What is a BESI die bonding machine?

A BESI die bonding machine is semiconductor assembly equipment used for die attach and related packaging workflows. Depending on the platform and configuration, it may be evaluated for multi-chip assembly, standard die bonding, soft solder bonding, flip chip or more specialized advanced packaging routes.

Is a die bonder different from a die bonding machine?

In most procurement and engineering discussions, die bonder and die bonding machine describe the same equipment category. The more important distinction is the actual process configuration, such as bond head type, material route, handling system, tooling and inspection capability.

What is the difference between BESI DATACON and Esec equipment?

DATACON and Esec platforms address different die attach and assembly routes. DATACON is commonly reviewed for configurable multi-module attach and selected advanced workflows, while Esec is commonly reviewed for established die bonding, soft solder and production-oriented assembly routes. Final suitability depends on the specific machine configuration.

Which BESI platform should be evaluated for multi-chip die attach?

A configurable Multi Module Attach route is commonly the starting point for multi-chip die attach evaluation. The proposed machine still needs to be checked for die sequence, tooling, handling modules, bond head arrangement, vision package and material process requirements.

Which BESI machine route is relevant for soft solder die bonding?

Soft solder die bonding should be evaluated against equipment designed for the required thermal and material process. Review bond force, heating capability, thermal tooling, substrate handling, material presentation, production target and the exact installed machine configuration.

Can a BESI DATACON machine be used for flip chip workflows?

Some DATACON configurations are evaluated for selected flip chip processes. The offered machine must be checked for pick-and-place tools, flipping method, fluxing or dipping route, vision alignment, wafer and substrate handling, inspection functions and package-specific tooling.

What should be checked before buying a used BESI die bonder?

Confirm the exact model, serial-number configuration, bond head, force range, vision system, handling modules, tooling package, controller condition, software options, calibration status, available spare parts, functional test information and installation support scope.

What information is needed before selecting a BESI die bonding machine?

Prepare the package drawing, die dimensions, die thickness, bonding material, wafer or tray format, substrate type, target output, placement requirement, thermal process conditions, tooling availability and any existing production-line constraints.

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Ku lifaaq Qaab-dhismeedka Go'aanka ee Semiconductor Die

Sida Loo Doorto Mashiinka Xidhmada Dhinta ee BESI: Tilmaamaha Go'aanka DATACON vs Esec

Mashiinnada isku xidhka BESI waxay taageeri karaan dariiqyo kala duwan oo isku-dubaridka semiconductor-ka, laga bilaabo qalabka lagu dhejiyo diabetar badan oo la habeyn karo ilaa qalabka lagu xidho wax soo saarka, hababka kulaylka iyo codsiyada jajabka rogrogmada ee la xushay. Meesha saxda ah ee laga bilaabayo waa shuruudaha habka, ee maaha magaca mashiinka oo keliya.

Isbarbardhig waxtar leh oo u dhexeeya mashiinka BESI DATACON iyo madal Esec waa inay tixgelisaa naqshadeynta baakadaha, cabbirrada dhimaha, walxaha isku xidhka, qaabka substrate-ka, habka maaraynta, wax-soo-saarka bartilmaameedka, qalabka habka iyo habaynta dhabta ah ee qalabka la bixiyo.

La-tashi Online ah Codso Dib-u-eegis Xulasho

Diyaari sawirka baakadka, cabbirka meydka, wadada agabka, qaabka substrate-ka, bartilmaameedka wax soo saarka iyo wixii faahfaahin ah ee qalabka jira ka hor inta aadan barbar dhigin habaynta mashiinka.

Guddiga Go'aanka Xulashada

Saddex Su'aalood oo Yareeya Raadinta Madal

01
Maxaa lagu lifaaqayaa? Nooca qalabka, dhismaha baakadaha, substrate-ka ama qaab-dhismeedka birta iyo walxaha isku xidhka ayaa qeexaya xadka qalabka ugu horreeya.
02
Sidee bay tahay in agabku u dhaqaaqo? Wafer, saxaarad, side, xarig, doon, Gel-Pak® iyo shuruudaha qalabka ayaa qeexaya ku habboonaanta qaabaynta wax ku oolka ah.
03
Maxaa la xaqiijinayaa ka hor inta aan la sii dayn? Shuruudaha meelaynta, waddada kormeerka, isbeddelka, UPH bartilmaameedka, baaxadda taageerada iyo habka u-qalmitaanka ayaa qaabeeya go'aanka kama dambaysta ah.

Macnaha Mashiinka Xidhmada ee BESI

Ha ula dhaqmin DATACON iyo Esec sidii beddel toos ah oo loogu talagalay sida kuwa kale.

Madal-hawleedka BESI DATACON iyo Esec waxay ku jiraan nidaam dhismeed ballaaran oo qalabka lagu xiro. Doorkooda wax ku oolka ah ayaa isbeddela iyadoo la adeegsanayo qalabka habka la rakibay, naqshadda madaxa xidhmada, xirmada aragtida, qaybaha maaraynta iyo socodka shaqada wax soo saarka.

DATACON badanaa waa meel laga bilaabo oo khuseeya halkaas oo mashruucu u baahan yahay lifaaq badan oo la habeyn karo, taxane badan oo jajab ah, qalab gaar ah oo codsi ah ama dariiqyo jajab rogaal ah oo la xushay. Esec waxay noqon kartaa meel laga bilaabo oo habboon halkaas oo geeddi-socodku ku dhisan yahay isku-xidhka meydka ee la soo celin karo, socodka walxaha la aasaasay ama shuruudaha otomaatiga wax soo saarka.

Mabda'a xulashada

Dooro jidka habka marka hore. Kadib hubi in mashiinka DATACON ee la soo jeediyay ama Esec uu yahayxidhitaankawaxay leedahay madaxa xidhmada loo baahan yahay, diyaarinta agabka, aragtida, maaraynta, qalabka iyo habaynta software-ka.

01

Magaca madalku maaha qeexitaanka dhammaystiran

Laba mashiin oo ka kala socda isla qoyska ayaa si weyn ugu kala duwanaan kara xoogga curaarta, habaynta maaraynta, muraayadaha indhaha, xirmada qalabka, soo saarista kontaroolada iyo hawlaha habka ee la awoodsiiyay.
02

Awoodda la daabacay waa bar bilow oo keliya

Ku habboonaanta kama dambaysta ah waxay ku xiran tahay cutubka saxda ah ee la bixiyo, agabka habka, qaabka qalabka, shuruudaha u-qalmitaanka iyo agabka wax soo saarka ee la heli karo.
03

Diyaargarowga qalabka la isticmaalay waa in si gaar ah loo eegaa

Xaaladda mashiinka, xaaladda hagaajinta, helitaanka qalabka, soo kabashada software-ka, qaybaha dayactirka iyo baaxadda taageerada ayaa beddeli kara qiimaha goob kale oo ku habboon.

Wadooyinka Go'aanka Madal

DATACON vs Esec: Laba Qodob oo Bilaabasho oo Kala Duwan oo loogu talagalay Mashruucyada Die Attach

Isbarbardhigga waxtarka leh maaha madalkee ka wanaagsan guud ahaan. Su'aasha waxtarka leh ayaa ah wadada u badan inay la jaanqaado habka loogu talagalay, qaab-dhismeedka baakadaha, maaraynta agabka iyo ujeeddada wax soo saarka.

Tan u isticmaal shaandhada koowaad.

Qaabeynta saxda ah ee mashiinka, xulashooyinka la rakibay, qalabka habka loo farsameeyo, qalabka iyo xaqiijinta codsiga ayaa lagama maarmaan ah ka hor inta aan la dooran qalabka.

Wadada Bilaabidda DATACON

Ku lifaaqa Module-ka Badan ee la habeyn karo iyo Habraacyada Shaqada ee Gaarka ah ee Codsiga

Goobaha DATACON waxaa badanaa lagu qiimeeyaa meesha geeddi-socodku u baahan yahay dabacsanaan qaabeyn ballaaran, maaraynta jajabyo badan, agabyo gaar ah ama taxane ka baxsan wareegga meelaynta ee soo noqnoqda ee fudud.

Ku xidhmo badan oo jajab ah iyo dariiqyo isku-dubarid ah oo la habeyn karo
Madaxyada xidhmooyinka gaarka ah ee codsiga, qalabka iyo qaybaha agabka
Qiimaynaha baakadaha ee la xushay iyo kuwa horumarsan
Mashruucyada ay tahay in si dhow loola socdo maaraynta wafer-ka, side-qaadaha, saxaaradda ama substrate-ka

Xaqiiji ka hor inta aan la soo xulin liiska musharixiinta

Habaynta madaxa xidhka, qalabka beddelka, dejinta qaybinta ama qulqulka, xirmada kamarada, qaybaha maaraynta, xaaladda kontaroolaha iyo qalabka ku jira.

Wadada Bilaabidda Esec

Xidhitaanka Dhirta ee La Aasaasay, Otomaatigga Wax Soo Saarka iyo Ku Celinta Habka

Goobaha Esec waxaa badanaa lagu qiimeeyaa halka wadada wax soo saarku ay ku xiran tahay qalabka lagu dhejiyo ee la soo celin karo, socodka walxaha la qeexay, isku-dhafka khadadka iyo hawlgallada isu-imaatinka semiconductor-ka ee deggan.

Xidhmada caadiga ah ee dhimaha iyo dariiqyada isu-imaatinka ee ku salaysan wax-soo-saarka
Qalabka Epoxy, alxanka jilicsan iyo shuruudaha habka kulaylka ee la xiriira
Socodka walxaha ku salaysan leadframe, strip, substrate ama side-ku-saleysan
Xasiloonida habka mugga sare leh iyo shuruudaha otomaatiga ee la qeexay

Xaqiiji ka hor inta aan la soo xulin liiska musharixiinta

Qaabka Die iyo substrate-ka, walxaha isku xidhka, shuruudaha kulaylka, wadada maaraynta, qaabaynta aragtida, qalabka habka, diyaarsanaanta taageerada software-ka iyo wax soo saarka.

Hagaha Jidka Geedi socodka

Ku habboon Mashiinka Wadada Ku lifaaqan ee Die

Ku bilow habka jireed. Tani waxay ka hortageysaa inaad doorato bonder BESI ah oo ku salaysan oo keliya magaca summada la yaqaan, sawirka badeecada guud ama sawirka booska cinwaanka.

Dib u eeg silsiladda oo dhan.

Qaadashada qalabka, diyaarinta agabka, meelaynta, isku xidhka, kormeerka, soo kabashada iyo maaraynta hoos u dhaca dhammaantood waxay saameeyaan go'aanka qalabka wax ku oolka ah.

Ku lifaaq Module badan

Isticmaal wadadan marka qalabka diet attach uu u baahan yahay habayn habaysan oo dabacsan, maaraynta jajabyo badan, qalab badan, qalab gaar ah ama taxane isku-dhafan oo ka baxsan wareegga meelaynta ee soo noqnoqda.

Chip badan Dabacsanaanta Qalabka Modules-ka Hab-raaca

Isku-xidhka Die-ga Caadiga ah

Isticmaal wadadan marka geeddi-socodku uu ku xiran yahay qalabka lagu dhejiyo ee la soo celin karo oo leh qulqulka walxaha la qeexay, shuruudaha maaraynta deggan iyo bartilmaameedka wax soo saarka oo ku xiran otomaatiga la xakameeyey.

Ku lifaaq Epoxy Qaab-dhismeedka Leadframe / Substrate Socodka Wax Soo Saarka

Xidhmada Jilicsan ee Alxanka Die

Isticmaal wadadan marka naqshadeynta baakadaha iyo shuruudaha habka ay soo bandhigaan tixgelinta maaraynta kulaylka, maaraynta alxanka, kuleylinta la xakameeyey ama isu-imaatinka korontada-nuqulka.

Qalabka Korontada Xakamaynta Kulaylka Waddada Agabka

Isku-xidhka Chip-ka Flip

Isticmaal wadadan marka la isku dhejiyo meelaynta matoorka, rogrogidda, rogrogidda ama quusidda, isku-dubaridka jajab-ilaa-substrate, kormeerka dammaanadda kadib iyo maaraynta side-gaari gaar ah oo qeexaysa codsiga.

Jabka rogrogmada Iswaafajinta Aragga Dareeraha / Quusitaanka

Wadooyinka Isku-xirka Sare

Isticmaal wadadan marka xirmadu u baahan tahay habab gaar ah oo isku xidh ah, xakamaynta side-ka, metrology, qaab-dhismeedka isku xidhka sare ama xaaladaha u-qalmitaanka ee ka baxsan lifaaqa caadiga ah ee diet.

Cadaadiska Heerkulka Isku-xidhka Isku-dhafan Baakad Sare

Hab-raaca Shaqada Xulashada Lixda Tallaabo ah

Sida Loo Yareeyo Qaabeynta Mashiinka Xidhmada Dhiman ee BESI

Isticmaal isku xigxiga go'aan qaadashada haddii aad dib u eegayso mashiinka DATACON, bonder Esec ah ama cutub beddelka la isticmaalay ee khadka wax soo saarka semiconductor-ka ee jira.

Qeex Baakadda iyo Xidhmada

Xaqiiji cabbirka meydka, dhumucda, xaaladda dambe, qaab-dhismeedka baakadka, qaab-dhismeedka birta ama burooyinka, nooca substrate-ka iyo jihada meelaynta.

Xaqiiji Jidka Agabka

Aqoonso in habkani uu isticmaalayo epoxy, alxan, walxaha sinteriga ah, qulqulka, dhejiska, cadaadiska kulaylka ama hab kale oo diyaarinta walxaha ah.

Khariidadee Socodka Maareynta

Xaqiiji qaabka wafer-ka, saxaaradda, Gel-Pak®, side-ka, xarigga, doonta, qaab-dhismeedka lead, substrate-ka iyo shuruudaha dejinta ka hor intaadan dib u eegin qalabka.

Qalabka Habka Isku-habaynta

Dib u eeg madaxyada xidhmada, kala duwanaanshaha xoogga, nidaamka kamarada, iftiiminta, qaybaha qaybinta ama qulqulka, kuleyliyeyaasha, qalabka, tuubooyinka iyo qalabka.

Xaqiiji Wax Soo Saarka iyo Wax Soo Saarka

Qeex wax soo saarka, inta jeer ee isbeddelka, taxanaha kormeerka, maaraynta soo kabashada, shuruudaha ku celcelinta iyo habka xaqiijinta wax soo saarka.

Xaqiiji Diyaargarowga Lahaanshaha

Dib u eeg marin u helidda software-ka, xaaladda kontaroolaha, kaydka, qaybaha dayactirka, diiwaannada cabbiraadda, baaxadda taageerada iyo shuruudaha rakibidda.

Matrix-ka Iswaafajinta Injineernimada

Su'aalaha Laga Jawaabayo Kahor Inta Ansaxinta BESI Die Bonder

Shaxdani waxay taageertaa dib u eegista injineernimada iyo iibka. Waa in lagu dhammaystiraa iyadoo la eegayo qaabaynta gaarka ah ee mashiinka la bixinayo, oo aan ahayn oo keliya magaca qoyska ee goobta.

Xaqiijinta heerka mashiinka ayaa muhiim ah.

Qaabeynta taxanaha ah, modules-yada la rakibay, xirmada qalabka iyo xaaladda ayaa beddeli kara ku habboonaanta in ka badan booska guud ee madal.

Shuruudaha Xirmada iyo Dhimashada	Xaqiiji cabbirka meydka, dhumucda, habka soo qaadista, jilicsanaanta, qaab-dhismeedka birta ama birta, jihada, joomatari baakadka iyo xasilloonida substrate-ka.
Shuruudaha Walxaha iyo Kulaylka	Xaqiiji shuruudaha epoxy, alxanka, walxaha sinteriga ah, qulqulka, dhejiska, kuleylinta, qaboojinta, qalabka kulaylka iyo deegaanka habka.
Maareynta Wafer iyo Substrate-ka	Xaqiiji cabbirka wafer-ka, nooca jir-dhiska, saxaaradda, side-qaadaha, xarigga, doonta, qaab-dhismeedka hogaanka, cabbirrada substrate-ka, jihada rarista iyo taxanaha wareejinta.
Xakamaynta Meelaynta iyo Habka	Qeex natiijada X/Y/theta ee loo baahan yahay xaaladaha dhabta ah ee habka, oo ay ku jiraan qaabka joomatari ee dhiman, jawaabta walxaha, dhaqdhaqaaqa substrate-ka iyo muuqaalka wareegga bartilmaameedka.
Qalabka iyo Xirmada Qalabka	Hubi qalabka xidhmada, af-xidhka, qalabka wax lagu saaro, qalabka, tixraacyada cabbiraadda, quudiyeyaasha, saxamada, haystayaasha, qalabka side-ka iyo agabka gaarka u ah habka.
Shuruudaha Wax Soo Saarka iyo Kormeerka	Dib u eeg UPH bartilmaameedka ah, isku darka badeecadaha, isbeddelka, waddada kormeerka, maaraynta soo kabashada, raadraaca xogta, xakamaynta cuntada iyo shuruudaha aqbalaadda.
Xaaladda Qalabka La Isticmaalay	Xaqiiji farsamooyinka, dhaqdhaqaaqa, aragtida, kontaroolaha, software-ka, ikhtiyaarrada, dukumeentiyada, diiwaannada hagaajinta, marin u helidda qaybaha dheeraadka ah iyo baaxadda dib-u-habaynta.

Dib u Eegista Qalabka La Isticmaalay

Madal ku habboon BESI wali way ku guuldareysan kartaa Shahaadada haddii cutubka la bixiyay uusan dhammaystirnayn

Qalabka la isticmaalay ama la dayactiray, magaca mishiinku waa qayb ka mid ah go'aanka. Farqiga u dhexeeya qaabaynta, qalabka duugoobay, arrimaha kontaroolada, qaybaha kamaradaha maqan, agabka aan la heli karin ama software-ka aan dhammaystirnayn ayaa dib u dhigi kara rakibidda iyo u-qalmitaanka.

Dib u eegis gaagaaban oo qalabka ah waa inuu aqoonsadaa walxaha muhiimka u ah habka kahor inta aan la rarin oo uu qeexaa waxa la tijaabin doono, la hagaajin doono, la bixin doono ama la taageeri doono.

Akhriso Tilmaamaha Dib-u-habaynta iyo Kormeerka ee DATACON 2200 evo

Aqoonsiga

Xaqiiji qaabka saxda ah, macluumaadka taxanaha ah, soo saarista wax soo saarka iyo xulashooyinka la rakibay.

Makaanikada

Hubi dhaqdhaqaaqa marxaladda, madaxyada xidhmada, marin u socodka fiilooyinka, nidaamyada xoogga iyo qalabka badbaadada.

Aragtida

Hubi kamaradaha, muraayadaha indhaha, iftiinka, jawaabta isku-xidhka iyo xaaladda hagaajinta.

Qalabaynta

Xaqiiji af-xidhka, qalabka, qalabka wax lagu shubo, quudiyeyaasha, sideyaasha iyo agabka wax lagu farsameeyo.

Barnaamijka

Dib u eegista koontaroolaha, PC-ga, kaydinta, ikhtiyaarada la suurta galiyay, dukumeentiyada iyo warbaahinta soo kabashada.

Aqbalaadda

Qeex baaxadda FAT, muunadaha walxaha, xaaladaha tijaabada, sii deynta rarista iyo taageerada rakibidda.

Wadooyinka Qalabka ee la xiriira BESI

Ka Gudub Tilmaamaha Xulashada una Gudub Bogga Madal ee Khuseeya

Isticmaal xiriiriyeyaasha hoose si aad uga gudubto qaab-dhismeedka xulashada ballaaran una gudubto boggaga DATACON ee diiradda saaraya, jajabyada rogrogmada, dib-u-habaynta ama qalabka la heli karo.

Dulmar Guud oo ku saabsan Madal

BESI The Bonder Inventory

Ka baadho qalabka isku xidhka la xiriira BESI iyo bogagga hadda jira ee helitaanka mashiinka.

Eeg BESI Die Bonders

Ku lifaaq Module Badan

DATACON 2200 evo

Sahamin noocyada kala duwan ee DATACON 2200 evo, meelaha habaynta iyo qiimaynta habka badan ee jajabyada.

Sahamin DATACON 2200 evo

Wadada Jabsiga Jibka ah ee Flip

DATACON 8800 Platforms

Dib u eeg tilmaamaha DATACON 8800 FC QUANTUM iyo CHAMEO ee ku saabsan socodka shaqada ee jajabka.

Sahamin DATACON 8800

Mawduuca Farsamada

BIRTA Flip Chip Bonder

Dib u eeg kooxaha BESI ee rogrogmada jajabka, su'aalaha habka iyo goobaha hubinta habaynta.

Sahamin Goobaha Flip Chip-ka

Su'aalaha Xulashada

Su'aalaha Inta Badan La Isweydiiyo ee ku Saabsan Mashiinka Xidhmada Dhiman ee BESI

Su'aalahani waxay diiradda saarayaan iswaafajinta habka iyo dib u eegista habaynta mashiinka. Si ula kac ah ayay uga duwan yihiin kaydka alaabta, madal DATACON 2200 evo iyo bogagga gaarka u ah dib-u-habaynta.

Waa maxay mashiinka isku xidhka BESI?

Mashiinka isku xidhka qalabka BESI waa qalabka isu-imaatinka semiconductor-ka ee loo isticmaalo isku-xidhka qalabka iyo hawlaha baakadaha ee la xiriira. Iyada oo ku xidhan goobta iyo habaynta, waxaa laga yaabaa in lagu qiimeeyo isu-imaatinka jajabyada badan, isku-xidhka qalabka caadiga ah, isku-xidhka alxanka jilicsan, jajabka rogrogmada ama dariiqyada baakadaha ee horumarsan ee gaarka ah.

Ma mashiinka isku xidhka die ayaa ka duwan mashiinka isku xidhka die?

Inta badan doodaha wax iibsiga iyo injineernimada, mashiinka isku xidhka qalabka iyo qalabka isku xidhka qalabka ayaa qeexaya isla qaybta qalabka. Kala soocida ugu muhiimsan waa habaynta habka dhabta ah, sida nooca madaxa isku xidhka, wadada agabka, nidaamka maaraynta, qalabka iyo kartida kormeerka.

Waa maxay faraqa u dhexeeya qalabka BESI DATACON iyo Esec?

DATACON iyo Esec waxay wax ka qabtaan marinnada kala duwan ee isku xidhka iyo isu-imaatinka. DATACON waxaa badanaa dib loogu eegaa lifaaqyada badan ee la habeyn karo iyo socodka shaqada ee horumarsan ee la xushay, halka Esec badanaa dib loogu eego isku xidhka dhimaha ee la aasaasay, alxanka jilicsan iyo dariiqyada isu-imaatinka ee ku salaysan wax soo saarka. Ku habboonaanta kama dambaysta ah waxay ku xiran tahay habaynta mashiinka gaarka ah.

Madalkee BESI ah ayaa loo qiimeyn doonaa qalabka lagu dhejiyo qalabka badan ee jajabka ah?

Jidka lagu lifaaqo Module-ka badan ee la habeyn karo ayaa badanaa ah meesha laga bilaabayo qiimeynta qalabka lagu lifaaqo ee jajabyada badan. Mashiinka la soo jeediyay wali wuxuu u baahan yahay in la hubiyo taxanaha qalabka, qalabka lagu rakibo, qaybaha maaraynta, habaynta madaxa xidhmada, xirmada aragga iyo shuruudaha habka agabka.

Wadada mashiinka BESI kee ayaa khuseysa isku xirka qalabka jilicsan ee alxanka?

Isku-xidhka qalabka jilicsan ee alxanka waa in lagu qiimeeyaa qalabka loogu talagalay habka kulaylka iyo walxaha loo baahan yahay. Dib u eeg xoogga isku-xidhka, awoodda kulaylinta, qalabka kulaylka, maaraynta substrate-ka, soo bandhigidda walxaha, bartilmaameedka wax soo saarka iyo habaynta saxda ah ee mashiinka la rakibay.

Ma loo isticmaali karaa mashiinka BESI DATACON socodka shaqada ee jajabka?

Qaar ka mid ah habaynta DATACON waxaa lagu qiimeeyaa hababka jajabka rogrogmada ee la xushay. Mashiinka la bixiyay waa in laga hubiyaa qalabka soo-qaadista iyo meelaynta, habka rogrogmada, wadada rogrogmada ama quusitaanka, iswaafajinta aragga, maaraynta wafer iyo substrate-ka, hawlaha kormeerka iyo qalabka gaarka u ah baakadka.

Maxaa la hubinayaa ka hor inta aan la iibsan bonder-ka BESI ee la isticmaalay?

Xaqiiji qaabka saxda ah, qaabaynta lambarka taxanaha ah, madaxa xidhmada, baaxadda xoogga, nidaamka aragga, modules-ka maaraynta, xirmada qalabka, xaaladda kontaroolaha, ikhtiyaarrada software-ka, xaaladda hagaajinta, qaybaha dayactirka ee la heli karo, macluumaadka tijaabada shaqaynaysa iyo baaxadda taageerada rakibidda.

Macluumaad noocee ah ayaa loo baahan yahay ka hor inta aan la dooran mashiinka isku xidhka BESI?

Diyaari sawirka baakadka, cabbirka dhimaha, dhumucda dhimaha, walxaha isku xidhka, qaabka wafer ama saxaaradda, nooca substrate-ka, wax soo saarka bartilmaameedka, shuruudaha meelaynta, xaaladaha habka kulaylka, helitaanka qalabka iyo wixii caqabado ah ee jira ee khadka wax soo saarka.

Ma u baahan tahay Caawimo Yareynta Qaabeynta Mashiinka Xidhmada Dhiman ee BESI?

La wadaag sawirka baakadka, qaabka dahaarka iyo substrate-ka, wadada agabka, wax soo saarka bartilmaameedka, qalabka la heli karo iyo faahfaahinta mashiinka jira. Dib u eegis waxtar leh ayaa ka bilaabata xaaladaha dhabta ah ee habka halkii laga isticmaali lahaa magac guud oo madal ah.

La-tashi Online ah

Maxay dad badani u doorteen inay la shaqeeyaan GeekValue?

Summadayadu waxay ku faaftaa magaalo ilaa magaalo, dad aan tiro lahayna waxay i waydiiyeen, "Waa maxay GeekValue?" Waxay ka timid aragti fudud: in la xoojiyo hal-abuurka Shiinaha ee tignoolajiyada gees-goynta ah. Tani waa ruux calaamad u ah horumar joogto ah, oo ku qarsoon dabagalkayaga hagar la'aanta ah ee faahfaahinta iyo farxadda filashada xad dhaafka ah ee gaarsiinta kasta. Tani waxay ku dhowdahay farsamo-yaqaannimo iyo naf-hurid ma aha oo kaliya adkaysiga aasaasayaashayada, laakiin sidoo kale nuxurka iyo diirimaadka calaamadeena. Waxaan rajeyneynaa inaad halkan ka bilaabi doonto oo aad na siiso fursad aan ku abuurno kaamil. Aynu ka wada shaqayno si aynu u abuurno mucjisada soo socota ee "eber iin".

Tilmaan

La xidhiidh khabiirka iibka

La xidhiidh kooxdayada iibka si aad u sahamiso xalal habaysan oo si fiican u daboolaya baahiyahaaga ganacsi oo aad wax uga qabato wixii su'aalo ah ee aad qabtid.

Codsiga Iibka

Nala Soco

Nala xiriir si aad u ogaato wax cusub oo cusub, soo jeedinno gaar ah, iyo aragtiyo kor u qaadi doona ganacsigaaga heerka xiga.

Navigation degdeg ah

Geekvalue: Wuxuu u dhashay Mashiinnada Qaadista iyo Goobta

Hogaamiye xal-joog ah oo loogu talagalay rakibayaasha chip

Mashiinnada SMT iyo agab-qeybiye ahaan, Geekvalue waxa uu bixiyaa Mashiinno cusub oo SMT ah oo la isticmaalay iyo agabyo ka yimid magacyo magac leh oo qiimahoodu aad u tartan yahay.

NALA SOO XIRIIR

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