ali ndi 70% pa Magawo a SMT - Mu Stock & Okonzeka Kutumiza
Pezani Quote →Mapulatifomu a BESI flip chip bonder amagwiritsidwa ntchito pa ntchito zolumikizirana za semiconductor zomwe zimafuna malo olondola a die, kuyang'anira zinthu, kuyang'anira mawonekedwe ndi magwiridwe antchito obwerezabwereza. Kutengera ndi DATACON kapena Esec configuration, makina a BESI flip chip akhoza kuyesedwa kuti apeze mass-reflow flip chip, multi-chip assembly, wafer-level packaging ndi mapulogalamu osankhidwa apamwamba a chip-to-substrate.
Cholumikizira cha flip chip choyenera chimadalira njira yogwirira ntchito, kukula kwa die, mawonekedwe a wafer ndi substrate, njira yokonzekera flux kapena zinthu, kulolera malo, kufunikira kwa kuyang'anira, throughput throughput ndi kasinthidwe ka makina omwe aperekedwa.
BESI flip chip bonder ndi nsanja yolumikizirana ya semiconductor yomwe imayika ma flipped dies pa substrates, zonyamulira, mipiringidzo kapena mitundu ina ya phukusi yokhala ndi kulinganiza kolamulidwa ndi kayendetsedwe ka njira. Pakupanga kogwira ntchito, makina ayenera kuyesedwa ngati dongosolo lathunthu osati ngati chida chosavuta choyikira.
Cholumikizira cha DATACON flip chip chingaphatikizepo mitundu yosiyanasiyana ya mitu yosankha ndi kuyika, zida zosinthira, makamera owonera, ma module odumphira kapena odumphira, kugwiritsa ntchito wafer, kugwira ntchito ya substrate, kuyang'anira pambuyo pa bond ndi ntchito zobwezeretsa. Ma module omwe adayikidwawa amatsimikizira ngati makina omwe aperekedwawo angathandize njira inayake yopangira phukusi.
Pulatifomu yomwe ingaike die siiyenera yokha kuti igwiritsidwe ntchito pa njira inayake yosinthira chip. Funso lofunika kwambiri ndilakuti ngati kasinthidwe komwe kaperekedwako kangathe kumaliza njira yofunikira ya phukusi nthawi zonse pamlingo wofunikira wotulutsa ndi wokolola.
Machitidwe a BESI flip chip amasiyana njira zogwirira ntchito. Gome ili pansipa limapereka njira yolinganiza mabanja a nsanja musanayese chipangizo china chogwiritsidwa ntchito kapena chokonzedwanso.
Banja la nsanja, zosankha zoyikidwa, zida zogwirira ntchito, zida zogwiritsira ntchito, ndi momwe makina alili zonse zimakhudza kuyenerera kwa dongosolo lomwe laperekedwa.
| Nsanja | Malangizo Owunikira Kawirikawiri | Mafunso Okhudza Njira Zotsimikizira | Kuyang'ana Kwambiri pa Kuwunika Zipangizo Zogwiritsidwa Ntchito |
|---|---|---|---|
| DATACON 8800 FC QUANTUM hSPulatifomu ya flip chip yothamanga kwambiri. | Kupanga Ma Chip Opangidwa ndi Volume YaikuluUnikani kukula kwa die, mawonekedwe a wafer, momwe substrate imagwirira ntchito, njira yogwiritsira ntchito, kuyang'anira pambuyo pa bond ndi zofunikira pakubwezeretsa. | Kuwongolera Njira Zachangu KwambiriTsimikizirani momwe ma nozzle amakhazikitsidwira, makina owonera, njira yotulutsira filimu, ntchito zowunikira, momwe nozzle imagwirira ntchito komanso momwe madzi amayendera. | Kutsimikizira Kuzungulira ndi Kuchuluka kwa ZokololaUnikani momwe kamera imagwirira ntchito, momwe kamera imagwirira ntchito, zida zomwe zayikidwa, momwe kamera imagwirira ntchito komanso zotsatira za mayeso ogwira ntchito pogwiritsa ntchito zipangizo zoyimira. |
| DATACON 8800 FC QUANTUM yotsogolaPulatifomu yopanga ma chips opindika pang'onopang'ono. | Msonkhano Wolamulidwa wa Chip-to-SubstrateUnikani kukula kwa die, kuchuluka kwa mphamvu ya bond, njira yosinthira, kasinthidwe ka kamera, zofunikira pakuyika ndi mbiri yopangira yomwe mukufuna. | Njira ndi Kulamulira ZokololaTsimikizirani dongosolo la CRYSTAL fluxer, ntchito zowunikira pambuyo pa bond, kayendedwe ka zinthu, mawonekedwe a substrate carrier ndi zosankha zodziyimira pawokha. | Kuwunikanso kwa Makonzedwe ndi MapulogalamuTsimikizani momwe zinthu zilili pa njira yoikidwiratu, deta yowunikira, kukhazikitsidwa kwa masomphenya, momwe zinthu zilili pa chowongolera, zida zomwe zilipo, ndi kuchuluka kwa kukonzanso. |
| DATACON 8800 FC QUANTUM advXMitundu yayikulu ya ntchito yogwiritsira ntchito chip-to-substrate. | Kupanga Chip Chosinthasintha ChosinthasinthaUnikani kukula kwa chip, kukula kwa substrate, kuchuluka kwa kupanga, dongosolo la flux dipping, phukusi lodzipangira lokha komanso zofunikira pakuwongolera zokolola. | Kulinganiza Liwiro ndi KulondolaTsimikizani zida za dual-gantry, mawonekedwe a maso, kuthekera kodumphira, ma module ogwirira ntchito komanso kugwirizana kwa njira ndi phukusi lomwe mukufuna. | Kutsimikizika kwa Module YoyikidwaTsimikizirani kuti ndi ma module ati a maso, zida zonyamulira, ma nozzles, ma feeder, zida ndi zowonjezera zomwe zili mu chipangizocho. |
| DATACON 8800 CHAMEO yapamwambaChip yokhala ndi ma chip ambiri komanso pulatifomu yogwirira ntchito yotulutsa fan-out. | Kuwunika kwa Multi-Chip ndi FO-WLPUnikani njira yoyendetsera phukusi poyang'ana mmwamba kapena molunjika pansi, momwe limagwirira ntchito, njira yoyendetsera phukusi, mawonekedwe a phukusi, kukhudzidwa kwa warpage ndi njira yowunikira. | Kuyenerera kwa Njira Yogwirizana ndi PhukusiTsimikizani mtundu wa chonyamulira, njira yogwirira ntchito, phukusi la masomphenya, zida, mawonekedwe a zinthu ndi kuyenerera kwa ntchito yomwe mukufuna kugwiritsa ntchito pamlingo wa wafer. | Ndemanga Yofananira ndi NtchitoTsimikizani kuti kasinthidwe ka CHAMEO komwe kaperekedwa kanapangidwira njira yofananira m'malo moganiza kuti mayunitsi onse amatha kusinthana. |
| Esec 2100 FC hSPulatifomu yothamanga kwambiri yosinthira ma chip kuti igwiritsidwe ntchito ndi FC. | Kupanga Phukusi la FC Lokhala ndi Volume YaikuluUnikani mtundu wa phukusi, miyeso ya die, njira ya leadframe kapena substrate, chiyembekezo cha throughput, mawonekedwe a mzere ndi zofunikira pakupanga ndi kukolola. | Kugwiritsa Ntchito ndi Kuphatikizana KuyeneraTsimikizirani kakonzedwe ka zida, kayendedwe ka zinthu, zida zogwirira ntchito, kuyang'anira komwe kulipo, ma module ogwirira ntchito komanso kugwirizana ndi mzere wa backend womwe ulipo. | Thandizo ndi Kukonzekera kwa Zigawo ZotsaliraYang'anani kupanga kwa owongolera, momwe masomphenya alili, momwe amakhazikitsira chakudya, zikalata zomwe zilipo, njira yothandizira komanso momwe zinthu zofunika kwambiri zimagwirira ntchito. |
Choyikapo flip chip nthawi zambiri chimagwiritsidwa ntchito ngati mawu ofufuzira ambiri a zida zomwe zimayika ma bumped dies pa substrates kapena zonyamulira. Mu uinjiniya wopanga, flip chip bonder iyenera kuwonedwanso ngati njira yonse yoyendetsera ntchito yomwe imayang'anira kunyamula ma die, kulondolera, kusinthasintha kapena kumiza, kulinganiza, kuyika, kuyang'anira, kubwezeretsanso ndi kuphatikizana kwapansi.
Pachifukwa ichi, choyika BESI flip chip kapena makina a DATACON sayenera kusankhidwa pokhapokha ngati pali kulondola kwa malo osindikizidwa kapena kutulutsa kwapadera. Njira yokonzekera phukusi ndi kasinthidwe kake kamene kayikidwa ziyenera kuunikidwanso kaye.
Funso lalikulu si kungofuna kudziwa ngati makina angathe kuyika dizilo. Koma ndi ngati chida, kukonzekera zinthu, njira yowonera, ndi momwe zinthu zimagwiritsidwira ntchito zingathe kupanga phukusi lofunikira moyenera pansi pa mikhalidwe yeniyeni yopangira.
Ma workflows osiyanasiyana a flip chip amafuna njira zosiyanasiyana zogwiritsira ntchito, machitidwe ogwiritsira ntchito, njira zolumikizirana, ndi milingo yowunikira. Magulu a ndondomekozi amathandiza kufotokozera bwino kuwunika kwa zida asanayang'ane nsanja inayake.
Pulogalamu iliyonse iyenera kutsimikiziridwa malinga ndi kasinthidwe ka dongosolo, zida zogwirira ntchito, kayendedwe ka zinthu, ndi zotsatira zake zoyenerera.
Unikani kukula kwa die, kapangidwe ka bump, chimango cha wafer, mawonekedwe a substrate kapena strip, flux dipping, cavity plate, placement tolerance, post-bond inspection ndi target UPH.
Unikani ndondomeko ya die, zida zingapo zosankhidwa ndi kuyikidwa, mawonekedwe a chonyamulira, mawonekedwe a nkhope mmwamba kapena pansi, mawonekedwe a phukusi, kukhudzidwa kwa warpage ndi njira yowunikira.
Unikani momwe zinthu zimagwiritsidwira ntchito, momwe zinthu zimayendera pamlingo wa wafer, momwe zinthu zimachitikira poyang'ana mmwamba kapena pansi, mawonekedwe a phukusi, zosowa za chipinda choyeretsera, zofunikira pakugwiritsa ntchito zida ndi metrology.
Unikani kuchuluka kwa makina odziyimira pawokha, kuchuluka kwa kusintha kwa zinthu, kuyenda kwa wafer ndi substrate, kukonzekera zinthu, nthawi yowunikira, momwe zinthu zimagwirira ntchito komanso zofunikira pakulumikiza mizere.
BESI DATACON flip chip bonder iyenera kuyesedwa ngati kapangidwe kathunthu kopangira. Dzina la nsanja yokha silikutsimikizira ngati makina omwe aperekedwa ali ndi zida, mapulogalamu, zida, ndi chithandizo cha njira zomwe zimafunikira pa njira inayake ya phukusi.
Zipangizo zogwiritsidwa ntchito za flip chip zitha kugwiritsidwa ntchito pamalonda ngati mtundu wa nsanja, momwe makina alili, zida zomwe zayikidwa, kasinthidwe ka njira ndi kukonzekera kothandizira zatsimikiziridwa musanatumize.
Pemphani zithunzi za makina omwe alipo, mndandanda wa zosankha zomwe zayikidwa, tsatanetsatane wa njira ndi zida, zambiri zoyesera, momwe zinthu zilili komanso momwe mungakonzere bwino.
Tsimikizani ngati makinawo ndi FC QUANTUM hS, advanced, advX, CHAMEO advanced, Esec 2100 FC hS kapena makonzedwe ena, kenako tsimikizirani tsatanetsatane wa nambala ya serial ndi ma module akuluakulu omwe adayikidwa.
Unikani zida zoti musankhe ndi kuziyika, zida zotulutsira, zida zosinthira, mitu yolumikizira, ma nozzles, zida zosinthira, kuwonongeka kwa zida ndi kupezeka kwa zida zina zogwirizana nazo.
Tsimikizirani makamera, ma optics, kuunikira, ntchito zogwirizanitsa, kuyang'anira pambuyo pa bond, momwe zinthu zilili komanso kupezeka kwa zinthu zina zowonera.
Tsimikizirani kuviika kwa madzi m'madzi, kusuntha kwa madzi m'madzi, mbale zotsekeka m'mabowo, ma module operekera madzi, kuwonetsa zinthu, njira zoyeretsera komanso momwe zipangizo zimagwirira ntchito.
Tsimikizirani mafelemu a wafer, ma tray, ma strips, maboti, zonyamulira, ma leadframes, zida zogwiritsira ntchito pansi, ma feeder ndi ma module onse osamutsira zinthu omwe amafunikira pa ndondomeko yowunikira.
Yang'anani zida zowongolera, momwe kompyuta ilili, malo ogwiritsira ntchito mapulogalamu, zolumikizira zobwezeretsa, zosankha zoyatsidwa, deta yoyendetsera, ntchito za barcode kapena mapu ndi zolemba zaukadaulo.
Fotokozani zinthu zoyimira, ndondomeko ya mayeso, malo oyikamo ndi njira zogwirira ntchito, zofunikira pakuwunika, zotsatira zomwe mukufuna komanso momwe mungavomerezere musanatumize.
Fotokozani njira yopakira, zofunikira zamagetsi ndi zofunikira pa ntchito, kukula kwa kuyika, maphunziro, dongosolo la zinthu zina, chithandizo cha njira ndi njira yoyankhira pambuyo poyika.
Gwiritsani ntchito matrix iyi kuti mukonze mafunso aukadaulo omwe ayenera kuyankhidwa musanasankhe DATACON kapena Esec flip chip system ya pulogalamu inayake yolumikizira semiconductor.
Kuthekera kwa nsanja yofalitsidwa ndi poyambira. Kuyenerera komaliza kumafuna kutsimikizira kakonzedwe kake, zida zake, ndi momwe zinthu zilili.
| Kapangidwe ka Die ndi Bump | Tsimikizirani kukula kwa die, makulidwe, mtundu wa bump, phokoso la bump, momwe kumbuyo kulili, kufooka, momwe zinthu zilili komanso njira yonyamulira. |
|---|---|
| Njira Yopangira Zinthu | Tsimikizirani ngati njira yogwiritsira ntchito ikufunika kuviika madzi m'madzi, kusakaniza madzi, zomatira, kusungunula madzi, njira ina yokonzekera zinthu kapena njira yoyeretsera yapadera. |
| Kuyenda kwa Wafer ndi Substrate | Tsimikizirani chimango cha wafer, thireyi, mzere, bwato, chonyamulira, chimango cha lead, kukula kwa substrate, ndondomeko yonyamulira katundu, njira yotulutsira katundu ndi zofunikira pakusamutsa zinthu. |
| Zofunikira pa Malo Oyikira | Fotokozani kulekerera kwa X/Y/theta pansi pa mikhalidwe yeniyeni ya ndondomeko, kuphatikizapo geometry ya die, mkhalidwe wa zinthu, kukhazikika kwa substrate ndi kuzungulira kwa kupanga komwe kumayang'aniridwa. |
| Zotuluka ndi Kusintha | Unikani UPH yomwe mukufuna, kusakaniza kwa zinthu, kuchuluka kwa kusintha kwa zinthu, kuchuluka kwa zida zogwiritsira ntchito, nthawi yowunikira, momwe zinthu zimagwirira ntchito komanso zofunikira pakuphatikiza mizere. |
| Kuwongolera Zokolola ndi Kuyang'anira | Tsimikizani kuyang'aniridwa kwa pambuyo pa bond, macheke a die crack kapena chips, momwe chida chilili, mphamvu ya kamera, njira yowerengera ndi njira zovomerezeka. |
| Kukonzekera kwa Zida Zogwiritsidwa Ntchito | Tsimikizirani mayendedwe, masomphenya, chowongolera, mapulogalamu, ma module a process, zida, mwayi wopezera zinthu zina, zikalata zomwe zilipo komanso kuchuluka kwa chithandizo. |
Mafunso awa akuyankha mavuto omwe nthawi zambiri amafunika kufotokozedwa bwino musanayerekeze, kugula kapena kukonzanso BESI DATACON flip chip bonder.
BESI flip chip bonder ndi nsanja yolumikizirana ya semiconductor yomwe imagwiritsidwa ntchito kuyika ndikugwirizanitsa ma dies opindidwa pa substrates, zonyamulira, mipiringidzo kapena mitundu ina ya phukusi. Njira yoyenera yogwirira ntchito imadalira DATACON yeniyeni kapena Esec configuration, njira yokonzekera zinthu, ma module ogwiritsira ntchito ndi zida zoyikidwa.
Choyika ma chip nthawi zambiri chimagwiritsidwa ntchito ngati mawu ofotokozera zida zoyika ma die. Poyesa kupanga, choyika ma chip chiyenera kuyesedwa ngati njira yonse yogwirira ntchito yomwe imaphatikizapo kutenga, kutembenuza, kukonzekera zinthu, kulinganiza, kuyika, kuyang'anira ndi kusamalira zobwezeretsa.
Cholumikizira cha DATACON flip chip chikutanthauza nsanja ya DATACON yopangidwira ntchito za flip chip. Makina osiyanasiyana a DATACON amatha kuyesedwa kuti agwiritse ntchito mass-reflow flip chip, multi-chip assembly, wafer-level packaging kapena njira zina za chip-to-substrate kutengera ma module ndi zida zomwe adakhazikitsa.
BESI imalemba DATACON 8800 FC QUANTUM hS, FC QUANTUM advanced, FC QUANTUM advX ndi DATACON 8800 CHAMEO advanced mkati mwa gulu lake la flip chip platform. Kuyenerera kumadalira njira yeniyeni yogwirira ntchito komanso kasinthidwe komwe kalipo.
Makonzedwe a FC QUANTUM nthawi zambiri amawunikidwa kuti aone ngati pali mass-reflow flip chips. CHAMEO advanced nthawi zambiri imawunikidwa kuti igwiritse ntchito ma multi-chip ndi fan-out wafer-level workflows. Kusankha kolondola kumadalirabe kapangidwe ka phukusi, njira yogwiritsira ntchito, zofunikira pakugwira ntchito, ndi zida zoyikidwa.
Ma configurations ena a DATACON 8800, makamaka CHAMEO advanced, amawunikidwa kuti agwire ntchito ndi ma multi-chip workflows. Makina omwe akuperekedwa ayenera kufufuzidwa kuti awone ngati ali ndi carrier processing, die sequence, face-up kapena face-down process mode, package tooling, ndi kuwunika komwe kulipo.
Tsimikizirani mtundu weniweni wa nsanja, ma module oyendetsera, zida zosankhidwa, makina owonera, zida zokonzekera zinthu, kasamalidwe ka wafer ndi substrate, momwe wowongolera alili, zosankha za mapulogalamu, zida zomwe zilipo, zolemba zowunikira ndi zambiri zoyeserera zogwira ntchito.
Ayi. Choyikamo cha BESI flip chip chiyenera kufananizidwa ndi miyeso yeniyeni ya die, kapangidwe ka bump, njira ya zinthu, mawonekedwe a wafer ndi substrate, zofunikira pakuyika, njira yowunikira, zotsatira zomwe zaperekedwa, ndi zida zomwe zikupezeka pakukonza.
Perekani chithunzi cha phukusi, kukula kwa die, makulidwe a die, mtundu wa bump, njira ya zinthu, mawonekedwe a wafer kapena thireyi, kukula kwa substrate, UPH yolunjika, kulolerana kwa malo, zofunikira pakuwunika ndi zoletsa zilizonse zomwe zilipo.
DATACON 2200 evo ndi nsanja yosinthika ya Multi Module Attach yomwe ingayesedwe kuti igwirizane ndi ma die attach, ma multi-chip ndi ma flip-chip workflows osankhidwa. Iyenera kuwunikidwanso padera ndi machitidwe a DATACON 8800 pamene kusinthasintha kwakukulu kwa njira kapena zida zinazake za pulogalamu zikufunika.
Gawani zojambula zanu za phukusi, kapangidwe ka die ndi bump, njira yogwiritsira ntchito, mawonekedwe a wafer kapena substrate, zotuluka zomwe zili mu target ndi tsatanetsatane uliwonse wa makina omwe alipo. Izi zimapangitsa kuti zikhale zotheka kuwona ngati DATACON kapena Esec configuration yomwe yaperekedwa ndiyoyenera kugwiritsidwa ntchito pa mzere wanu wopanga.
Chifukwa chiyani anthu ambiri amasankha kugwira ntchito ndi GeekValue?
Mtundu wathu ukufalikira kuchokera ku mzinda kupita ku mzinda, ndipo anthu osawerengeka andifunsa, "Kodi GeekValue ndi chiyani?" Zimachokera ku masomphenya osavuta: kupatsa mphamvu luso lachi China ndi luso lamakono. Uwu ndi mzimu wodzitukumula mosalekeza, wobisika pakufunafuna kwathu tsatanetsatane komanso chisangalalo chopitilira zomwe tikuyembekezera pakubweretsa kulikonse. Mmisiri waluso komanso kudzipereka uku sikungolimbikira kwa omwe adayambitsa, komanso tanthauzo ndi kutentha kwa mtundu wathu. Tikukhulupirira kuti muyambira pano ndikutipatsa mwayi wopanga ungwiro. Tiyeni tigwire ntchito limodzi kuti tipange chozizwitsa chotsatira cha "zero defect".
ChenLumikizanani ndi katswiri wazogulitsa
Lumikizanani ndi gulu lathu lazamalonda kuti mufufuze mayankho omwe amagwirizana bwino ndi bizinesi yanu ndikuyankha mafunso aliwonse omwe mungakhale nawo.
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