What is a BESI die bonding machine?

A BESI die bonding machine is semiconductor assembly equipment used for die attach and related packaging workflows. Depending on the platform and configuration, it may be evaluated for multi-chip assembly, standard die bonding, soft solder bonding, flip chip or more specialized advanced packaging routes.

Is a die bonder different from a die bonding machine?

In most procurement and engineering discussions, die bonder and die bonding machine describe the same equipment category. The more important distinction is the actual process configuration, such as bond head type, material route, handling system, tooling and inspection capability.

What is the difference between BESI DATACON and Esec equipment?

DATACON and Esec platforms address different die attach and assembly routes. DATACON is commonly reviewed for configurable multi-module attach and selected advanced workflows, while Esec is commonly reviewed for established die bonding, soft solder and production-oriented assembly routes. Final suitability depends on the specific machine configuration.

Which BESI platform should be evaluated for multi-chip die attach?

A configurable Multi Module Attach route is commonly the starting point for multi-chip die attach evaluation. The proposed machine still needs to be checked for die sequence, tooling, handling modules, bond head arrangement, vision package and material process requirements.

Which BESI machine route is relevant for soft solder die bonding?

Soft solder die bonding should be evaluated against equipment designed for the required thermal and material process. Review bond force, heating capability, thermal tooling, substrate handling, material presentation, production target and the exact installed machine configuration.

Can a BESI DATACON machine be used for flip chip workflows?

Some DATACON configurations are evaluated for selected flip chip processes. The offered machine must be checked for pick-and-place tools, flipping method, fluxing or dipping route, vision alignment, wafer and substrate handling, inspection functions and package-specific tooling.

What should be checked before buying a used BESI die bonder?

Confirm the exact model, serial-number configuration, bond head, force range, vision system, handling modules, tooling package, controller condition, software options, calibration status, available spare parts, functional test information and installation support scope.

What information is needed before selecting a BESI die bonding machine?

Prepare the package drawing, die dimensions, die thickness, bonding material, wafer or tray format, substrate type, target output, placement requirement, thermal process conditions, tooling availability and any existing production-line constraints.

i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa

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EKHAYA
Umatshini we-SMT
SMT uMlayishi/uMkhuhli SMT Docking Station SMT Stencil Printer SMT SPI SMT Mounter SMT Reflow Oven SMT AOI Umatshini wokusika wePCB Xhakaza kuMatshini SMT X-RAY SAKI AOI Machine
Amacandelo e-SMT
INtloko ye-SMT Ibhodi ye-SMT Iimoto ze-SMT I-SMT feeder Umbhobho we-SMT I-SMT Trolley Isihluzo se-SMT Ibhanti le-SMT Isilayidi se-SMT Amacandelo e-SMT amaninzi
Izixhobo zeSemiconductor
Isixhobo sokukhwelisa iWafer Isicoci sePlasma Sika kwaye Ubumbe Inkqubo ye-Electroplating ye-Semiconductor Umatshini wokuMakisha weLaser yeSemiconductor Isicoci seWafer Isixhobo sokugaya i-wafer Probe Station Isarha yokusika I-Bonder I-BESI The Bonder I-Flip Chip Bonder I-Wire Bonder Umatshini wokubumba Izibambo zovavanyo Umvavanyi weSemiconductor Umatshini weModyuli ye-AA ye-Optical Izincedisi zeSemiconductor
Umgca we-SMT
PCBA & PCBA
PCB PCBA
Indawo yeTekhnoloji
Izinto zokukhuphela izinto Utshintshiselwano lobuGcisa
SMT isiBulgaria
FAQ Amanqaku oBuchule be-SMT SMT Ukulungisa ividiyo Isikhokelo se-SMT Iindaba zeSemiconductor
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umsebenzi wenkampani Qhagamshelana nathi

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Isakhelo seSigqibo seSemiconductor Die Attach

Indlela yokukhetha umatshini we-BESI Die Bonding: Isikhokelo se-DATACON vs Esec Decision

Oomatshini bokubopha ii-die be-BESI banokuxhasa iindlela ezahlukeneyo zokuhlanganisa ii-semiconductor, ukusuka kwi-configurable multi-chip die attach ukuya kwi-production-oriented bonding, iinkqubo zobushushu kunye nezicelo ze-flip chip ezikhethiweyo. Indawo echanekileyo yokuqala yimfuno yenkqubo, hayi igama lomatshini lodwa.

Uthelekiso oluluncedo phakathi komatshini we-BESI DATACON kunye neqonga le-Esec kufuneka luqwalasele uyilo lwephakheji, ubungakanani bedayi, izinto zokubopha, ifomathi yesiseko, indlela yokuphatha, i-target throughput, izixhobo zenkqubo kunye noqwalaselo lokwenyani lwezixhobo ezibonelelwayo.

Ukubonisana kwi-Intanethi Cela uHlolo loKhetho

Lungisa umzobo wephakheji, ubungakanani bedayi, indlela yezinto ezisetyenzisiweyo, ifomathi yesiseko, ithagethi yemveliso kunye nazo naziphi na iinkcukacha zezixhobo ezikhoyo ngaphambi kokuthelekisa uqwalaselo lomatshini.

Iphaneli Yesigqibo Sokukhetha

Imibuzo Emithathu Ethintela Ukukhangela Kweqonga

01
Yintoni eqhotyoshelwayo? Uhlobo lwedaya, ulwakhiwo lwephakheji, isiseko okanye ifreyimu yentsimbi kunye nezinto zokubopha zichaza umda wokuqala wesixhobo.
02
Izinto ezisetyenzisiweyo mazihambe njani? I-wafer, itreyi, umthwali, umcu, isikhephe, i-Gel-Pak® kunye neemfuno zezixhobo zichaza ukulungelelaniswa okusebenzayo.
03
Yintoni ekufuneka iqinisekiswe ngaphambi kokuba ikhutshwe? Imfuneko yokubekwa, indlela yokuhlola, utshintsho, i-UPH ekujoliswe kuyo, ububanzi benkxaso kunye nendlela yokufaneleka zenza isigqibo sokugqibela.

Umxholo woMshini woBonding we-BESI Die

Musa Ukuphatha i-DATACON kunye ne-ESEC Njengeendlela Ezizenzekelayo Zokuthandana

Iiplatifomu ze-BESI DATACON kunye ne-Esec zikwinkqubo ebanzi yezixhobo zokudibanisa izixhobo. Indima yazo ebonakalayo iyatshintsha ngehardware yenkqubo efakiweyo, uyilo lweentloko zebhondi, iphakheji yombono, iimodyuli zokuphatha kunye nomsebenzi wokuvelisa.

I-DATACON idla ngokuba yindawo yokuqala efanelekileyo apho iprojekthi ifuna i-attach ye-multi-module enokulungiselelwa, ukulandelelana kwe-multi-chip, izixhobo ezithile zesicelo okanye iindlela ezikhethiweyo ze-flip chip. I-Esec inokuba yindawo yokuqala efanelekileyo apho inkqubo yakhelwe kwi-die bonding ephindaphindwayo, ukuhamba kwezinto ezimiselweyo okanye iimfuno ze-automation yemveliso.

Umgaqo wokukhetha

Khetha indlela yenkqubo kuqala. Emva koko qinisekisa ukuba umatshini we-DATACON ocetywayo okanye i-Esecibhondiinentloko yebhondi efunekayo, ukulungiswa kwezinto, umbono, ukuphathwa, izixhobo kunye noqwalaselo lwesoftware.

01

Igama leplatifomu alilolona candelo lipheleleyo

Oomatshini ababini abavela kusapho olunye banokwahluka kakhulu kwi-bond force, handling configuration, optics, tooling package, controller generation kunye nemisebenzi yenkqubo enikwe amandla.
02

Ubuchule bokupapashwa yindawo yokuqala kuphela

Ukufaneleka kokugqibela kuxhomekeke kwiyunithi enikezelwayo, izixhobo zenkqubo, ifomathi yesixhobo, iikhrayitheriya zokufaneleka kunye nezixhobo zemveliso ezikhoyo.
03

Ukulungela kwezixhobo ezisetyenzisiweyo kufuneka kuhlolwe ngokwahlukeneyo

Imeko yomatshini, imeko yokulinganisa, ukufumaneka kwezixhobo, ukubuyiswa kwesoftware, iindawo ezingasetyenziswayo kunye nobubanzi benkxaso kunokutshintsha ixabiso leqonga elifanelekileyo.

Iindlela zokuthatha izigqibo kwiQonga

I-DATACON vs i-Esec: Amanqaku amabini ahlukeneyo okuqala kwiiprojekthi ze-Die Attach

Uthelekiso oluluncedo alukuko ukuba leliphi iqonga elingcono kwihlabathi liphela. Umbuzo oluncedo kukuba yeyiphi indlela enokuthi ihambelane nenkqubo ekujoliswe kuyo, uyilo lweepakeji, ukuphathwa kwezinto kunye nenjongo yemveliso.

Sebenzisa oku njengesihluzo sokuqala.

Uqwalaselo oluchanekileyo lomatshini, iindlela ezifakiweyo, izixhobo zenkqubo, izixhobo kunye nokuqinisekiswa kwesicelo kusafuneka ngaphambi kokukhethwa kwezixhobo.

Indlela Yokuqalisa yeDATACON

Ukuncamathisela iiModule ezininzi okuCwangcisiweyo kunye nokuhamba komsebenzi okuthe ngqo kwiSicelo

Iiplatifomu zeDATACON zihlala zivavanywa apho inkqubo ifuna ukuguquguquka okubanzi koqwalaselo, ukuphathwa kweetshiphusi ezininzi, izixhobo ezikhethekileyo okanye ulandelelwano oludlula umjikelo olula wokubeka ophindaphindiweyo.

Iindlela zokudibanisa ii-chip ezininzi kunye neendlela zokuhlanganisa ezinokulungiselelwa
Iintloko zebhondi ezithile zesicelo, izixhobo kunye neemodyuli zezinto eziphathekayo
Iitshiphusi ezikhethiweyo kunye novavanyo oluphambili lokupakisha
Iiprojekthi apho ukuphathwa kwe-wafer, i-carrier, itreyi okanye i-substrate kufuneka kuhambelane ngokusondeleyo

Qinisekisa ngaphambi kokufaka kuluhlu olufutshane

Ukulungiswa kwentloko yebhondi, ukutshintsha izixhobo, ukuseta ukusasaza okanye ukujika, iphakheji yekhamera, iimodyuli zokuphatha, imeko yomlawuli kunye nezixhobo ezibandakanyiweyo.

Indlela Yokuqala ye-Esec

Ukusekwa kweDie Bonding, iMveliso ezenzekelayo kunye nokuPhinda-phinda kweNkqubo

Amaqonga e-Esec ahlala evavanywa apho indlela yemveliso igxile kwi-die attachment ephindaphindwayo, ukuhamba kwezinto ezichaziweyo, ukuhlanganiswa komgca kunye nemisebenzi yokuhlanganiswa kwe-semiconductor ezinzileyo.

Iindlela zokuhlanganisa ezisemgangathweni kunye neendlela zokuhlanganisa ezijolise kwimveliso
I-Epoxy attachment, i-soft solder kunye neemfuno ezinxulumene nenkqubo yobushushu
Ifreyimu yentsimbi, umcu, isiseko okanye ukuhamba kwezinto ezisekelwe kumthwali
Uzinzo lwenkqubo yomthamo ophezulu kunye neemfuno ezichaziweyo zokwenza izinto ngokuzenzekelayo

Qinisekisa ngaphambi kokufaka kuluhlu olufutshane

Ifomathi ye-die kunye ne-substrate, izinto zokubopha, iimfuno zobushushu, indlela yokuphatha, uqwalaselo lombono, izixhobo zenkqubo, isoftware kunye nokulungiselela inkxaso yemveliso.

I-Process Route Navigator

Tshatisa umatshini nendlela yokuncamathisela i-Die Attach

Qala ngenkqubo ebonakalayo. Oku kuthintela ukukhetha i-BESI die bonder ngokusekelwe kuphela kwigama lophawu oluqhelekileyo, ifoto yemveliso eqhelekileyo okanye umfanekiso obekwe kwisihloko.

Hlaziya uluhlu olupheleleyo.

Ukulandwa kweedizili, ukulungiswa kwezinto, ukubekwa kwazo, ukubopha, ukuhlolwa, ukubuyiswa kwazo kunye nokuphathwa kwazo ngezantsi konke kuchaphazela isigqibo sezixhobo ezisebenzayo.

Isincamathelisi seeModule ezininzi

Sebenzisa le ndlela xa i-die attach ifuna ulungelelwaniso lwenkqubo oluguquguqukayo, ukuphathwa kweetshiphusi ezininzi, izixhobo ezininzi, izixhobo ezikhethekileyo okanye ulandelelwano lokuhlanganisa oludlula umjikelo olula wokubeka ophindaphindiweyo.

Iitshiphu ezininzi Ukuguquguquka kweSixhobo Iimodyuli zeNkqubo

Ukubopha okuqhelekileyo kweDie

Sebenzisa le ndlela xa inkqubo igxile kwi-die attachment ephindaphindwayo enokuhamba kwezinto ezichaziweyo, iimfuno zokuphatha ezizinzileyo kunye nethagethi yemveliso exhomekeke kwi-automation elawulwayo.

Qhoboshela i-Epoxy Ifreyimu yentsimbi / isiseko sentsimbi Ukuhamba kweMveliso

Ukubopha iSoft Solder Die

Sebenzisa le ndlela xa uyilo lweepakethe kunye neemfuno zenkqubo zizisa ulawulo lobushushu, ukuphathwa kwe-solder, ukufudumeza okulawulwayo okanye izinto ezifunekayo ekuhlanganisweni kwamandla kunye ne-semiconductor.

Izixhobo zamandla Ulawulo lobushushu Indlela yezinto eziphathekayo

Indibano yeFlip Chip

Sebenzisa le ndlela xa ubeka idayisi egobileyo, ujikajika, ujika okanye udipha, ulungelelaniso lwe-chip-to-substrate, ukuhlolwa kwe-post-bond kunye nokuphathwa kwenkampani ethile kwinkqubo ethile kuchazwa isicelo.

Itshiphu yokujika Ulungelelwaniso lombono Ukuntywila/Ukudipha

Iindlela zoQhagamshelo oluPhambili

Sebenzisa le ndlela xa iphakheji ifuna iindlela ezikhethekileyo zokubopha, ulawulo lomthwali, i-metrology, izakhiwo zonxibelelwano eziphambili okanye iimeko zokufaneleka ngaphaya kwe-die attach eqhelekileyo.

Uxinzelelo lweThermo Ukubopha okuhlanganisiweyo Ukupakisha Okuphambili

Indlela Yokusebenza Yokukhetha Amanyathelo Amathandathu

Indlela yokuNciphisa uBume boMatshini we-BESI Die Bonding

Sebenzisa ulandelelwano olufanayo lwezigqibo nokuba kukuphonononga umatshini we-DATACON, i-Esec die bonder okanye iyunithi yokutshintsha esetyenzisiweyo yomgca wemveliso we-semiconductor okhoyo.

Chaza iDie kunye nePakeji

Qinisekisa ubungakanani bedayi, ubukhulu, imeko yangasemva, uyilo lwephakheji, ulwakhiwo lwe-bump okanye i-metallization, uhlobo lwe-substrate kunye nolwalathiso lokubekwa.

Qinisekisa indlela yezinto eziphathekayo

Chonga ukuba le nkqubo isebenzisa i-epoxy, i-solder, i-sinter material, i-flux, i-adhesive, i-thermo-compression okanye enye indlela yokulungisa izinto.

Imephu yoMzila woLawulo

Qinisekisa ifreyimu yewafer, itreyi, iGel-Pak®, umthwali, umcu, isikhephe, ifreyimu yelead, isiseko kunye neemfuno zokukhupha impahla ngaphambi kokuba uhlole izixhobo.

Inkqubo yokuQondanisa izixhobo zekhompyutha

Hlola iintloko zebhondi, uluhlu lwamandla, inkqubo yekhamera, ukukhanyisa, iimodyuli zokuhambisa okanye zokuhambisa, izifudumezi, izixhobo, imilomo kunye nezixhobo.

Qinisekisa isiphumo kunye nemveliso

Chaza i-throughput, i-changeover frequency, ulandelelwano lokuhlolwa, ukuphathwa kokubuyisela kwimeko yesiqhelo, imfuneko yokuphinda-phinda kunye nendlela yokuqinisekisa imveliso.

Qinisekisa ukulungela ubunini

Hlola ukufikelela kwisoftware, imeko yomlawuli, ii-backups, iindawo ezingasetyenziswanga, iirekhodi zokulinganisa, ubungakanani benkxaso kunye neemfuno zokufakela.

I-Matrix yokuHlanganisa uBunjineli

Imibuzo Ekufuneka Uyiphendule Ngaphambi Kokuba Uvume I-BESI Die Bonder

Le matrix ixhasa uphononongo lobunjineli kunye nokuthengwa. Ifanele igqitywe ngokuhambelana noqwalaselo oluthile lomatshini olunikezelwayo, kungekuphela nje ngokuhambelana negama losapho lweqonga.

Ukuqinisekiswa kwinqanaba lomatshini kubalulekile.

Uqwalaselo lwe-serial, iimodyuli ezifakiweyo, iphakheji yezixhobo kunye nemeko zinokutshintsha ukufaneleka ngaphezu kokubekwa kweqonga eliqhelekileyo.

Imfuneko yeDie kunye nePakeji	Qinisekisa ubungakanani bedayi, ubukhulu, indlela yokuthathwa, ubuthaka, ulwakhiwo lwe-bump okanye i-metallization, ulungelelwaniso, i-package geometry kunye nozinzo lwe-substrate.
Imfuneko yezinto eziphathekayo kunye nobushushu	Qinisekisa iimfuno ze-epoxy, i-solder, izinto ze-sinter, i-flux, i-adhesive, i-heating, i-cooling, izixhobo zokushisa kunye ne-process-environment.
Ukuphathwa kweWafer kunye neSubstrate	Qinisekisa ubungakanani be-wafer, uhlobo lwesakhelo, itreyi, umthwali, umcu, isikhephe, ifreyimu yentsimbi, ubungakanani besakhelo, indlela yokulayisha kunye nolandelelwano lokudluliselwa.
Ukubekwa kunye noLawulo lweNkqubo	Chaza isiphumo se-X/Y/theta esifunekayo phantsi kweemeko zenkqubo yokwenyani, kubandakanya i-die geometry, impendulo yezinto, intshukumo ye-substrate kunye neprofayili yomjikelo wethagethi.
Iphakheji yezixhobo kunye nezixhobo	Qinisekisa izixhobo zokubopha, ii-nozzles, izixhobo zokukhupha, izixhobo zokulungisa, iireferensi zokulinganisa, ii-feeders, iiplate, izibambi, izixhobo zokuthwala kunye nezixhobo ezithile zenkqubo.
Imfuneko yeMveliso kunye noHlolo	Hlaziya i-UPH ekujoliswe kuyo, umxube wemveliso, utshintsho, indlela yokuhlola, ukuphathwa kokubuyisela, ukulandelelwa kwedatha, ulawulo lweresiphi kunye neendlela zokwamkelwa.
Imeko yeZixhobo ezisetyenzisiweyo	Qinisekisa ubuchule, intshukumo, umbono, umlawuli, isoftware, ukhetho, amaxwebhu, iirekhodi zokulinganisa, ukufikelela kwinxalenye eseleyo kunye nobubanzi bokuhlaziya.

Uphononongo lweZixhobo ezisetyenzisiweyo

Iqonga le-BESI elifanelekileyo lisenokungaphumeleli kwiSatifikethi ukuba iYunithi enikezelwayo ayiphelelanga

Kwizixhobo ezisetyenzisiweyo okanye ezihlaziyiweyo, igama lomatshini liyinxalenye enye yesigqibo. Izikhewu zoqwalaselo, izixhobo ezigugileyo, iingxaki zolawulo, iimodyuli zekhamera ezingekhoyo, izixhobo ezingafumanekiyo okanye isoftware engaphelelanga inokulibazisa ukufakwa kunye nokufaneleka.

Uphononongo olufutshane lwezixhobo kufuneka luchonge izinto ezibalulekileyo kwinkqubo ngaphambi kokuba zithunyelwe kwaye luchaze ukuba zeziphi eziza kuvavanywa, zilinganiswe, zinikezelwe okanye zixhaswe.

Funda isikhokelo sokuhlaziya nokuhlola seDATACON 2200 evo

Ubuwena

Qinisekisa imodeli echanekileyo, ulwazi olulandelelanayo, ukuveliswa kwemveliso kunye neenketho ezifakiweyo.

Iimekheniki

Jonga intshukumo yeqonga, iintloko zebhondi, indlela yokuhambisa intambo, iinkqubo zamandla kunye nezixhobo zokhuseleko.

Umbono

Qinisekisa iikhamera, i-optics, ukukhanya, impendulo yokulungelelanisa kunye nemeko yokulinganisa.

Izixhobo

Qinisekisa ii-nozzles, izixhobo zokufaka, izixhobo zokukhupha, izixhobo zokondla, izixhobo zokuthwala kunye nezixhobo zokucubungula.

Isoftware

Hlola isilawuli, iPC, ii-backups, iinketho ezivunyiweyo, amaxwebhu kunye nemidiya yokubuyisela.

Ukwamkelwa

Chaza ububanzi be-FAT, iisampulu zezinto, iimeko zovavanyo, ukukhululwa kokuthunyelwa kunye nenkxaso yokufakelwa.

Iindlela zeZixhobo zeBESI ezinxulumeneyo

Ukusuka kwiSikhokelo soKhetho ukuya kwiPhepha leQonga elifanelekileyo

Sebenzisa amakhonkco angezantsi ukuze usuke kwisakhelo sokukhetha esibanzi uye kwi-DATACON egxile kuyo, i-flip chip, i-revivshiment okanye amaphepha ezixhobo ezikhoyo.

Isishwankathelo seQonga

I-BESI Uluhlu lweBonder

Khangela izixhobo zokubopha iidayi ezinxulumene ne-BESI kunye namaphepha okufumaneka koomatshini ngoku.

Jonga iiBESI Die Bonders

Qhoboshela iiModyuli ezininzi

I-DATACON 2200 evo

Hlola iinguqu ze-DATACON 2200 evo, iindawo zoqwalaselo kunye novavanyo lwenkqubo ye-multi-chip.

Hlola i-DATACON 2200 evo

Indlela yeFlip Chip

Amaqonga eDATACON 8800

Hlaziya imiyalelo ye-DATACON 8800 FC QUANTUM kunye ne-CHAMEO yeendlela zokusebenza kwe-flip chip.

Hlola i-DATACON 8800

Isihloko soBugcisa

I-IRON Flip Chip Bonder

Hlaziya amaqela eqonga le-BESI flip chip, imibuzo yenkqubo kunye neendawo zokujonga uqwalaselo.

Hlola iiPlatforms zeFlip Chip

Imibuzo yoKhetho

Imibuzo ebuzwa rhoqo malunga nomatshini wokubopha i-BESI Die Bonding

Le mibuzo igxile ekufanisweni kwenkqubo kunye nokuhlolwa koqwalaselo lomatshini. Yahluke ngabom kwi-inventory yemveliso, iqonga le-DATACON 2200 evo kunye namaphepha athile okuhlaziya.

Yintoni umatshini wokubopha iidayi ze-BESI?

Umatshini we-BESI die bonding sisixhobo sokudibanisa semiconductor esisetyenziselwa i-die attach kunye nemisebenzi yokupakisha enxulumeneyo. Ngokuxhomekeke kwiqonga kunye noqwalaselo, unokuvavanywa kwi-multi-chip assembly, i-die bonding eqhelekileyo, i-soft solder bonding, i-flip chip okanye iindlela zokupakisha ezikhethekileyo ngakumbi.

Ingaba i-die bond yahlukile kumatshini we-die bonding?

Kwiingxoxo ezininzi zokuthenga nobunjineli, umatshini we-die bonder kunye nomatshini we-die bonding uchaza udidi olufanayo lwezixhobo. Umahluko obaluleke ngakumbi kukumiselwa kwenkqubo yokwenyani, njengohlobo lwentloko yebhondi, indlela yezinto ezisetyenziswayo, inkqubo yokuphatha, izixhobo kunye nokukwazi ukuhlola.

Yintoni umahluko phakathi kwezixhobo ze-BESI DATACON kunye ne-Esec?

Iiplatifomu zeDATACON kunye ne-Esec zijongana neendlela ezahlukeneyo zokudibanisa ii-die attach kunye ne-assembly. I-DATACON idla ngokuphononongwa kwiindlela ezininzi zokudibanisa ii-module kunye neendlela zokusebenza ezikhethiweyo eziphambili, ngelixa i-Esec idla ngokuphononongwa kwiindlela zokudibanisa ii-die ezisekwe, i-soft solder kunye neendlela zokudibanisa ezijolise kwimveliso. Ukufaneleka kokugqibela kuxhomekeke kuqwalaselo oluthile lomatshini.

Yeyiphi iqonga le-BESI ekufuneka livavanywe kwi-multi-chip die attach?

Indlela ye-Multi Module Attach enokulungiselelwa idla ngokuba yindawo yokuqala yovavanyo lwe-multi-chip die attach. Umatshini ocetywayo usafuna ukujongwa ukuba ulandelana njani, izixhobo, iimodyuli zokuphatha, ulungiselelo lwentloko yebhondi, iphakheji yombono kunye neemfuno zenkqubo yezinto.

Yeyiphi indlela yomatshini we-BESI efanelekileyo kwi-soft solder die bonding?

I-soft solder die bonding kufuneka ihlolwe ngokubhekiselele kwizixhobo ezenzelwe inkqubo yobushushu kunye nezinto ezifunekayo. Hlaziya amandla e-bond, amandla okufudumeza, izixhobo zobushushu, ukuphathwa kwe-substrate, ukubonakaliswa kwezinto, injongo yemveliso kunye noqwalaselo oluchanekileyo lomatshini ofakiweyo.

Ngaba umatshini we-BESI DATACON ungasetyenziselwa imisebenzi ye-flip chip?

Ezinye iindlela zokucwangcisa i-DATACON ziyavavanywa kwiinkqubo ezikhethiweyo ze-flip chip. Umatshini onikezelwayo kufuneka uhlolwe izixhobo zokukhetha nokubeka, indlela yokujika, indlela yokujika okanye yokudipha, ulungelelwaniso lombono, ukuphathwa kwe-wafer kunye ne-substrate, imisebenzi yokujonga kunye nezixhobo ezithile zephakheji.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-BESI die bonder esetyenzisiweyo?

Qinisekisa imodeli echanekileyo, uqwalaselo lweenombolo zeserial, intloko yebhondi, uluhlu lwamandla, inkqubo yombono, iimodyuli zokuphatha, iphakheji yezixhobo, imeko yomlawuli, ukhetho lwesoftware, imeko yokulinganisa, iindawo ezisele ezikhoyo, ulwazi lovavanyo olusebenzayo kunye nobubanzi benkxaso yokufakela.

Loluphi ulwazi olufunekayo ngaphambi kokukhetha umatshini wokubopha i-BESI?

Lungisa umzobo wephakheji, ubungakanani bedayi, ubukhulu bedayi, izinto zokubopha, ifomathi ye-wafer okanye yetreyi, uhlobo lwesiseko, imveliso ekujoliswe kuyo, imfuneko yokubeka, iimeko zenkqubo yobushushu, ukufumaneka kwezixhobo kunye nayo nayiphi na imida ekhoyo yomgca wemveliso.

Ngaba ufuna uncedo lokunciphisa uqwalaselo lomatshini we-BESI Die Bonding?

Yabelana ngomzobo wephakheji, ifomathi yedayi kunye ne-substrate, indlela yezinto ezibonakalayo, imveliso ekujoliswe kuyo, izixhobo ezikhoyo kunye nazo naziphi na iinkcukacha zomatshini ezikhoyo. Uhlolo oluluncedo ngakumbi luqala ngeemeko zenkqubo yokwenyani endaweni yegama eliqhelekileyo leqonga.

Ukubonisana kwi-Intanethi

Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?

Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".

Iinkcukacha

Qhagamshelana nengcali yokuthengisa

Finyelela kwiqela lethu lezentengiso ukuze ujonge izisombululo ezilungiselelweyo ezihlangabezana ngokugqibeleleyo neemfuno zeshishini lakho kwaye ulungise nayiphi na imibuzo onokuba unayo.

Isicelo sokuthengisa

Silandele

Hlala uqhagamshelene nathi ukuze ufumane izinto ezintsha zamva nje, izibonelelo ezikhethekileyo, kunye nokuqonda okuya kuphakamisa ishishini lakho ukuya kwinqanaba elilandelayo.

Ukukhangela ngokukhawuleza

I-Geekvalue: Uzalelwe oomatshini bokuKhetha-neNdawo

Inkokeli yesisombululo esinye sokumisa i-chip mounters

Njengomthengisi wee-SMT koomatshini kunye neZincedisi, i-Geekvalue ibonelela ngoluhlu lwabatsha nabasetyenziswayo oomatshini be-SMT kunye neZincedisi ezivela kwiibrendi ezaziwayo ngamaxabiso akhuphisana kakhulu.

QHAGAMSHELANA NATHI

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