bonding, i-clip attach, okanye enye indlela ekhethekileyo yokuhlanganisa.
Qinisekisa ubungakanani bedayi, ubukhulu bedayi, imbonakalo ye-wafer okanye yetreyi, ifomathi ye-substrate okanye ye-leadframe, i-strip indexing, indlela yokudlulisa izinto, kunye nesidingo sokuhambisa, ukufudumeza, ukucola, okanye ukuhlola.
Hlaziya intloko yokubopha yokwenyani, iphakheji yombono, iimodyuli zokuphatha, izixhobo, inkqubo yobushushu, ujongano oluzenzekelayo, imeko yesoftware, kunye neendlela ezikhoyo kwinkqubo enikezelwayo.
Thelekisa imveliso elindelekileyo, imfuno yotshintsho, iimfuno zolondolozo, ukufikelela kwinxalenye yezixhobo ezingasetyenziswanga, ububanzi bokulinganisa, ukugubungela inkonzo, umthwalo womsebenzi wokufaneleka, kunye neendleko zizonke zobunini.
Cinga ngoqwalaselo lwe-ASM AD838 xa luhambelana ngokusondeleyo nenkqubo yokuncamathisela idayisi esele imiselwe kwaye ukuqhubeka kwemveliso yeyona nto iphambili. Cinga ngeqonga le-BESI xa iphakheji efunekayo kunye nendlela yokuncamathisela ihambelana nosapho oluthile lobuchwepheshe oluphantsi kohlolo. Cinga ngeqonga le-K&S xa uqwalaselo oluchanekileyo lwezixhobo luxhasa i-die attachment ecetywayo, ukupakishwa okuphambili, i-clip attach, i-thermo-compression, okanye inkqubo yokuhlanganisa enxulumene nayo.
Umatshini onobuchule bobuchwephesha usenokuba yinto engafanelekanga xa ulungelelwaniso olunikezelwayo, izixhobo zenkqubo, imeko yomatshini, okanye inkxaso ekhoyo ingahambelani neemfuno zemveliso ekujoliswe kuzo.
Amanani okubekwa, amabango exesha lomjikelo, kunye noluhlu lweepakeji ezixhaswayo kufuneka zihlolwe phantsi kobukhulu bokwenyani bedayi, imeko yezinto ezisetyenzisiweyo, uhlobo lwesiseko, iwindow yenkqubo, kunye nenjongo yemveliso efunekayo kwiprojekthi.
Oomatshini ababini abavela kubavelisi abahlukeneyo banokukhonza iindlela ezahlukeneyo zokuhlanganisa nokuba zombini zichazwa njengezixhobo zokubopha ngoxinzelelo. Ukutshintshwa ngokuthe ngqo kufuneka kuthathelwe ingqalelo kuphela emva kokuqinisekiswa kwenkqubo kunye noqwalaselo.
Kwizixhobo ezisetyenzisiweyo okanye ezihlaziyiweyo, imeko yabalawuli, oomatshini, iimodyuli zombono, ii-feeders, ii-bond heads, iinkqubo zokhuseleko, iirekhodi zokulinganisa, kunye nezixhobo ezifumanekayo zinokubaluleka njengoyilo lweplatifomu yokuqala.
Ngaphambi kokuba uthunyelwe, qinisekisa izixhobo ezikhoyo, izixhobo zesampulu, inkqubo yovavanyo, iikhrayitheriya zokwamkelwa, imfuneko yokufakela, iimfuno zombane kunye neenkonzo, kunye nobubanzi benkxaso yobugcisa emva kokufakwa.
Le mibuzo ilandelayo ijongana nemiba esebenzayo edla ngokufuna ukucaciswa ngaphambi kokuthelekisa ulungelelwaniso oluthile lwe-semiconductor die bonding.
Kuphela xa oomatshini abachanekileyo benzelwe inkqubo efanayo yokuncamathisela kunye nohlobo lwephakheji. Uthelekiso kufuneka lubandakanye ubungakanani bedayi, ifomathi yesiseko, izinto zokubopha, indlela yokuphatha, imfuneko yokubeka, inqanaba lokuzenzekela, izixhobo, kunye nemeko yeyunithi ebonelelwayo.
Hayi. Ukufaneleka kuxhomekeke kulungiselelo olufakiweyo, kubandakanya intloko yebhondi, ukuphathwa kwezinto, ifomathi yesiseko, ukuseta umbono, izixhobo, ukhetho lwenkqubo, kunye neemfuno zomgca wemveliso ocetywayo.
Qinisekisa uqwalaselo oluchanekileyo, ifomathi yezinto ezixhaswayo, umthombo wedayi, imeko yentloko yebhondi, inkqubo yombono, iimodyuli zokwenza izinto ngokuzenzekelayo, izixhobo ezikhoyo, imeko yokulinganisa, ukufikelela kwinxalenye eseleyo, kunye nobubanzi bokuhlaziya.
Hayi. I-BESI ineentsapho ezahlukeneyo zezixhobo zeendlela ezahlukeneyo zokudibanisa iidayi kunye neendlela zokupakisha. Iqonga elithile kufuneka lihambelane nenkqubo efunekayo, efana ne-epoxy attach, i-soft solder, i-flip chip, i-multi-chip assembly, i-thermo-compression, okanye i-hybrid bonding.
Qinisekisa indlela yokuhlanganisa ecetywayo kunye noqwalaselo lomatshini. Ngokuxhomekeke kwiqonga, inkqubo efanelekileyo inokubandakanya i-die attach, i-clip attach, i-thermo-compression bonding, i-power-device assembly, i-advanced packaging, okanye inkqubo efakiweyo endala.
Akukho nanye kwezi zinto ifanele ihlolwe yodwa. Ukunyamezelana kokubekwa okufunekayo kufuneka kufezekiswe rhoqo ngexesha lomjikelo elicetywayo, imeko yokufa, imeko yesiseko, izinto zokubopha, kunye nenqanaba lemveliso.
Eyona mngcipheko mkhulu kukungalingani kwenkqubo kunye nokulungela inkxaso engaphelelanga. Umatshini ungabonakala ufanelekile de izixhobo ezilahlekileyo, isoftware engaxhaswayo, izinto ezigugileyo zoomatshini, iindawo ezingasetyenziswayo, okanye iirekhodi zokulinganisa ezingaphelelanga zichaphazele ukufakwa kunye nokufaneleka.
Nika umzobo wephakheji, ubungakanani bedayi, ubukhulu bedayi, izinto ezincamathiselweyo, ifomathi yesiseko okanye ifreyimu ye-lead, i-UPH ekujoliswe kuyo, ukunyamezelana kokubekwa, izixhobo ezikhoyo, imfuneko yokwenza izinto ngokuzenzekelayo, kunye nayo nayiphi na imida ekhoyo yezixhobo okanye yenkqubo.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.
© Onke Amalungelo Agciniwe. Inkxaso yobuGcisa:TiaoQingCMS
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