Besi Fico Compact Line - P semiconductor trim and form

The Besi Fico Compact Line - P (FCL-P) is a high-precision, fully automated trim and form system designed specifically for power semiconductor products. It integrates exceptional precision, powerful punching capabilities, and rigorous contamination control, aiming to address the increasingly stringent requirements for Process Capability Index (Cpk—specifically, the long-term process capability index) and traceability in power chip manufacturing.

**Key Parameters at a Glance**

The following are the key parameters of the FCL-P, compiled based on official specifications:

**Item** | **Specification**

**Equipment Type** | Fully Automated Trim and Form System

**Punching Force** | 50 kN (58 Joules)

**Punching Speed** | Up to 250 strokes/minute

**Tool Width** | 225 mm

**Leadframe Dimensions (L x W)** | 150–300 mm x 18–125 mm

**Leadframe Thickness** | 0.1 – 2 mm

**Product Thickness** | 0 – 10 mm

**Noise Level** | Below 75 dB(A)

**Power Requirements** | 208–480 VAC, 3-phase, 50/60 Hz

**Compressed Air** | 5–10 bar

**Key Technologies and Features**

To enable the FCL-P to efficiently tackle the challenges inherent in power device manufacturing, Besi focused on the following key areas during its design:

**Optimized Specifically for Power Devices:** The system is engineered to meet the rigorous demands of power products regarding precision, Cpk, and traceability; it acts as a specialized "expert" solution for the packaging of high-power, high-reliability chips.

**Advanced Contamination Control System:** This is a critical feature enabling the FCL-P to handle sensitive materials, such as pre-plated leadframes. The system equips each punching unit with an independent suction mechanism and utilizes an innovative cyclonic dust filter to effectively capture particulate matter, thereby ensuring stable and trouble-free production.

**High Precision and Powerful Drive Force:** It delivers a robust punching force of up to 50 kN (58 Joules), capable of processing most thick leadframes or complex pin structures. Additionally, it integrates a vision inspection system for leadframe recognition and positioning, providing reliable data support for subsequent quality analysis. Flexible Modular Design and Automation: The FCL-P offers flexible configuration options through various modules—including intelligent magazine handling systems, multi-format tube feeders, laser markers, and sorters—to meet highly customized production requirements. Furthermore, it supports optional integration via the SECS/GEM protocol to seamlessly interface with factory MES systems, thereby enabling fully automated management.

Key Application Areas

In short, the FCL-P is specifically designed for the core components used in high-reliability and high-power application scenarios.

Application Area | Primary Function

Power Semiconductors | In the production of power chips—such as IGBTs, MOSFETs, and power management ICs—it is responsible for punching, separating, and performing the final forming of entire leadframes.

Automotive Electronics | Delivers stable and reliable forming quality for automotive-grade chips (e.g., ECUs), ensuring their durability and reliability in harsh operating environments.

Other High-Reliability Applications | Catering to sectors such as industrial control and new energy, it efficiently performs the trim-and-form operations for third-generation semiconductor devices, such as SiC and GaN components.

Various Package Types | Capable of handling a wide range of high-density, small-footprint packages, including DFN, QFN, SOT, and SOD.

Collaborative Ecosystem

Within a semiconductor packaging production line, the FCL-P typically works in close collaboration with upstream and downstream equipment to form a closed-loop production system encompassing "molding, forming, and sorting."

Collaboration with Upstream Equipment: Receives leadframes or substrates that have completed the molding process from molding machines, and subsequently performs the trim-and-form operations.

Integration with Other Besi Equipment: This represents the ideal approach for maximizing the system's overall efficiency and performance.

Fico Molding Systems: Provides the products once the molding process is complete.

Integrated Laser Marking Module: Enables the marking of products—with batch numbers, QR codes, or other identifiers—either before or after the trim-and-form process, thereby ensuring full product traceability.

Sorter: Performs the final sorting, counting, and packaging of the devices after they have been punched and separated.

Summary

The Besi Fico Compact Line - P (FCL-P) is not merely a "general-purpose" trim and form machine; rather, it is a "high-precision process specialist" meticulously tailored for the power semiconductor sector.

Leveraging a robust 50kN punching force and an industry-leading contamination control system, it efficiently resolves the critical issue of particulate contamination during the production process.

Its modular and traceable design meets the rigorous standards required for advanced factory automation and quality management.

Therefore, when your production requirements center on the key attributes of "power products," "high precision," and "high reliability," the FCL-P undoubtedly stands out as a core piece of equipment deserving of your serious consideration.