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Chikhazikitso cha Chisankho cha Semiconductor Die Attach

Momwe Mungasankhire Makina Olumikizirana a BESI Die: Buku Lotsogolera Zosankha za DATACON vs Esec

Makina olumikizira ma die a BESI amatha kuthandizira njira zosiyanasiyana zolumikizira ma semiconductor, kuyambira ma configurable multi-chip die attach mpaka ma production-oriented bonding, ma thermal processes ndi ma flip chip applications osankhidwa. Poyambira koyenera ndi chofunikira pa ndondomekoyi, osati dzina la makina lokha.

Kuyerekeza kothandiza pakati pa makina a BESI DATACON ndi nsanja ya Esec kuyenera kuganizira kapangidwe ka phukusi, miyeso ya die, zinthu zomangira, mawonekedwe a substrate, njira yogwirira ntchito, njira yogwiritsira ntchito, njira yogwiritsira ntchito, zida zogwirira ntchito, ndi kasinthidwe kake ka zida zomwe zaperekedwa.

Kufunsana Pa intaneti Pemphani Ndemanga Yosankha
Konzani zojambula za phukusi, kukula kwa die, njira ya zinthu, mawonekedwe a substrate, cholinga chotulutsa ndi tsatanetsatane uliwonse wa zida zomwe zilipo musanayerekezere momwe makina amagwirira ntchito.
BESI Die Bonding Machine Context

Musamaone DATACON ndi Esec ngati njira zina zodziyimira zokha

Mapulatifomu a BESI DATACON ndi Esec ali mkati mwa njira yolumikizirana ya zida zolumikizirana. Ntchito yawo yothandiza imasintha ndi zida zoyikiramo, kapangidwe ka mutu wa bond, phukusi la masomphenya, ma module ogwirira ntchito, ndi njira yogwirira ntchito yopangira.

DATACON nthawi zambiri ndi poyambira koyenera pomwe pulojekiti imafuna ma module ambiri osinthika, kutsata ma chip ambiri, zida zapadera kapena njira zosankhidwa za flip chip. Esec ikhoza kukhala poyambira koyenera pomwe njirayi imamangidwa mozungulira ma die bonding obwerezabwereza, kuyenda kwa zinthu zomwe zakhazikitsidwa kapena zofunikira pakupanga automation.

Mfundo yosankha

Sankhani njira yoyendetsera kaye. Kenako tsimikizirani ngati makina a DATACON omwe akuperekedwa kapena Esecwogwirizanitsaili ndi mutu wofunikira wa bond, kukonzekera zinthu, masomphenya, kusamalira, kugwiritsa ntchito zida ndi kukonza mapulogalamu.

  • 01

    Dzina la nsanja silofunikira kwathunthu

    Makina awiri ochokera m'banja limodzi amatha kusiyana kwambiri mu mphamvu ya bond, kasinthidwe ka ma handling, optics, tooling package, controller generation ndi enabled process functions.

  • 02

    Kutha kufalitsa ndi poyambira chabe

    Kuyenerera komaliza kumadalira chipangizo chomwe chikuperekedwa, zipangizo zogwirira ntchito, mtundu wa chipangizocho, zofunikira zake, ndi zowonjezera zomwe zilipo.

  • 03

    Kukonzekera kwa zida zogwiritsidwa ntchito kuyenera kuunikidwanso padera

    Mkhalidwe wa makina, momwe makina amagwiritsidwira ntchito, kupezeka kwa zida, kubwezeretsa mapulogalamu, zida zosinthira, ndi kuchuluka kwa chithandizo kungasinthe mtengo wa nsanja yoyenera.

Njira Zosankhira Mapulatifomu

DATACON vs Esec: Malo Oyambira Awiri Osiyana a Mapulojekiti a Die Attach

Kuyerekeza kothandiza sikutanthauza kuti ndi nsanja iti yomwe ili yabwino kwambiri padziko lonse. Funso lothandiza ndilakuti ndi njira iti yomwe ingagwirizane ndi njira yomwe ikufunidwa, kapangidwe ka phukusi, kagwiritsidwe ntchito ka zinthu, ndi cholinga chopangira.

Gwiritsani ntchito izi ngati fyuluta yoyamba.

Kukonza makina molondola, njira zokhazikitsira, zida zogwirira ntchito, zida zogwiritsira ntchito, ndi kutsimikizira kugwiritsa ntchito ndikofunikira musanasankhe zida.

Njira Yoyambira ya DATACON

Ma Configurable Multi-Module Attach ndi Ma Workflow Omwe Angagwiritsidwe Ntchito

Mapulatifomu a DATACON nthawi zambiri amawunikidwa pomwe njirayi ikufunika kusinthasintha kwakukulu kwa kasinthidwe, kugwiritsa ntchito ma chip ambiri, zowonjezera zapadera kapena njira yomwe imapitilira kuzungulira kosavuta kobwerezabwereza.

  • Njira zosonkhanitsira ma chip ambiri komanso zosinthika
  • Mitu yolumikizirana, zida ndi ma module azinthu zokhudzana ndi ntchito
  • Chip yosankhidwa yosankhidwa ndi kuwunika kwapamwamba kwa phukusi
  • Mapulojekiti omwe ma wafer, chonyamulira, thireyi kapena kugwirira ntchito pansi pa nthaka kuyenera kufanana kwambiri
Tsimikizani musanasankhe

Makonzedwe a mutu wa bond, chosinthira zida, kukhazikitsa kogawa kapena kusinthasintha, phukusi la kamera, ma module ogwiritsira ntchito, momwe chowongolera chilili ndi zida zomwe zili mkati mwake.

VS
Njira Yoyambira ya Esec

Kukhazikitsa Kugwirizana kwa Die, Kupanga Makina Okha ndi Kubwerezabwereza kwa Njira

Mapulatifomu a Esec nthawi zambiri amawunikidwa pomwe njira yopangira imayang'ana kwambiri pa ma die attach obwerezabwereza, kuyenda kwa zinthu zomwe zafotokozedwa, kuphatikiza mzere ndi ntchito zokhazikika za semiconductor assembly.

  • Njira zomangira zomangira ndi zopangira zomwe zimayang'ana pakupanga
  • Epoxy attach, solder yofewa ndi zofunikira zokhudzana ndi kutentha
  • Chingwe chotsogolera, mzere, gawo lapansi kapena kayendedwe ka zinthu kochokera ku chonyamulira
  • Kukhazikika kwa njira yogwira ntchito kwambiri komanso zofunikira zodziyimira pawokha
Tsimikizani musanasankhe

Kapangidwe ka die ndi substrate, zinthu zomangira, zofunikira pa kutentha, njira yogwirira ntchito, kasinthidwe ka masomphenya, zida zogwirira ntchito, mapulogalamu ndi kukonzekera kothandizira kupanga.

Woyendetsa Njira Yoyendetsera Njira

Gwirizanitsani Makina ndi Njira Yolumikizirana

Yambani ndi njira yeniyeni. Izi zimapewa kusankha BESI die bonder kutengera dzina lodziwika bwino la kampani, chithunzi cha chinthu chodziwika bwino kapena chithunzi cha mutu wa kampani.

Unikani unyolo wonse.

Kutenga zida, kukonzekera zinthu, kuziyika, kuzigwirizanitsa, kuziyang'anira, kuzibwezeretsa, ndi kuzisamalira pambuyo pake zonse zimakhudza chisankho cha zida zogwirira ntchito.

01

Chomangira cha Ma Module Ambiri

Gwiritsani ntchito njira iyi pamene cholumikizira cha die chikufunika kusinthasintha kwa njira, kugwiritsa ntchito ma chip ambiri, zida zingapo, zowonjezera zapadera kapena njira yosonkhanitsira yomwe imapitilira kuzungulira kosavuta kobwerezabwereza.

Ma Chip Ambiri Kusinthasintha kwa Chida Magawo a Njira
02

Kugwirizana Kwabwino kwa Die

Gwiritsani ntchito njira iyi pamene njirayo ikuyang'ana kwambiri pa cholumikizira chobwerezabwereza chomwe chimayendetsedwa ndi zinthu zomwe zafotokozedwa, zofunikira pakugwira ntchito mokhazikika komanso cholinga chopanga chomwe chimadalira makina owongolera.

Chogwirizira cha Epoxy Chingwe cha Leadframe / Substrate Kuyenda kwa Kupanga
03

Kugwirizana kwa Die Wofewa Wofewa

Gwiritsani ntchito njira iyi pamene kapangidwe ka phukusi ndi zofunikira pa ndondomeko zikuyambitsa kayendetsedwe ka kutentha, kusamalira solder, kutentha kolamulidwa kapena kuganizira za kusonkhana kwa magetsi ndi semiconductor.

Zipangizo Zamagetsi Kulamulira Kutentha Njira Yopangira Zinthu
04

Msonkhano wa Chip

Gwiritsani ntchito njira iyi pamene malo oyika zida zomangira, kutembenuza, kusuntha kapena kuviika, kulinganiza chip-to-substrate, kuyang'anira pambuyo pa bond ndi kusamalira chonyamulira cha njira inayake kumatanthauza momwe ntchitoyo ikuyendera.

Chip Chozungulira Kulinganiza Masomphenya Kusakaniza / Kuviika
05

Njira Zapamwamba Zolumikizirana

Gwiritsani ntchito njira iyi pamene phukusi likufunika njira zapadera zolumikizirana, kulamulira chonyamulira, metrology, kapangidwe kapamwamba kolumikizirana kapena zikhalidwe zoyenerera kupitirira zomwe zakhazikika.

Kupsinjika kwa Thermo Kugwirizana Kosakanikirana Kupaka Patsogolo
Njira Yosankhira Zinthu Zosankhira Zinthu Zosakwana Zisanu ndi Chimodzi

Momwe Mungachepetsere Kapangidwe ka Makina Olumikizirana a BESI Die

Gwiritsani ntchito ndondomeko yofanana ya zisankho kaya kuwunikanso makina a DATACON, Esec die bonder kapena chipangizo chosinthira chomwe chagwiritsidwa ntchito pa mzere wopanga wa semiconductor womwe ulipo.

01

Fotokozani Die ndi Phukusi

Tsimikizirani kukula kwa die, makulidwe, momwe mbali yakumbuyo ilili, kapangidwe ka paketi, kapangidwe ka bump kapena metallization, mtundu wa substrate ndi momwe imayikidwira.

02

Tsimikizani Njira Yopangira Zinthu

Dziwani ngati njira yogwiritsira ntchito epoxy, solder, sinter material, flux, glue, thermo-compression kapena njira ina yokonzekera zinthu.

03

Mapu a Kuyenda kwa Kayendedwe

Tsimikizirani zofunikira pa chimango cha wafer, thireyi, Gel-Pak®, chonyamulira, mzere, bwato, chimango cha leadframe, substrate ndi kutsitsa katundu musanayang'anenso zida.

04

Fananitsani Zida Zogwirira Ntchito

Unikani mitu ya ma bond, mphamvu yogwiritsira ntchito, makina a kamera, ma module owunikira, ogawa kapena osinthasintha, zotenthetsera, zida zogwiritsira ntchito, ma nozzles ndi zida zina.

05

Tsimikizirani Zotuluka ndi Zotuluka

Fotokozani kuchuluka kwa zinthu zomwe zagwiritsidwa ntchito, kuchuluka kwa zinthu zomwe zasinthidwa, ndondomeko yowunikira, njira yobwezeretsera, kufunikira kobwerezabwereza, ndi njira yotsimikizira kupanga.

06

Tsimikizani Kukonzeka kwa Umwini

Unikani momwe mapulogalamu amagwirira ntchito, momwe woyang'anira alili, zosunga zobwezeretsera, zida zosinthira, zolemba zowunikira, kuchuluka kwa chithandizo ndi zofunikira pakuyika.

Matrix Ofananiza Uinjiniya

Mafunso Oyenera Kuyankha Musanavomereze BESI Die Bonder

Matrix iyi imathandizira kuwunikanso kwa uinjiniya ndi kugula. Iyenera kumalizidwa motsatira kapangidwe ka makina omwe akuperekedwa, osati kokha motsatira dzina la banja la nsanja.

Kutsimikizira kwa makina ndikofunikira.

Kusintha kwa serial, ma modules omwe adayikidwa, phukusi la zida ndi momwe zinthu zilili zitha kusintha kuyenerera kuposa momwe zimakhalira papulatifomu.

Kufunika kwa Die ndi Phukusi Tsimikizirani kukula kwa die, makulidwe, njira yonyamulira, kufooka, kapangidwe ka bump kapena metallization, momwe zinthu zilili, mawonekedwe a phukusi ndi kukhazikika kwa substrate.
Zofunika pa Zinthu ndi Kutentha Tsimikizirani zofunikira za epoxy, solder, sinter material, flux, glue, heating, cooling, thermal tooling ndi process-environment.
Kusamalira ndi Kusamalira Pansi pa Madzi Tsimikizani kukula kwa wafer, mtundu wa chimango, thireyi, chonyamulira, mzere, bwato, chimango cha lead, kukula kwa substrate, komwe katundu amalowera komanso ndondomeko yosamutsira.
Kuyika ndi Kuwongolera Njira Fotokozani zotsatira za X/Y/theta zomwe zikufunika malinga ndi momwe zinthu zilili, kuphatikizapo die geometry, yankho la zinthu, kayendedwe ka substrate ndi mbiri ya kuzungulira kwa chandamale.
Phukusi la Zida ndi Zowonjezera Tsimikizirani zida zomangira, ma nozzles, zida zotulutsira, zida zolumikizira, zowerengera zoyezera, zodyetsa, mbale, zogwirira, zida zonyamulira ndi zowonjezera zina zokhudzana ndi njira.
Zofunikira pa Kupanga ndi Kuyang'anira Unikani UPH yomwe mukufuna, kusakaniza kwa zinthu, kusintha, njira yowunikira, kusamalira kuchira, kutsata deta, kuwongolera maphikidwe ndi njira zovomerezeka.
Mkhalidwe wa Zida Zogwiritsidwa Ntchito Tsimikizirani makina, mayendedwe, masomphenya, chowongolera, mapulogalamu, zosankha, zolemba, zolemba zowunikira, mwayi wopeza zinthu zina ndi malo okonzanso.
Kuwunikanso Zipangizo Zogwiritsidwa Ntchito

Pulatifomu Yoyenera ya BESI Ikhoza Kulepherabe Kuyenerera Ngati Chida Choperekedwacho Sichikwanira

Pazida zomwe zagwiritsidwa ntchito kapena zokonzedwanso, dzina la makina ndi gawo limodzi lokha la chisankhocho. Mipata yosinthira, zida zosweka, mavuto a owongolera, ma module a kamera omwe akusowa, zowonjezera zomwe sizikupezeka kapena mapulogalamu osakwanira zitha kuchedwetsa kukhazikitsa ndi kuyenerera.

Kuwunika mwachidule zida kuyenera kuzindikira zinthu zofunika kwambiri pa ndondomekoyi musanatumize ndikufotokozera zomwe zidzayesedwe, kuyesedwa, kuperekedwa kapena kuthandizidwa.

Werengani Buku Lowongolera ndi Kuyang'anira la DATACON 2200 evo
01

Kudziwika

Tsimikizani chitsanzo chenicheni, zambiri zotsatizana, kupanga zinthu ndi njira zoyikidwa.

02

Makanika

Yang'anani kayendetsedwe ka siteji, mitu ya ma bond, njira yolumikizira mawaya, makina amphamvu ndi zida zotetezera.

03

Masomphenya

Tsimikizirani makamera, kuwala, kuunikira, kuyankhidwa kwa kayendedwe ka magetsi ndi momwe zinthu zilili.

04

Kugwiritsa ntchito zida

Tsimikizirani ma nozzles, zida zolumikizira, zida zotulutsira madzi, zodyetsera, zonyamulira ndi zowonjezera pa ntchito.

05

Mapulogalamu

Onaninso chowongolera, PC, zosunga zobwezeretsera, zosankha zoyatsidwa, zolemba ndi zolumikizira zobwezeretsa.

06

Kuvomereza

Fotokozani kuchuluka kwa FAT, zitsanzo za zinthu, momwe zinthu zimayezedwera, kutulutsa katundu ndi chithandizo chokhazikitsa.

Njira Zogwirizana ndi Zida za BESI

Pitani ku Tsamba Loyenera la Malangizo Okhudza Kusankha

Gwiritsani ntchito maulalo omwe ali pansipa kuti musunthe kuchoka pa dongosolo lalikulu losankhira kupita ku masamba a DATACON, flip chip, revistment kapena zida zomwe zilipo.

Chidule cha Nsanja

BESI The Bonder Inventory

Yang'anani zida zolumikizirana ndi ma die zokhudzana ndi BESI komanso masamba omwe alipo pakali pano.

Onani BESI Die Bonders
Chomangira cha Ma Module Ambiri

DATACON 2200 evo

Fufuzani mitundu ya DATACON 2200 evo, madera okonzera zinthu, ndi kuwunika njira yogwiritsira ntchito ma chip ambiri.

Fufuzani DATACON 2200 evo
Njira Yosinthira Chip

Mapulatifomu a DATACON 8800

Unikani malangizo a DATACON 8800 FC QUANTUM ndi CHAMEO a momwe mungagwirire ntchito ndi flip chip.

Fufuzani DATACON 8800
Mutu waukadaulo

Chitsulo Cholumikizira Chip cha IRON

Unikani magulu a nsanja ya BESI flip chip, mafunso okhudza njira zoyendetsera zinthu ndi malo owunikira makonzedwe.

Fufuzani Mapulatifomu a Flip Chip
Mafunso Osankha

Mafunso Ofunsidwa Kawirikawiri pa Makina Olumikizirana a BESI Die

Mafunso awa akuyang'ana kwambiri pa kufananiza njira ndi kuwunikanso kakonzedwe ka makina. Mwadala ndi osiyana ndi zinthu zomwe zili mumndandanda wazinthu, nsanja ya DATACON 2200 evo ndi masamba okhudzana ndi kukonzanso.

Kodi makina olumikizirana a BESI ndi chiyani?

Makina olumikizirana a BESI die bonding ndi zida zolumikizirana za semiconductor zomwe zimagwiritsidwa ntchito polumikiza ma die attach ndi ntchito zina zokhudzana ndi ma paketi. Kutengera ndi nsanja ndi kapangidwe kake, zitha kuyesedwa kuti zigwirizane ndi ma multi-chip assembly, standard die bonding, soft solder bonding, flip chip kapena njira zina zapadera zolumikizira ma paketi.

Kodi cholumikizira cha die bond ndi chosiyana ndi makina olumikizira cha die bond?

Mu zokambirana zambiri zogula ndi zaukadaulo, makina olumikizirana a die bonder ndi die bonding amafotokoza gulu lomwelo la zida. Kusiyana kwakukulu ndi kasinthidwe ka njira yeniyeni, monga mtundu wa mutu wa bond, njira ya zinthu, njira yogwirira ntchito, zida zogwiritsira ntchito ndi kuthekera kowunikira.

Kodi pali kusiyana kotani pakati pa zida za BESI DATACON ndi Esec?

Mapulatifomu a DATACON ndi Esec amalankhula za njira zosiyanasiyana zolumikizirana ndi ma die attachment. DATACON nthawi zambiri imawunikidwa kuti igwirizane ndi ma multi-module attachment ndi njira zina zosankhidwa zapamwamba, pomwe Esec nthawi zambiri imawunikidwa kuti igwirizane ndi ma die attachment, solder yofewa komanso njira zolumikizirana zopangira. Kuyenerera komaliza kumadalira makina enieni.

Ndi nsanja iti ya BESI yomwe iyenera kuyesedwa kuti igwirizane ndi multi-chip die attach?

Njira yokhazikitsira Multi Module Attach nthawi zambiri imakhala poyambira kuwunika kwa ma multi-chip die attach. Makina omwe akuperekedwawa akuyenera kuyang'aniridwa kuti awone ngati pali ma die sequence, zida, ma module ogwirira ntchito, makonzedwe a bond head, vision package, ndi zofunikira pa njira yogwirira ntchito.

Ndi njira iti ya makina a BESI yomwe ingathandize pa mgwirizano wofewa wa solder die?

Bonding yofewa ya solder iyenera kuyesedwa poyerekeza ndi zida zomwe zapangidwira kutentha ndi zinthu zofunika. Unikani mphamvu ya bonding, mphamvu yotenthetsera, zida zotenthetsera, kusamalira substrate, mawonekedwe a zinthu, cholinga chopangira ndi momwe makina amakhazikitsidwira.

Kodi makina a BESI DATACON angagwiritsidwe ntchito pa ntchito za flip chip?

Ma DATACON ena amawunikidwa kuti agwiritse ntchito njira zina zosinthira ma flip chip. Makina omwe aperekedwa ayenera kufufuzidwa ngati ali ndi zida zosinthira, njira yosinthira, njira yosinthira kapena kumiza, kulinganiza masomphenya, kusamalira ma wafer ndi substrate, ntchito zowunikira, ndi zida zina zomwe zimagwiritsidwa ntchito pa phukusi.

Kodi ndi chiyani chomwe chiyenera kufufuzidwa musanagule BESI die bonder yogwiritsidwa ntchito kale?

Tsimikizirani chitsanzo chenicheni, kasinthidwe ka nambala ya serial, mutu wa bond, mphamvu, makina owonera, ma module ogwiritsira ntchito, phukusi la zida, mkhalidwe wa wowongolera, zosankha za mapulogalamu, momwe zinthu zilili, zida zosinthira zomwe zilipo, zambiri zoyeserera zogwira ntchito komanso kuchuluka kwa chithandizo chokhazikitsa.

Ndi mfundo ziti zomwe zimafunika musanasankhe makina olumikizirana a BESI?

Konzani zojambula za phukusi, kukula kwa die, makulidwe a die, zinthu zomangira, mawonekedwe a wafer kapena thireyi, mtundu wa substrate, kutulutsa kwa cholinga, kufunikira kwa malo, momwe kutentha kumakhalira, kupezeka kwa zida ndi zoletsa zilizonse zomwe zilipo pakupanga.

Mukufuna Thandizo Lochepetsa Kapangidwe ka Makina Olumikizirana a BESI Die?

Gawani zojambula za phukusi, mtundu wa die ndi substrate, njira yogwiritsira ntchito, zotuluka zomwe zagwiritsidwa ntchito, zida zomwe zilipo komanso tsatanetsatane uliwonse wa makina omwe alipo. Kuwunikanso kothandiza kwambiri kumayamba ndi momwe zinthu zilili m'malo mwa dzina la nsanja.

Kufunsana Pa intaneti

Chifukwa chiyani anthu ambiri amasankha kugwira ntchito ndi GeekValue?

Mtundu wathu ukufalikira kuchokera ku mzinda kupita ku mzinda, ndipo anthu osawerengeka andifunsa, "Kodi GeekValue ndi chiyani?" Zimachokera ku masomphenya osavuta: kupatsa mphamvu luso lachi China ndi luso lamakono. Uwu ndi mzimu wodzitukumula mosalekeza, wobisika pakufunafuna kwathu tsatanetsatane komanso chisangalalo chopitilira zomwe tikuyembekezera pakubweretsa kulikonse. Mmisiri waluso komanso kudzipereka uku sikungolimbikira kwa omwe adayambitsa, komanso tanthauzo ndi kutentha kwa mtundu wathu. Tikukhulupirira kuti muyambira pano ndikutipatsa mwayi wopanga ungwiro. Tiyeni tigwire ntchito limodzi kuti tipange chozizwitsa chotsatira cha "zero defect".

Chen

Lumikizanani ndi katswiri wazogulitsa

Lumikizanani ndi gulu lathu lazamalonda kuti mufufuze mayankho omwe amagwirizana bwino ndi bizinesi yanu ndikuyankha mafunso aliwonse omwe mungakhale nawo.

Kufunsira Zogulitsa

Titsatireni

Lumikizanani nafe kuti mupeze zatsopano zaposachedwa, zotsatsa zapadera, ndi zidziwitso zomwe zikweza bizinesi yanu kupita patsogolo.

Kuyenda Mwamsanga

LUMIKIZANANI NAFE

Adilesi yolumikizirana:

No. 18, Shangliao Industrial Road, Shajing Town, Baoan District, Shenzhen, China

Nambala yafoni yolumikizana:

+86 13823218491

Imelo:

smt-sales3@gdxinling.cn

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