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Funa Quote →ASM AD838, BESI, ne K&S die bonders zirondebwa olw’ebintu eby’enjawulo ebisookerwako mu kukola semiconductor. AD838 okutwalira awamu yeekenneenyezebwa ku layini eziteereddwawo ezisiba die nga okuteekebwa okuddiŋŋana n’okutebenkera kw’okukola bikulu nnyo; Enkola za BESI zitera okulowoozebwako olw’ebyetaago by’okupakinga eby’omulembe; Enkola za K&S zitera okwekebejjebwa awali okukyukakyuka kw’enkola, okukwatagana kwa layini okuliwo, oba okufuga omuwendo.
Okugerageranya wansi kwekenneenya okutebenkera kw’okufulumya, obusobozi bw’okuteeka, okusaanira enkola, ensalo z’okukozesa, n’okulowooza ku bwannannyini mu nkola ku mirimu gy’okupakinga semikondokita.
A ow’amakuluomukuumi w’ebintuokugeraageranya kutandikira ku kyetaagisa ekipapula n’enkola, so si bbaagi eri ku fuleemu y’ekyuma. Sayizi ya die, ensengeka ya substrate, attach material, placement tolerance, output eyetaagisa, n’ensengeka y’okukwata ebintu byonna bikosa oba platform esaanira layini y’okufulumya entongole.
ASM AD838 etera okwekenneenyezebwa ku mirimu egyateekebwawo egy’okuyunga ku die nga okuteeka okuddiŋŋana, okukola kw’enzirukanya eyesigika, n’okugenda mu maaso kw’okufulumya okulabirira bye bikulu. BESI ekwata ku tekinologiya ow’enjawulo ow’okusiba die attach, omuli enkola ezikozesebwa ku multi-chip, precision flip-chip, n’enkola y’emirimu ey’okupakinga ey’omulembe. K&S erina okwekenneenya okusinziira ku muze omutuufu n’ekkubo ly’okukuŋŋaanya, kubanga ekifo kyayo eky’okukuŋŋaanya semikondokita kikwata ku tekinologiya ow’enjawulo ow’okuyunga okusinga ekika kimu eky’okukyusa obutereevu.
Totwala AD838, BESI platform, ne K&S platform nga automatic like-for-like alternatives. Okugeraageranya okwesigika kulina okukolebwa ku mutendera gw’ekyokulabirako n’enkola oluvannyuma lw’okukakasa dizayini y’ekipapula, enkola y’okukwata die, ebintu ebisiba, n’engeri y’okufulumya ekigendererwa.
Ebikwata ku kukola bino bye bisalawo oba ekyuma kituukira ddala mu by’ekikugu, kya mugaso mu by’obusuubuzi, era nga kiwanirirwa oluvannyuma lw’okukiteeka.
Ebyuma bya ASM AD838, BESI, ne K&S tebirina kutwalibwa ng’ebikozesebwa mu ngeri ey’otoma nga bifaanana. Okugeraageranya okw’amakulu kutandikira ku nkola egenderere ey’okusiba die, okuzimba ekipapula, enkola y’okukwata ebintu, ekyetaagisa okuteeka, n’ekigendererwa ky’okufulumya okusinga erinnya ly’omukozi lyokka.
Matrix wammanga ekoleddwa okuyamba ttiimu za yinginiya n’okugula ebintu okuzuula ebibuuzo eby’ekikugu ebirina okukakasibwa nga tebannalonda nsengeka ya die bonder entongole.
Dizayini y’omutwe gwa bond, engeri y’okulaba, enkwata ya wafer oba tray, enkola y’okugaba, enkola y’ebbugumu, embeera y’ebikozesebwa, n’obuyambi bw’empeereza obuliwo bisobola okukyusa ennyo oba ekyuma kisaanira layini y’okufulumya.
Kozesa enkola eno okugeraageranya enkola okutuukagana, okugatta okufulumya, n’ebyetaago by’obwannannyini nga tonnasalawo kugula.
| Ekitundu eky’okwekenneenya | Omukutu gwa ASM AD838 | BESI Ebifo eby'okugattako | K&S Die Attach / Enkola z'okupakinga ez'omulembe |
|---|---|---|---|
| Omutendera Omutuufu ogw’Okugeraageranya Tandika n'ekyuma ekituufu, ebikozesebwa, n'ensengeka etekeddwa. | Kakasa Ensengeka ya AD838 Kakasa ekika ky’omutwe gwa bond, vision package, ensengeka y’emmere, enkwata ya substrate, n’enkola eziriwo. | Kakasa Famire y'Ebikozesebwa Laba oba ekifo ekiteeseddwa kitegekeddwa okuyunga epoxy, soft solder, flip-chip, multi-chip, oba ekkubo eddala ery’enkola. | Kakasa Ekkubo ly’Okukuŋŋaana Salawo oba enkola eteeseddwa egendereddwamu okuyunga ku die, okusiba thermo-compression, okukuŋŋaanya amaanyi, oba enkola endala eyenjawulo ey’okukozesa. |
| Ekibuuzo ky’Enkola Enkulu Lambulula engeri die gy’erina okusibirwamu ne kiki ekipapula ekiwedde ky’erina okutuukako. | Okufulumya Die Attach Fit Weekenneenye okukwatagana n’okukwata die okugendereddwa, okugikwataganya, ensengeka y’okugattako, ekintu ekisiiga oba ekikwatagana, n’okufulumya ekigendererwa. | Enkola Range Fit Weekenneenye oba nga platform erongooseddwa ekwatagana ne tekinologiya eyetagisa die attach n’ekkubo ly’okukulaakulanya package. | Okukwatagana-Specific Fit Weekenneenye ekkubo ly’enkola n’obwegendereza awali okupakinga okw’omulembe, okukuŋŋaanya ekyuma ky’amasannyalaze, okukwata clip, oba emitendera egy’enjawulo egy’okuyungagana gye gizingirwamu. |
| Okuddamu okwetegereza okuteekebwa n’okukwatagana Ebigambibwa nti bituufu bulijjo birina okukeberebwa wansi w’embeera z’okufulumya ezigendereddwamu. | Okwolesebwa n’enzirukanya y’obudde n’obudde Kakasa okugumiikiriza okuteeka ku sayizi yennyini eya die, ekika kya substrate, embeera y’ebintu, n’enzirukanya y’okufulumya eyeetaagisa. | Obutuufu okusinziira ku Kika kya Pulatifoomu Kakasa oba enkola erongooseddwa erongooseddwa okusiba die ku sipiidi ey’amaanyi, okuteeka mu butuufu obw’amaanyi, okukwataganya flip-chip, oba okukwata chip eziwera. | Ebikozesebwa n’Okwesigamira ku Nkola Okukakasa obusobozi bw’okuteeka awamu n’ensengeka y’omutwe gwa bond, okuteekawo okwolesebwa, embeera y’ebikozesebwa, n’ebyetaago by’okukwata ebikwata ku nkola. |
| Enkwata y’ebikozesebwa n’ebipapula Kebera engeri dies, substrates, leadframes, strips, trays, oba wafers gye ziyingira n’okufuluma mu nkola. | Okuddamu okwetegereza okukwatagana kwa layini Kakasa ensengeka y’ebintu ewagirwa, ebipimo bya substrate, enkola y’okuwandiika, ensibuko y’okufa, n’ebyetaago by’enkolagana ey’obwengula. | Okwekenenya Okukyukakyuka mu Paka Kakasa oba ensengeka y’enkola ewagira sayizi ya wafer eyeetaagisa, ensengeka ya substrate, geometry ya die, n’okutambula kw’ebintu ebikolebwa. | Okwekenenya Ebikozesebwa mu Kukozesa Kakasa enkola-ebitongole ebikozesebwa, enkola y’okulaga die, ekkubo ly’okutambuza ebintu, n’ebyetaago byonna eby’enjawulo eby’okukebera oba okuyunga. |
| Okugatta Ebintu Ebikolebwa Weekenneenye engeri ebyuma gye bikwataganamu ne layini y’okufulumya eby’emabega ebigazi. | Okugenda mu maaso kwa Layini okuteereddwawo Ebiseera ebisinga okukwatagana nga enkola eriwo ekwatagana yeesigamye dda ku bikozesebwa ebimanyiddwa, enkola z’emirimu, n’ebikozesebwa ebiwagira. | Obusobozi bw’okugaziya enkola Ebiseera ebisinga okwekenneenya nga enteekateeka y’okufulumya erimu ebyetaago ebigazi eby’okusiba die attach, flip-chip, multi-chip, oba eby’okupakinga eby’omulembe. | Okukwatagana kw’Entambula y’Enkuŋŋaana Ebiseera ebisinga okwekenneenya awali omutendera gw’okusiba die gulina okuyungibwa n’okukuŋŋaanya okw’enjawulo, okuyungibwa, ekyuma ky’amaanyi, oba emirimu gy’okupakinga egy’omulembe. |
| Okwekenenya obwannannyini n’obuwagizi Bbeeyi y’okugula yokka tennyonnyola ssente ntuufu ezisaasaanyizibwa mu kukola kwa die bonder ekozesebwa oba erongooseddwa. | Weekenneenye Obuwagizi bwa Installed-Base Kebera okuyingira kwa sipeeya, embeera ya pulogulaamu ne controller, ebyafaayo by’okupima, ebiwandiiko ebiriwo, n’obuwanvu bw’okuddaabiriza. | Weekenneenye Obuwagizi obukwata ku nkola Kebera ebikozesebwa ebiriwo, okumanya okukozesa, ebikozesebwa ebyetaagisa, ebyetaago by’ebisaanyizo by’enkola, n’obusobozi bw’okuddamu empeereza. | Weekenneenye Obuwagizi bwa Tekinologiya-Eby’enjawulo Kebera oba ebikozesebwa ebikwatagana eby’okukozesa, okumanya enkola, sipeeya, n’obuyambi bwa yinginiya bisigala nga biriwo ku kkubo erigendereddwa. |
| Ekisinga Okugula Okugula Laba embeera efuula omukutu okwesigika mu by’obusuubuzi n’eby’ekikugu ku pulojekiti yo. | Obwetaavu bw’okufulumya obukwatagana obutebenkevu Esaanira okulowoozebwako nga ensengeka y’ekyuma ekwatagana nnyo n’enkola ya die attach etandikiddwawo n’okugenda mu maaso kw’okufulumya kye kikulembeza. | Ekyetaagisa mu nkola egazi Esaanira okulowoozebwako nga okukulaakulanya package oba ebyetaago by’okufulumya biwa obujulizi ku platform n’ekyetaagisa die attach technology range. | Ekyetaagisa Ekitongole eky’Okukuŋŋaanya Esaanira okulowoozebwako ng’okukozesa okugendereddwamu kukwatagana bulungi n’ekyuma ekikwata ku die, okupakinga okw’omulembe, oba obusobozi bw’okukuŋŋaanya amaanyi. |
Okusalawo okusinga amaanyi mu kulonda kutera okukolebwa oluvannyuma lw’okukakasa okukuba ekifaananyi ky’ekipapula, ebipimo by’ekifa, ebintu ebisiba, UPH egenderere, okugumiikiriza okuteeka, obwetaavu bw’okukola otoma, n’embeera yennyini ey’ekyuma ekiweebwa.
Lambulula oba pulojekiti yeetaaga epoxy die attach, solder attach, flip-chip placement, thermo-compression bonding, oba enkola endala ey’okukuŋŋaanya.
Gyaanyisa ekyuma ne sayizi ya die entuufu, ensengeka ya substrate, okutambula kw’ebintu, ekigendererwa ky’enzirukanya, ekyetaagisa mu kukebera, n’enkola y’emirimu gy’omukozi.
Ku byuma ebikozesebwa oba ebiddaabiriziddwa, kakasa ebiwandiiko by’empeereza, embeera y’ebitundu, obuwanvu bw’okupima, ebivudde mu kugezesebwa, ebikozesebwa ebiriwo, n’obuyambi bw’okussaako.
Ttiimu za yinginiya n’okugula zirina okugeraageranya ebyuma ebisiba die okusinziira ku kkubo lyennyini ery’enkola, okuzimba ekipapula, enkola y’okulaga die, ebintu ebisiba, okugumiikiriza okuteeka, ebifulumizibwa mu bigendererwa, n’okuweereza ensengeka eweereddwa okusinga erinnya ly’omukozi lyokka.
Ensengeka ya ASM AD838 oba AD838L etera okwekebejjebwa ku mirimu gya die attach egyateekebwawo nga okugenda mu maaso kw’enkola, ebikozesebwa ebikwatagana, n’omutindo gw’okufulumya oguddibwamu bikulu. Enkola za BESI zirina okwekenneenya okusinziira ku tekinologiya eyeetaagisa ow’okusiba ku die, gamba nga epoxy attach, soft solder, okukwata chip eziwera, flip-chip, oba enkola y’emirimu ey’okupakinga ey’omulembe. Ebyuma bya K&S birina okwekebejjebwa okusinziira ku kkubo eryetongodde ery’okukuŋŋaanya, naddala nga ensengeka z’okupakinga ez’omulembe, okukuŋŋaanya amaanyi, okusiba clip, oba legacy die attach configurations zeenyigiddemu.
Okugerageranya okulabika kulaga ebitundu ebitera okwetaaga okwekenneenya okw’ekikugu okw’okumpi: okugenda mu maaso kw’okufulumya, enkola y’emirimu, ebyetaago by’okupakinga eby’omulembe, okukyukakyuka mu nsengeka, n’okwetegekera obuyambi oluvannyuma lw’okussaako. Okusaanira okusembayo kwesigama ku nnyiriri z’ekyuma ekituufu, ekipapula ky’ebikozesebwa, ebivudde mu bisaanyizo by’enkola, n’embeera ya yuniti eweereddwa.
Ekipande kigendereddwamu okuzuula ebitundu by’okwekenneenya ebirina okufuna okwekenneenya okusinga nga tonnalonda nsengeka ya ASM AD838, BESI, oba K&S eyeetongodde.
Maapu erabika erina okuwagira okwekenneenya ebyuma ebitegekeddwa, so si kudda mu kifo ky’okukakasa enkola oba okukakasa yinginiya ku ddaala ly’okusengeka.
Weekenneenye oba ensengeka eteeseddwa ekwatagana n’okutambula kw’okuyunga ku die okuliwo, enkola z’emirimu ezimanyiddwa, ebikozesebwa ebiteekeddwamu, sipeeya aliwo, n’ebikozesebwa ebimanyiddwa eby’obuyambi.
Kakasa oba ebyuma bisobola okuwagira enkola eyetaagisa ey’okugattako, ensibuko y’okufa, ensengeka ya substrate, ebintu ebisiba, dizayini y’ekipapula, n’ekkubo erigendereddwamu okufulumya.
Salawo oba pulojekiti yeetaaga okuteeka mu butuufu obw’amaanyi, okukuŋŋaanya chip nnyingi, okukwatagana kwa flip-chip, okusiba thermo-compression, okusiba hybrid, oba enkola endala ey’okupakinga ey’omulembe.
Kakasa obusobozi bw’omutwe gwa bond, eby’okulonda eby’okulaba, enkwata ya wafer oba tray, enkola y’okugaba, ebyetaago by’enkola y’ebbugumu, okubeerawo kw’ebikozesebwa, n’enkolagana z’otomatiki.
Ku byuma ebikozesebwa oba ebiddaabiriziddwa, okwekenneenya ebiwandiiko by’okupima, embeera y’omufuzi, ebyafaayo by’empeereza, okuyingira mu sipeeya, obuwanvu bw’okuddaabiriza, ebikozesebwa mu nkola, n’obuyambi bw’okussaako.
Enjawulo enkulu mu yinginiya si ya linnya lya kika oba emiwendo gy’okuteekebwa mu bifo egyafulumiziddwa. Y’engeri ensengeka y’ekyuma entongole gy’ekola mu kkubo erigendereddwamu ery’okuyunga ku die, omuli okulaga die, okukwata substrate, okusiba ebintu, enkola y’okulaba, embeera y’ebikozesebwa, enkola y’ebbugumu, n’obwetaavu bw’enzirukanya y’okufulumya.
Platform eyinza okuba nga mu by’ekikugu esobola enkola ku lupapula naye nga ekyali tesaanira singa ensengeka ewereddwa terimu mutwe gwa bond ogwetaagisa, enkola y’okukwata wafer, ensengeka y’okugaba, okuliisa ebintu, omulimu gw’okukebera, oba ebikozesebwa mu kukola.
Okugeraageranya okusinga okuba okw’omugaso kukolebwa oluvannyuma lw’okukakasa okukuba ekifaananyi ky’ekipapula, ebipimo by’ekifa, ebintu ebigattibwako, okugumiikiriza okuteekebwa, UPH egenderere, okutambula kw’ebintu, n’obuyambi obw’ekikugu obuliwo ku yuniti entuufu eyeekenneenyezebwa.
Ennyonyi ekika kya ASM AD838 obaAD838Lensengeka okutwalira awamu yeekenneenyezebwa nga okutambula kw’okukwata ku die okugendereddwamu kuyinza okukwatagana n’okukwata ebintu ebiteekeddwawo, omutwe gwa bond, vision package, substrate format, n’ebikozesebwa ebiriwo.
Okukwatagana okusinga amaanyi kutera okusangibwa nga okugenda mu maaso kw’okufulumya kwe kukulu: enkola z’emirimu eziteereddwawo, sipeeya akwatagana, enkola ezimanyiddwa, enkola ezimanyiddwa, obuyambi bw’okupima obuliwo, n’ekifo ekituufu eky’okuddaabiriza yuniti eweereddwa.
Ebikozesebwa mu kyumaerina okwekenneenyezebwa ku mutendera gw’amaka g’ebintu kubanga ekifo kyayo eky’okuyunga ku die kikwata ku ndagiriro z’enkola ez’enjawulo, omuli epoxy die attach, soft solder, multi-chip assembly, flip chip, thermo-compression bonding, ne hybrid bonding platforms.
Ekibuuzo kya yinginiya kiri nti oba ekifo ekiteeseddwa kyakolebwa ku nsengeka y’ekipapula eyeetaagisa n’ekkubo ly’enkola, okusinga oba erinnya lya BESI lyokka likiikirira okukyusa obutereevu ku die bonder eriwo.
Ebyuma bya K&Serina okwekebejjebwa okusinziira ku kkubo eryetongodde ery’okukuŋŋaanya semikondokita eririmu. Okusinziira ku musingi, okwekenneenya kuyinza okwekuusa ku die attach, clip attach, thermo-compression bonding, okupakinga okw’omulembe, okukuŋŋaanya power-device, oba legacy installed configuration.
Kikulu okukakasa oba ekyuma kino kigendereddwamu nkola y’emu ey’okusiba ne layini y’okufulumya egenderere. Enkola ekoleddwa okwetoloola ekkubo ery’enjawulo ery’okuyunga oba okukuŋŋaanya amasannyalaze tesaana kugeraageranyizibwa mu ngeri ya otomatiki n’ensengeka ya die attach eya bulijjo.
Enkola z’okupakinga semiconductor zirina okugabanyizibwamu okusinziira ku nkola y’okusiba n’okuzimba okupakinga okusinga okusinziira ku kabonero akalaga ekika ekya bulijjo. Famire y’ebintu y’emu eyinza okutegekebwa mu ngeri ey’enjawulo ku epoxy attach, solder attach, flip-chip placement, multi-chip assembly, power-device packaging, oba enkola ez’enjawulo ez’okuyunga.
Ekyuma kisaana okutwalibwa ng’ekisaanira oluvannyuma lw’enkola yaakyo ey’okukwata, ebikozesebwa, enkola y’okusiba, obusobozi bw’okuteeka, okutambula kw’ebintu, n’embeera y’okuwagira okukakasibwa okusinziira ku nteekateeka y’okufulumya egenderere.
Esaanira enkola gy’ekozesa omutendera gw’okusiba die ogukakasibwa era ekikulu kwe kukuuma ebifulumizibwa ebinywevu n’okukwata die okukwatagana, okukwata substrate, okufuga enkola y’okusiiga oba solder, n’enkola z’okukola eziddibwamu.
Ensengeka ya AD838 eyinza okuba entuufu nga ebyokulonda byayo ebiteekeddwamu bikwatagana nnyo n'ekkubo ly'okufulumya eririwo era ebikozesebwa ebiriwo bisobola okuwagira ensengeka y'ekipapula eyeetaagisa.
Okukuŋŋaanya ekyuma ky’amaanyi kitera okwetaagisa okwekenneenya ennyo sayizi ya die, ebintu ebikwatagana, ebyetaago by’ebbugumu, ensengeka ya leadframe oba substrate, n’enneeyisa y’ebyuma ey’ekipapula ekisembayo.
Enkola ezikoleddwa ku soft solder, conductive adhesive, clip attach, oba enkola endala ez’amaanyi-package zirina okugeraageranyizibwa ku package entuufu n’ekkubo ly’ebbugumu eryetaagisa.
Okukozesa kuno kwetaaga okusinga ku basic die placement. Okwekenenya kuyinza okuli okulungamya die, ensengeka y’okukuba oba okuyunga, obutuufu bw’okukwatagana wansi w’embeera z’okufulumya, okuwunyiriza kwa substrate, okukwata flux oba adhesive, n’ebyetaago by’okukebera.
Amaka g’ebintu bya BESI ne K&S gayinza okubeeramu emikutu egyekuusa ku makubo ng’ago, naye ensengeka y’enkola entuufu erina okukakasibwa nga tebannaba kugeraageranya.
Enkola ezirimu okuyungibwa kw’ebbugumu-okunyigirizibwa, okuyungibwa okw’omugatte, okuyungibwa kwa density enkulu, okufa okutumbidde, oba modulo ezitali zimu ezitali zimu zeetaaga okwekenneenya enkola eyeetongodde okusinga okugeraageranya obutereevu n’okusiba okufa okwa bulijjo.
Okusalawo kulina okulowooza ku ddirisa ly’enkola mu bujjuvu, ekifaananyi ky’ebbugumu, ebanga ly’amaanyi g’okusiba, okuteekateeka ebintu, okupima, ekiruubirirwa ky’amakungula, n’enteekateeka y’okuyamba yinginiya.
Die bonder entuufu kye kyuma ekisobola okumaliriza enkola egenderere obutakyukakyuka mu ddirisa ly’okufulumya eryetaagisa, ate nga kisigala nga kiwanirirwa oluvannyuma lw’okuteekebwa. Okugeraageranya ekika kya mugaso oluvannyuma lw’ekkubo ery’ekikugu okunnyonnyolwa.
Kakasa oba pulojekiti yeetaaga epoxy attach, eutectic oba soft-solder attach, conductive adhesive, flip-chip okuteeka, thermo-compression bonding, clip attach, oba enkola endala ey’enjawulo ey’okukuŋŋaanya.
Kakasa ebipimo bya die, obuwanvu bwa die, wafer oba tray presentation, substrate oba leadframe format, strip indexing, ekkubo ly’okutambuza ebintu, n’obwetaavu bw’okugaba, okubugumya, okuwonya, oba okukebera.
Weekenneenye omutwe gwennyini ogwa bond, vision package, handling modules, tooling, thermal process, automation interface, embeera ya software, n’enkola eziriwo ku nkola ewereddwa.
Geraageranya ebisuubirwa ebifulumizibwa, obwetaavu bw’okukyusa, obwetaavu bw’okuddaabiriza, okutuuka ku sipeeya, obuwanvu bw’okupima, okubikka ku mpeereza, omulimu gw’ebisaanyizo, n’omuwendo gwonna ogw’obwannannyini.
Lowooza ku nsengeka ya ASM AD838 ng’ekwatagana nnyo n’enkola y’okuyunga ku die etandikiddwawo era okugenda mu maaso kw’okufulumya kye kikulembeza. Lowooza ku musingi gwa BESI nga package eyeetaagisa n’ekkubo ly’okugattako bikwatagana n’amaka ga tekinologiya ag’enjawulo agatunuuliddwa. Lowooza ku K&S platform nga ensengeka y’ebyuma entuufu ewagira die attach egenderere, okupakinga okw’omulembe, clip attach, thermo-compression, oba enkola y’okukuŋŋaanya ekwatagana nayo.
Ekyuma ekisobola mu by’ekikugu kikyayinza okufuuka okugula okutasaana nga ensengeka eweereddwa, ebikozesebwa mu nkola, embeera y’ekyuma, oba obuyambi obuliwo tebikwatagana na kyetaagisa ky’okufulumya ekigendererwa.
Emiwendo gy’okuteekebwa, okusaba kw’obudde bw’enzirukanya, n’enkalala z’ebipapula eziwagirwa zirina okwekenneenyezebwa wansi w’obunene bwennyini obw’okufa, embeera y’ebintu, ekika kya substrate, eddirisa ly’enkola, n’ekiruubirirwa ky’okufulumya ekyetaagisa pulojekiti.
Ebyuma bibiri okuva mu bakola eby’enjawulo biyinza okukola amakubo ag’enjawulo ag’okukuŋŋaanya ne bwe kiba nti byombi byogerwako ng’ebyuma ebisiba die. Okukyusa obutereevu kulina okulowoozebwako oluvannyuma lw’okukakasa enkola n’ensengeka.
Ku byuma ebikozesebwa oba ebiddaabiriziddwa, embeera y’ebifuga, bamakanika, modulo z’okulaba, emmere, emitwe gya bond, enkola z’obukuumi, ebiwandiiko by’okupima, ne sipeeya aliwo eyinza okuba enkulu nga dizayini ya pulatifomu eyasooka.
Nga tonnasindika, kakasa ebikozesebwa ebiriwo, ebikozesebwa mu sampuli, enkola y’okugezesa, emisingi gy’okukkiriza, ekyetaagisa okugiteeka, ebyetaago by’amasannyalaze n’ebikozesebwa, n’obunene bw’obuyambi obw’ekikugu oluvannyuma lw’okutandika okukola.
Ebibuuzo bino wammanga bikwata ku nsonga ez’omugaso ezitera okwetaaga okunnyonnyolwa nga tetunnageraageranya nsengekera za semikondokita ez’enjawulo ez’okukwatagana.
Nga ebyuma ebituufu bigendereddwamu enkola y’okugattako n’ekika ky’ekipapula kye kimu. Okugeraageranya kulina okubeeramu sayizi ya die, ensengeka ya substrate, ebintu ebisiba, enkola y’okukwata, ekyetaagisa okuteeka, omutindo gw’okukola otoma, ebikozesebwa, n’embeera ya yuniti eweereddwa.
Nedda.Okusaanira kisinziira ku nsengeka etekeddwa, omuli omutwe gwa bond, enkwata y’ebintu, ensengeka ya substrate, vision setup, tooling, process option, n’ebyetaago bya line y’okufulumya egenderere.
Kakasa ensengeka entuufu, ensengeka y’ebintu ebiwagirwa, ensibuko y’okufa, embeera y’omutwe gwa bond, enkola y’okulaba, modulo za otomatiki, ebikozesebwa ebiriwo, embeera y’okupima, okuyingira mu sipeeya, n’obuwanvu bw’okuddaabiriza.
Nedda BESI erina famire z’ebyuma ez’enjawulo ku makubo ag’enjawulo aga die attach n’okupakinga. Platform entongole erina okukwatagana n’enkola eyeetaagisa, gamba nga epoxy attach, soft solder, flip chip, multi-chip assembly, thermo-compression, oba hybrid bonding.
Kakasa ekkubo ly’okukuŋŋaanya erigendereddwamu n’ensengeka y’ekyuma. Okusinziira ku pulatifomu, enkola ekwatagana eyinza okuzingiramu okusiba die, okukwata clip, okusiba thermo-compression, okukuŋŋaanya ekyuma ky’amaanyi, okupakinga okw’omulembe, oba enkola ey’edda essiddwawo.
Tewali n’emu ku zombi tesaana kwekenneenyezebwa yokka. Okugumiikiriza okwetaagisa okuteeka kulina okutuukibwako obutakyukakyuka mu kiseera ky’enzirukanya ekigendereddwa, embeera y’okufa, embeera ya substrate, ebintu ebikwatagana, n’eddaala ly’ebifulumizibwa mu kukola.
Obulabe obusinga obunene bwe butakwatagana mu nkola nga bugatta wamu n’okwetegekera obuwagizi obutajjuvu. Ekyuma kiyinza okulabika ng’ekisaanira okutuusa ng’ebikozesebwa ebibula, pulogulaamu ezitawagirwa, ebitundu by’ebyuma ebyambala, sipeeya ataliiwo, oba ebiwandiiko by’okupima ebitali bijjuvu bikosa okuteekebwa n’ebisaanyizo.
Waayo okukuba ekifaananyi ky’ekipapula, ebipimo by’okufa, obuwanvu bw’ekifa, okugattako ebintu, enkola ya substrate oba leadframe, target UPH, okugumiikiriza okuteeka, ebikozesebwa ebiriwo, ekyetaagisa mu otomatiki, n’ebiziyiza byonna ebiriwo mu bikozesebwa oba enkola.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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