What is a BESI die bonding machine?

A BESI die bonding machine is semiconductor assembly equipment used for die attach and related packaging workflows. Depending on the platform and configuration, it may be evaluated for multi-chip assembly, standard die bonding, soft solder bonding, flip chip or more specialized advanced packaging routes.

Is a die bonder different from a die bonding machine?

In most procurement and engineering discussions, die bonder and die bonding machine describe the same equipment category. The more important distinction is the actual process configuration, such as bond head type, material route, handling system, tooling and inspection capability.

What is the difference between BESI DATACON and Esec equipment?

DATACON and Esec platforms address different die attach and assembly routes. DATACON is commonly reviewed for configurable multi-module attach and selected advanced workflows, while Esec is commonly reviewed for established die bonding, soft solder and production-oriented assembly routes. Final suitability depends on the specific machine configuration.

Which BESI platform should be evaluated for multi-chip die attach?

A configurable Multi Module Attach route is commonly the starting point for multi-chip die attach evaluation. The proposed machine still needs to be checked for die sequence, tooling, handling modules, bond head arrangement, vision package and material process requirements.

Which BESI machine route is relevant for soft solder die bonding?

Soft solder die bonding should be evaluated against equipment designed for the required thermal and material process. Review bond force, heating capability, thermal tooling, substrate handling, material presentation, production target and the exact installed machine configuration.

Can a BESI DATACON machine be used for flip chip workflows?

Some DATACON configurations are evaluated for selected flip chip processes. The offered machine must be checked for pick-and-place tools, flipping method, fluxing or dipping route, vision alignment, wafer and substrate handling, inspection functions and package-specific tooling.

What should be checked before buying a used BESI die bonder?

Confirm the exact model, serial-number configuration, bond head, force range, vision system, handling modules, tooling package, controller condition, software options, calibration status, available spare parts, functional test information and installation support scope.

What information is needed before selecting a BESI die bonding machine?

Prepare the package drawing, die dimensions, die thickness, bonding material, wafer or tray format, substrate type, target output, placement requirement, thermal process conditions, tooling availability and any existing production-line constraints.

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Semiconductor Die Attach Murtii Bu'uura

Akkaataa Maashinii Daayi Bonding BESI Filachuu Dandeenyu: Qajeelfama Murtii DATACON vs Esec

Maashiniiwwan BESI die bonding karaa walgahii semiconductor adda addaa deeggaru danda'u, configurable multi-chip die attach irraa kaasee hanga oomisha irratti xiyyeeffate bonding, adeemsa ho'aa fi fayyadama flip chip filatame. Qabxiin jalqabaa sirrii ta'e adeemsa barbaachisu malee maqaa maashinii qofa miti.

Walmadaalchisni faayidaa qabu maashinii BESI DATACON fi waltajjii Esec gidduutti taasifamu dizaayinii paakeejii, safara daayi, meeshaa walitti hidhamiinsaa, bifa substrate, mala qabachuu, bu’aa galma, meeshaalee adeemsaa fi qindeessaa qabatamaa meeshaalee dhiyaatan ilaaluu qaba.

Marii Toora Interneetii Irra Deebiin Filannoo Gaafadhu

Fakkii paakeejii, guddina daayi, daandii meeshaa, bifa sabsteeretii, galma oomishaa fi ibsa meeshaa jiru kamiyyuu qindeessuu qindeessuu maashinii walbira qabuu dura.

Paanaalii Murtii Filannoo

Gaaffiiwwan Sadii Barbaacha Waltajjii Dhiphisan

01
Maaltu walitti qabamaa jira? Gosti daayi, ijaarsi paakeejii, substrate ykn leadframe fi bonding material daangaa meeshaa jalqabaa ibsu.
02
Meeshaan sun akkamitti sochoʼuu qaba? Wafer, tray, carrier, strip, boat, Gel-Pak® fi meeshaalee barbaachisan walsimsiisa qindeessaa qabatamaa ibsu.
03
Osoo hin gadhiifamin dura maaltu mirkanaa’uu qaba? Ulaagaa ramaddii, daandii inspeekshinii, jijjiirraan, target UPH, bal’ina deeggarsa fi mala gahumsaa murtii dhumaa bocu.

BESI Die Bonding Maashinii Haala

DATACON fi Esec akka Filannoo Ofumaan Walfakkaachuutti Hin ilaalinaa

Waltajjiiwwan BESI DATACON fi Esec sirna ikoo meeshaalee die attach bal'aa keessa taa'u. Gaheen qabatamaan isaanii haardwaara adeemsaa fe’ame, dizaayinii mataa boondii, paakeejii mul’ataa, moojuulota qabachuu fi adeemsa hojii oomishaa wajjin jijjiirama.

DATACON yeroo baayyee bakka jalqabaa barbaachisaa ta'ee pirojektiin tokko walqabsiisa moojuulii hedduu qindaa'uu danda'u, tartiiba chippii hedduu, meeshaalee application addaa ykn karaalee chiip garagalchuu filataman barbaadudha. Esec adeemsichi naannoo irra deddeebiin daayi bonding, dhangala’aa meeshaa hundeeffame ykn barbaachisummaa otoomaatikii oomishaa irratti ijaarame ta’uu danda’a.

Qajeelfama filannoo

Dursa karaa adeemsaa filadhu. Sana booda maashiniin DATACON yaadame ykn Eseckan bonder ta’emataa boondii, qophii meeshaa, mul’ata, qabachuu, meeshaalee fi qindeessaa sooftiweerii barbaachisu qaba.

01

Maqaan waltajjii ibsa guutuu miti

Maashiniiwwan lama maatii tokko irraa humna hidhoo, qindeessaa qabachuu, optikii, paakeejii meeshaalee, dhaloota too’ataa fi dalagaalee adeemsa dandeessifame irratti garaagarummaa guddaa qabaachuu danda’u.
02

Dandeettiin maxxanfame ka’umsa qofa

Mijachuun dhumaa yuunitii sirrii dhiyaate, meeshaalee adeemsaa, bifa meeshaa, ulaagaalee gahumsaa fi meeshaalee oomishaa jiran irratti hundaa’a.
03

Qophiin meeshaalee itti fayyadaman addaan baafamee ilaalamuu qaba

Haalli maashinii, haala safartuu, argama meeshaalee, deebisanii dhaabuu sooftiweerii, qaamolee dabalataa fi bal’inni deeggarsa gatii waltajjii haala biraatiin mijaawaa ta’e jijjiiruu danda’a.

Daandiiwwan Murtii Waltajjii

DATACON vs Esec: Pirojektoota Die Attach'f Qabxiilee Jalqabaa Garaa Garaa Lama

Walbira qabamuun faayidaa qabu waltajjiin kam akka addunyaatti fooyya’aa ta’e miti. Gaaffiin faayidaa qabu karaan kami adeemsa yaadame, ijaarsa paakeejii, qabannaa meeshaalee fi kaayyoo oomishaa wajjin walsimuu danda’a kan jedhudha.

Kana akka calaqqee jalqabaatti fayyadami.

Qindaa’inni maashinii sirrii, filannoowwan fe’aman, haardwaara adeemsaa, meeshaalee fi mirkaneessuun aplikeeshinii filannoo meeshaalee dura barbaachisaa ta’ee hafa.

DATACON Daandii Jalqabaa

Adeemsa Hojii Walitti Hidhuu fi Appilikeeshinii Addaa Moojuulii Hedduu Qindaa'uu danda'u

Waltajjiiwwan DATACON yeroo baay’ee bakka adeemsichi haala qindaa’ina bal’aa, qabachuu chippii hedduu, meeshaalee addaa ykn tartiiba marsaa irra deddeebi’amee kaa’uu salphaa irra darbee barbaadutti madaalamu.

Multi-chip die attach fi karaalee walgahii qindaa'uu danda'an
Mataa boondii hojiirra oolmaa adda ta’e, moojuulota meeshaalee fi meeshaa
Flip chip filatamoo fi madaallii paakeejii sadarkaa olaanaa
Pirojektoota weefar, carrier, tray ykn substrate qabachuun itti dhiyeenyaan walsimsiisuu qabu

Tarree gabaabaa osoo hin galchin dura mirkaneessi

Qophii mataa boondii, jijjiirraa meeshaa, qophii kennuu ykn fluxing, paakeejii kaameraa, moojuulota qabachuu, haala too’ataa fi fixtures dabalatee.

Daandii Jalqabaa Esec

Die Bonding, Production Automation fi Adeemsa Irra Deddeebi’uu Hundeesse

Waltajjiiwwan Esec yeroo baay’ee kan madaalamu bakka karaan oomishaa irra deddeebi’amee daayi attach, dhangala’aa meeshaa ibsame, walitti makamuu sararaa fi hojiiwwan walgahii semiikondaaktarii tasgabbaa’aa irratti giddugaleessa ta’etti.

Daandiiwwan walga’ii istaandaardii die bonding fi oomisha irratti xiyyeeffatan
Epoxy attach, soft solder fi adeemsa ho’aa walqabatee barbaachisu
Dhangala’aa meeshaa liidfreemii, strip, substrate ykn carrier irratti hundaa’e
Tasgabbii adeemsa ulfaatina olaanaa fi barbaachisummaa otoomaatikii ibsame

Tarree gabaabaa osoo hin galchin dura mirkaneessi

Bifa daayi fi sabsteeretii, meeshaa walitti hidhamiinsaa, barbaachisummaa ho’aa, daandii qabachuu, qindeessaa mul’ataa, meeshaalee adeemsaa, qophii sooftiweerii fi deeggarsa oomishaa.

Navigator Daandii Adeemsaa

Maashinicha karaa Die Attach Route wajjin walsimsiisi

Adeemsa qaamaa irraa jalqabi. Kunis maqaa maqaa beekamaa, suuraa oomisha waliigalaa ykn lakkoofsa mata duree kaa’uu qofa irratti hundaa’uun BESI die bonder filachuu irraa of qusata.

Sansalata guutuu irra deebi’ii ilaali.

Die pickup, qophii meeshaa, kaa’uu, bonding, inspection, recovery fi downstream handling hundi isaanii murtii meeshaa qabatamaa irratti dhiibbaa qaba.

Moojuulii Hedduu Attach

Karaa kana fayyadami yeroo die attach qindeessaa adeemsa socho'aa, qabannaa chippii hedduu, meeshaalee hedduu, meeshaalee addaa ykn tartiiba walgahii marsaa irra deddeebi'amee kaa'uu salphaa bira darbee barbaadu.

Chiipsii hedduu kan qabu Meeshaa Daddabbii Moojuulota Adeemsaa

Istaandardii Die Bonding

Adeemsi sun dhangala’aa meeshaa ibsame, barbaachisummaa qabannaa tasgabbaa’aa fi galma oomishaa otoomaatikii to’atame irratti hundaa’e kan qabu daayi attach irra deddeebi’amuu danda’u irratti yeroo giddugaleessa ta’e fayyadami.

Epoxy Attach jedhamuun beekama Liidfreemii / Substrate Dhangala’aa Omishaa

Lallaafaa Solder Die Bonding

Karaa kana fayyadami yeroo dizaayiniin paakeejii fi adeemsa barbaachisummaa bulchiinsa ho’aa, qabannaa sooldirii, hoo’isa to’atame ykn yaada walgahii humna-semiikondaaktarii beeksisu.

Meeshaalee Humnaa To'annoo Ho'aa Karaa Meeshaa

Yaa'ii Chiipsii Gargalchuu

Karaa kana fayyadami yeroo bumped die placement, flipping, fluxing ykn dipping, chip-to-substrate alignment, post-bond inspection fi adeemsa addaa carrier handling application ibsu.

Chiip garagalchuu Mul’ata Hiriiruu Flux / Cuuphaa

Daandiiwwan Walqunnamtii Sadarkaa Ol’aanaa

Karaa kana yeroo paakeejichi mala hidhata addaa, to’annoo geejjibaa, meetrooloojii, caasaa walqunnamtii sadarkaa olaanaa ykn haala gahumsaa die attach barame bira darbee barbaadutti fayyadami.

Dhiibbaa Teermoo Hibriid Bonding Paakeejii Sadarkaa Ol’aanaa

Adeemsa Hojii Filannoo Tarkaanfii Jahaa

Akkaataa Qindeessituu Maashinii Die Bonding BESI itti dhiphisuu dandeenyu

Maashinii DATACON, Esec die bonder ykn sarara oomisha semiconductor jiruuf yuunitii bakka bu'aa fayyadame gamaaggamuus ta'e tartiiba murtii walfakkaataa fayyadami.

Daayi fi Paakeejii ibsi

Dimshaashumatti, furdina, haala duubaa, ijaarsa paakeejii, caasaa bump ykn metallization, gosa substrate fi orientation kaa’uu mirkaneessuu.

Karaa Meeshaa Mirkaneessi

Adeemsichi epooksii, sooldirii, meeshaa sinter, flux, adhesive, thermo-compression ykn mala meeshaa qopheessuu kan biraa fayyadamuu isaa adda baasuu.

Dhangala'aa Qabduu kaartaa

Hardware gamaaggamuu dura furmaata wafer, tray, Gel-Pak®, carrier, strip, boat, leadframe, substrate fi unloading barbaachisu mirkaneessuu.

Hardware Adeemsa Walsimsiisuu

Mataa hidhoo, fageenya humnaa, sirna kaameraa, ibsaa, moojuulota kennuu ykn fluxing, hoo’isitoota, meeshaalee, noozlii fi fixtures ilaali.

Bu’aa fi Bu’aa Mirkaneessuu

Bu’aa, firikuweensii jijjiirraa, tartiiba sakatta’iinsaa, haala deebisanii dhaabuu, barbaachisummaa irra deddeebi’amuu fi mala mirkaneessuu oomishaa ni ibsu.

Qophii Abbummaa Mirkaneessi

Dhaqqabummaa sooftiweerii, haala too’ataa, duwwaa, kutaalee faayidaa, galmee safartuu, bal’ina deeggarsaa fi barbaachisummaa fe’iinsaa ilaaluu.

Maatiriksii Walsimsiisaa Injinariingii

Gaaffiiwwan Deebii Qaban BESI Die Bonder Raggaasisuu Dura

Maatiriksiin kun gamaaggama injinariingii fi bittaa ni deeggara. Maqaa maatii waltajjii qofa irratti osoo hin taane, qindeessaa maashinii addaa dhiyaachaa jiruun xumuramuu qaba.

Dhimmoota mirkaneessuu sadarkaa maashinii.

Qindaa'inni tartiiba, moojuulota fe'aman, paakeejii meeshaalee fi haalli mijachuu bakka waltajjii waliigalaa caalaa jijjiiruu danda'a.

Die fi Paakeejii Barbaachisu	Guddina daayi, furdina, mala fudhachuu, dadhabina, caasaa bump ykn metallization, orientation, ji’oomeetirii paakeejii fi tasgabbii substrate mirkaneessuu.
Meeshaa fi Ho’a Barbaachisu	Epoxy, solder, sinter material, flux, adhesive, hoo’isuu, qabbanaa’uu, meeshaa ho’aa fi adeemsa-naannoo barbaachisummaa mirkaneessuu.
Waafer fi Substrate Qabduu	Safara weefar, gosa furmaataa, saanii, geejjiba, strip, bidiruu, liidfreemii, safara substrate, kallattii fe’iinsaa fi tartiiba dabarsuu mirkaneessuu.
Ramaddii fi To’annoo Adeemsaa	Ji’oomeetirii daayi, deebii meeshaa, sochii substrate fi piroofaayilii marsaa galma dabalatee haala adeemsa qabatamaa jalatti bu’aa X/Y/theta barbaachisu ibsi.
Paakeejii Meeshaalee fi Meeshaalee Gargaarsaa	Meeshaalee hidhoo, noozlii, meeshaalee eject, fixtures, wabiiwwan safartuu, nyaachiftoota, gabatee, qabduu, meeshaalee geejjibaa fi meeshaalee adeemsa addaa mirkaneessuu.
Ulaagaalee Omishaa fi Inspeekshinii	Galma UPH, makaa oomishaa, jijjiirraa, daandii sakatta’iinsaa, haala deebisanii dhaabuu, hordoffii daataa, to’annoo qophii nyaataa fi ulaagaalee fudhatama ilaaluu.
Haala Meeshaalee Fayyadamaa	Makaaniksii, sochii, mul’ata, too’ataa, sooftiweerii, filannoowwan, sanada, galmee safartuu, qaqqabummaa kutaa dabalataa fi daangaa haaromsaa mirkaneessuu.

Gamaaggama Meeshaalee Fayyadamaa

Waltajjiin BESI Mijaawaa Ta’e Ammallee Ulaagaa Dhabuu Danda’a Yoo Yuunitiin Dhiyeessame Guutuu Hin Taane

Meeshaalee itti fayyadamaniif ykn haaromfamaniif maqaan maashinichaa kutaa murtii keessaa tokko qofa. Qaawwi qindeessaa, meeshaaleen uffataman, dhimma too'ataa, moojuulonni kaameraa dhabaman, meeshaalee gargaarsaa hin jirre ykn sooftiweerii guutuu hin taane fe'uu fi gahumsa harkisuu danda'a.

Gamaaggamni meeshaalee gabaabaan ergaa dura meeshaalee adeemsaaf murteessoo ta’an adda baasuu fi maaltu akka qoratamu, akka safaramu, akka dhihaatu ykn akka deeggaramu ibsuu qaba.

Qajeelfama Haaromsaa fi Inspeekshinii DATACON 2200 evo dubbisaa

Eenyummaa

Moodeela sirrii, odeeffannoo tartiiba, dhaloota oomishaa fi filannoowwan fe'aman mirkaneessuu.

Makaaniksii

Sochii waltajjii, mataa boondii, daandii keebilii, sirna humnaa fi haardwaara nageenyaa ilaali.

rra ja

Kaameeraa, optikii, ibsaa, deebii walsimsiisaa fi haala safartuu mirkaneessuu.

Meeshaalee

Noozlii, fixtures, eject tools, feeders, carriers fi meeshaalee adeemsaa mirkaneessuu.

Mosaajii

Too'ataa, PC, duwwaa, filannoo dandeessifame, galmee fi miidiyaa deebisuu ilaali.

Fudhatama argachuu

Daangaa FAT, saamuda meeshaa, haala qorannoo, gadhiifamuu ergaa fi deeggarsa dhaabbii ni ibsu.

Daandiiwwan Meeshaalee BESI walqabatan

Qajeelfama Filannoo Irraa Gara Fuula Waltajjii Barbaachisaa ta'etti ce'i

Fuula filannoo bal'aa irraa gara fuula DATACON, flip chip, haaromsa ykn meeshaalee-argamanitti ce'uuf hidhannoowwan armaan gadii fayyadami.

Haala Waliigalaa Waltajjii

BESI Inventarii Bonder

Meeshaalee die bonding BESI wajjin walqabatan fi fuula argama maashinii ammaa daawwadhaa.

BESI Die Bonders jedhu ilaalaa

Moojuulii Hedduu Attach

DATACON 2200 kan jedhu evo

Garaagarummaa evo DATACON 2200, naannoo qindeessaa fi madaallii adeemsa chiip hedduu qoradhu.

DATACON 2200 qoradhu evo

Karaa Chiippii Gargalchuu

DATACON 8800 Waltajjiiwwan

Adeemsa hojii flip chip kallattii DATACON 8800 FC QUANTUM fi CHAMEO ilaali.

DATACON 8800 qoradhu

Mata duree Teeknikaa

SIBIILII Flip Chip Bonder

Gareewwan waltajjii BESI flip chip, gaaffilee adeemsaa fi qabxiiwwan sakatta'iinsa qindeessaa ilaali.

Waltajjiiwwan Flip Chip qoradhu

Gaaffiiwwan Filannoo

Maashinii Die Bonding BESI FAQ

Gaaffiiwwan kunniin walsimsiisa adeemsaa fi gamaaggama qindeessaa maashinii irratti xiyyeeffatu. Isaanis itti yaadanii inventarii oomishaa, waltajjii DATACON 2200 evo fi fuula haaromsa addaa irraa adda.

Maashiniin BESI die bonding maali?

Maashiniin BESI die bonding meeshaa walga’ii semiconductor kan die attach fi adeemsa hojii paakeejii walqabateef ooludha. Waltajjii fi qindeessaa irratti hundaa’uun, walgahii chippii hedduu, hidhata daayi istaandaardii, hidhata sooldirii lallaafaa, chiip garagalchuu ykn karaa paakeejii sadarkaa olaanaa adda ta’eef madaalamuu danda’a.

Die bonder maashinii die bonding irraa adda?

Marii bittaa fi injinariingii irra caalaan isaanii, maashiniin daayi bonder fi die bonding gosa meeshaalee walfakkaataa ibsu. Garaagarummaan caalaatti barbaachisaa ta’e qindeessaa adeemsa qabatamaa, kan akka gosa mataa boondii, karaa meeshaa, sirna qabachuu, meeshaalee fi dandeettii sakatta’iinsaa ti.

Garaagarummaan meeshaalee BESI DATACON fi Esec gidduu jiru maali?

Waltajjiiwwan DATACON fi Esec daandii die attach fi assembly adda addaa ilaala. DATACON yeroo baayyee kan ilaalamu yoo ta’u, adeemsa hojii sadarkaa olaanaa kan qindaa’uu danda’u multi-module attach fi filatamoo yoo ta’u, Esec ammoo yeroo baay’ee kan ilaalamu die bonding hundeeffame, soft solder fi karaa walga’ii oomisha irratti xiyyeeffate. Mijachuun dhumaa qindeessaa maashinii addaa irratti hundaa'a.

Waltajjii BESI kamtu multi-chip die attach dhaaf madaalamuu qaba?

Daandiin Multi Module Attach qindaa'uu danda'u yeroo baay'ee madaallii multi-chip die attach'f bakka jalqabaati. Maashiniin yaadame ammallee tartiiba daayi, meeshaalee, moojuulota qabachuu, qophii mataa boondii, paakeejii mul’ataa fi adeemsa meeshaa barbaachisan sakatta’amuu qaba.

Daandiin maashinii BESI kamtu soft solder die bonding tiif barbaachisaa dha?

Soft solder die bonding meeshaalee adeemsa ho’aa fi meeshaa barbaachisaa ta’eef qophaa’aniin madaalamuu qaba. Humna hidhoo, dandeettii hoo’isuu, meeshaalee ho’aa, qabachuu substrate, dhiheessi meeshaa, galma oomishaa fi qindeessaa maashinii sirrii dhaabame gamaaggamuu.

Maashiniin BESI DATACON adeemsa hojii flip chip tiif fayyadamuu ni danda'amaa?

Qindaa'inoota DATACON tokko tokko adeemsa flip chip filatamaniif madaalamu. Maashiniin dhiyaate meeshaalee fudhachuu fi kaa’uu, mala garagalchuu, karaa fluxing ykn dipping, walsimsiisa mul’ataa, qabachuu wafer fi substrate, dalagaalee inspeekshinii fi meeshaalee paakeejii adda ta’an irratti sakatta’amuu qaba.

BESI die bonder fayyadame bitachuu dura maaltu sakatta'amuu qaba?

Moodeela sirrii, qindeessaa lakkoofsa tartiiba, mataa hidhoo, fageenya humnaa, sirna mul’ataa, moojuulota qabachuu, paakeejii meeshaalee, haala too’ataa, filannoowwan sooftiweerii, haala safartuu, kutaalee faayidaa qaban, odeeffannoo qorannoo dalagaa fi daangaa deeggarsa dhaabbii mirkaneessuu.

Maashinii BESI die bonding filachuu dura odeeffannoo akkamii barbaachisa?

Fakkii paakeejii, safara daayi, furdina daayi, meeshaa hidhuu, bifa weefer ykn saanii, gosa sabsteeretii, oomisha galma, barbaachisummaa kaa’uu, haala adeemsa ho’aa, argama meeshaalee fi danqaa sarara oomishaa jiru kamiyyuu qopheessuu.

Qindeessituu Maashinii BESI Die Bonding Dhiphisuuf Gargaarsa Barbaadduu?

Fakkii paakeejii, bifa du'aa fi sabsteeretii, daandii meeshaa, oomisha galma, meeshaalee jiruu fi ibsa maashinii jiru kamiyyuu qoodi. Gamaaggamni caalaatti faayidaa qabu maqaa waltajjii waliigalaa osoo hin taane haala adeemsa dhugaa irraa jalqaba.

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Namoonni baay'een maaliif GeekValue wajjin hojjechuu filatu?

Maqaan keenya magaalaa irraa gara magaalaatti babal'achaa jira, namoonni lakkoofsa hin qabne "GeekValue maali?" Mul'ata salphaa irraa madda: kalaqa Chaayinaa teknooloojii ammayyaatiin humneessuu. Kun hafuura maqaa (brand spirit) fooyya’iinsa itti fufiinsa qabuudha, bal’inaan hordofuu keenya kan hin boqonne fi gammachuu geejjibni hunda waliin waan eegamu caalu keessatti dhokate. Ogummaa fi of kennuu obsessive jechuun ni danda’ama kun cimina hundeessitoota keenyaa qofa osoo hin taane, hundee fi ho’ina maqaa keenyaati. Asirraa jalqabdee carraa mudaa hin qabne uumuuf akka nuuf kennitu abdii qabna. Dinqii itti aanu "mudaa zeeroo" jedhu uumuuf waliin haa hojjennu.

Bir

Ogeessa gurgurtaa qunnamaa

Furmaata fedhii daldalaa keessanii haala gaariin guutu qorachuu fi gaaffii qabdan kamiyyuu deebisuuf garee gurgurtaa keenya qunnamaa.

Gaaffii Gurgurtaa

Nu Hordofaa

Kalaqawwan haaraa, dhiyeessii addaa, fi hubannoowwan daldala keessan sadarkaa itti aanutti ol guddisan argachuuf nu waliin walitti hidhamiinsa qabaadhaa.

Saffisaan Naanna'uu

Geekvalue: Maashiniiwwan Pick-and-Place jedhamuuf dhalate

Hogganaa furmaata bakka tokkoo kan chip mounters

Akka dhiyeessaa Maashinii fi Akseesoora SMTtti, Geekvalue Maashinii fi Akseesoora SMT haaraa fi kan itti fayyadaman maqaa beekamoo irraa gatii baayyee dorgomaa ta'een dhiyeessa.

NU QUNNAMTII

Teessoo quunnamtii:

Lakk 18, Daandii Industirii Shangliao, Magaalaa Shajing, Aanaa Baoan, Shenzhen, Chaayinaa

Lakkoofsa bilbilaa marii:

+86 13823218491

Imeelii:

smt-gurgurtaa3@gdxinling.cn irraa argattu

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