What is a BESI DATACON 2200 evo machine?

BESI DATACON 2200 evo is a multi-module attach platform used for die attach, multi-chip assembly and selected flip-chip workflows. Its practical capability depends on the exact evo version, installed process modules, handling options, tooling and condition of the offered unit.

Is BESI DATACON 2200evo the same as DATACON 2200 evo?

Yes. BESI DATACON 2200evo is commonly used as a search variation of the official DATACON 2200 evo platform name. The exact machine version should still be confirmed because the family includes evo, evo plus, hF, hS and advanced configurations.

What is the difference between DATACON 2200 evo and evo plus?

The evo plus configuration is positioned with enhanced vision, high-speed image processing, thermal compensation and automatic multi-chip production functions. The exact capability of a used machine depends on which options are physically installed and operational.

What is DATACON 2200 evo hF used for?

DATACON 2200 evo hF is designed for high-bond-force applications and is commonly evaluated for power modules, IGBT, MCM and SiP workflows. Process suitability depends on the available force range, heating setup, material route and package tooling.

Can a DATACON 2200 evo handle die attach and flip-chip processes?

Several configurations are designed for die attach, multi-chip and selected flip-chip workflows. The exact process route should be verified against bond head, dispensing or fluxing setup, vision system, material handling and tooling package.

What should be checked before buying a used DATACON 2200 evo?

Confirm the exact model, installed options, bond head, force range, vision system, wafer or tray handling, controller condition, software status, calibration records, available tooling, functional test information and refurbishment scope.

Are published DATACON 2200 evo specifications valid for every machine?

No. Published values belong to specific DATACON 2200 evo versions and configurations. The capability of an individual used machine must be confirmed through its model identity, installed options, tooling, maintenance condition and functional validation.

What information is needed for a DATACON 2200 evo recommendation?

Provide the package drawing, die dimensions, die thickness, material route, wafer or tray format, substrate type, target UPH, placement tolerance, process temperature, available tooling and any existing line constraints.

Iiplatfomu zokuncamathisela iiModyuli ezininzi ze-BESI

BESI DATACON 2200 evo Die Bonder Platform Guide

I-BESI DATACON 2200 evo yiplatifomu yokuncamathisela iimodyuli ezininzi enokulungiswa esetyenziselwa i-die attach, i-multi-chip assembly kunye nemisebenzi ekhethiweyo ye-flip-chip. Amandla asebenzayo omatshini we-DATACON 2200 evo anikezelwayo axhomekeke kwinguqulelo yawo echanekileyo, ulungiselelo lwentloko yebhondi, iphakheji yombono, ukuphathwa kwe-wafer, izixhobo kunye neemodyuli zenkqubo ezifakiweyo.

Kwizixhobo zeDATACON ezisetyenzisiweyo nezihlaziyiweyo, igama leqonga lodwa alanelanga. Umatshini ofanelekileyo kufuneka uhlolwe ngokwendlela yephakheji ekujoliswe kuyo, ifomathi yedayi, izinto zenkqubo, imveliso ekujoliswe kuyo, imeko yesoftware kunye nezixhobo zemveliso ezikhoyo.

Isincamathelisi se-Multi-Chip Die Iimodyuli zeNkqubo eziCwangcisiweyo Uvavanyo lweZixhobo ezisetyenzisiweyo

Ukubonisana kwi-Intanethi Cela uHlolo loBume

Yabelana ngomzobo wephakheji yakho, ubungakanani bedayi, ifomathi yokuphatha, izinto zenkqubo, ukuchaneka kokubekwa okufunekayo kunye nemveliso ekujoliswe kuyo ukuze ufumane uphononongo lwezixhobo ezifanelekileyo.

BESI DATACON 2200 evo die bonder platform in a semiconductor manufacturing environment

Uvavanyo lweQonga Vavanya uqwalaselo oluchanekileyo lwe-DATACON 2200 evo ngaphambi kokuba ucwangcise ukutshintshwa okanye ukuphuculwa kwemveliso.

Isishwankathelo seQonga leDATACON Automated semiconductor die bonding equipment for BESI DATACON 2200 evo platform evaluation

Yintoni i-BESI DATACON 2200 evo?

Iqonga lokuncamathisela iiModule ezininzi, Akukho nkcazelo yomatshini enye esisigxina

I-BESI DATACON 2200 evo liqonga le-die bonder elichanekileyo kakhulu elenzelwe usetyenziso lwe-die attach kunye ne-flip-chip. Iqonga le-evo elisisiseko linokulungiswa ngemisebenzi efana nokusasaza okudibeneyo, ukuphathwa kwe-wafer ye-intshi ezili-12, ukutshintsha izixhobo ngokuzenzekelayo kunye nezixhobo ezithile zesicelo.

Usapho lwe-DATACON 2200 evo luquka iinguqulelo ezininzi, kuquka i-evo plus, i-hF, i-hS kunye ne-advanced. Ezi nguqulelo zinokwahluka ngokwamandla okubeka, uluhlu lwe-bond-force, uyilo lwembono, iindlela zokuphatha, izixhobo zenkqubo kunye nesikhokelo sesicelo.

Umgaqo wokukhetha osebenzayo

Qinisekisa imodeli echanekileyo, iinketho ezifakiweyo, iphakheji yezixhobo, imeko yomatshini kunye nokukwazi ukuvavanya isampuli ngaphambi kokuba uthathe inkqubo ye-DATACON 2200 evo njengento ethatha indawo ye-like-for-like.

Hlola ii-BESI Die Bonders ezikhoyo Jonga iindidi zoMatshini wokuDie Bonding

Iinguqu zePlatform

I-DATACON 2200 evo, evo plus, hF, hS kunye ne-advanced: Yintoni Efanele Ithelekiswe?

Igama le-DATACON 2200 evo liquka iindlela ezingaphezu kwesinye zenkqubo. I-matrix engezantsi inceda ukwahlula iinguqulelo eziphambili zeqonga ngaphambi kokuthelekisa umatshini osetyenzisiweyo okanye ohlaziyiweyo ngokumalunga neemfuno zesicelo sakho.

Thelekisa inguqulelo yomatshini echanekileyo.

Uqwalaselo, ukuveliswa kwemveliso, iimodyuli zenkqubo ezifakiweyo kunye nezixhobo ezikhoyo zinokutshintsha kakhulu amandla eyunithi ye-DATACON 2200 evo enikezelwayo.

Inguqulelo yeQonga	Isikhokelo soVavanyo oluQhelekileyo	Ingqwalasela ephambili yeTekhnoloji	Ingqwalasela yoHlolo lweZixhobo eziSetyenzisiweyo
I-DATACON 2200 evoIqonga le-multi-chip die bonder elichanekileyo kakhulu elisekwe kwisiseko.	I-Die Attach, i-Multi-Chip kunye ne-Flip-Chip ekhethiweyoVavanya ngokuthelekisa umthombo wokufa, ukuhamba kwe-substrate, izinto zenkqubo, iintloko zokusebenza kunye noyilo lweepakeji.	Isincamathiselo seModyuli ezininzi esiguquguqukayoUkusasazwa okudibeneyo, ukuphathwa kwe-wafer ye-intshi ezili-12, ukutshintsha izixhobo kunye nokusetyenziswa kwezixhobo ezithile kunokuba luncedo ngokuxhomekeke kwiyunithi ebonelelwayo.	Ukugqibelela koqwalaseloQinisekisa iimodyuli zokuphatha, iintloko zebhondi, iindlela zokuhambisa, izixhobo zenkqubo, imeko yesoftware kunye nezixhobo ezifakiweyo.
I-DATACON 2200 evo plusIqonga lokuncamathisela iimodyuli ezininzi eliphuculweyo.	Uphononongo lokuChaneka okuphezulu kunye nokuzinza kwemvelisoVavanya ukuba ngaba le nkqubo iyancedakala na kwinkqubo yekhamera, indlela yokubuyisela ubushushu kunye nephakheji yokucubungula imifanekiso ngesantya esiphezulu.	Ukuzenzekelayo kweMveliso yeeChip ezininziHlaziya utshintsho lwe-wafer oluzenzekelayo kunye nezixhobo, izixhobo zokukhetha nokubeka, izixhobo zokukhupha, imisebenzi yokulungelelanisa kunye neendlela zokukhetha izinto zenkqubo.	Ukuqinisekiswa koMbono kunye neZixhoboQinisekisa imeko yekhamera, izixhobo zokucubungula imifanekiso, izixhobo zokulinganisa, ukusebenza kokutshintsha izixhobo kunye nokuseta inkqubo ekhoyo.
I-DATACON 2200 evo hFUqwalaselo lwe-die bonding olunamandla aphezulu.	Iimodyuli zamandla, i-IGBT, i-MCM kunye noVavanyo lwe-SiPHlaziya iimfuno zokubopha ngamandla aphezulu, iimfuno zokufudumeza, indlela yezinto kunye neemfuno zephakheji yoomatshini.	Izicelo ze-High Bonding ForceQinisekisa intloko yebhondi enamandla aphezulu, amandla avaliweyo kunye nolawulo lobushushu, amandla okucoca, izixhobo ezifudumezayo kunye neendlela zokufudumeza ze-substrate.	Imeko yoBushushu kunye neNkqubo yaMandlaHlaziya intloko yebhondi, izixhobo zokufudumeza, ukulinganiswa kwamandla, iinkqubo zokhuseleko, izixhobo zenkqubo kunye nemeko yokwenyani yendibano yoomatshini.
I-DATACON 2200 evo hSUqwalaselo lokuncamathisela iimodyuli ezininzi olunesantya esiphezulu.	Uphononongo lweDie Attachment oluneziphumo eziphezuluVavanya i-UPH ekujoliswe kuyo, uluhlu lobungakanani bedayi, ulungelelwaniso lombono, ukuphathwa kwe-substrate kunye nokuphindaphinda kwenkqubo efunekayo.	Ukuchaneka, ukuCwangciswa koMfanekiso kunye nokuPhumaHlola ukucutshungulwa komfanekiso ngesantya esiphezulu, ukuphathwa ngokuzenzekelayo, imfuneko yokubekwa kunye nokuhamba kwezinto zomgca ocetywayo.	Ukuqinisekiswa koMjikelo weMvelisoQinisekisa imeko yentshukumo, ukusebenza kwekhamera, ukuseta i-feeder okanye i-wafer, imveliso yovavanyo kunye nokufumaneka kwezixhobo ezifanelekileyo.
I-DATACON 2200 evo ephuculweyoIqonga lokuncamathisela iimodyuli ezininzi elichanekileyo kakhulu.	Uphononongo lwePrecision Multi-Chip kunye neFlip-ChipVavanya ukuba ingaba indlela yephakheji ifuna ukuchaneka okuphezulu kokubekwa, ukhetho lwekhamera olunokulungiselelwa, umlinganiselo wokuphakama ongenanto yokuthinta okanye ukuphathwa kwezixhobo ezininzi.	Umbono oPhambili kunye nokuguquguquka kwenkquboHlaziya ukuveliswa kwe-gantry kunye nolawulo, i-optics, ukuseta umbono, uluhlu lwe-bond-force, iimodyuli zokuhambisa kunye noqwalaselo lwesixhobo senkqubo.	Ukuqinisekiswa Kokhetho OluchanekileyoQinisekisa ukuba inkqubo yekhamera efakiweyo ifakiwe, imeko ye-gantry, ukwenziwa kwesilawuli, amandla okulinganisa ubude, izixhobo zokuhambisa kunye neendlela zokupheka iinkqubo.

Inkqubo ye-DATACON Die Bonder Fit

Apho umatshini we-DATACON 2200 evo Die Bonding unokuvavanywa khona

Ukulingana komatshini ofanelekileyo kuqala ngenkqubo yokuncamathisela kunye nolwakhiwo lwephakheji. Imveliso yemveliso kunye neenkcukacha zokubekwa kwemveliso kufuneka zithelekiswe kuphela emva kokuba idayisi, izinto, isiseko, izixhobo kunye nendlela yokuphatha iqinisekisiwe.

Ukufaneleka kwenkqubo kuza ngaphambi kokufaneleka kophawu.

Uthelekiso oluluncedo luqala ngendlela idayisi ekhethwa ngayo, ebekwa ngayo, ebotshelelwe ngayo, ehlolwayo kwaye idluliselwa ngayo ngendlela ecwangcisiweyo yokuvelisa.

Indibano yeetshiphu ezininzi

Hlola ulandelelwano lweedayi, izixhobo ezininzi zokukhetha nokubeka, imbonakalo ye-wafer okanye yetreyi, ifomathi yokuthwala, ijiyometri yephakheji, inkqubo yokuncamathelisa kunye neemfuno zokuhlola.

I-Die Attach kunye nokubekwa kwezinto

Qinisekisa ukuba inkqubo ecwangcisiweyo isebenzisa i-epoxy, i-soldering, i-thermo-compression, i-eutectic okanye enye indlela yezinto, uze uqinisekise ukuba i-dispensing kunye ne-heating configuration iyimfuneko.

Iindlela zokusebenza zeFlip-Chip ezikhethiweyo

Jonga indlela yokulungelelanisa, indlela yokujonga idayethi, indlela yokujikeleza okanye yokuntywila, ukuphathwa kwe-wafer, ifomathi ye-substrate, ukunyamezelana kokubekwa kunye nendlela yokuqinisekisa inkqubo.

Izicelo zamandla kunye namandla aphezulu

Kwimilungiselelo yesitayile se-hF, jonga amandla ebhondi, ulawulo lobushushu, inkqubo ye-sinter, ukufudumeza kwe-substrate, izixhobo zobushushu kunye neemfuno zoomatshini ezithile kwiphakheji.

Precision die bonder configuration review with vision alignment and semiconductor handling modules

Uhlolo loMatshini we-BESI DATACON

Iindawo Ezintandathu Zokumisela Ezimisela Ubuchule Obusebenzayo

Umatshini we-DATACON 2200 evo kufuneka uvavanywe njengoqwalaselo olupheleleyo lwemveliso. Uthotho lweqonga alubonisi ukuba iyunithi enikezelwayo inezixhobo zenkqubo ezichanekileyo, ukhetho lwesoftware, iimodyuli zokuphatha kunye nezixhobo zendlela yephakheji ekujoliswe kuyo.

Uyilo lwentloko yebhondi, uluhlu lwamandla, ukujikeleza kunye neendlela zokukhetha izixhobo ezishushu
Iikhamera zokubona, i-optics, i-incasa kunye nemisebenzi yokulungelelanisa
Iwafa, itreyi, iGel-Pak®, ifeeder, ithwali kunye nokuphathwa kwesubstrate
Iimodyuli zokuhambisa, ukuhambisa, ukunyathela, ukutshiza okanye ukulungisa izinto
Umlawuli, inkqubo yokuhamba, inguqulelo yesoftware kunye neenketho ezivuliweyo
Ii-nozzles, izixhobo zokulungisa, izixhobo zokulinganisa kunye ne-interfaces yokudibanisa imigca

Uvavanyo olusetyenzisiweyo noluhlaziyiweyo

Yintoni Ekufuneka Ihlolwe Ngaphambi Kokuthenga I-DATACON 2200 evo Esetyenzisiweyo?

Umatshini we-DATACON osetyenzisiweyo unokuba luncedo kwezorhwebo xa uqwalaselo oluchanekileyo, imeko yeyunithi, izixhobo zenkqubo, indlela yovavanyo kunye nobubanzi benkxaso buhlolwa ngaphambi kokuba kuthunyelwe.

Cela ubungqina phambi kokuba uzinikele.

Iifoto zangoku, uluhlu lweenketho ezifakiweyo, izixhobo ezikhoyo, iziphumo zovavanyo loomatshini, idatha yombane kunye nobubanzi bokuhlaziya obubhaliweyo ziluncedo ngakumbi kunenkcazo yemodeli eqhelekileyo.

Imodeli echanekileyo kunye neNguqulelo

Qinisekisa ukuba iyunithi i-base evo, evo plus, hF, hS okanye i-advanced, uze uqinisekise ukuveliswa kwayo, uqwalaselo lwenombolo ye-serial kunye neemodyuli ezifakiweyo.

Intloko yeBond kunye neMotion Condition

Jonga imeko yentloko yebhondi, uluhlu lwamandla, uhambo lwesiteji, inkqubo ye-gantry okanye yokuhamba, imeko yeebhereyitha, ukuhanjiswa kweentambo kunye nembali yokugcinwa kokuthintela.

Umbono kunye noLungiso

Qinisekisa iikhamera, i-optics, ukukhanya, imisebenzi yokulungelelanisa, imeko yokulinganisa, izixhobo zokucubungula imifanekiso kunye nokufumaneka kwezinto ezitshintshayo.

Iphakheji yokuphatha kunye neZixhobo

Qinisekisa iifreyimu ze-wafer, iitreyi, izinto zokuthwala, ii-feeders, ii-nozzles, izixhobo zokukhupha, izixhobo ze-substrate, izixhobo zokulinganisa kunye nezixhobo ezithile zephakheji.

Imeko yoMlawuli kunye neSoftware

Jonga i-hardware yomlawuli, imeko yePC, indawo yesoftware, imidiya yokubuyisela, iinketho ezivunyiweyo, idatha yenkqubo, amaxwebhu obuchwephesha kunye nemisebenzi yebhakhowudi okanye imephu apho kufuneka khona.

Isicwangciso seMfanelo kunye neNkxaso

Chaza iimfuno zovavanyo lwesampulu, iikhrayitheriya zokwamkelwa, indlela yokupakisha, ubungakanani bokufakelwa, izixhobo zokusebenza, imfuneko yoqeqesho, isicwangciso senxalenye yokuncedisa kunye nenkxaso emva kokufakelwa.

Isalathiso Esithile Soqwalaselo

Usapho lwe-DATACON 2200 evo: Uthelekiso lweeReferensi eziPapashiweyo

Amaxabiso angezantsi ngamanqaku ereferensi apapashiweyo kwiinguqulelo ze-evo ze-DATACON 2200 ezibizwa ngokuba yi-evo. Azingobungqina bezakhono zokwenyani, ukhetho olubandakanyiweyo okanye imeko yomatshini osetyenzisiweyo ngamnye.

Qinisekisa iyunithi ebonelelwayo.

Ukuveliswa koomatshini, izixhobo ezifakelweyo, izixhobo, isoftware kunye nemeko yokugcinwa kwazo zinokuchaphazela kakhulu ukusebenza okusebenzayo.

I-DATACON 2200 evo	Ukuchaneka kokubekwa kwe-X/Y okupapashiweyo: ±10 µm @ 3σ; amandla ebhondi anokucwangciswa: 0.5N ukuya kwi-75N; isalathiso se-die attach throughput: ukuya kuthi ga kwi-7,000 UPH ngemodyuli nganye.
I-DATACON 2200 evo plus	Ukuchaneka kokubekwa kwe-X/Y okupapashiweyo: ±7 µm @ 3σ; amandla ebhondi anokucwangciswa: 0.5N ukuya kwi-75N; isalathiso se-die attach throughput: ukuya kuthi ga kwi-7,000 UPH ngemodyuli nganye.
I-DATACON 2200 evo hF	Ukuchaneka kokubekwa kwe-X/Y epapashweyo: ±10 µm @ 3σ; uluhlu lwamandla ebhondi: 0.5N ukuya kwi-500N; yenzelwe iimfuno zenkqubo enamandla aphezulu.
I-DATACON 2200 evo hS	Ukuchaneka kokubekwa kwe-X/Y okupapashiweyo: ±7 µm @ 3σ; amandla ebhondi anokucwangciswa: 0.5N ukuya kwi-75N; isalathiso se-die attach throughput: ukuya kuthi ga kwi-12,000 UPH ngemodyuli nganye.
I-DATACON 2200 evo ephuculweyo	Ukuchaneka kokubekwa kwe-X/Y okupapashiweyo: ±3 µm @ 3σ; ukuchaneka kwe-theta: ±0.07° @ 3σ; amandla ebhondi anokucwangciswa: 0.5N ukuya kwi-25N.
Isalathiso Esiqhelekileyo Sokuphathwa	Iindidi ezahlukeneyo ze-DATACON 2200 evo zidwelisa inkxaso ye-wafer ye-intshi ezi-4 ukuya kwezi-12 kunye noluhlu olusebenzayo lwe-substrate ye-intshi ezi-13 × 8, kuxhomekeke kwinguqulelo echanekileyo kunye noqwalaselo olufakiweyo.

Xa i-DATACON 2200 evo ifanelekile ukuvavanywa

Eli qonga lifanelekile ukuluhlu olufutshane xa uqwalaselo olunikezelwayo luhambelana ngokusondeleyo ne-target die attach, i-multi-chip, i-flip-chip ekhethiweyo okanye indlela yenkqubo enamandla aphezulu.

Inguqulelo echanekileyo kunye neemodyuli ezifakiweyo zibhaliwe.
I-wafer, itreyi, i-feeder, i-carrier okanye i-substrate efunekayo iyafumaneka.
Intloko yebhondi, uluhlu lwamandla, iphakheji yokubona kunye nezixhobo zenkqubo zihambelana nephakheji ekujoliswe kuyo.
Imeko yomatshini kunye nendawo yesoftware inokuqinisekiswa ngaphambi kokuba ithunyelwe.
Uvavanyo lwesampulu, ucwangciso lokufakela kunye nobubanzi benkxaso ziluncedo kwezorhwebo.

Ixesha lokumisa nokuqinisekisa ngaphambi kokuba uthenge

I-DATACON 2200 evo nameplate ayibonisi ukuba lo matshini ufanelekile ngokwetekhnoloji kuzo zonke izicelo zomatshini wokubopha iidayi.

Umatshini onikezelwayo awunalo uluhlu oluthembekileyo loqwalaselo okanye ingxelo yemeko.
Izixhobo ezifunekayo, iimodyuli zenkqubo, ii-feeders okanye ukuphathwa kwe-wafer azikho.
Indlela yephakheji ekujoliswe kuyo ayikavavanywa kwisimo esibonelelwayo.
Ukusebenza kwekhamera, isilawuli, intshukumo okanye i-bond-head akunakuboniswa.
Izixhobo zokusebenza, iimfuno zokufakela, ukufikelela kwiindawo ezingasetyenziswanga okanye umda wenkxaso akukacaci.

Imibuzo yoBugcisa kunye nokuThenga

BESI DATACON 2200 evo Die Bonder FAQ

Le mibuzo igubungela uhlolo olusebenzayo oluhlala lubalulekile ngaphambi kokuthelekisa, ukuthenga okanye ukuhlaziya umatshini we-DATACON 2200 evo die bonding.

Yintoni umatshini we-BESI DATACON 2200 evo?

I-BESI DATACON 2200 evo liqonga lokuncamathisela leemodyuli ezininzi elisetyenziselwa i-die attach, i-multi-chip assembly kunye nemisebenzi ekhethiweyo ye-flip-chip. Amandla ayo asebenzayo axhomekeke kwinguqulelo ye-evo echanekileyo, iimodyuli zenkqubo ezifakiweyo, iindlela zokuphatha, izixhobo kunye nemeko yeyunithi enikezelwayo.

Ingaba i-BESI DATACON 2200evo iyafana ne-DATACON 2200 evo?

Ewe. I-“BESI DATACON 2200evo” isetyenziswa rhoqo njengotshintsho lokukhangela lwegama elisemthethweni leqonga le-DATACON 2200 evo. Inguqulelo echanekileyo yomatshini isafanele iqinisekiswe kuba usapho luquka i-evo, i-evo plus, i-hF, i-hS kunye noqwalaselo oluphambili.

Yintoni umahluko phakathi kwe-DATACON 2200 evo kunye ne-evo plus?

Uqwalaselo lwe-evo plus lubekwe kwindawo enombono ophuculweyo, ukucutshungulwa kwemifanekiso ngesantya esiphezulu, ukubuyiselwa kobushushu kunye nemisebenzi yokuvelisa ii-chip ezininzi ngokuzenzekelayo. Amandla okwenyani omatshini osetyenzisiweyo axhomekeke ekubeni zeziphi iindlela ezifakelweyo nezisebenzayo.

Isetyenziselwa ntoni i-DATACON 2200 evo hF?

I-DATACON 2200 evo hF yenzelwe usetyenziso lwe-high-bond-force kwaye idla ngokuvavanywa kwiimodyuli zamandla, i-IGBT, i-MCM kunye neendlela zokusebenza ze-SiP. Ukufaneleka kwenkqubo kuxhomekeke kuluhlu lwamandla olufumanekayo, ukuseta ukufudumeza, indlela yezinto kunye nezixhobo zephakheji.

Ngaba i-DATACON 2200 evo ingakwazi ukuphatha iinkqubo ze-die attach kunye ne-flip-chip?

Kukho iindlela ezahlukeneyo zokulungiselela imisebenzi ye-die attach, i-multi-chip kunye ne-flip-chip ekhethiweyo. Indlela echanekileyo yenkqubo kufuneka iqinisekiswe ngokuchasene nentloko yebhondi, ukuseta okusasazwayo okanye ukuguquguquka, inkqubo yokubona, ukuphathwa kwezinto kunye nephakheji yezixhobo.

Yintoni ekufuneka ihlolwe ngaphambi kokuba uthenge i-DATACON 2200 evo esetyenzisiweyo?

Qinisekisa imodeli echanekileyo, ukhetho olufakelweyo, intloko yebhondi, uluhlu lwamandla, inkqubo yokubona, ukuphathwa kwe-wafer okanye itreyi, imeko yomlawuli, imeko yesoftware, iirekhodi zokulinganisa, izixhobo ezikhoyo, ulwazi lovavanyo olusebenzayo kunye nobubanzi bokuhlaziya.

Ngaba iinkcukacha ze-DATACON 2200 evo ezipapashiweyo ziyasebenza kuyo yonke imashini?

Hayi. Amaxabiso apapashiweyo ngaweenguqulelo ezithile ze-DATACON 2200 evo kunye noqwalaselo. Amandla omatshini osetyenzisiweyo ngamnye kufuneka aqinisekiswe ngokuchongwa komzekelo wawo, ukhetho olufakiweyo, izixhobo, imeko yolondolozo kunye nokuqinisekiswa kokusebenza.

Loluphi ulwazi olufunekayo kwingcebiso ye-DATACON 2200 evo?

Nika umzobo wephakheji, ubungakanani bedayi, ubukhulu bedayi, indlela yezinto, ifomathi ye-wafer okanye yetreyi, uhlobo lwesiseko, i-UPH ekujoliswe kuyo, ukunyamezelana kokubekwa, ubushushu benkqubo, izixhobo ezikhoyo kunye nayo nayiphi na imida yomgca ekhoyo.

Ngaba ufuna uphononongo loqwalaselo lwe-DATACON 2200 evo?

Yabelana ngomzobo wephakheji yakho, ifomathi yedayi kunye ne-substrate, inkqubo yezinto ezifunekayo, imveliso ekujoliswe kuyo kunye nazo naziphi na iinkcukacha zomatshini ezikhoyo. Oku kwenza kube nokwenzeka ukuvavanya ukuba ulungiselelo lwe-BESI DATACON 2200 evo olunikezelwayo lufanelekile na kumgca wakho wemveliso.

Ukubonisana kwi-Intanethi