SAKI 3D spi smt mashiinka koodhka alxanka 3Si-MS2

SAKI 3Si-MS2 waa nidaamka kormeerka koollada alxanka 3D-sax-sare ee loogu talagalay khadadka wax-soo-saarka casriga ah ee SMT. Waxay isticmaashaa tignoolajiyada sawirka 3D-ka badan si ay si toos ah u ogaato mugga, dhererka, iyo qaabka koollada alxanka ka dib daabacaadda iyo ka hor SMT, si wax ku ool ah uga hortagto cilladaha alxanka iyo hagaajinta dhalidda ka gudubka (FPY). Waxaa inta badan loo adeegsadaa habraaca kontoroolka tayada PCB-yada heerka sare ah sida Motherboard-yada moobilka, Elektrooniga baabuurta, iyo server-yada.

2. Mabda'a tignoolajiyada aasaasiga ah

📌 Farsamada sawirka 3D

Isticmaalka saddex-geesoodka laysarka + qaab-dhismeed iftiinka iftiinka laba qaab:

Iskaanka Laser (Laser Triangulation)

Laydhka saxda ah ee saxda ah wuxuu baadhayaa dusha koollada alxanka, wuxuu ku qabtaa iftiinka kaamirada CCD, wuxuuna xisaabiyaa xogta dhererka dhidibka Z

Saxnimada ± 1.5μm ( dhidibka Z), oo ku habboon qaybaha garoonka aadka u-fiican (01005)

Saadaasha iftiinka habaysan (Iftiin habaysan)

Saadaasha nalka xariijinta xagal badan, waxay wanaajisaa awooda dib u soo celinta koodhka 3D ee suufka adag (sida BGA, QFN)

Xalli dhibaatada "saamaynta hadhku" ee iskaanka laysarka ee cidhifyada dhaadheer

📌 Habka ogaanshaha garaadka

Meelaynta PCB → iskaanka dhinacyo badan leh → qaabaynta 3D → falanqaynta cillad AI → jawaab celinta xogta SPC

3. Astaamaha shaqada muhiimka ah

🔹 1. Ogaanshaha koollada alxanka oo buuxa

Alaabta lagu ogaanayo Cabbirka saxnaanta habka muhiimka ah

Mugga (mugga) ± 3% Hubi daasadda ku filan si looga fogaado alxanka qabow ama daasadda aan ku filnayn

Dhererka (Dhererka) ± 1.5μm Xakamaynta koollada alxanka ayaa burbura kana hortagaya isku xidhka

Aagga: ± 5μm Aqoonso xannibaadyada daabacaadda ama xannibaadda stencil

Qaabka: Isbarbardhigga konturrada 3D Soo ogow cilladaha qaabeynta sida caarada jiid iyo niyad-jabka

🔹 2. Awoodaha ogaanshaha cilladaha sare

Caymiska caadiga ah:

✅ Dheello aan ku filnayn

✅ Isku xidhid

✅ Habacsanaan

✅ Kor u kaca/Dimmaynta

✅ Wasakhda Stencil

Ogaanshaha goobta gaarka ah:

✔ Magdhowga kala duwanaanshaha dhumucdiisuna waxay u tahay stencil tallaabo

✔ Aqoonsiga caarada jiidida koollada alxanka ee QFN garoon

🔹 3. Falanqaynta xogta garaadka

Xakamaynta waqtiga-dhabta ah ee SPC: Si toos ah u soo saar warbixinnada CPK/PPK si loola socdo xasilloonida habka daabacaadda

Jawaab celin xiran: Si toos ah u hagaaji xuduudaha daabacaha (sida cadaadiska xoqida iyo xawaaraha)

4. Tilmaamaha qalabka iyo habaynta

📌 Nidaamka indhaha

Qaybaha Parameters

isha Laser 650nm laser cas, inta jeer ee iskaanka 20kHz

Saadaasha nalka qaabaysan ee nalka laydhka buluuga ah, xallinta 5μm

Kamarada 5 milyan pixel-xawaaraha sare ee CMOS, heerka jir 120fps

Nidaamka isha iftiinka Ring LED + isku dhafka iftiinka coaxial, 8 qaababka iftiinka la hagaajin karo

📌 Waxqabadka makaanikada

Tilmaamaha Mashruuca

Xawaaraha ogaanshaha ugu badnaan 45cm²/s (qaab xawaare sare leh)

Cabbirka PCB wuxuu u dhexeeyaa 50mm × 50mm ~ 510mm × 460mm

Cunsurka ogaanshaha ugu yar 01005 (0.4mm×0.2mm)

Ku celi saxnaanta X/Y: ± 3μm, Z: ± 1.5μm

Habka dhaqdhaqaaqa Matoor toosan oo adag, dardargelinta 1.5G

📌 Software platform

Nidaamka hawlgalka SAKI VisionPro

Interface barnaamij garaafeed, taageer jilitaanka offline (OLP)

Shaqada is-barasho ee AI: hagaajinta tooska ah ee heerka ogaanshaha

Ka warbixi qaabka wax soo saarka: PDF/Excel, taageerada qaab-dhismeedka gaarka ah

5. Faa'iidooyinka asaasiga ah ee alaabta

✅ Isku dheelitirnaanta saxda ah iyo xawaaraha

Saxanka dhidibka Z-± 1.5μm, iyadoo la ilaalinayo xawaaraha ogaanshaha ee 45cm²/s, 20% ka dhakhso badan qalabka la midka ah

U beddelashada tooska ah ee qaababka iskaanka laba-geesoodka ah (laser + iftiin habaysan), iyadoo la tixgelinayo waxtarka iyo saxnaanta labadaba.

✅ Aqoon heer sare ah

Algorithm barashada qoto dheer: kala soocida tooska ah ee noocyada cilladaha, heerka digniinta beenta ah <2%

Iftiinka la qabsiga: baabi'inta PCB midabka/faragelinta milicsiga

6. Kiisaska codsiga caadiga ah

📱 Qalabka elektarooniga ah ee macaamiisha

Motherboard-ka taleefanka gacanta: ogaanshaha daabacaadda koollada alxanka ee aaladaha CSP ee 0.3mm

TWS sanduuqa ku dallaca taleefoonka dhegta: xakamaynta mugga suufka yaryar (dhexroor 0.2mm)

🚗 Gawaarida Elektarooniga ah

module ADAS: hubi buuxinta koollada BGA ee heerka buuxinta> 90% (waafaqsan IPC Class 3)

Bandhiga gaadhiga dhexdiisa: FPC boodhka dabacsan ee daabacaadda tayada la socodka

🖥️ Qalabka warshadaha

Socket CPU Server: Ogaanshaha wadajirka ee suufka cabbirka weyn

5G saldhiga saldhiga PA module: alxanka koollada xakamaynta ee alaabta soo noqnoqda sare

7. Faa'iidooyinka marka la barbar dhigo alaabta tartanka

Cabbirka SAKI 3Si-MS2 Caadiga ah 3D SPI 2D SPI

Tignoolajiyada ogaanshaha Laser + qaab-dhismeed nalka oo habaysan oo sawir-qaadis laser kaliya ah

Saxanka dhidibka Z-±1.5μm ±3~5μm Lama qiyaasi karo

Xawaaraha 45cm²/s Caadiyan 30 ~ 35cm²/s Si ka dhakhso badan laakiin shaqadiisa xaddidan tahay

Aqoonsiga cilladda leh ee AI kala soocida 20+ cilladood Algorithm aasaasiga ah (noocyada 5-10) Falanqaynta muraayadaha oo kaliya

8. Kooban

SAKI 3Si-MS2 waxay siisaa wax soo saarka cufnaanta sare ee SMT oo leh sawir 3D-muuqaal badan leh + falanqaynta caqliga AI:

Habka ka hortagga: dhexda in ka badan 95% cilladaha koollada alxanka ka hor inta aan la dhejin

Xoojinta xogta: SPC-waqtiga-dhabta ah waxa ay wadaa hagaajinta habka daabacaadda

La qabsiga dabacsan: ogaanshaha daboolka buuxa laga bilaabo 01005 ilaa BGA weyn