What is a BESI flip chip bonder?

A BESI flip chip bonder is a semiconductor assembly platform used to place and align flipped dies onto substrates, carriers, strips or other package formats. The applicable process route depends on the exact DATACON or Esec configuration, material-preparation method, handling modules and installed tooling.

Is a flip chip mounter the same as a flip chip bonder?

Flip chip mounter is often used as a general term for die-placement equipment. In production evaluation, a flip chip bonder should be assessed as a complete process platform that includes pickup, flipping, material preparation, alignment, placement, inspection and recovery handling.

What is a DATACON flip chip bonder?

A DATACON flip chip bonder refers to a DATACON platform configured for flip chip workflows. Different DATACON systems may be evaluated for mass-reflow flip chip, multi-chip assembly, wafer-level packaging or other chip-to-substrate processes depending on their installed modules and tooling.

Which BESI DATACON platforms are used for flip chip assembly?

BESI lists DATACON 8800 FC QUANTUM hS, FC QUANTUM advanced, FC QUANTUM advX and DATACON 8800 CHAMEO advanced within its flip chip platform group. Suitability depends on the exact process route and offered configuration.

What is the difference between FC QUANTUM and CHAMEO?

FC QUANTUM configurations are typically evaluated for mass-reflow flip chip production. CHAMEO advanced is typically evaluated for multi-chip and fan-out wafer-level workflows. The correct selection still depends on the package design, material route, handling requirement and installed tooling.

Can a DATACON 8800 support multi-chip flip chip applications?

Some DATACON 8800 configurations, particularly CHAMEO advanced, are evaluated for multi-chip workflows. The offered machine must be checked for carrier handling, die sequence, face-up or face-down process mode, package tooling and inspection capability.

What should be checked before buying a used flip chip bonder?

Confirm the exact platform version, process modules, pick-and-place tools, vision system, material-preparation hardware, wafer and substrate handling, controller condition, software options, available tooling, calibration records and functional test information.

Is a BESI flip chip mounter suitable for every flip chip package?

No. A BESI flip chip mounter should be matched to the exact die dimensions, bump structure, material route, wafer and substrate format, placement requirement, inspection strategy, target output and available process tooling.

What information is needed before requesting a BESI flip chip platform recommendation?

Provide the package drawing, die size, die thickness, bump type, material route, wafer or tray format, substrate dimensions, target UPH, placement tolerance, inspection requirement and any existing line constraints.

Can DATACON 2200 evo also be evaluated for flip chip processes?

DATACON 2200 evo is a configurable Multi Module Attach platform that can be evaluated for die attach, multi-chip and selected flip-chip workflows. It should be reviewed separately from DATACON 8800 systems when broader process flexibility or application-specific tooling is required.

Izixhobo Zokuhlanganisa I-Semiconductor Flip Chip

Isikhokelo sePlatform yeBESI Flip Chip Bonder yeDATACON kunye nokuPakisha okuPhambili

Amaqonga e-BESI flip chip bonder asetyenziselwa imisebenzi ye-semiconductor assembly efuna indawo echanekileyo yokudaya, ukuphathwa kwezinto ezilawulwayo, ukulungelelaniswa kombono kunye nokusebenza kwemveliso okuphindaphindwayo. Ngokuxhomekeke kulungiselelo lwe-DATACON okanye lwe-Esec, umatshini we-BESI flip chip unokuvavanywa kwi-mass-reflow flip chip, i-multi-chip assembly, i-wafer-level packaging kunye nezicelo ezikhethiweyo ze-chip-to-substrate eziphezulu.

I-flip chip bonder echanekileyo ixhomekeke kwindlela yenkqubo, ubungakanani bedayi, ifomathi ye-wafer kunye ne-substrate, indlela yokulungiselela i-flux okanye izinto, ukunyamezelana kokubekwa, imfuneko yokuhlolwa, i-target throughput kunye noqwalaselo lokwenyani lomatshini onikezelwayo.

I-Mass-Reflow Flip Chip Iindlela zokusebenza zeMulti-Chip kunye neFO-WLP Uvavanyo lweZixhobo ezisetyenzisiweyo

Ukubonisana kwi-Intanethi Cela uHlolo lweFlip Chip

Yabelana ngomzobo wephakheji, ubungakanani bedayi, ifomathi ye-wafer okanye ye-substrate, izinto zenkqubo kunye nemveliso ekujoliswe kuyo ukuze ufumane uvavanyo oluluncedo ngakumbi lweqonga.

BESI flip chip bonder platform in a semiconductor manufacturing environment

Uvavanyo loBume Vavanya iqonga lenkqubo epheleleyo, kungekuphela nje igama lomatshini.

Isishwankathelo sePlatform yeFlip Chip Semiconductor flip chip bonder with precision die placement and substrate handling

Yintoni iBESI Flip Chip Bonder?

Iqonga leFlip Chip lingaphezulu nje komatshini wokubeka i-die

I-BESI flip chip bonder liqonga le-semiconductor assembly elibeka ii-flipped dies kwi-substrates, abathwali, ii-strips okanye ezinye iifomathi zeepakeji ezinokulungelelaniswa okulawulwayo kunye nokuphathwa kwenkqubo. Kwimveliso ebonakalayo, umatshini kufuneka uvavanywe njengenkqubo epheleleyo kunokuba ube sisixhobo esilula sokubeka.

I-DATACON flip chip bonder ingabandakanya indibaniselwano eyahlukeneyo yeentloko zokukhetha kunye nendawo, izixhobo zokujika, iikhamera zokubona, iimodyuli zokudipha okanye zokujika, ukuphathwa kwe-wafer, ukuphathwa kwe-substrate, ukuhlolwa kwe-post-bond kunye nemisebenzi yokubuyisela. Ezi modyuli zifakiweyo zimisela ukuba umatshini onikezelwayo unokuxhasa na indlela ethile yephakheji.

Umgaqo wokukhetha osebenzayo

Iqonga elinokubeka idayisi alifaneleki ngokuzenzekelayo kwinkqubo ethile ye-flip chip. Umbuzo obalulekileyo kukuba ingaba uqwalaselo olunikezelwayo lungayigqiba na indlela yephakheji ecetywayo rhoqo kwinqanaba lemveliso kunye ne-yield elifunekayo.

Hlola iiPlatforms ze-DATACON 8800 Flip Chip Hlola iiSemiconductor Die Bonders

BESI Flip Chip Platform Landscape

Iinkqubo zeDATACON kunye ne-Esec zeemfuno ezahlukeneyo zeFlip Chip

Iinkqubo ze-BESI flip chips zigubungela iindlela ezahlukeneyo zenkqubo. Itheyibhile engezantsi ibonelela ngendlela ecwangcisiweyo yokuthelekisa iintsapho zeqonga ngaphambi kokuvavanya iyunithi ethile esetyenzisiweyo okanye ehlaziyiweyo.

Thelekisa uqwalaselo ngaphambi kophawu.

Usapho lweplatifomu, iindlela ezifakiweyo, izixhobo zenkqubo, izixhobo kunye nemeko yomatshini zonke zinefuthe ekufanelekileni kwenkqubo ecetywayo.

Iqonga	Isikhokelo soVavanyo oluQhelekileyo	Imibuzo yoQhuba ukuqinisekisa	Ingqwalasela yoHlolo lweZixhobo eziSetyenzisiweyo
I-DATACON 8800 FC QUANTUM hSIqonga le-flip chip elihamba ngokukhawuleza kakhulu.	Ukuveliswa kweeChip ezijijekileyo ezineVolume ephezuluHlola ubungakanani bedayi, ifomathi ye-wafer, ukuphathwa kwe-substrate, i-target throughput, ukuhlolwa kwe-post-bond kunye neemfuno zokubuyisela.	Ulawulo lweNkqubo olukhawulezayoQinisekisa ukuseta i-multi-nozzle, inkqubo yokubona, inkqubo ye-flux-film, imisebenzi yokujonga, imeko ye-nozzle kunye nokuhamba kwe-substrate.	Ukuqinisekiswa koMjikelo kunye neNzuzoHlola imeko yentshukumo, ukusebenza kwekhamera, izixhobo ezifakiweyo, imeko yokulinganisa kunye neziphumo zovavanyo ezisebenzayo ngezixhobo ezimeleyo.
I-DATACON 8800 FC QUANTUM iqhubekileIqonga lokuvelisa iitshiphusi eziphinda zibuyele esiqhelweni.	Indibano eLawulwayo yeChip-to-SubstrateHlola ubungakanani bedayi, uluhlu lwebhondi-force, indlela yokujikeleza, uqwalaselo lwekhamera, imfuneko yokubekwa kunye neprofayili yemveliso ekujoliswe kuyo.	Ulawulo lweNkqubo kunye neNzuzoQinisekisa ulungiselelo lwe-CRYSTAL fluxer, imisebenzi yokuhlolwa kwe-post-bond, ukuhamba kwezinto, ifomathi yokuthwala i-substrate kunye neendlela zokwenza izinto ngokuzenzekelayo.	Uqwalaselo kunye noHlolo lweSoftwareQinisekisa imeko yokhetho olufakiweyo, idatha yokulinganisa, ukuseta umbono, imeko yomlawuli, izixhobo ezikhoyo kunye nobubanzi bokuhlaziya.
I-DATACON 8800 FC QUANTUM advXUluhlu olubanzi lwesicelo se-mass-reflow chip-to-substrate.	Imveliso yeFlip Chip eguquguqukayoHlaziya uluhlu lobungakanani be-chip, ubukhulu be-substrate, umthamo wemveliso, ulungiselelo lwe-flux dipping, iphakheji ye-automation kunye neemfuno zokulawula isivuno.	Isantya kunye nokulinganisela okuchanekileyoQinisekisa ukuba i-hardware ye-dual-gantry, uqwalaselo lombono, amandla okudipha, iimodyuli zokuphatha kunye nokuhambelana kwenkqubo nephakheji ekujoliswe kuyo.	Ukuqinisekiswa kweModyuli eFakiweyoQinisekisa ukuba zeziphi iimodyuli zokubona, izixhobo zokuthwala, ii-nozzles, ii-feeders, izixhobo zokulungisa kunye nezixhobo zokufaka ezifakiwe kwiyunithi ebonelelwayo.
I-DATACON 8800 CHAMEO iqhubekileI-chip ye-multi-chip flip kunye ne-fan-out workflow platform.	Uvavanyo lweMulti-Chip kunye ne-FO-WLPHlaziya indlela yephakheji ejonge phezulu okanye ejonge phantsi, ukuphathwa kwenkampani, ulandelelwano lwedayi, ijiyometri yephakheji, uvakalelo lwe-warpage kunye necebo lokuhlola.	Ukulingana kweNkqubo ethile kwiPhakhejiQinisekisa ifomathi yomphathi, indlela yokuphatha, iphakheji yombono, izixhobo, ukubonakaliswa kwezinto kunye nokufaneleka komsebenzi ocwangcisiweyo wenqanaba le-wafer.	Uhlolo lokuFaniswa kweSiceloQinisekisa ukuba uqwalaselo lwe-CHAMEO olunikezelwayo lwenzelwe indlela yenkqubo efanayo endaweni yokucinga ukuba zonke iiyunithi ziyatshintshana.
I-Esec 2100 FC hSIqonga le-flip chip elikhawulezayo elinoluhlu olubanzi lwezicelo ze-FC.	Imveliso yePakeji yeFC eneVolume ephezuluHlaziya uhlobo lwephakheji, ubukhulu bedayi, indlela yefreyimu okanye yesiseko, ulindelo lokuphuma, ujongano lomgca kunye nemfuneko yemveliso kunye nesivuno.	Ukufaneleka kokusetyenziswa kunye nokuhlanganiswaQinisekisa uqwalaselo lwezixhobo, ukuhamba kwezinto, izixhobo zenkqubo, uhlolo olufumanekayo, iimodyuli zokuphatha kunye nokuhambelana nomgca wasemva okhoyo.	Inkxaso kunye nokuLungela iinxalenye zeSpare-PartJonga ukwenziwa kwesilawuli, imeko yombono, ukuseta i-feeder, amaxwebhu afumanekayo, indlela yokuxhasa kunye nemeko yeenxalenye ezibalulekileyo kwinkqubo.

I-Flip Chip Bonder vs i-Flip Chip Mounter

Kutheni iFlip Chip Mounter ifanele ihlolwe njengeQonga leNkqubo epheleleyo

I-flip chip mounter idla ngokusetyenziswa njengegama elibanzi lokukhangela izixhobo ezibeka ii-bumped dies kwi-substrates okanye kwi-carriers. Kubunjineli bemveliso, i-flip chip bonder kufuneka ihlolwe njengeqonga lenkqubo epheleleyo elilawula i-die pickup, i-orientation, i-fluxing okanye i-dipping, i-alignment, i-placement, i-survey, i-recovery handling kunye ne-downstream integration.

Ngenxa yesi sizathu, i-BESI flip chip mounter okanye umatshini we-DATACON akufuneki ukhethwe kuphela xa kupapashwa ukuchaneka kokubekwa okanye xa kuphuma into ethile. Indlela yephakheji ecetywayo kunye noqwalaselo olufakelweyo kufuneka luhlolwe kuqala.

Isikhumbuzo sobunjineli

Umbuzo ophambili asikokuba umatshini unako na ukufaka idayisi, kodwa kukuba ingaba isixhobo, ukulungiswa kwezinto, inkqubo yokubona kunye nolandelelwano lokuphatha zinokuvelisa iphakheji efunekayo ngokuthembekileyo phantsi kweemeko zokwenyani zemveliso.

Indlela yokuthathwa kweedayi, ubukhulu beedayi, ulwakhiwo lwe-bump kunye nemeko yomqolo
Ukuntywila nge-flux, ukuxubha, ukuncamathelisa okanye enye indlela yokulungisa izinto
Ifomathi yesakhelo se-wafer, itreyi, umthwali, umcu, isikhephe kunye nokuphathwa kwe-substrate
Imfuneko yokubekwa phantsi kweemeko zenkqubo kunye nomjikelo ocetywayo
Ukuhlolwa emva kwebhondi, ulandelelwano lokubuyiselwa kwemali kunye nemfuneko yokulawula isivuno
Izixhobo ezikhoyo, ii-nozzles, izixhobo, inkxaso yokulinganisa kunye nokulungelelaniswa kwenkonzo

I-Flip Chip Process Fit

Zeziphi iindlela zokusebenza zeFlip Chip ezinokuhlolwa yiPlatform yeBESI DATACON?

Iindlela ezahlukeneyo zokusebenza kwe-flip chip zifuna iindlela ezahlukeneyo zezinto, iinkqubo zokuphatha, amaqhinga okulungelelanisa kunye namanqanaba okuhlola. La maqela eenkqubo anceda ekuchazeni uphononongo oluchanekileyo lwezixhobo ngaphambi kokuvavanya iqonga elithile.

Ukufaneleka kuxhomekeke kuqwalaselo oluthile.

Isicelo ngasinye kufuneka siqinisekiswe ngokwendlela echanekileyo yokuseta inkqubo, izixhobo zenkqubo, ukuhamba kwezinto kunye neziphumo zokufaneleka.

I-Mass-Reflow Flip Chip

Hlola ubungakanani bedayi, isakhiwo se-bump, ifreyimu ye-wafer, ifomathi ye-substrate okanye ye-strip, i-flux dipping, i-cavity plate, ukunyamezelana kokubekwa, ukuhlolwa kwe-post-bond kunye ne-target UPH.

Itshiphu yokujika iitshiphu ezininzi

Hlola ulandelelwano lweedayi, izixhobo ezininzi zokukhetha nokubeka, ifomathi yenkampani, ukujonga ubuso phezulu okanye phantsi, ijiyometri yephakheji, uvakalelo lwe-warpage kunye necebo lokuhlola.

Ukupakisha okuphuma kwiFan kunye neWafer

Hlaziya ukuphathwa komthwali, ukuhamba kwezinto kwinqanaba le-wafer, imo yenkqubo yokujonga phezulu okanye ejonge phantsi, ifomathi yephakheji, iimfuno zegumbi lokucoca, iimfuno zezixhobo kunye ne-metrology.

Indibano ye-Chip-to-Substrate eneVolume ephezulu

Hlola inqanaba lokusebenza ngokuzenzekelayo, ubuninzi bokutshintsha, ukuhamba kwe-wafer kunye ne-substrate, ukulungiswa kwezinto, umjikelo wokuhlola, ukuphathwa kokubuyisela kunye neemfuno zokudibanisa umgca.

Flip chip bonder configuration with precision vision alignment and semiconductor handling modules

Uhlolo loMatshini we-BESI DATACON

Iindawo Ezintandathu Zoqwalaselo Ezilawula Ubuchule Bokufaka I-Flip Chip Bonder

I-BESI DATACON flip chip bonder kufuneka ihlolwe njengoqwalaselo olupheleleyo lwemveliso. Igama leqonga lodwa aliqinisekisi ukuba umatshini onikezelwayo unazo na izixhobo zekhompyutha, ukhetho lwesoftware, izixhobo kunye nenkxaso yenkqubo efunekayo kwindlela ethile yephakheji.

Uyilo lwentloko yokukhetha nokubeka, isixhobo sokujika kunye noyilo lwentloko yokubopha
Iikhamera zokubona, i-optics, i-incasa kunye nemisebenzi yokulungelelanisa
Iimodyuli zokuphatha i-wafer, itreyi, umcu, umthwali, isikhephe kunye ne-substrate
Ukuntywila nge-flux, ukutyibiliza, ukulungiselela izinto kunye nezixhobo zokuhlola
Umlawuli, inkqubo yokuhamba, inguqulelo yesoftware kunye neenketho ezivuliweyo
Ii-nozzles, izixhobo zokulungisa, izixhobo zokulinganisa kunye ne-interfaces yokudibanisa imigca

Uvavanyo lweZixhobo ezisetyenzisiweyo nezihlaziyiweyo

Yintoni Ekufuneka Ihlolwe Ngaphambi Kokuthenga I-BESI Flip Chip Bonder Esetyenzisiweyo?

Izixhobo ze-flip chip ezisetyenzisiweyo zinokuba luncedo kwezorhwebo xa inguqulelo yeqonga, imeko yomatshini, izixhobo ezifakiweyo, uqwalaselo lwenkqubo kunye nokulungelelaniswa kwenkxaso kuqinisekiswa ngaphambi kokuthunyelwa.

Cela ubungqina phambi kokuba uzibophelele.

Cela iifoto zomatshini zangoku, uluhlu lweenketho ezifakiweyo, iinkcukacha zenkqubo-yesixhobo, ulwazi lovavanyo olusebenzayo, imeko yokulinganisa kunye nobubanzi bokuhlaziya obuchaziweyo.

Ubume bePlatform obuchanekileyo

Qinisekisa ukuba umatshini yi-FC QUANTUM hS, i-advanced, i-advX, i-CHAMEO advanced, i-Esec 2100 FC hS okanye olunye ulungiselelo, uze uqinisekise iinkcukacha zeenombolo ze-serial kunye neemodyuli ezinkulu ezifakiweyo.

Izixhobo zokukhetha, zokujika kunye nezokubopha

Hlola izixhobo zokukhetha nokubeka, izixhobo zokukhupha, izixhobo zokujika, iintloko zebhondi, ii-nozzles, izixhobo ezingasebenziyo, ukuguguleka kwezixhobo kunye nokufumaneka kwezinto ezitshintshayo ezifanelekileyo.

Inkqubo yoMbono noHlolo

Qinisekisa iikhamera, i-optics, ukukhanya, imisebenzi yokulungelelanisa, ukuhlolwa kwe-post-bond, imeko yokulinganisa kunye nokufumaneka kwezinto zokutshintsha umbono.

Izixhobo zokulungiselela izinto

Qinisekisa ukuntywila kwe-flux, ukutyibilika, iipleyiti ze-cavity, iimodyuli zokusasaza, ukuboniswa kwezinto, iindlela zokucoca kunye nemeko yehardware ethile yenkqubo.

Ukuphathwa kweWafer kunye neSubstrate

Qinisekisa iifreyimu ze-wafer, iitreyi, imicu, iinqanawa, abathwali, iifreyimu ze-lead, izixhobo ze-substrate, ii-feeders kunye nazo zonke iimodyuli zokudlulisa izinto ezifunekayo kwinkqubo ekujoliswe kuyo.

Imeko yoMlawuli kunye neSoftware

Jonga izixhobo zokulawula, imeko yePC, indawo yesoftware, imidiya yokubuyisela, iinketho ezivunyiweyo, idatha yenkqubo, imisebenzi yebhakhowudi okanye imephu kunye namaxwebhu obuchwephesha.

Uvavanyo loomatshini kunye nokwamkelwa kwabo

Chaza izixhobo ezimeleyo, ulandelelwano lovavanyo, iindlela zokubeka kunye neenkqubo, iimfuno zovavanyo, imveliso ekujoliswe kuyo kunye neemeko zokwamkelwa ngaphambi kokuthunyelwa.

Isicwangciso soFakelo kunye neNkxaso

Cacisa indlela yokupakisha, iimfuno zombane kunye nezokusetyenziswa, ubungakanani bokufakelwa, uqeqesho, isicwangciso senxalenye yezixhobo, inkxaso yenkqubo kunye nendlela yokuphendula emva kokufakelwa.

I-Matrix yoKhetho loBunjineli

BESI Flip Chip Bonder Configuration Review Matrix

Sebenzisa le matrix ukuhlela imibuzo yobugcisa ekufuneka iphendulwe ngaphambi kokukhetha inkqubo ye-DATACON okanye ye-Esec flip chip yenkqubo ethile yokuhlanganisa i-semiconductor.

Qinisekisa kwinqanaba lemodeli.

Ubuchule beqonga elipapashiweyo yindawo yokuqala. Ukufaneleka kokugqibela kufuna ukuqinisekiswa koqwalaselo oluchanekileyo, izixhobo kunye nemeko yemveliso.

Ulwakhiwo lweDie and Bump	Qinisekisa ubungakanani bedayi, ubukhulu, uhlobo lweqhuma, isandi sokugquma, imeko yomqolo, ubuthathaka, indlela yokujonga kunye nendlela yokuthatha.
Indlela yezinto eziphathekayo	Qinisekisa ukuba le nkqubo ifuna ukudipha nge-flux, ukuxubha, ukuncamathelisa, ukunyibilikisa, enye indlela yokulungisa izinto okanye ukucoca okucwangcisiweyo.
Ukuhamba kweWafer kunye neSubstrate	Qinisekisa ifreyimu ye-wafer, itreyi, umcu, isikhephe, umthwali, ifreyimu ye-lead, ubungakanani be-substrate, ulandelelwano lokulayisha, indlela yokukhupha impahla kunye nesidingo sokudlulisa izinto.
Imfuneko yokubekwa	Chaza ukunyamezelana kwe-X/Y/theta phantsi kweemeko zenkqubo yokwenyani, kubandakanya i-die geometry, imeko yezinto eziphathekayo, uzinzo lwe-substrate kunye nomjikelo wemveliso ekujoliswe kuyo.
Imveliso kunye noTshintsho	Hlaziya i-UPH ekujoliswe kuyo, umxube wemveliso, ubuninzi bokutshintsha, ubungakanani bezixhobo, umjikelo wokuhlola, ukuphathwa kokubuyisela kunye nesidingo sokudibanisa imigca.
Ulawulo lweNzuzo kunye noHlolo	Qinisekisa ukuhlolwa emva kwebhondi, ukujonga i-die crack okanye i-chipping, imeko yesixhobo, amandla ekhamera, indlela yokulinganisa kunye neendlela zokwamkela.
Ukulungela Izixhobo Ezisetyenzisiweyo	Qinisekisa intshukumo, umbono, umlawuli, isoftware, iimodyuli zenkqubo, izixhobo, ukufikelela kwiindawo ezingasetyenziswanga, amaxwebhu akhoyo kunye nobubanzi benkxaso.

Imibuzo yoBugcisa kunye nokuThenga

Imibuzo ebuzwa rhoqo nge-BESI Flip Chip Bonder

Le mibuzo ijongana nemiba esebenzayo edla ngokufuna ukucaciswa ngaphambi kokuthelekisa, ukuthenga okanye ukuhlaziya i-BESI DATACON flip chip bonder.

Yintoni i-BESI flip chip bonder?

I-BESI flip chip bonder liqonga lokuhlanganisa i-semiconductor elisetyenziselwa ukubeka nokulungelelanisa ii-flipped dies kwi-substrates, abathwali, ii-strips okanye ezinye iifomathi zephakheji. Indlela yenkqubo efanelekileyo ixhomekeke kuqwalaselo oluchanekileyo lwe-DATACON okanye i-Esec, indlela yokulungiselela izinto, iimodyuli zokuphatha kunye nezixhobo ezifakiweyo.

Ngaba isixhobo sokufaka ii-flip chip siyafana nesixhobo sokufaka ii-flip chip?

I-flip chip mounter idla ngokusetyenziswa njengegama eliqhelekileyo lezixhobo zokubeka i-die-placement. Kuvavanyo lwemveliso, i-flip chip bonder kufuneka ihlolwe njengeqonga lenkqubo epheleleyo equka ukuthuthwa, ukujikwa, ukulungiswa kwezinto, ukulungelelaniswa, ukubekwa, ukuhlolwa kunye nokuphathwa kokubuyisela.

Yintoni i-DATACON flip chip bonder?

I-DATACON flip chip bonder ibhekisa kwiqonga le-DATACON elenzelwe imisebenzi ye-flip chip. Iinkqubo ezahlukeneyo ze-DATACON zinokuvavanywa kwi-mass-reflow flip chip, i-multi-chip assembly, i-wafer-level packaging okanye ezinye iinkqubo ze-chip-to-substrate kuxhomekeke kwiimodyuli zazo ezifakiweyo kunye nezixhobo.

Ngawaphi amaqonga e-BESI DATACON asetyenziselwa ukuhlanganisa ii-flip chip?

I-BESI idwelisa i-DATACON 8800 FC QUANTUM hS, i-FC QUANTUM advanced, i-FC QUANTUM advX kunye ne-DATACON 8800 CHAMEO advanced kwiqela layo leqonga le-flip chip. Ukufaneleka kuxhomekeke kwindlela yenkqubo echanekileyo kunye noqwalaselo olunikezelwayo.

Yintoni umahluko phakathi kweFC QUANTUM kunye neCHAMEO?

Uqwalaselo lwe-FC QUANTUM luhlala luvavanywa ukuze kujongwe imveliso ye-flip chips eziphinda ziphume ngobuninzi. I-CHAMEO advanced idla ngokuvavanywa kwimisebenzi yokusebenza ye-multi-chip kunye ne-fan-out wafer-level. Ukhetho oluchanekileyo luxhomekeke kuyilo lwephakheji, indlela yezinto ezisetyenzisiweyo, imfuneko yokuphatha kunye nezixhobo ezifakiweyo.

Ngaba i-DATACON 8800 ingakwazi ukuxhasa usetyenziso lwe-multi-chip flip chips?

Ezinye ii-configurations ze-DATACON 8800, ngakumbi i-CHAMEO advanced, zivavanywa kwiindlela zokusebenza ze-multi-chip. Umatshini onikezelwayo kufuneka uhlolwe ukuba awuphathwanga na umthwali, ulandelelwano lwe-die, imo yenkqubo yokujonga phezulu okanye ejonge phantsi, izixhobo zephakheji kunye nokukwazi ukuhlola.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-flip chip bonder esetyenzisiweyo?

Qinisekisa inguqulelo yeqonga echanekileyo, iimodyuli zenkqubo, izixhobo zokukhetha nokubeka, inkqubo yokubona, izixhobo zokulungiselela izinto, ukuphathwa kwe-wafer kunye ne-substrate, imeko yomlawuli, ukhetho lwesoftware, izixhobo ezikhoyo, iirekhodi zokulinganisa kunye nolwazi lovavanyo olusebenzayo.

Ngaba isixhobo sokubeka iitshiphusi ze-BESI sifanelekile kwiphakheji nganye yeetshiphusi ze-flip?

Hayi. I-BESI flip chip mounter kufuneka ihambelane nobukhulu be-die, ulwakhiwo lwe-bump, indlela yezinto ezisetyenziswayo, ifomathi ye-wafer kunye ne-substrate, imfuneko yokubeka, icebo lokuhlola, imveliso ekujoliswe kuyo kunye nezixhobo zenkqubo ezikhoyo.

Loluphi ulwazi olufunekayo ngaphambi kokuba ucele isindululo seqonga le-BESI flip chip?

Nika umzobo wephakheji, ubungakanani bedayi, ubukhulu bedayi, uhlobo lokuqubha, indlela yezinto ezisetyenzisiweyo, ifomathi ye-wafer okanye yetreyi, ubukhulu be-substrate, i-UPH ekujoliswe kuyo, ukunyamezelana kokubekwa, imfuneko yokuhlolwa kunye nayo nayiphi na imida ekhoyo yomgca.

Ngaba i-DATACON 2200 evo ingavavanywa kwiinkqubo ze-flip chip?

I-DATACON 2200 evo liqonga le-Multi Module Attach elinokulungiselelwa elinokuvavanywa kwiindlela zokusebenza ze-die attach, multi-chip kunye ne-flip-chip ezikhethiweyo. Kufuneka ihlolwe ngokwahlukileyo kwiinkqubo ze-DATACON 8800 xa kufuneka ukuguquguquka kweenkqubo ezibanzi okanye izixhobo ezithile zesicelo.

Ngaba ufuna uphononongo loqwalaselo lwe-BESI Flip Chip Bonder?

Yabelana ngomzobo wephakheji yakho, isakhiwo sedayi kunye ne-bump, indlela yezinto, ifomathi ye-wafer okanye ye-substrate, imveliso ekujoliswe kuyo kunye nazo naziphi na iinkcukacha zomatshini ezikhoyo. Oku kwenza kube nokwenzeka ukuvavanya ukuba ngaba uqwalaselo lwe-DATACON okanye lwe-Esec olunikezelwayo lufanelekile na kumgca wakho wemveliso.

Ukubonisana kwi-Intanethi

Isikhokelo sePlatform yeBESI Flip Chip Bonder yeDATACON kunye nokuPakisha okuPhambili

Iqonga leFlip Chip lingaphezulu nje komatshini wokubeka i-die

Iinkqubo zeDATACON kunye ne-Esec zeemfuno ezahlukeneyo zeFlip Chip

Kutheni iFlip Chip Mounter ifanele ihlolwe njengeQonga leNkqubo epheleleyo

Zeziphi iindlela zokusebenza zeFlip Chip ezinokuhlolwa yiPlatform yeBESI DATACON?

I-Mass-Reflow Flip Chip

Itshiphu yokujika iitshiphu ezininzi

Ukupakisha okuphuma kwiFan kunye neWafer

Indibano ye-Chip-to-Substrate eneVolume ephezulu

Iindawo Ezintandathu Zoqwalaselo Ezilawula Ubuchule Bokufaka I-Flip Chip Bonder

Yintoni Ekufuneka Ihlolwe Ngaphambi Kokuthenga I-BESI Flip Chip Bonder Esetyenzisiweyo?

Ubume bePlatform obuchanekileyo

Izixhobo zokukhetha, zokujika kunye nezokubopha

Inkqubo yoMbono noHlolo

Izixhobo zokulungiselela izinto

Ukuphathwa kweWafer kunye neSubstrate

Imeko yoMlawuli kunye neSoftware

Uvavanyo loomatshini kunye nokwamkelwa kwabo

Isicwangciso soFakelo kunye neNkxaso

BESI Flip Chip Bonder Configuration Review Matrix

Imibuzo ebuzwa rhoqo nge-BESI Flip Chip Bonder

Ngaba ufuna uphononongo loqwalaselo lwe-BESI Flip Chip Bonder?

Umatshini we-SMT

Amacandelo e-SMT

Cela iQuote

Isikhokelo sePlatform yeBESI Flip Chip Bonder yeDATACON kunye nokuPakisha okuPhambili

Iqonga leFlip Chip lingaphezulu nje komatshini wokubeka i-die

Iinkqubo zeDATACON kunye ne-Esec zeemfuno ezahlukeneyo zeFlip Chip

Kutheni iFlip Chip Mounter ifanele ihlolwe njengeQonga leNkqubo epheleleyo

Zeziphi iindlela zokusebenza zeFlip Chip ezinokuhlolwa yiPlatform yeBESI DATACON?

I-Mass-Reflow Flip Chip

Itshiphu yokujika iitshiphu ezininzi

Ukupakisha okuphuma kwiFan kunye neWafer

Indibano ye-Chip-to-Substrate eneVolume ephezulu

Iindawo Ezintandathu Zoqwalaselo Ezilawula Ubuchule Bokufaka I-Flip Chip Bonder

Yintoni Ekufuneka Ihlolwe Ngaphambi Kokuthenga I-BESI Flip Chip Bonder Esetyenzisiweyo?

Ubume bePlatform obuchanekileyo

Izixhobo zokukhetha, zokujika kunye nezokubopha

Inkqubo yoMbono noHlolo

Izixhobo zokulungiselela izinto

Ukuphathwa kweWafer kunye neSubstrate

Imeko yoMlawuli kunye neSoftware

Uvavanyo loomatshini kunye nokwamkelwa kwabo

Isicwangciso soFakelo kunye neNkxaso

BESI Flip Chip Bonder Configuration Review Matrix

Apho iDATACON 8800 ifaneleka khona

Apho i-DATACON 2200 evo ifanela khona

Imibuzo ebuzwa rhoqo nge-BESI Flip Chip Bonder

Ngaba ufuna uphononongo loqwalaselo lwe-BESI Flip Chip Bonder?

Umatshini we-SMT

Amacandelo e-SMT

Cela iQuote