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Semiconductor Die Attach Enkola y'okusalawo

Engeri y'okulondamu ekyuma ekikola BESI Die Bonding: DATACON vs Esec Decision Guide

Ebyuma bya BESI die bonding bisobola okuwagira amakubo ag’enjawulo ag’okukuŋŋaanya semiconductor, okuva ku configurable multi-chip die attach okutuuka ku production-oriented bonding, enkola z’ebbugumu n’okukozesa flip chip ezirondeddwa. Entandikwa entuufu ye nkola eyeetaagisa, so si linnya ly’ekyuma lyokka.

Okugeraageranya okw’omugaso wakati w’ekyuma kya BESI DATACON n’omusingi gwa Esec kulina okulowooza ku dizayini y’ekipapula, ebipimo by’ekifa, ebintu ebikwatagana, ensengeka ya substrate, enkola y’okukwata, okuyita mu bigendererwa, ebikozesebwa mu nkola n’ensengeka entuufu ey’ebyuma ebiweereddwa.

Okwebuuza ku yintaneeti Saba Okuddamu Okulonda
Tegeka ekifaananyi ky’ekipapula, obunene bw’ekifa, ekkubo ly’ebintu, ensengeka ya substrate, ekigendererwa ky’okufulumya n’ebikwata ku bikozesebwa byonna ebiriwo nga tonnageraageranya nsengeka za kyuma.
BESI Die Bonding Ekyuma Ensonga

Totwala DATACON ne Esec nga Automatic Like-for-Like Alternatives

BESI DATACON ne Esec platforms zituula munda mu die attach equipment ecosystem egazi. Omulimu gwabwe ogw’omugaso gukyuka n’ebintu ebikozesebwa mu nkola ebiteekeddwawo, dizayini y’omutwe gwa bond, vision package, handling modules n’enkola y’emirimu gy’okufulumya.

DATACON etera okuba entandikwa ekwatagana nga pulojekiti yeetaaga okuteekebwako modulo eziwera ezisobola okuteekebwateekebwa, okulondamu chip eziwera, ebikozesebwa ebikwata ku nkola oba amakubo ga flip chip agalondeddwa. Esec eyinza okuba entandikwa ekwatagana nga enkola ezimbiddwa okwetoloola okuddiŋŋana die bonding, established material flow oba production automation requirements.

Omusingi gw’okulonda

Sooka olonde ekkubo ly’enkola. Oluvannyuma kakasa oba ekyuma kya DATACON ekiteeseddwa oba Esecomukuumi w’ebintualina omutwe gwa bond ogwetaagisa, okuteekateeka ebintu, okulaba, okukwata, okukozesa ebikozesebwa n’okusengeka pulogulaamu.

  • 01

    Erinnya lya platform si lye specification enzijuvu

    Ebyuma bibiri okuva mu famire emu bisobola okwawukana ennyo mu maanyi ga bond, ensengeka y’okukwata, optics, tooling package, controller generation ne enabled process functions.

  • 02

    Obusobozi obufulumiziddwa ntandikwa yokka

    Okusaanira okusembayo kisinziira ku yuniti entuufu ewereddwa, ebikozesebwa mu nkola, enkola y’ekyuma, ebisaanyizo n’ebikozesebwa mu kukola ebiriwo.

  • 03

    Okwetegekera ebyuma ebikozesebwa kulina okwekenneenya okwawukana

    Embeera y’ekyuma, embeera y’okupima, okubeerawo kw’ebikozesebwa, okuzzaawo pulogulaamu, sipeeya n’obuwanvu bw’obuyambi bisobola okukyusa omuwendo gw’omukutu ogusaanira mu ngeri endala.

Amakubo g’Okusalawo ku Pulatifoomu

DATACON vs Esec: Entandikwa bbiri ez'enjawulo ku pulojekiti za Die Attach

Okugeraageranya okw’omugaso si nti platform ki esinga universally. Ekibuuzo eky’omugaso kiri nti kkubo ki erisinga okukwatagana n’enkola egenderere, enzimba y’ebipapula, enkwata y’ebintu n’ekigendererwa ky’okufulumya.

Kino kikozese ng’omusengejja ogusooka.

Ensengeka entuufu ey’ekyuma, eby’okulonda ebiteekeddwa, ebikozesebwa mu nkola, ebikozesebwa n’okukakasa enkola bisigala nga byetaagisa nga tonnalonda byuma.

DATACON Ekkubo ly'okutandika

Enkola z’emirimu ez’okugattako n’enkola ezikwata ku nkola eziwera ezisobola okuteekebwateekebwa

Enkola za DATACON zitera okwekenneenyezebwa ng’enkola yeetaaga okukyukakyuka mu nsengeka okugazi, okukwata chip eziwera, ebikozesebwa eby’enjawulo oba omutendera ogusukka enzirukanya ennyangu ey’okuteeka enfunda eziwera.

  • Multi-chip die attach n'amakubo g'okukuŋŋaanya agasobola okuteekebwateekebwa
  • Emitwe gya bond egy’enjawulo egy’okukozesa, modulo z’ebikozesebwa n’ebintu
  • Flip chip erongooseddwa n’okwekenneenya okupakinga okw’omulembe
  • Pulojekiti nga enkwata ya wafer, carrier, tray oba substrate erina okukwatagana ennyo
Kakasa nga tonnaba kusunsula

Enteekateeka y’omutwe gwa bond, okukyusa ebikozesebwa, okuteekawo okugaba oba okufuuwa, okupakinga kwa kkamera, modulo z’okukwata, embeera ya controller n’ebintu ebiteekebwamu.

VS
Esec Ekkubo ly'okutandika

Yateekebwawo Die Bonding, Production Automation n'okuddiŋŋana enkola

Esec platforms zitera okwekenneenyezebwa nga ekkubo ly’okufulumya lyesigamiziddwa ku repeatable die attach, defined material flow, line integration n’emirimu gy’okukuŋŋaanya semiconductor stable.

  • Standard die bonding n'amakubo g'okukuŋŋaanya agatunuulidde okufulumya
  • Epoxy attach, soft solder n’ebyetaago by’enkola y’ebbugumu ebikwatagana nabyo
  • Leadframe, strip, substrate oba okutambula kw’ebintu okusinziira ku carrier
  • Okutebenkera kw’enkola ya voliyumu ennene n’ebyetaago by’otomatiki ebitegeerekese
Kakasa nga tonnaba kusunsula

Enkola ya die ne substrate, ebintu ebisiba, ebyetaago by’ebbugumu, ekkubo ly’okukwata, ensengeka y’okulaba, ebikozesebwa mu nkola, software n’okuyamba okufulumya okwetegekera.

Omulambuzi w’Ekkubo ly’Enkola

Gyaanyisa Ekyuma ku Die Attach Route

Tandika n’enkola ey’omubiri. Kino kyewala okulonda BESI die bonder okusinziira ku linnya lyokka erimanyiddwa, ekifaananyi ky’ebintu eby’enjawulo oba omuwendo gw’okuteekebwa ku mutwe.

Weekenneenye olujegere olujjuvu.

Okulonda die, okuteekateeka ebintu, okuteeka, okusiba, okukebera, okuzzaawo n’okukwata wansi byonna bikosa okusalawo kw’ebyuma mu nkola.

01

Multi-Module Okugattako

Kozesa ekkubo lino nga die attach yeetaaga ensengeka y’enkola ekyukakyuka, okukwata chip eziwera, ebikozesebwa ebingi, ebikozesebwa eby’enjawulo oba omutendera gw’okukuŋŋaanya ogusukka enzirukanya ennyangu ey’okuddiŋŋana okuteeka.

Multi-Chip ezirimu Chip eziwera Okukyukakyuka kw’Ebikozesebwa Module z’enkola
02

Standard Die Bonding

Kozesa ekkubo lino ng’enkola yeesigamiziddwa ku repeatable die attach n’okutambula kw’ebintu okutegeerekese, ebyetaago by’okukwata ebinywevu n’ekigendererwa ky’okufulumya ekisinziira ku controlled automation.

Epoxy Okugattako Leadframe / Ekintu ekiyitibwa Substrate Entambula y’okufulumya ebintu
03

Soft Solder Die Okusiba

Kozesa ekkubo lino nga dizayini y’ebipapula n’ebyetaago by’enkola bireeta okuddukanya ebbugumu, okukwata solder, okufukirira okufugibwa oba okulowooza ku kukuŋŋaanya amaanyi-semikondokita.

Ebyuma by’Amasannyalaze Okufuga ebbugumu Ekkubo ly’Ebikozesebwa
04

Olukungaana lwa Flip Chip

Kozesa ekkubo lino nga bumped die placement, flipping, fluxing oba dipping, chip-to-substrate alignment, post-bond inspection n’enkola-specific carrier handling okunnyonnyola enkola.

Flip Chip Okukwatagana kw’okulaba Flux / Okunnyika
05

Amakubo g’okuyunga eby’omulembe

Kozesa ekkubo lino nga ekipapula kyetaagisa enkola ez’enjawulo ez’okusiba, okufuga abasitula, okupima, ebizimbe eby’omulembe eby’okuyunga oba embeera z’ebisaanyizo ezisukka ku die attach eya bulijjo.

Okunyigirizibwa kw’ebbugumu (thermo Compression). Okukwatagana (Hybrid Bonding) mu ngeri ey’omugatte Okupakinga eby’omulembe
Enkola y’okusunsulamu ey’emitendera omukaaga

Engeri y'okufunzaamu Ensengeka y'ekyuma ekikwata ku BESI Die Bonding Machine

Kozesa omutendera gwe gumu ogw’okusalawo oba okwetegereza ekyuma kya DATACON, Esec die bonder oba ekintu ekikyusiddwa ekikozesebwa ku layini y’okufulumya semikondokita eriwo.

01

Nnyonnyola Die ne Package

Kakasa ebipimo bya die, obuwanvu, embeera y’emabega, enzimba y’ekipapula, ensengeka y’ekikonde oba ekyuma, ekika kya substrate n’engeri y’okuteekebwamu.

02

Kakasa Ekkubo ly’Ebikozesebwa

Laba oba enkola ekozesa epoxy, solder, sinter material, flux, adhesive, thermo-compression oba enkola endala ey’okuteekateeka ebintu.

03

Maapu y’Entambula y’Enkwata

Kakasa wafer frame, tray, Gel-Pak®, carrier, strip, boat, leadframe, substrate n’ebyetaago by’okutikkula nga tonnaba kwetegereza hardware.

04

Okukwataganya Enkola ya Hardware

Weekenneenye emitwe gya bond, force range, camera system, ekitangaala, modulo ezigaba oba fluxing, heaters, tooling, nozzles ne fixtures.

05

Okukakasa Ebifulumizibwa n’Amakungula

Lambulula okuyita mu, emirundi gy’okukyusaamu, ensengeka y’okukebera, enkwata y’okuzzaawo, obwetaavu bw’okuddiŋŋana n’enkola y’okukakasa okufulumya.

06

Kakasa Okwetegefu Obwannannyini

Weekenneenye enkola ya software, embeera ya controller, backups, spare parts, calibration records, support scope n’ebyetaago by’okussaako.

Engineering Okukwatagana Matrix

Ebibuuzo by'olina Okuddamu Nga Tonnakkiriza BESI Die Bonder

Matrix eno ewagira okwekenneenya yinginiya n’okugula ebintu. Kisaanye okumalirizibwa okusinziira ku nsengeka y'ekyuma entongole eweebwa, so si ku linnya ly'amaka g'omukutu gwokka.

Ensonga z’okukakasa ku ddaala ly’ekyuma.

Ensengeka ya serial, modules eziteekeddwawo, tooling package n’embeera bisobola okukyusa suitability okusinga generic platform positioning.

Ekyetaagisa mu Die ne Package Kakasa sayizi ya die, obuwanvu, enkola y’okukwata, obunafu, ensengeka y’okubumbulukuka oba ey’ekyuma, okutunula, geometry y’ekipapula n’obutebenkevu bwa substrate.
Ebyetaago by’Ebikozesebwa n’Ebbugumu Kakasa epoxy, solder, sinter material, flux, adhesive, okubuguma, okunyogoza, thermal tooling n’enkola-obutonde ebyetaagisa.
Enkwata ya Wafer ne Substrate Kakasa sayizi ya wafer, ekika kya fuleemu, tray, carrier, strip, eryato, leadframe, ebipimo bya substrate, obulagirizi bw’okutikka n’omutendera gw’okutambuza.
Okuteeka n’okufuga enkola Lambulula ekiva mu X/Y/theta ekyetaagisa wansi w’embeera z’enkola entuufu, omuli geometry y’okufa, okuddamu kw’ebintu, entambula ya substrate n’ensengeka y’enzirukanya y’ekigendererwa.
Package y'ebikozesebwa n'ebikozesebwa Kakasa ebikozesebwa mu bond, nozzles, eject tools, fixtures, calibration references, feeders, plates, holders, ebikozesebwa mu kusitula n’ebikozesebwa ebikwata ku nkola.
Ekyetaagisa mu kukola n’okukebera Weekenneenye ekiruubirirwa UPH, okutabula ebintu, okukyusa, ekkubo ly’okukebera, enkwata y’okuzzaawo, okulondoola data, okufuga enkola y’emmere n’emisingi gy’okukkiriza.
Embeera y'Ebyuma Ebikozesebwa Kakasa makanika, entambula, okulaba, controller, software, options, ebiwandiiko, calibration records, spare-part access n’okuddaabiriza scope.
Okwekenenya Ebyuma Ebikozesebwa

Omukutu gwa BESI Omutuufu Gukyayinza Okulemererwa Ebisaanyizo Singa Ekitundu Ekiweereddwa Tekijjuvu

Ku byuma ebikozesebwa oba ebiddaabiriziddwa, erinnya ly’ekyuma kitundu kimu kyokka ku kusalawo. Ebituli mu kusengeka, ebikozesebwa ebyambala, ensonga za controller, modulo za kkamera ezibula, ebikozesebwa ebitaliiwo oba pulogulaamu ezitali ntuufu bisobola okulwawo okuteeka n’okutuukiriza ebisaanyizo.

Okwekenenya ebyuma mu bumpimpi kulina okuzuula ebintu ebikulu mu nkola nga tebinnasindikibwa n’okunnyonnyola ebigenda okugezesebwa, okupimibwa, okuweebwa oba okuwagirwa.

Soma ekitabo ekikwata ku kuddaabiriza n’okukebera DATACON 2200 evo
01

Ebikukwatako

Kakasa model entuufu, serial information, production generation n'enkola eziteekeddwamu.

02

Bamakanika

Kebera entambula ya siteegi, emitwe gya bond, cable routing, force systems ne safety hardware.

03

Okulaba

Kakasa kamera, optics, ekitangaala, alignment response n’embeera ya calibration.

04

Okukozesa ebikozesebwa

Kakasa entuuyo, ebinyweza, ebikozesebwa okufulumya, emmere, ebisitula n’ebikozesebwa mu kukola.

05

Sofutiweeya

Weekenneenye controller, PC, backups, enabled options, ebiwandiiko n'emikutu gy'okuzzaawo.

06

Okukkiriza

Lambulula obuwanvu bwa FAT, sampuli z’ebintu, embeera z’okugezesa, okufulumya okusindika n’obuyambi bw’okussaako.

Amakubo g’Ebyuma bya BESI agakwatagana

Tambula Okuva ku Bulagirizi bw'Okulonda Odde ku Muko gwa Platform ogukwatagana

Kozesa enkolagana wansi okuva mu nkola y’okulonda empanvu okudda mu mpapula eziteekeddwako essira DATACON, flip chip, okuddaabiriza oba ebyuma ebiriwo.

Okulaba Omukutu

BESI Ekiwandiiko kya Bonder

Browse BESI-related die bonding equipment n'emiko gy'ebyuma ebiriwo kati.

Laba BESI Okufa Bonders
Multi Module Okugattako

DATACON 2200 evo

Yeekenneenya enjawulo za DATACON 2200 evo, ebitundu by’okusengeka n’okwekenneenya enkola ya chip eziwera.

Yeekenneenya DATACON 2200 evo
Ekkubo lya Flip Chip

DATACON 8800 Ebifo eby’enjawulo

Weekenneenye endagiriro za DATACON 8800 FC QUANTUM ne CHAMEO ku nkola y’emirimu gya flip chip.

Yeekenneenya DATACON 8800
Omulamwa gw'ebyekikugu

EKYUMA Flip Chip Bonder

Weekenneenye ebibinja bya BESI flip chip platform, ebibuuzo by’okukola n’ebifo eby’okukebera ensengeka.

Yeekenneenya Enkola za Flip Chip
Ebibuuzo by’Okusunsulamu

BESI Ekyuma Ekisiba Enfa FAQ

Ebibuuzo bino bitunuulira nnyo okukwatagana kw’enkola n’okwekenneenya ensengeka y’ebyuma. Zaawukana mu bugenderevu ku yinvensulo y’ebintu, omukutu gwa DATACON 2200 evo n’emiko egy’enjawulo egy’okuddaabiriza.

Ekyuma ekiyitibwa BESI die bonding machine kye ki?

Ekyuma kya BESI die bonding kye kimu ku byuma ebikuŋŋaanya semikondokita ebikozesebwa mu kukola emirimu gy’okusiba die n’okupakinga ebikwatagana nabyo. Okusinziira ku pulatifomu n’ensengeka, kiyinza okwekenneenyezebwa okukuŋŋaanyizibwa kwa chip eziwera, standard die bonding, soft solder bonding, flip chip oba amakubo ag’omulembe agasingawo ag’omulembe ag’okupakinga.

Die bonder ya njawulo ku kyuma ekikola die bonding?

Mu kukubaganya ebirowoozo okusinga ku kugula ne yinginiya, die bonder ne die bonding machine zinnyonnyola ekika ky’ebyuma kye kimu. Enjawulo esinga obukulu ye nsengeka y’enkola entuufu, gamba ng’ekika ky’omutwe gwa bond, ekkubo ly’ebintu, enkola y’okukwata, ebikozesebwa n’obusobozi bw’okukebera.

Njawulo ki eriwo wakati w’ebyuma bya BESI DATACON ne Esec?

DATACON ne Esec platforms zikola ku makubo ag’enjawulo aga die attach ne assembly. DATACON etera okwekenneenyezebwa ku configurable multi-module attach ne selected advanced workflows, ate Esec etera okwekenneenyezebwa ku established die bonding, soft solder ne production-oriented assembly routes. Okusaanira okusembayo kisinziira ku nsengeka y’ekyuma eyeetongodde.

Platform ki eya BESI esaana okwekenneenyezebwa ku multi-chip die attach?

Ekkubo lya Multi Module Attach eriyinza okuteekebwateekebwa litera okuba entandikwa y’okwekenneenya okuyungibwa kw’okufa kwa chip eziwera. Ekyuma ekiteeseddwa kyetaaga okukeberebwa okulaba oba die sequence, tooling, handling modules, bond head arrangement, vision package ne material process requirements.

Ekkubo ki ery’ekyuma kya BESI erikwatagana ku soft solder die bonding?

Soft solder die bonding erina okwekenneenya okusinziira ku byuma ebikoleddwa ku nkola eyetaagisa ey’ebbugumu n’ebintu. Weekenneenye empalirizo ya bond, obusobozi bw’ebbugumu, ebikozesebwa mu bbugumu, okukwata substrate, okwanjula ebintu, ekigendererwa ky’okufulumya n’ensengeka entuufu ey’ekyuma ekissiddwa.

Ekyuma kya BESI DATACON kisobola okukozesebwa ku nkola y'emirimu gya flip chip?

Ezimu ku nsengeka za DATACON zeekenneenyezebwa ku nkola za flip chip ezirondeddwa. Ekyuma ekiweereddwa kirina okukeberebwa oba tekirina bikozesebwa mu kulonda n’okuteeka, enkola y’okufuumuula, ekkubo ly’okufuumuula oba okunnyika, okukwataganya okulaba, okukwata wafer ne substrate, emirimu gy’okukebera n’ebikozesebwa ebikwata ku package.

Kiki ekirina okukeberebwa nga tonnagula BESI die bonder ekozesebwa?

Kakasa model entuufu, ensengeka ya serial-number, omutwe gwa bond, force range, vision system, handling modules, tooling package, embeera ya controller, software options, calibration status, spare parts eziriwo, functional test information ne installation support scope.

Mawulire ki ageetaagisa nga tonnalonda kyuma kya BESI die bonding machine?

Tegeka okukuba ekifaananyi ky’ekipapula, ebipimo by’ekifa, obuwanvu bw’ekifa, ebintu ebisiba, ensengeka ya wafer oba tray, ekika kya substrate, ekifulumizibwa ekigendererwa, ekyetaagisa okuteeka, embeera y’enkola y’ebbugumu, okubeerawo kw’ebikozesebwa n’ebiziyiza byonna ebiriwo mu layini y’okufulumya.

Okwetaaga Obuyambi Okufunza Ensengeka y'Ekyuma Ekikwatagana n'Ekifa ekya BESI?

Gabana ekifaananyi ky’ekipapula, enkola ya die ne substrate, ekkubo ly’ebintu, ekifulumizibwa ekigendererwa, ebikozesebwa ebiriwo n’ebikwata ku kyuma kyonna ekiriwo. Okwekenenya okw’omugaso ennyo kutandikira ku mbeera z’enkola entuufu okusinga erinnya ly’omukutu erya bulijjo.

Okwebuuza ku yintaneeti

Lwaki abantu bangi basalawo okukola ne GeekValue?

Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".

Ebikwata ku ddyo

Tuukirira omukugu mu by’okutunda

Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.

Okusaba Okutunda

Tugoberere

Sigala ng’okwatagana naffe okuzuula obuyiiya obusembyeyo, ebiweebwayo eby’enjawulo, n’okutegeera okujja okusitula bizinensi yo ku ddaala eddala.

Okutambulira mu Mangu

TUKUTUUKAKO

Endagiriro y’okutuukirira:

No. 18, oluguudo lw’amakolero mu Shangliao, mu kibuga Shajing, mu Disitulikiti y’e Baoan, Shenzhen, China

Ennamba y’essimu ey’okwebuuza:

+86 13823218491

Email:

smt-okutunda3@gdxinling.cn

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