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Funa Quote →BESI flip chip bonder platforms zikozesebwa mu nkola y’emirimu gy’okukuŋŋaanya semiconductor ezeetaaga okuteeka die mu butuufu, okukwata ebintu ebifugibwa, okukwatagana n’okulaba n’okukola emirimu egy’okuddiŋŋana. Okusinziira ku nsengeka ya DATACON oba Esec, ekyuma kya BESI flip chip kiyinza okwekenneenyezebwa ku mass-reflow flip chip, okukuŋŋaanya chip eziwera, okupakinga ku ddaala lya wafer n’okukozesa okulonda kwa chip-to-substrate okw’obunene obw’amaanyi.
Flip chip bonder entuufu esinziira ku kkubo ly’enkola, sayizi y’okufa, enkola ya wafer ne substrate, enkola ya flux oba material-preparation, okugumiikiriza okuteeka, obwetaavu bw’okukebera, target throughput n’ensengeka yennyini ey’ekyuma ekiweereddwa.
BESI flip chip bonder ye semiconductor assembly platform eteeka flipped dies ku substrates, carriers, strips oba package endala formats nga controlled alignment n’okukwata enkola. Mu kukola mu nkola, ekyuma kiteekwa okwekenneenyezebwa ng’enkola enzijuvu okusinga ng’ekintu eky’enjawulo eky’okuteeka.
DATACON flip chip bonder eyinza okubeeramu okugatta okw’enjawulo okw’emitwe egy’okulonda n’okuteeka, ebikozesebwa mu kufuumuula, kkamera z’okulaba, modulo ezinnyika oba ezifuuwa flux, okukwata wafer, okukwata substrate, okukebera oluvannyuma lw’okusiba n’emirimu gy’okuzzaawo. Module zino eziteekeddwawo zisalawo oba ekyuma ekiweereddwa kisobola okuwagira ekkubo lya package eryetongodde.
Platform esobola okuteeka die telina bisaanyizo bya automatically for a specific flip chip process. Ekibuuzo ekikulu kiri nti oba ensengeka eweereddwa esobola okumaliriza ekkubo lya package erigendereddwa obutakyukakyuka ku ddaala ly’ebifulumizibwa n’amakungula eryetaagisa.
Enkola za BESI flip chip zikwata ku ndagiriro z’enkola ez’enjawulo. Omulongooti wansi guwa engeri entegeke ey’okugeraageranya amaka ga pulatifomu nga tonnaba kwekenneenya yuniti entongole ekozesebwa oba erongooseddwa.
Famire ya pulatifomu, eby’okulonda ebiteekeddwa, ebikozesebwa mu nkola, ebikozesebwa n’embeera y’ekyuma byonna bikwata ku kusaanira okw’omugaso kw’enkola eteeseddwa.
| Ekifo | Obulagirizi bw’okwekenneenya obwa bulijjo | Ebibuuzo by’enkola okukakasa | Essira ly’okuddamu okwetegereza ebyuma ebikozesebwa |
|---|---|---|---|
| DATACON 8800 FC OMUKULU HSOmukutu gwa flip chip ogw’amas-reflow ogw’amaanyi ogw’amaanyi. | Okukola Flip Chip ez’obunene obw’amaanyiWeekenneenye sayizi ya die, enkola ya wafer, enkwata ya substrate, target throughput, post-bond inspection n’okuzzaawo ebyetaago. | Okufuga Enkola ey’Embiro EnneneKakasa okuteekawo entuuyo nnyingi, enkola y’okulaba, enkola ya flux-film, emirimu gy’okukebera, embeera y’entuuyo n’okutambula kwa substrate. | Okukakasa enzirukanya n’amakungulaWeekenneenye embeera y’entambula, enkola ya kkamera, ebikozesebwa ebiteekeddwamu, embeera y’okupima n’ebyava mu kukebera emirimu n’ebintu ebikiikirira. |
| DATACON 8800 FC QUANTUM egenda mu maasoOmukutu gw’okufulumya flip chip eya mass-reflow. | Okukuŋŋaanya kwa Chip-to-Substrate okufugibwaWeekenneenye sayizi ya die, bond-force range, fluxing route, ensengeka ya camera, obwetaavu bw’okuteeka ne target production profile. | Enkola n’okufuga amakungulaKakasa enteekateeka ya CRYSTAL fluxer, emirimu gy’okukebera oluvannyuma lwa bond, okutambula kw’ebintu, enkola ya substrate carrier n’enkola za automation. | Okusengeka n’Okwekenneenya SofutiweyaKakasa embeera y’enkola essiddwawo, data y’okupima, okuteekawo okwolesebwa, embeera ya controller, ebikozesebwa ebiriwo n’obuwanvu bw’okuddaabiriza. |
| DATACON 8800 FC QUANTUM advXBroad mass-reflow chip-to-substrate okukozesa range. | Okukola Flip Chip EkyukakyukaWeekenneenye chip-size range, substrate dimensions, production volume, flux dipping enteekateeka, automation package n’ebyetaago by’okufuga amakungula. | Bbalansi y’Obwangu n’ObutuufuKakasa ebikozesebwa ebibiri-gantry, ensengeka y’okulaba, obusobozi bw’okunnyika, okukwata modulo n’okukwatagana kw’enkola n’ekipapula ekigendereddwa. | Okukakasa Module EssiddwawoKakasa modulo ki ez’okulaba, ebikozesebwa mu kusitula, entuuyo, emmere, ebinyweza n’ebikozesebwa mu kusiiga ebirimu ne yuniti ewereddwa. |
| DATACON 8800 CHAMEO ya mulembeMulti-chip flip chip ne fan-out enkola y’emirimu. | Okwekenenya kwa Multi-Chip ne FO-WLPWeekenneenye ekkubo ly’ebipapula nga litunudde waggulu oba wansi, enkwata y’ebisitula, ensengeka y’ebifa, geometry y’ebipapula, okuwulikika kw’olutalo n’enkola y’okukebera. | Enkola ya Package-Specific FitKakasa ensengeka y’omutwala, ekkubo ly’okukwata, ekipapula ky’okulaba, ebikozesebwa, okwanjula ebintu n’okusaanira enkola y’emirimu egenderere ku ddaala lya wafer. | Okuddamu okwetegereza okukwatagana kw’okusabaKakasa nti ensengeka ya CHAMEO eweereddwa yakolebwa ku kkubo ly’enkola erigeraageranyizibwa okusinga okulowooza nti yuniti zonna zikyusibwakyusibwa. |
| Esec 2100 FC hSOmukutu gwa flip chip ogw’amaanyi ogw’okukozesa FC mu ngeri engazi. | Okufulumya Package ya FC ey’obunene obw’amaanyiWeekenneenye ekika kya package, die dimensions, leadframe oba substrate route, throughput expectation, line interface n’obwetaavu bw’okufulumya-amakungula. | Okukozesa n’okugatta FitKakasa ensengeka y’ebyuma, okutambula kw’ebintu, ebikozesebwa mu nkola, okwekebejja okuliwo, modulo z’okukwata n’okukwatagana ne layini y’emabega eriwo. | Obuwagizi n’Okwetegekera SipeeyaKebera omulembe gwa controller, embeera y’okulaba, okuteekawo feeder, ebiwandiiko ebiriwo, ekkubo ly’obuyambi n’embeera y’ebitundu ebikulu mu nkola. |
Flip chip mounter etera okukozesebwa ng’ekigambo ekigazi eky’okunoonya ebyuma ebiteeka ebifa ebikubiddwa ku substrates oba carriers. Mu yinginiya w’okufulumya, flip chip bonder erina okwekenneenya nga full process platform efugira die pickup, orientation, fluxing oba dipping, alignment, placement, inspection, recovery handling ne downstream integration.
Olw’ensonga eno, BESI flip chip mounter oba ekyuma kya DATACON tekirina kulondebwa ku butuufu bw’okuteeka obufulumiziddwa oba okufuluma okw’erinnya kwokka. Ekkubo lya package erigendereddwamu n'ensengeka yennyini etekeddwako birina okusooka okwekenneenya.
Ekibuuzo ekikulu si kyokka oba ekyuma kisobola okuteeka die. Kiba oba ekintu ekikozesebwa, okuteekateeka ebintu, enkola y’okulaba n’omutendera gw’okukwata bisobola okufulumya ekipapula ekyetaagisa mu ngeri eyesigika wansi w’embeera z’okufulumya entuufu.
Enkola ez’enjawulo ez’emirimu gya flip chip zeetaaga amakubo ag’enjawulo ag’ebintu, enkola z’okukwata, enkola z’okukwataganya n’emitendera gy’okukebera. Ebibinja by’enkola bino biyamba okunnyonnyola okwekenneenya ebyuma okutuufu nga tebannaba kwekenneenya musingi ogwetongodde.
Buli kusaba kulina okukakasibwa okusinziira ku nsengeka y’enkola entuufu, ebikozesebwa mu nkola, okutambula kw’ebintu n’ekivudde mu bisaanyizo.
Weekenneenye sayizi ya die, ensengeka ya bump, wafer frame, substrate oba strip format, flux dipping, cavity plate, okugumiikiriza okuteeka, okukebera post-bond ne target UPH.
Weekenneenye ensengeka y’okufa, ebikozesebwa ebingi eby’okulonda n’okuteeka, enkola y’okusitula, okutunula mu maaso oba okutunula wansi, geometry y’ekipapula, okuwulikika kw’olupapula lw’olutalo n’enkola y’okukebera.
Weekenneenye enkwata y’ebisitula, okutambula kw’ebintu ku ddaala lya wafer, engeri y’enkola ey’okutunula waggulu oba okutunula wansi, ensengeka y’ekipapula, ebyetaago by’ekisenge ekiyonjo, ebyetaago by’ebikozesebwa n’okupima.
Weekenneenye omutendera gw’okukola otomatiki, emirundi gy’okukyusakyusa, okutambula kwa wafer ne substrate, okuteekateeka ebintu, enzirukanya y’okukebera, enkwata y’okuzzaawo n’ebyetaago by’okugatta layini.
BESI DATACON flip chip bonder erina okwekebejjebwa nga ensengeka y’okufulumya enzijuvu. Erinnya lya platform lyokka terikakasa oba ekyuma ekiweereddwa kirina hardware, software options, tooling ne process support ezeetaagisa ku package route entongole.
Ebyuma ebikozesebwa mu kukola flip chip bisobola okuba eby’omugaso mu by’obusuubuzi nga enkyusa ya pulatifomu, embeera y’ekyuma, ebikozesebwa ebiteekeddwamu, ensengeka y’enkola n’obwetegefu bw’okuwagira bikakasiddwa nga tebinnasindikibwa.
Saba ebifaananyi by’ekyuma ebiriwo kati, enkalala z’ebyokulonda ebiteekeddwa, ebikwata ku nkola-ebikozesebwa, amawulire agakwata ku kugezesebwa okukola, embeera y’okupima n’obuwanvu bw’okuddaabiriza obutegeerekese.
Kakasa oba ekyuma kiri FC QUANTUM hS, advanced, advX, CHAMEO advanced, Esec 2100 FC hS oba ensengeka endala, olwo okakasizza ebikwata ku serial-number ne modules enkulu eziteekeddwamu.
Weekenneenye ebikozesebwa mu kulonda n’okuteeka, ebikozesebwa okufulumya, ebikozesebwa mu kufuumuula, emitwe gya bond, nozzles, tool offsets, tool wear n’okubaawo kw’ebikyusibwa ebikwatagana.
Kakasa kkamera, optics, ekitangaala, emirimu gy’okulaganya, okwekenneenya oluvannyuma lwa bond, embeera y’okupima n’okubaawo kw’ebitundu by’okulaba ebikyusibwa.
Kakasa flux dipping, fluxing, cavity plates, dispensing modules, okulaga ebintu, enkola y’okuyonja n’embeera ya process-specific hardware.
Kakasa wafer frames, trays, strips, amaato, carriers, leadframes, substrate tooling, feeders ne modules zonna ez’okutambuza ebintu ezeetaagisa enkola egenderere.
Kebera controller hardware, embeera ya PC, embeera ya software, recovery media, enabled options, process data, barcode oba emirimu gya maapu n'ebiwandiiko eby'ekikugu.
Lambulula ebikozesebwa ebikiikirira, ensengeka y’okugezesa, emisingi gy’okuteekebwa n’enkola, ebyetaago by’okukebera, ebifulumizibwa ebiruubirirwa n’embeera z’okukkiriza nga tonnasindikibwa.
Lambulula enkola y’okupakinga, ebyetaago by’amasannyalaze n’ebikozesebwa, obuwanvu bw’okussaako, okutendekebwa, enteekateeka ya sipeeya, okuwagira enkola n’ekkubo ly’okuddamu oluvannyuma lw’okussaako.
Kozesa matrix eno okusengeka ebibuuzo eby’ekikugu ebirina okuddibwamu nga tonnalonda nkola ya DATACON oba Esec flip chip ku pulogulaamu y’okukuŋŋaanya semikondokita entongole.
Obusobozi bwa platform obufulumiziddwa y’entandikwa. Okusaanira okusembayo kwetaaga okukakasa ensengeka entuufu, ebikozesebwa n’embeera y’okufulumya.
| Enzimba ya Die ne Bump | Kakasa sayizi ya die, obuwanvu, ekika kya bump, bump pitch, embeera y’emabega, fragility, orientation n’enkola y’okukwata. |
|---|---|
| Ekkubo ly’Ebikozesebwa | Kakasa oba enkola yeetaaga okunnyika mu flux, fluxing, adhesive, solder, enkola endala ey’okuteekateeka ebintu oba omutendera ogw’okwoza ogwetongodde. |
| Okutambula kwa Wafer ne Substrate | Kakasa wafer frame, tray, strip, eryato, carrier, leadframe, ebipimo bya substrate, ensengeka y’okutikka, ekkubo ly’okutikkula n’obwetaavu bw’okutambuza ebintu. |
| Ekyetaagisa mu kuteekebwa mu kifo | Nnyonnyola okugumiikiriza kwa X/Y/theta wansi w’embeera z’enkola entuufu, omuli geometry ya die, embeera y’ebintu, okutebenkera kwa substrate n’enzirukanya y’okufulumya ekigendererwa. |
| Ebifulumizibwa n’Okukyusa | Weekenneenye ekiruubirirwa UPH, okutabula ebintu, emirundi gy’okukyusaamu, obungi bw’ebikozesebwa, enzirukanya y’okukebera, enkwata y’okuzzaawo n’obwetaavu bw’okugatta layini. |
| Okufuga amakungula n’okukebera | Kakasa okukebera oluvannyuma lwa bond, okukebera die crack oba chipping, embeera y’ebikozesebwa, obusobozi bwa kamera, enkola ya calibration n’emisingi gy’okukkiriza. |
| Okwetegekera Ebyuma Ebikozesebwa | Kakasa entambula, okulaba, omufuzi, pulogulaamu, modulo z’enkola, ebikozesebwa, okuyingira mu sipeeya, ebiwandiiko ebiriwo n’obunene bw’obuyambi. |
Ebibuuzo bino bikwata ku nsonga ez’omugaso ezitera okwetaaga okunnyonnyolwa nga tonnageraageranya, kugula oba okuddaabiriza BESI DATACON flip chip bonder.
BESI flip chip bonder ye nkola y’okukuŋŋaanya semikondokita ekozesebwa okuteeka n’okukwataganya ebifa ebikyusiddwa ku substrates, carriers, strips oba enkola endala ez’okupakinga. Ekkubo ly’enkola erikozesebwa lisinziira ku nsengeka entuufu eya DATACON oba Esec, enkola y’okuteekateeka ebintu, okukwata modulo n’ebikozesebwa ebiteekeddwamu.
Flip chip mounter etera okukozesebwa ng’ekigambo eky’awamu ekitegeeza ebyuma ebiteeka die-placement. Mu kwekenneenya okufulumya, flip chip bonder erina okwekenneenyezebwa nga enkola enzijuvu omuli okulonda, okufuumuula, okuteekateeka ebintu, okukwatagana, okuteeka, okukebera n’okukwata okuzzaawo.
DATACON flip chip bonder kitegeeza omukutu gwa DATACON ogutegekeddwa okukola emirimu gya flip chip. Enkola za DATACON ez’enjawulo ziyinza okwekenneenyezebwa ku mass-reflow flip chip, multi-chip assembly, wafer-level packaging oba enkola endala chip-to-substrate okusinziira ku modules zazo eziteekeddwamu n’ebikozesebwa.
BESI ewandiika DATACON 8800 FC QUANTUM hS, FC QUANTUM ez’omulembe, FC QUANTUM advX ne DATACON 8800 CHAMEO ez’omulembe mu kibinja kyayo ekya flip chip platform. Okusaanira kisinziira ku kkubo lyennyini ery’enkola n’ensengeka eweereddwa.
Ensengeka za FC QUANTUM zitera okwekenneenyezebwa okukola mass-reflow flip chip. CHAMEO advanced etera okwekenneenyezebwa ku nkola z’emirimu ezirina chip eziwera ne fan-out wafer-level. Okulonda okutuufu kukyasinziira ku dizayini y’ekipapula, ekkubo ly’ebintu, ekyetaagisa okukwata n’ebikozesebwa ebiteekeddwamu.
Ensengeka ezimu eza DATACON 8800 naddala eza CHAMEO ez’omulembe, zeekenneenyezebwa ku nkola z’emirimu ezirimu chip eziwera. Ekyuma ekiweereddwa kirina okukeberebwa okulaba oba kikwata ku kisitula, ensengeka y’ebifa, engeri y’enkola ey’okutunula waggulu oba okutunula wansi, okukozesa ebikozesebwa mu kupakinga n’obusobozi bw’okukebera.
Kakasa enkyusa entuufu ey’omukutu, modulo z’enkola, ebikozesebwa mu kulonda n’okuteeka, enkola y’okulaba, ebikozesebwa mu kutegeka ebintu, okukwata wafer ne substrate, embeera ya controller, software options, ebikozesebwa ebiriwo, ebiwandiiko by’okupima n’amawulire agakwata ku kugezesa emirimu.
Nedda.A BESI flip chip mounter erina okukwatagana n’ebipimo by’okufa ebituufu, ensengeka y’ebikonde, ekkubo ly’ebintu, enkola ya wafer ne substrate, obwetaavu bw’okuteeka, enkola y’okukebera, okufulumya ekigendererwa n’ebikozesebwa mu nkola ebiriwo.
Waayo okukuba ekifaananyi ky’ekipapula, obunene bw’ekifa, obuwanvu bw’ekifa, ekika ky’ekikonde, ekkubo ly’ebintu, ensengeka ya wafer oba tray, ebipimo bya substrate, target UPH, okugumiikiriza okuteeka, obwetaavu bw’okukebera n’ebiziyiza byonna ebiriwo ku layini.
DATACON 2200 evo ye nkola ya Multi Module Attach esobola okuteekebwateekebwa nga esobola okwekenneenya enkola y’emirimu eya die attach, multi-chip ne flip-chip erongooseddwa. Kisaanye okwekenneenya okwawukana ku nkola za DATACON 8800 nga kyetaagisa okukyukakyuka mu nkola okugazi oba ebikozesebwa ebikwata ku nkola.
Gabana ekifaananyi kyo eky’ekipapula, ensengeka y’okufa n’okukuba, ekkubo ly’ebintu, ensengeka ya wafer oba substrate, ekifulumizibwa ekigendererwa n’ebikwata ku kyuma byonna ebiriwo. Kino kisobozesa okwekenneenya oba ensengeka ya DATACON oba Esec ewereddwa esaanira okubeera n’ebisaanyizo ku layini yo ey’okufulumya.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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