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Funa Quote →BESI DATACON 2200 evo ye nkola ey’okugattako modulo nnyingi esobola okuteekebwateekebwa ekozesebwa okuyunga ku die, okukuŋŋaanya chip eziwera n’enkola z’emirimu eza flip-chip ezirondeddwa. Obusobozi obw’omugaso obw’ekyuma kya DATACON 2200 evo ekiweebwayo businziira ku nkyusa yaakyo entuufu, enteekateeka y’omutwe gwa bond, vision package, okukwata wafer, okukozesa ebikozesebwa ne modulo z’enkola eziteekeddwamu.
Ku byuma bya DATACON ebikozesebwa n’ebiddaabiriziddwa, erinnya lya platform lyokka terimala. Ekyuma ekituufu kisaana okwekebejjebwa okusinziira ku kkubo ly’okupakinga erigendereddwa, enkola ya die, ebikozesebwa mu kukola, ebifulumizibwa ekigendererwa, embeera ya pulogulaamu n’ebikozesebwa ebiriwo mu kukola.
BESI DATACON 2200 evo ye nkola ya die bonder erimu chip eziwera nga ya butuufu nnyo era nga yakolebwa okukozesa die attach ne flip-chip. Base evo platform eyinza okuteekebwateekebwa n’emirimu nga okugabanya ebintu mu ngeri ey’omuggundu, okukwata wafer za yinsi 12, okukyusa ebikozesebwa mu ngeri ey’otoma n’okukozesa ebikozesebwa mu ngeri ey’enjawulo.
Famire ya DATACON 2200 evo erimu enkyusa eziwera, omuli evo plus, hF, hS ne advanced. Enkyusa zino zisobola okwawukana mu busobozi bw’okuteeka, obuwanvu bw’amaanyi ga bond-force, enzimba y’okulaba, engeri y’okukwatamu, ebikozesebwa mu nkola n’obulagirizi bw’okukozesa.
Kakasa model entuufu, ebyokulonda ebiteekeddwa, tooling package, embeera y'ekyuma n'obusobozi bw'okugezesa sample nga tonnakwata DATACON 2200 evo system nga like-for-like replacement.
Erinnya lya DATACON 2200 evo lirimu obulagirizi bw’enkola obusukka mu bumu. Matrix wansi eyamba okwawula enkyusa z’omukutu omukulu nga tonnageraageranya kyuma kikozesebwa oba ekiddaabiriziddwa ku byetaago by’okukozesa kwo.
Okusengeka, okukola okufulumya, modulo z’enkola eziteekeddwawo n’ebikozesebwa ebiriwo bisobola okukyusa ennyo obusobozi bwa yuniti ya DATACON 2200 evo ewereddwa.
| Enkyusa ya Platform | Obulagirizi bw’okwekenneenya obwa bulijjo | Essira erikulu erissiddwa ku tekinologiya | Essira ly’okuddamu okwetegereza ebyuma ebikozesebwa |
|---|---|---|---|
| DATACON 2200 evoBase ey'obutuufu obw'amaanyi multi-chip die bonder platform. | Die Attach, Multi-Chip ne Flip-Chip ezirondeddwaWeekenneenye okusinziira ku nsibuko ya die, okutambula kwa substrate, ebikozesebwa mu nkola, emitwe egikola n’enzimba y’ekipapula. | Flexible Multi-Module OkugattakoOkugaba ebikozesebwa mu ngeri ey’omuggundu, okukwata wafer ya yinsi 12, okukyusa ebikozesebwa n’okukozesa ebikozesebwa mu ngeri ey’enjawulo biyinza okuba ebikwatagana okusinziira ku yuniti ewereddwa. | Okujjuza OkusengekaKakasa modulo z’okukwata, emitwe gya bond, engeri y’okugaba, ebikozesebwa mu nkola, embeera ya pulogulaamu n’ebikozesebwa ebirimu. |
| DATACON 2200 evo n'okugattakoEnhanced multi-module okugatta platform. | Okuddamu okwetegereza obutuufu obw’oku ntikko n’obutebenkevu bw’okufulumyaWeekenneenye oba enkola eno eganyulwa mu nkola ya kkamera, enkola y’okuliyirira ebbugumu n’enkola y’okukola ebifaananyi ku sipiidi ey’amaanyi. | Okukola mu ngeri ey’obwengula (Multi-Chip Production Automation).Weekenneenye okukyusa wafer n’ebikozesebwa mu ngeri ey’otoma, ebikozesebwa mu kulonda n’okuteeka, ebikozesebwa okufulumya, emirimu gy’okulaganya n’enkola y’ebintu ebikozesebwa. | Okukakasa Okwolesebwa n’EbikozesebwaKakasa embeera ya kamera, ebikozesebwa mu kukola ebifaananyi, ebikozesebwa mu kupima, enkola y’ekikyusa ebikozesebwa n’okuteekawo enkola eriwo. |
| DATACON 2200 evo hFAmaanyi amangi multi-chip die okusiba ensengeka. | Module z’amaanyi, IGBT, MCM ne SiP EvaluationWeekenneenye okukwatagana okw’amaanyi amangi, ebyetaago by’ebbugumu, ekkubo ly’ebintu n’ebyetaago by’okupakinga eby’ebyuma. | Okukozesa Amaanyi g’Okukwatagana (High Bonding Force).Kakasa omutwe gwa bond ogw’amaanyi amangi, amaanyi aga closed-loop n’okufuga ebbugumu, obusobozi bw’okusiba, ebikozesebwa ebibuguma n’enkola z’okufumbisa substrate. | Embeera y’ebbugumu n’amaanyi-enkolaWeekenneenye omutwe gwa bond, ebikozesebwa mu kufumbisa, okupima amaanyi, enkola z’obukuumi, ebikozesebwa mu nkola n’embeera entuufu ey’ekibiina ky’ebyuma. |
| DATACON 2200 evo hSEnsengeka y’okugattako modulo eziwera ku sipiidi ey’amaanyi. | High-Output Die Attach Okuddamu okwetegerezaWeekenneenye target UPH, die size range, vision alignment, substrate handling n’okuddiŋŋana enkola eyeetaagisa. | Obutuufu, Okukola ku bifaananyi n’okufulumyaWeekenneenye okukola ebifaananyi ku sipiidi ey’amaanyi, okukwata mu ngeri ey’otoma, okwetaagisa okuteeka n’okutambula kw’ebintu kwennyini okwa layini egenderere. | Okukakasa enzirukanya y’okufulumyaKakasa embeera y’entambula, omulimu gwa kkamera, okuteekawo feeder oba wafer, okugezesa okufuluma n’okubaawo kw’ebikozesebwa ebikwatagana. |
| DATACON 2200 evo ya mulembeHigher-obutuufu multi-module attach platform. | Precision Multi-Chip ne Flip-Chip Okuddamu okwetegerezaWeekenneenye oba ekkubo ly’ekipapula lyetaaga obutuufu obw’okuteeka obw’oku ntikko, okulonda kwa kkamera ezisobola okuteekebwateekebwa, okupima obuwanvu obutakwatagana oba okukwata ebikozesebwa ebingi. | Okwolesebwa okw’omulembe n’okukyukakyuka mu nkolaWeekenneenye okukola gantry ne controller, optics, vision setup, bond-force range, modulo z’okugaba n’okusengeka enkola-ebikozesebwa. | Okukakasa Enkola EntuufuKakasa enkola ya kkamera etekeddwa, embeera ya gantry, omulembe gwa controller, obusobozi bw’okupima obuwanvu, okugaba ebikozesebwa n’enkola y’enkola. |
Okukwatagana kw’ekyuma okutuufu kutandika n’enkola y’okugattako n’ensengeka y’ekipapula. Ebifulumizibwa mu kukola n’ebiragiro ebikwata ku kuteekebwa mu linnya birina okugeraageranyizibwa oluvannyuma lw’okukakasibwa oluvannyuma lw’okukakasibwa die, material, substrate, tooling n’ekkubo ly’okukwata.
Okugerageranya okw’omugaso kutandikira ku ngeri die gy’alondebwamu, gy’eteekebwamu, gy’esibwamu, gye yeekebejjebwamu n’okukyusibwamu okuyita mu nkola y’emirimu gy’okufulumya egenderere.
Weekenneenye ensengeka y’ebifa, ebikozesebwa ebingi okulonda n’okubiteeka, okulaga wafer oba tray, enkola y’ekitwala, geometry y’ekipapula, enkola y’okusiiga n’ebyetaago by’okukebera.
Kakasa oba enkola etegekeddwa ekozesa epoxy, soldering, thermo-compression, eutectic oba ekkubo eddala ery’ebintu, olwo okakasizza ensengeka eyetaagisa ey’okugaba n’okufumbisa.
Kebera enkola y’okulaganya, okulungamya die, ekkubo ly’okukulukuta oba okunnyika, enkwata ya wafer, enkola ya substrate, okugumiikiriza okuteeka n’enkola y’okukakasa enkola.
Ku nsengeka ez’omulembe gwa hF, okwekenneenya amaanyi g’okukwatagana, okufuga ebbugumu, enkola ya sinter, okubugumya substrate, ebikozesebwa mu bbugumu n’ebyetaago by’ebyuma ebikwata ku package.
Ekyuma kya DATACON 2200 evo kirina okwekenneenya ng’ensengeka y’okufulumya enzijuvu. Omusomo gwa platform tegulaga oba yuniti ewereddwa erina hardware y’enkola entuufu, software options, handling modules ne tooling for a target package route.
Ekyuma kya DATACON ekikozesebwa kiyinza okuba eky’omugaso mu by’obusuubuzi nga ensengeka entuufu, embeera ya yuniti, ebikozesebwa mu nkola, enkola y’okugezesa n’obuwanvu bw’obuyambi byekenneenyezebwa nga tebannasindikibwa.
Ebifaananyi ebiriwo kati, enkalala z’ebyokulonda ebiteekeddwa, ebikozesebwa ebiriwo, ebivudde mu kukebera ebyuma, data y’amasannyalaze n’obuwanvu bw’okuddaabiriza obuwandiikiddwa bya mugaso nnyo okusinga ennyonyola y’ekyokulabirako eky’enjawulo.
Kakasa oba yuniti ya base evo, evo plus, hF, hS oba ya mulembe, olwo okakasizza omulembe gwayo ogw’okufulumya, ensengeka ya serial-number ne module eziteekeddwamu.
Weekenneenye embeera y’omutwe gwa bond, force range, stage travel, gantry oba motion system, embeera ya bearing, cable routing n’ebyafaayo by’okuddaabiriza okuziyiza.
Kakasa kamera, optics, ekitangaala, emirimu gy’okulaganya, embeera y’okupima, ebikozesebwa mu kukola ebifaananyi n’okubaawo kw’ebitundu ebikyusibwa.
Kakasa fuleemu za wafer, trays, carriers, feeders, nozzles, ebikozesebwa mu kufulumya, ebikozesebwa mu substrate, ebikozesebwa mu kalifuuwa n’ebikozesebwa ebikwata ku package.
Kebera controller hardware, embeera ya PC, embeera ya software, recovery media, enabled options, process data, ebiwandiiko eby’ekikugu n’emirimu gya barcode oba mapping we kyetaagisa.
Lambulula ebyetaago by’okugezesa sampuli, emisingi gy’okukkiriza, enkola y’okupakinga, obuwanvu bw’okussaako, ebikozesebwa, obwetaavu bw’okutendekebwa, enteekateeka ya sipeeya n’obuyambi oluvannyuma lw’okussaako.
Emiwendo wansi gifulumiziddwa ebifo ebijuliziddwa ku nkyusa za DATACON 2200 evo ezituumiddwa amannya. Si kukakasa busobozi bwennyini, eby’okulonda ebirimu oba embeera y’ekyuma ekikozesebwa ssekinnoomu.
Okukola ebyuma, ebikozesebwa ebiteekeddwamu, ebikozesebwa, pulogulaamu n’embeera y’okuddaabiriza bisobola okukosa ennyo omulimu ogw’omugaso.
| DATACON 2200 evo | Obutuufu bw’okuteeka X/Y obufulumiziddwa: ±10 μm @ 3σ; empalirizo y’okukwatagana (programmable bond force): 0.5N okutuuka ku 75N; die attach throughput reference: okutuuka ku 7,000 UPH buli modulo. |
|---|---|
| DATACON 2200 evo n'okugattako | Obutuufu bw’okuteeka X/Y obufulumiziddwa: ±7 μm @ 3σ; empalirizo y’okukwatagana (programmable bond force): 0.5N okutuuka ku 75N; die attach throughput reference: okutuuka ku 7,000 UPH buli modulo. |
| DATACON 2200 evo hF | Obutuufu bw’okuteeka X/Y obufulumiziddwa: ±10 μm @ 3σ; bond-force range: 0.5N okutuuka ku 500N; ekoleddwa olw’ebyetaago by’enkola ey’amaanyi amangi. |
| DATACON 2200 evo hS | Obutuufu bw’okuteeka X/Y obufulumiziddwa: ±7 μm @ 3σ; empalirizo y’okukwatagana (programmable bond force): 0.5N okutuuka ku 75N; die attach throughput reference: okutuuka ku 12,000 UPH buli modulo. |
| DATACON 2200 evo ya mulembe | Obutuufu bw’okuteeka X/Y obufulumiziddwa: ±3 μm @ 3σ; obutuufu bwa theta: ±0.07° @ 3σ; empalirizo y’ekiyungo ekiyinza okuteekebwa mu pulogulaamu: 0.5N okutuuka ku 25N. |
| Ekiwandiiko ekikwata ku ngeri eya bulijjo | Enkyukakyuka za DATACON 2200 evo eziwerako ziwandiika obuyambi bwa wafer okuva ku yinsi 4 okutuuka ku yinsi 12 n’okukola substrate ya yinsi 13 × yinsi 8, okusinziira ku nkyusa entuufu n’ensengeka eyateekebwamu. |
Omukutu guno gusaanira okusunsulwa nga ensengeka eweereddwa ekwatagana nnyo n’ekkubo ly’enkola erya target die attach, multi-chip, selected flip-chip oba high-force process route.
DATACON 2200 evo nameplate tekakasa nti ekyuma kino mu by’ekikugu kisaanira buli kyuma ekikwata die bonding.
Ebibuuzo bino bikwata ku kukebera okw’omugaso okutera okuba okw’omugaso nga tonnageraageranya, kugula oba kuddaabiriza kyuma kya DATACON 2200 evo die bonding.
BESI DATACON 2200 evo ye nkola ya multi-module attach platform ekozesebwa mu die attach, okukuŋŋaanya chip eziwera n’enkola z’emirimu eza flip-chip ezirondeddwa. Obusobozi bwayo obw’omugaso businziira ku nkyusa ya evo entuufu, modulo z’enkola eziteekeddwawo, engeri y’okukwatamu, ebikozesebwa n’embeera ya yuniti eweereddwa.
Yee. “BESI DATACON 2200evo” etera okukozesebwa ng’enkyukakyuka y’okunoonya ey’erinnya ettongole erya DATACON 2200 evo platform. Enkyusa y’ekyuma entuufu ekyalina okukakasibwa kubanga famire erimu evo, evo plus, hF, hS n’ensengeka ez’omulembe.
Ensengeka ya evo plus eteekeddwa mu kifo ekirabika obulungi, okukola ebifaananyi ku sipiidi ey’amaanyi, okuliyirira ebbugumu n’emirimu gy’okufulumya chip eziwera mu ngeri ey’otoma. Obusobozi obutuufu obw’ekyuma ekikozesebwa businziira ku ngeri ki eziteekeddwa mu mubiri era ezikola.
DATACON 2200 evo hF ekoleddwa okukozesa amaanyi ga bond-force aga waggulu era etera okwekenneenyezebwa ku modulo z’amaanyi, IGBT, MCM ne SiP workflows. Okusaanira enkola kisinziira ku maanyi agaliwo, ensengeka y’ebbugumu, ekkubo ly’ebintu n’ebikozesebwa mu kupakinga.
Ensengeka eziwerako zikoleddwa ku die attach, multi-chip ne selected flip-chip workflows. Ekkubo ettuufu ery’enkola lirina okukakasibwa okusinziira ku mutwe gwa bond, dispensing oba fluxing setup, vision system, material handling ne tooling package.
Kakasa model entuufu, eby’okulonda ebiteekeddwa, omutwe gwa bond, force range, vision system, wafer oba tray handling, controller, embeera ya software, calibration records, tooling eziriwo, functional test information n’okuddaabiriza scope.
Nedda.Emiwendo egyafulumiziddwa gya nkyusa n'ensengeka za DATACON 2200 evo ezenjawulo. Obusobozi bw’ekyuma ekikozesebwa ssekinnoomu bulina okukakasibwa okuyita mu ndagamuntu yaakyo ey’ekyokulabirako, eby’okulonda ebiteekeddwa, ebikozesebwa, embeera y’okuddaabiriza n’okukakasa emirimu.
Waayo ekifaananyi ky’ekipapula, ebipimo by’ekifa, obuwanvu bw’ekifa, ekkubo ly’ebintu, ensengeka ya wafer oba tray, ekika kya substrate, target UPH, okugumiikiriza okuteeka, ebbugumu ly’enkola, ebikozesebwa ebiriwo n’ebiziyiza byonna ebiriwo ku layini.
Gabana ekifaananyi kyo ekya package, die ne substrate format, enkola y’ebintu eyeetaagisa, target output n’ebikwata ku kyuma byonna ebiriwo. Kino kisobozesa okwekenneenya oba ensengeka ya BESI DATACON 2200 evo ewereddwa esaanira okubeera n’ebisaanyizo ku layini yo ey’okufulumya.
Lwaki abantu bangi basalawo okukola ne GeekValue?
Brand yaffe esaasaana okuva mu kibuga okudda mu kirala, era abantu abatabalika bambuuzizza nti, "GeekValue kye ki?" Kisibuka mu kwolesebwa okwangu: okutumbula obuyiiya bw’Abachina nga bakozesa tekinologiya ow’omulembe. Guno mwoyo gwa kika ogw’okulongoosa obutasalako, ogukwese mu kugoberera kwaffe okutasalako okukola buli kantu n’essanyu ery’okusukka ebisuubirwa buli lwe tutuusa. Obukugu buno kumpi obw’okwewaayo n’okwewaayo si kugumiikiriza kwokka kw’abatandisi baffe, wabula n’omusingi n’ebbugumu ly’ekibinja kyaffe. Tusuubira nti ojja kutandikira wano era otuwe omukisa okutondawo obutuukirivu. Tukolere wamu okutondawo ekyamagero ekiddako ekya "zero defect".
Ebikwata ku ddyoTuukirira omukugu mu by’okutunda
Tuuka ku ttiimu yaffe ey’abatunzi okunoonyereza ku nkola ezikoleddwa ku mutindo ogutuukana obulungi n’ebyetaago bya bizinensi yo n’okukola ku bibuuzo byonna by’oyinza okuba nabyo.
© Eddembe lyonna liri mu buyinza bwaffe. Obuwagizi mu by'ekikugu:TiaoQingCMS
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