What is a BESI DATACON 2200 evo machine?

BESI DATACON 2200 evo is a multi-module attach platform used for die attach, multi-chip assembly and selected flip-chip workflows. Its practical capability depends on the exact evo version, installed process modules, handling options, tooling and condition of the offered unit.

Is BESI DATACON 2200evo the same as DATACON 2200 evo?

Yes. BESI DATACON 2200evo is commonly used as a search variation of the official DATACON 2200 evo platform name. The exact machine version should still be confirmed because the family includes evo, evo plus, hF, hS and advanced configurations.

What is the difference between DATACON 2200 evo and evo plus?

The evo plus configuration is positioned with enhanced vision, high-speed image processing, thermal compensation and automatic multi-chip production functions. The exact capability of a used machine depends on which options are physically installed and operational.

What is DATACON 2200 evo hF used for?

DATACON 2200 evo hF is designed for high-bond-force applications and is commonly evaluated for power modules, IGBT, MCM and SiP workflows. Process suitability depends on the available force range, heating setup, material route and package tooling.

Can a DATACON 2200 evo handle die attach and flip-chip processes?

Several configurations are designed for die attach, multi-chip and selected flip-chip workflows. The exact process route should be verified against bond head, dispensing or fluxing setup, vision system, material handling and tooling package.

What should be checked before buying a used DATACON 2200 evo?

Confirm the exact model, installed options, bond head, force range, vision system, wafer or tray handling, controller condition, software status, calibration records, available tooling, functional test information and refurbishment scope.

Are published DATACON 2200 evo specifications valid for every machine?

No. Published values belong to specific DATACON 2200 evo versions and configurations. The capability of an individual used machine must be confirmed through its model identity, installed options, tooling, maintenance condition and functional validation.

What information is needed for a DATACON 2200 evo recommendation?

Provide the package drawing, die dimensions, die thickness, material route, wafer or tray format, substrate type, target UPH, placement tolerance, process temperature, available tooling and any existing line constraints.

Madal ku lifaaqan Module badan oo BESI ah

BESI DATACON 2200 evo Die Bonder Platform Guide

BESI DATACON 2200 evo waa madal isku xidhka badan ee loo habeyn karo oo loo isticmaalo qalabka isku xidhka badan ee loo yaqaan 'die attach', qalabka isku xidhka badan ee 'multi-chip' iyo shaqada 'flip-chip' ee la soo xulay. Awoodda wax ku oolka ah ee mashiinka DATACON 2200 evo ee la bixiyo waxay ku xiran tahay nooca saxda ah, habaynta madaxa xidhka, xirmada aragga, maaraynta wafer-ka, qalabka iyo qaybaha habka ee la rakibay.

Qalabka DATACON ee la isticmaalay iyo kuwa dib loo habeeyay, magaca goobta kaliya kuma filna. Mashiin ku habboon waa in lagu qiimeeyaa habka loogu talagalay xirmada, qaabka meydka, agabka wax lagu farsameeyo, wax soo saarka bartilmaameedka, xaaladda software-ka iyo qalabka wax soo saarka ee la heli karo.

Ku lifaaq Die Multi-Chip ah Qaybaha Habka La Hagaajin Karo Qiimaynta Qalabka La Isticmaalay

La-tashi Online ah Codso Dib u Eegista Qaabeynta

La wadaag sawirka xirmadaada, cabbirka meydka, qaabka maaraynta, agabka habka, saxnaanta meelaynta loo baahan yahay iyo natiijada bartilmaameedka si aad u hesho dib u eegis qalab oo khuseeya.

BESI DATACON 2200 evo die bonder platform in a semiconductor manufacturing environment

Qiimaynta Madal Qiimee habaynta saxda ah ee DATACON 2200 evo ka hor intaadan qorsheynin casriyeyn beddelka ama wax soo saarka.

Dulmar Guud oo ku saabsan Madal DATACON Automated semiconductor die bonding equipment for BESI DATACON 2200 evo platform evaluation

Waa maxay BESI DATACON 2200 evo?

Madal Ku-xidhan Module Badan, Maaha Hal Qeexitaan oo Mashiin Go'an ah

BESI DATACON 2200 evo waa madal isku-xidhka die-chip-ka badan oo sax ah oo loogu talagalay codsiyada die attach iyo flip-chip. Madalkan saldhigga ah ee evo waxaa lagu habeyn karaa hawlo sida qaybinta isku dhafan, maaraynta wafer-ka 12-inji ah, beddelka qalabka otomaatiga ah iyo qalab gaar ah oo loogu talagalay codsiga.

Qoyska DATACON 2200 evo waxaa ku jira noocyo badan, oo ay ku jiraan evo plus, hF, hS iyo advanced. Noocyadani way ku kala duwanaan karaan awoodda meelaynta, baaxadda isku xidhka, qaab-dhismeedka aragga, ikhtiyaarrada maaraynta, agabka habka iyo jihada codsiga.

Mabda'a xulashada wax ku oolka ah

Xaqiiji nooca saxda ah, xulashooyinka la rakibay, xirmada qalabka, xaaladda mashiinka iyo kartida tijaabada muunadda ka hor inta aadan u qaadan nidaamka DATACON 2200 evo sidii beddelka u eg-u-eg.

Sahamin BESI Die Bonders oo la heli karo Fiiri Qaybaha Mashiinka Isku-xidhka Die

Noocyada Kala Duwan ee Madal

DATACON 2200 evo, evo plus, hF, hS iyo horumarsan: Maxaa la barbar dhigi karaa?

Magaca DATACON 2200 evo wuxuu ka kooban yahay in ka badan hal jiho oo habka loo maro. Matrix-ka hoose wuxuu ka caawiyaa kala soocida noocyada waaweyn ee madal ka hor inta aan la barbar dhigin mashiinka la isticmaalay ama la dayactiray iyo shuruudaha codsigaaga.

Isbarbardhig nooca saxda ah ee mashiinka.

Qaabeynta, soo saarista wax soo saarka, qaybaha habka la rakibay iyo qalabka la heli karo ayaa si weyn u beddeli kara awoodda cutubka DATACON 2200 evo ee la bixiyo.

Nooca Madal	Tilmaamaha Qiimaynta Caadiga ah	Diiradda Tiknoolajiyadda Muhiimka ah	Diiradda Dib u Eegista Qalabka La Isticmaalay
DATACON 2200 evoSaldhigga saxnaanta sare ee saldhigga oo leh jajabyo badan oo jajab ah.	Ku lifaaq Die, Multi-Chip iyo Flip-Chip la xushayQiimee isha dhiman, socodka substrate-ka, walxaha habka loo farsameeyo, madaxyada shaqada iyo qaab-dhismeedka baakadaha.	Ku lifaaq Module badan oo dabacsanQaybinta isku dhafan, maaraynta wafer 12-inji ah, beddelka qalabka iyo qalabka gaarka ah ee codsiga ayaa laga yaabaa inay khuseeyaan iyadoo ku xiran cutubka la bixiyay.	Dhammaystirka QaabeyntaXaqiiji qaybaha maaraynta, madaxyada xidhmooyinka, ikhtiyaarrada qaybinta, qalabka wax lagu hagaajiyo, xaaladda software-ka iyo agabka ku jira.
DATACON 2200 evo plusMadal ku lifaaqan module badan oo la xoojiyay.	Dib u eegista Saxnaanta Sare iyo Xasilloonida WaxsoosaarkaQiimee in habkani uu ka faa'iideysanayo nidaamka kamarada, habka magdhowga kulaylka iyo xirmada farsamaynta sawirka ee xawaaraha sare leh.	Otomaatigga Wax Soo Saarka Multi-ChipDib u eeg beddelaadda otomaatiga ah iyo qalabka, qalabka soo-qaadista iyo meelaynta, qalabka soo saarista, hawlaha isku-dubaridka iyo ikhtiyaarrada habka-hawlgalka.	Xaqiijinta Aragtida iyo QalabkaXaqiiji xaaladda kamaradda, qalabka sawir-qaadista, qalabka cabbiraadda, hawlgalka beddelka qalabka iyo dejinta habka la heli karo.
DATACON 2200 evo hFQaabeynta isku xidhka disha ee xoogga badan ee badan.	Modules-ka Awoodda, Qiimaynta IGBT, MCM iyo SiPDib u eeg isku xidhka xoogga sare leh, shuruudaha kululaynta, wadada agabka iyo shuruudaha baakadaha farsamada.	Codsiyada Xoogga Xidhitaanka SareXaqiiji madaxa isku xidhka xoogga sare leh, xoogga wareegga xiran iyo xakamaynta heerkulka, awoodda sintering, qalabka kululaynta iyo ikhtiyaarrada kululaynta substrate-ka.	Xaaladda Kuleylka iyo XooggaDib u eeg madaxa xidhmada, qalabka kululaynta, habaynta xoogga, nidaamyada badbaadada, qalabka habka iyo xaaladda dhabta ah ee isku-xidhka farsamada.
DATACON 2200 evo hSQaabeynta lifaaqa badan ee xawaaraha sare leh.	Dib u eegista Ku lifaaq Die-ga Wax Soo Saarka Sare lehQiimee UPH-ka bartilmaameedka ah, baaxadda cabbirka meydka, iswaafajinta aragga, maaraynta substrate-ka iyo ku celcelinta habka loo baahan yahay.	Saxnaanta, Habaynta Sawirka iyo Soo-saarkaDib u eeg habaynta sawirka xawaaraha sare leh, maaraynta otomaatiga ah, shuruudaha meelaynta iyo socodka dhabta ah ee khadka loogu talagalay.	Xaqiijinta Wareegga Wax-soo-saarkaXaqiiji xaaladda dhaqdhaqaaqa, waxqabadka kamarada, dejinta quudinta ama wafer-ka, tijaabada wax soo saarka iyo helitaanka qalab ku habboon.
DATACON 2200 evo oo horumarsanMadal ku lifaaqan module badan oo sax ah oo heer sare ah.	Dib u eegista Saxnaanta Multi-Chip iyo Flip-ChipQiimee in wadada baakadu u baahan tahay saxnaan meelayn oo sare, ikhtiyaarro kamarad la habeyn karo, cabbiraadda dhererka aan taabashada lahayn ama maaraynta qalab badan.	Aragti Sare iyo Dabacsanaanta HabkaDib u eeg soo saarista qalabka gantry iyo kontoroolka, muraayadaha indhaha, dejinta aragga, kala duwanaanshaha xoogga isku xidhka, qaybaha qaybinta iyo habaynta qalabka habka.	Xaqiijinta Xulashada Saxda ahXaqiiji nidaamka kamarada ee la rakibay, xaaladda gangry, soo saarista kontaroolada, awoodda cabbiraadda dhererka, qalabka qaybinta iyo cuntooyinka habaynta.

Habka Bonder ee DATACON Die

Halka Mashiinka DATACON 2200 evo Die Bonding Machine lagu Qiimeyn karo

Ku habboonaanta mashiinka saxda ah waxay ka bilaabataa habka ku lifaaqa iyo qaab-dhismeedka baakadka. Wax soo saarka wax soo saarka iyo qeexitaannada meelaynta magacaaban waa in la barbar dhigaa oo keliya ka dib marka la xaqiijiyo dhererka, agabka, substrate-ka, qalabka iyo wadada maaraynta.

Hab-raaca ku habboonaanta ayaa ka horreeya ku habboonaanta summada.

Isbarbardhigga waxtarka leh wuxuu ka bilaabmaa sida loo soo qaado, loo dhigo, loo xidho, loo kormeero loona wareejiyo habka shaqada wax soo saarka ee loogu talagalay.

Golaha Multi-Chip

Dib u eeg taxanaha maaskarada, qalabka kala duwan ee la soo qaado oo la dhigo, bandhigga maaskarada ama saxaaradda, qaabka side-qaadaha, joomatari baakadka, habka dhejiska iyo shuruudaha kormeerka.

Ku lifaaqa Die iyo Meelaynta Agabka

Xaqiiji in habka la qorsheeyay uu isticmaalayo epoxy, alxanka, cadaadiska heerkulka, eutectic ama waddo kale oo agab ah, ka dibna xaqiiji qaybinta iyo habaynta kululaynta ee loo baahan yahay.

Habraacyada Shaqada ee Flip-Chip ee la Xushay

Hubi habka isku-dubaridka, jihada dice, socodka qulqulka ama marin-u-quudinta, maaraynta wafer-ka, qaabka substrate-ka, dulqaadka meelaynta iyo habka xaqiijinta habka.

Awoodda iyo Codsiyada Xoogga Sare

Qaabeynta qaabka hF, dib u eeg xoogga isku xidhka, xakamaynta heerkulka, habka sinter-ka, kulaylinta substrate-ka, qalabka kulaylka iyo shuruudaha farsamo ee gaarka u ah baakadka.

Precision die bonder configuration review with vision alignment and semiconductor handling modules

Dib u eegista Mashiinka DATACON ee BESI

Lix Meelood oo Qaabeyn ah oo Go'aamiya Awoodda Wax-ku-oolka ah

Mashiinka DATACON 2200 evo waa in loo qiimeeyaa qaab-dhismeed dhammaystiran oo wax soo saar ah. Taxanaha madalku ma muujinayo in cutubka la bixiyay uu leeyahay qalabka saxda ah ee habka, ikhtiyaarrada software-ka, modules-ka maaraynta iyo qalabka loogu talagalay wadada xirmada bartilmaameedka ah.

Naqshadeynta madaxa Bond, kala duwanaanshaha xoogga, wareegga iyo xulashooyinka qalabka kululaynta
Kaamirooyinka aragga, muraayadaha indhaha, iftiiminta iyo hawlaha isku-dubaridka
Wafer, saxaarad, Gel-Pak®, quudiye, qaade iyo maaraynta substrate-ka
Qaybaha qaybinta, qulqulka, shaabadaynta, wasakhaynta ama diyaarinta walxaha
Xakamaynta, nidaamka dhaqdhaqaaqa, nooca software-ka iyo ikhtiyaarrada la awoodsiiyay
Buskudka, qalabka lagu rakibo, qalabka hagaajinta iyo is-dhexgalka khadka

Qiimaynta La Isticmaalay & La Dayactiray

Maxaa la hubinayaa ka hor intaadan iibsan DATACON 2200 evo oo la isticmaalay?

Mashiinka DATACON ee la isticmaalay wuxuu noqon karaa mid ganacsi ahaan wax ku ool ah marka dib loo eego qaabeynta saxda ah, xaaladda cutubka, qalabka habka, habka tijaabada iyo baaxadda taageerada ka hor inta aan la rarin.

Codso caddayn ka hor intaadan fulin.

Sawirrada hadda jira, liisaska ikhtiyaarrada la rakibay, qalabka la heli karo, natiijooyinka tijaabada mashiinka, xogta korantada iyo baaxadda dib-u-habaynta ee la diiwaangeliyey ayaa ka faa'iido badan sharraxaadda moodeelka guud.

Qaabka Saxda ah iyo Nooca

Xaqiiji in cutubku yahay saldhig evo, evo plus, hF, hS ama horumarsan, ka dibna xaqiiji soo saarista wax soo saarkiisa, habaynta lambarka taxanaha ah iyo modules-yada la rakibay.

Madaxa Dammaanadda iyo Xaaladda Dhaqdhaqaaqa

Dib u eeg xaaladda madaxa xidhmada, baaxadda xoogga, safarka masraxa, nidaamka dhaqdhaqaaqa ama gangry, xaaladda side, marin u socodka fiilada iyo taariikhda dayactirka ka hortagga ah.

Aragga iyo Habaynta

Hubi kamaradaha, muraayadaha indhaha, iftiinka, hawlaha isku-dubaridka, xaaladda hagaajinta, qalabka sawir-samaynta iyo helitaanka qaybaha beddelka ah.

Xirmada Maareynta iyo Qalabka

Xaqiiji qaababka wafer-ka, saxamada, sideyaasha, quudiyeyaasha, af-xidhka, qalabka wax lagu shubo, qalabka substrate-ka, qalabka hagaajinta iyo agabka gaarka u ah baakadka.

Xaaladda Xakamaynta iyo Software-ka

Hubi qalabka kontaroolaha, xaaladda PC-ga, deegaanka software-ka, warbaahinta soo kabashada, xulashooyinka la awoodsiiyay, xogta habaynta, dukumentiyada farsamada iyo hawlaha barcode-ka ama khariidaynta meesha loo baahdo.

Qorshaha Aqoonta iyo Taageerada

Qeex shuruudaha tijaabada muunadda, shuruudaha aqbalaadda, habka baakadaha, baaxadda rakibidda, adeegyada korontada, baahida tababarka, qorshaha qaybaha dheeraadka ah iyo taageerada rakibidda kadib.

Tixraaca Gaarka ah ee Qaabeynta

Qoyska DATACON 2200 evo: Isbarbardhigga Tixraaca ee la daabacay

Qiimaha hoose waa qodobbo tixraac ah oo la daabacay oo loogu talagalay noocyada loogu magac daray DATACON 2200 evo. Ma aha xaqiijin ku saabsan awoodaha dhabta ah, xulashooyinka ku jira ama xaaladda mashiin la isticmaalay.

Xaqiiji cutubka la bixiyay.

Soo saarista mashiinka, qalabka la rakibay, qalabka, software-ka iyo xaaladda dayactirka waxay si weyn u saameyn karaan waxqabadka dhabta ah.

DATACON 2200 evo	Saxnaanta meelaynta X/Y ee la daabacay: ±10 µm @ 3σ; xoogga isku xidhka ee la barnaamijin karo: 0.5N ilaa 75N; tixraaca ku lifaaqan gudbinta: ilaa 7,000 UPH modulekiiba.
DATACON 2200 evo plus	Saxnaanta meelaynta X/Y ee la daabacay: ±7 µm @ 3σ; xoogga isku xidhka ee la barnaamijin karo: 0.5N ilaa 75N; tixraaca ku lifaaqan gudbinta: ilaa 7,000 UPH modulekiiba.
DATACON 2200 evo hF	Saxnaanta meelaynta X/Y ee la daabacay: ±10 µm @ 3σ; kala duwanaanshaha xoogga isku xidhka: 0.5N ilaa 500N; loogu talagalay shuruudaha habka xoogga sare leh.
DATACON 2200 evo hS	Saxnaanta meelaynta X/Y ee la daabacay: ±7 µm @ 3σ; xoogga isku xidhka ee la barnaamijin karo: 0.5N ilaa 75N; tixraaca ku lifaaqan gudbinta: ilaa 12,000 UPH modulekiiba.
DATACON 2200 evo oo horumarsan	Saxnaanta meelaynta X/Y ee la daabacay: ±3 µm @ 3σ; saxnaanta theta: ±0.07° @ 3σ; xoogga isku xidhka ee la barnaamijin karo: 0.5N ilaa 25N.
Tixraaca Maareynta Guud	Dhowr nooc oo kala duwan oo DATACON 2200 evo ah ayaa liis gareeya taageerada wafer-ka 4-inji ilaa 12-inji iyo kala duwanaansho shaqo oo ah 13-inji × 8-inji, iyadoo ku xiran nooca saxda ah iyo habaynta la rakibay.

Marka DATACON 2200 evo ay mudan tahay in la qiimeeyo

Madalku wuxuu mudan yahay in la xuso marka qaabaynta la bixiyay ay si dhow ula mid tahay habka loo yaqaan 'diet attachment', 'multi-chip', 'flip-chip' ama 'high-force way'.

Nooca saxda ah iyo modules-ka la rakibay waa la diiwaangeliyey.
Wafer-ka loo baahan yahay, saxaarad, quudiye, qaadiye ama maaraynta substrate-ka ayaa diyaar ah.
Madaxa xidhitaanka, kala duwanaanshaha xoogga, xirmada aragga iyo qalabka habka ayaa ku habboon xirmada loogu talagalay.
Xaaladda mashiinka iyo deegaanka software-ka waa la xaqiijin karaa ka hor inta aan la rarin.
Tijaabinta muunadda, qorsheynta rakibidda iyo baaxadda taageerada waa kuwo ganacsi ahaan wax ku ool ah.

Goorta la Joojinayo oo la Xaqiijinayo Kahor Iibsashada

Calaamadda magaca ee DATACON 2200 evo ma caddaynayso in mashiinku uu farsamo ahaan ku habboon yahay codsi kasta oo mashiinka isku xidhka ah.

Mashiinka la bixiyay ma laha liis lagu kalsoonaan karo oo habayn ah ama warbixin xaaladeed.
Qalabaynta loo baahan yahay, modules-ka habka, quudiyeyaasha ama maaraynta wafer-ka ayaa maqan.
Wadada loogu talagalay xirmada laguma tijaabin habaynta la bixiyay.
Shaqada kamarada, koontaroolaha, dhaqdhaqaaqa ama madaxa isku xidhka lama muujin karo.
Adeegyada, baahiyaha rakibidda, marin u helidda qaybaha dheeraadka ah ama baaxadda taageerada weli ma cadda.

Su'aalaha Farsamada & Iibsiga

BESI DATACON 2200 evo Die Bonder FAQ

Su'aalahani waxay daboolayaan hubinta wax ku oolka ah ee badanaa muhiim ah ka hor inta aan la barbar dhigin, la iibsan ama la dayactirin mashiinka isku xidhka DATACON 2200 evo die.

Waa maxay mashiinka BESI DATACON 2200 evo?

BESI DATACON 2200 evo waa madal isku-xidh badan oo loo isticmaalo qalabka isku-xidhka ee die attach, qalabka isku-xidhka badan ee chip-ka iyo shaqooyinka loo yaqaan flip-chip. Awooddeeda wax-ku-oolka ah waxay ku xidhan tahay nooca saxda ah ee evo, modules-ka habka ee la rakibay, fursadaha maaraynta, qalabka iyo xaaladda cutubka la bixiyay.

BESI DATACON 2200evo ma la mid baa DATACON 2200 evo?

Haa. "BESI DATACON 2200evo" waxaa badanaa loo isticmaalaa nooc raadinta magaca rasmiga ah ee madal DATACON 2200 evo. Nooca saxda ah ee mashiinka wali waa in la xaqiijiyaa sababtoo ah qoyska waxaa ku jira evo, evo plus, hF, hS iyo habayn horumarsan.

Waa maxay farqiga u dhexeeya DATACON 2200 evo iyo evo plus?

Qaabeynta evo plus waxaa lagu meeleeyay aragti la xoojiyay, habaynta sawirka xawaaraha sare leh, magdhowga kulaylka iyo shaqooyinka wax soo saarka ee chip-yada badan ee otomaatiga ah. Awoodda saxda ah ee mashiinka la isticmaalay waxay ku xiran tahay xulashooyinka la rakibay ee la shaqeynayo.

Maxaa loo isticmaalaa DATACON 2200 evo hF?

DATACON 2200 evo hF waxaa loogu talagalay codsiyada xoogga sare leh waxaana badanaa lagu qiimeeyaa modules-ka awoodda, socodka shaqada IGBT, MCM iyo SiP. Ku habboonaanta habka waxay kuxirantahay baaxadda xoogga la heli karo, dejinta kuleylinta, wadada agabka iyo qalabka baakadaha.

Ma DATACON 2200 evo qaban kartaa hababka isku xidhka iyo rogrogista jajabka?

Qaabab dhowr ah ayaa loogu talagalay shaqada ku lifaaqan ee die attach, multi-chip iyo flip-chip-ka la soo xulay. Jidka saxda ah ee habka waa in lagu xaqiijiyaa madaxa xidhmada, dejinta qaybinta ama flowing, nidaamka aragga, maaraynta agabka iyo xirmada qalabka.

Maxaa la hubin karaa ka hor intaadan iibsan DATACON 2200 evo oo la isticmaalay?

Xaqiiji nooca saxda ah, xulashooyinka la rakibay, madaxa xidhmada, baaxadda xoogga, nidaamka aragga, maaraynta wafer ama saxaaradda, xaaladda kontaroolaha, xaaladda software-ka, diiwaannada hagaajinta, qalabka la heli karo, macluumaadka tijaabada shaqaynaysa iyo baaxadda dib-u-habaynta.

Tilmaamaha DATACON 2200 evo ee la daabacay ma ku habboon yihiin mashiin kasta?

Maya. Qiimaha la daabacay waxay ka tirsan yihiin noocyada iyo habaynta gaarka ah ee DATACON 2200 evo. Awoodda mashiinka la isticmaalay waa in lagu xaqiijiyaa aqoonsiga moodeelka, xulashooyinka la rakibay, qalabka, xaaladda dayactirka iyo xaqiijinta shaqada.

Macluumaad noocee ah ayaa loo baahan yahay si loogu helo talo soo jeedinta DATACON 2200 evo?

Bixi sawirka baakadka, cabbirka dhimaha, dhumucda dhimaha, wadada agabka, qaabka wafer ama saxaaradda, nooca substrate-ka, UPH bartilmaameedka, dulqaadka meelaynta, heerkulka habka, qalabka la heli karo iyo wixii xayiraado xariiq ah oo jira.

Ma u baahan tahay dib u eegis habaynta DATACON 2200 evo?

La wadaag sawirka xirmadaada, qaabka qalabka la shiiday iyo kuwa la isku daray, habka loo baahan yahay ee wax soo saarka, wax soo saarka bartilmaameedka iyo wixii faahfaahin ah ee mashiinka la heli karo. Tani waxay suurtogal ka dhigaysaa in la qiimeeyo in qaabaynta BESI DATACON 2200 evo ee la bixiyay ay u qalanto khadkaaga wax soo saarka.

La-tashi Online ah