SAKI 3D spi smt igurisha paste imashini igenzura 3Si-MS2

SAKI 3Si-MS2 ni sisitemu yo kugenzura neza ya 3D igurisha paste igenewe imirongo igezweho ya SMT. Ikoresha tekinoroji ya 3D yerekana amashusho kugirango ihite imenya ingano, uburebure, nuburyo bwa paste yagurishijwe nyuma yo gucapa na mbere ya SMT, ikumira neza inenge yo kugurisha no kuzamura umusaruro (FPY). Ikoreshwa cyane muburyo bwo kugenzura ubuziranenge bwa PCB zo mu rwego rwo hejuru nkibibaho bya terefone igendanwa, ibikoresho bya elegitoroniki, na seriveri.

2. Ihame ryikoranabuhanga ryibanze

Technology Ikoranabuhanga rya 3D

Ukoresheje lazeri triangulation + itunganijwe yumucyo uteganijwe muburyo bubiri:

Gusikana Laser (Triangulation ya Laser)

Umurongo-wuzuye wa laser umurongo usikana uwagurishije paste hejuru, ufata urumuri rwerekanwe ukoresheje kamera ya CCD, kandi ubara amakuru ya Z-axis yuburebure

Ukuri kwa 1.5μm (Z axis), ibereye ibice byiza cyane (01005)

Itara ryubatswe (Umucyo wubatswe)

Ibice byinshi byerekana urumuri, byongera ubushobozi bwa 3D kontour yo kugarura padi igoye (nka BGA, QFN)

Gukemura ikibazo "igicucu ingaruka" ya laser yogusikana kumpande zihanamye

Process Uburyo bwo kumenya ubwenge

Umwanya wa PCB → gusikana ibintu byinshi → Kwerekana 3D → Gusesengura inenge ya AI feedback ibitekerezo bya SPC

3. Ibyingenzi bikora

🔹 1. Ibintu byose byagurishijwe kugurisha paste

Ibintu byo gutahura Ibipimo byukuri Igikorwa akamaro

Umubumbe (Umubumbe) ± 3% Menya amabati ahagije kugirango wirinde kugurisha imbeho cyangwa amabati adahagije

Uburebure (Uburebure) ± 1.5μm Kugenzura kugurisha paste kugwa no kwirinda ikiraro

Agace: ± 5μm Menya gucapisha offset cyangwa guhagarika stencil

Imiterere: Kugereranya 3D kontour Menya inenge zifatika nko gukurura inama no kwiheba

🔹 2. Ubushobozi buhanitse bwo kumenya inenge

Ubwenge busanzwe:

Paste idahagije

Briding

✅ Kudahuza

Pe Peaking / Dimming

Cont Kwanduza

Kugaragaza ibintu bidasanzwe:

Compensation Indishyi zinyuranye zingana kuri stencil intambwe

✔ Solder paste gukurura inama iranga ikibuga cyiza QFN

🔹 3. Isesengura ryamakuru ryubwenge

Igenzura-nyaryo rya SPC: Mu buryo bwikora gutanga raporo ya CPK / PPK kugirango ikurikirane icapiro ryimikorere

Gufunga-gusubiramo ibitekerezo: Hindura mu buryo bwikora ibipimo bya printer (nkumuvuduko wa scraper n'umuvuduko)

4. Ibyuma bisobanurwa nibikoresho

System Sisitemu nziza

Ibigize Ibipimo

Inkomoko ya Laser 650nm laser itukura, gusikana inshuro 20kHz

Itara ryubatswe ryerekanwe Ubururu LED umurongo wubururu, imiterere 5μm

Kamera miliyoni 5 pigiseli yihuta ya CMOS, igipimo cya 120fps

Sisitemu yumucyo Sisitemu Impeta LED + coaxial yumucyo, 8 uburyo bwo gucana

Performance Imikorere ya mashini

Ibisobanuro byumushinga

Umuvuduko wo gutahura Ntarengwa 45cm² / s (uburyo bwihuse)

Ingano ya PCB ingana na 50mm × 50mm ~ 510mm × 460mm

Ikintu ntarengwa cyo gutahura 01005 (0.4mm × 0.2mm)

Subiramo neza X / Y: ± 3μm, Z: ± 1.5μm

Sisitemu yimodoka Ikomeye cyane umurongo wa moteri, kwihuta 1.5G

Platform Porogaramu

Sisitemu y'imikorere ya SAKI VisionPro

Igishushanyo mbonera cya porogaramu, shyigikira kwigana kumurongo (OLP)

Imikorere yo kwiyigisha AI: gukora byikora neza kurwego rwo gutahura

Raporo y'ibisohoka: PDF / Excel, inkunga kubishusho byihariye

5. Ibicuruzwa byingenzi byingenzi

Kuringaniza neza kandi byihuse

Z-axis itomoye ± 1.5μm, mugihe ikomeza umuvuduko wo gutahura 45cm² / s, 20% byihuse kuruta ibikoresho bisa

Guhindura byikora muburyo bubiri bwo gusikana (laser + urumuri rwubatswe), hitabwa kubikorwa byombi

Level Urwego rwo hejuru rwubwenge

Kwiga byimbitse algorithm: gutondekanya byubwoko bwinenge, igipimo cyibimenyesha <2%

Amatara yo guhuza n'imihindagurikire y'ikirere: ikuraho ibara rya PCB / kwivanga

6. Imanza zisanzwe zo gusaba

Ibyuma bya elegitoroniki

Ububiko bwa terefone igendanwa: gutahura ibicuruzwa byacapishijwe ibikoresho bya CSP 0.3mm

Agasanduku ko kwishyiriraho amatwi ya TWS: kugenzura amajwi mato mato (0.2mm diameter)

Ibyuma bya elegitoroniki

Module ya ADAS: menya neza ko BGA igurisha paste yuzuye> 90% (ijyanye na IPC Icyiciro cya 3)

Imodoka yerekana: FPC yoroheje ikibaho cyandika icapiro ryiza

Equipment Ibikoresho byo mu nganda

Seriveri ya CPU sock: gutahura koplanarite yerekana ubunini bunini

5G shingiro rya sitasiyo PA module: kugurisha paste molding kugenzura ibikoresho byinshyi

7. Ibyiza ugereranije nibicuruzwa birushanwe

Igipimo SAKI 3Si-MS2 Ibisanzwe 3D SPI 2D SPI

Gutahura tekinoroji Laser + yubatswe urumuri rwuburyo bubiri Uburyo bumwe bwa laser yogusuzuma Igishushanyo mbonera gusa

Z-axis yukuri ± 1.5μm ± 3 ~ 5μm Ntibishobora gupima

Umuvuduko 45cm² / s Mubisanzwe 30 ~ 35cm² / s Byihuta ariko bigarukira mumikorere

Kumenyekanisha neza AI gutondekanya 20+ inenge algorithm yibanze (ubwoko 5-10) Gusa isesengura rya kontour

8. Incamake

SAKI 3Si-MS2 itanga umusaruro mwinshi wa SMT hamwe na 3D-yerekana amashusho menshi + AI isesengura ryubwenge:

Kwirinda inzira: fata ibirenga 95% byamakosa yagurishijwe mbere yo guterwa

Guha imbaraga amakuru: igihe nyacyo SPC itwara uburyo bwo gucapa neza

Guhuza n'imihindagurikire y'ikirere: kumenya neza kuva 01005 kugeza kuri BGA nini