i-ave ukuya kuthi ga kwi-70% kuMacandelo e-SMT - KwiSitokhwe & Ukulungele ukuThunyelwa
Fumana iQuote →Umphathi we-semiconductor chip uhambisa izixhobo ukusuka kwi-media yazo engenayo ukuya kuvavanyo, uvavanyo lombane okanye izikhululo zokugqiba, agcine i-chip nganye ijongeke ngokuchanekileyo kwaye ilandeleka, aze ayibeke kwi-output bin efunekayo, kwitreyi, kwityhubhu okanye kwiteyiphu. Umatshini ofanelekileyo uxhomekeke ekubeni isixhobo siqala phi, ukuba sibuthathaka kangakanani, zeziphi izinto ekufuneka zenzeke phakathi kunye nendlela ii-chips ezamkelweyo nezilahliweyo ekufuneka ziphume ngayo kwinkqubo.
Oomatshini ababini banokubizwa ngokuba ngabaphangi beetshiphusi ze-semiconductor ngelixa besebenzisa iinkqubo zokulayisha, zokunyakaza nezokukhupha ezahluke ngokupheleleyo. Qala ngemidiya yesixhobo kunye nendawo oya kuyo ngaphambi kokuthelekisa isantya okanye uphawu.
Izixhobo ezipakishwe nge-singled okanye izinto ezithambileyo ezifakwe kwi-JEDEC okanye kwiitreyi ezenziwe ngokwezifiso.
Ijiyometri yetreyi, ubunzulu bepokotho, umphezulu wepick kunye nolwalathiso lwesixhobo zichonga ukuba ingaba ilori ekhoyo, indlwane kunye nokuseta umbono kunokusetyenziswa kwakhona.
Izixhobo ezinikezelwa ngeetyhubhu, ii-feeders okanye i-input ejolise kubuninzi ukuze zigqitywe ngesantya esiphezulu.
Indlela kufuneka igcine izixhobo zijonge kwi-bulk okanye kwi-tube input ngokubhala, ukuhlola okanye ukuvavanya, emva koko zibeke iziphumo nganye kwi-tape pocket echanekileyo okanye kwi-reject output.
Izixhobo ezisikiweyo zihlala kwifreyimu yefilimu emva kokunyibilika kwaye kufuneka zikhethwe ngaphandle kokonakalisa idayisi okanye iphakheji.
Idatha yemephu ye-wafer, inkxaso ye-ejector, amandla okuthatha kunye nokujongwa kwe-die kufuneka zihlale zidibene xa izixhobo zisuka kwifreyimu yefilimu ziye kwitreyi, iteyiphu okanye imveliso ye-wafer eyakhiwe ngokutsha.
Izixhobo ziyavavanywa okanye zihlolwe ngaphambi kokuba zifakwe ngokupheleleyo okanye xa zifakwe kwi-carrier.
Ubungakanani bemicu, inkxaso yomthwali, uyilo loqhagamshelwano kunye nokwahlukana emva kovavanyo kugqiba ukuba iqonga lingayicubungula na imveliso ngaphambi okanye emva kokuyicubungula.
Izixhobo ngazinye zijikeleza kwizikhululo ezininzi ukuze zivavanye, zihlole, zimakishwe kwaye zihlelwe.
Uqwalaselo oluluncedo luxhomekeke kumyalelo wesitishi, indlela yokuthatha, uhlolo kunye noqhagamshelo lwabavavanyi, iimfuno zokumakisha kunye nendlela yokugqibela yebhini, itreyi okanye iteyiphu.
Khangela ingqokelela yangoku, uze uqinisekise imidiya yokufaka, ubungakanani besixhobo, izitishi ezifunekayo, ifomathi yemveliso kunye nezixhobo zokuguqula ezifakiweyo zomatshini wokwenyani.
I-SUNBIRD ibonelela ngesisombululo sovavanyo lwe-wafer esisebenzayo, esithembekileyo nesiguquguqukayo kushishino lwe-semiconductor ngokusebenzisa uphuhliso...
Njengenguqulelo ephuculweyo ye-MS100, i-ASM MS100 Plus ikwasisixhobo sokuhlela iitships kunye nokulungiselela ngokusekelwe kwi-wafer...
I-ISMECA NY20 (ngoku eyiyeyeCohu) ngumatshini wokuvavanya nokuhlunga we-semiconductor ojikelezayo onesantya esiphezulu onezikhululo ezingama-20.
Umatshini wokuhlela we-ASM i-MS90 sisixhobo esenzelwe ukuhlela iintsimbi zezibane, esinomsebenzi wokuhlela osebenzayo nochanekileyo. Oku...
Ubungakanani bombane ophezulu buluncedo kuphela xa umphathi ekhusela isixhobo, egcina ubuwena belothi kwaye eveza itshiphusi nganye ngokuchanekileyo kumsebenzi olandelayo. Ezi ngozi zihlala zimisela uqwalaselo lokwenyani lomatshini.
Idayi engenanto, i-WLCSP, iipakethe ezincinci, i-MEMS, iisensa kunye nezixhobo ze-optoelectronic zinokufuna i-vacuum elawulwayo, uqhagamshelwano oluhambelanayo, inkxaso yomphetho okanye umphezulu okhethekileyo wokuthatha.
Inkqubo kufuneka iqaphele isixhobo, iqinisekise ukuba sibekwe njani kwaye siyibeke rhoqo ngaphambi kokuhlolwa, ukudibana nombane, ukuphawulwa okanye ukupakisha okuphumayo.
Indawo yemephu, ibhakhodi, i-OCR, iresiphi, isiphumo sebhini kunye nendawo yokuphuma kunokufuneka zihlale ziqhagamshelwe kuyo yonke indlela yokuphatha.
Ukulungelelaniswa kwesokhethi, amandla oqhagamshelwano, ukulingana kunye nexesha lokuhlala kuchaphazela ukuphindaphinda nokuba umlinganiselo wombane wenziwa yi-ATE eyahlukileyo.
Izixhobo ezamkelweyo, ezingamkelekanga nezilinganisiweyo zinokuphuma kwiitreyi ezahlukeneyo, iityhubhu, iibhini, iireli okanye iindawo zewafer ezakhiwe ngokutsha.
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xhUMBONOUkuhlolwa kwekhowudi ngentla, ezantsi, ecaleni, kwi-bump, i-lead okanye ikhowudi kungongezwa ngaphambi okanye emva kovavanyo.
UVAVANYOUmphathi ubeka isixhobo kwindawo yoqhagamshelwano ngelixa i-ATE okanye umvavanyi ozinikeleyo esenza umlinganiselo.
I-thermalAmandla obushushu kufuneka ahambelane namandla esixhobo, ixesha lovavanyo, indlela yokuntywila kwi-thermal kunye nokuchaneka okufunekayo.
UMARKOAbanye abaphathi bokugqiba badibanisa ukumakisha, ukuqinisekiswa kwekhowudi kunye nokuhlolwa kwakhona ngaphambi kokuba kuphume imveliso.
IPHEKIIfomathi yokugqibela yepakethi kunye nengqiqo yamanqanaba kufuneka ichazwe ngaphambi kokuba kukhethwe iikhithi zokuguqula kunye nokuzisebenzela ngokuzenzekelayo.
Igama elithi i-chip handler lingachaza okungaphezulu nje komatshini wokuthutha olula. Ngokuxhomekeke kwiqonga, linokubonisa izixhobo zovavanyo lombane, lizijikelezise kwizikhululo zokuhlola, lifake uphawu, lihlele iziphumo kwaye lilungiselele imidiya yokugqibela ephumayo.
Isixhobo sokuphatha isixhobo se-semiconductor siluncedo kuphela xa izixhobo zaso ezifakiweyo zinokuthwala isixhobo sakho ukusuka kwimidiya engenayo ukuya kwizitishi ezifunekayo ukuya kwisiphumo esichanekileyo. Chaza loo ndlela ngaphambi kokuthelekisa amagama eemodeli okanye isantya esibhengeziweyo.
Bhala phantsi ubungakanani bepakeji okanye idayisi, ubukhulu, ubunzima, i-warpage, iindawo ezibuthathaka kunye nobuso obunokuthi buqhagamshelane ngokukhuselekileyo nozzle, i-gripper, indlwane okanye i-ejector.
Xela ukuba izixhobo zifika ngeetreyi, iityhubhu, imicu, izitya, ii-carriers okanye iifreyimu zefilimu, kubandakanya i-pocket geometry, i-orientation kunye nemida yokukhupha impahla.
Chaza i-polarity, ukujikeleza, ukusetyenziswa kwemephu ye-wafer, iimfuneko zebhakhowudi okanye ze-OCR kunye nendawo apho umatshini kufuneka aqinisekise khona ubuwena besixhobo.
Ukuhlolwa koluhlu, uvavanyo lombane, ukulungiswa kobushushu, ukumakishwa, ukuhlaziywa kwakhona kunye nokubekwa kwinqanaba ngokolandelelwano isixhobo ekufuneka sizityelele.
Cacisa indlela yokudlulisa, ukusilela, ukujonga kwakhona, isiphene sokubona, ibhini yombane okanye umgangatho womthengi ekufuneka ulawule ngayo indawo elandelayo.
Qinisekisa itreyi, ityhubhu, ireyile, i-wafer eyakhiwe ngokutsha okanye i-bin output kunye ne-tester, i-MES, ukulandeleka kunye noqhagamshelo lwe-utility-fektri.
Le mibuzo igxile ekushukumeni kwesixhobo kunye nokuthembeka kwemveliso endaweni yokuphinda amaphepha e-Test Handler, isakhiwo somatshini okanye iipakeji ze-IC.
Amagama adla ngokudibana. Umphathi wovavanyo usetyenziselwa ngokukodwa ukwenza imbonakalo yesixhobo ibe ngokuzenzekelayo, ulawulo lobushushu kunye nokwahlula-hlula uvavanyo lokugqibela lombane. Umphathi we-chip ye-semiconductor gama elibanzi unokusetyenziselwa amaqonga adibanisa uthutho kunye nokuhlolwa kombono, ukumakisha, ukupakisha okanye eminye imisebenzi yokugqiba. Uluhlu lwesitishi sokwenyani kufuneka luhlolwe kumatshini ngamnye.
Amanye amaqonga enzelwe ii-IC ezipakishwe nge-singular, ngelixa amanye anokukhetha i-diced die ngqo kwifreyimu yefilimu okanye aphathe iipakethe ezithambileyo ze-wafer-level. Ukufaneleka kuxhomekeke kwindlela yokuthathwa, inkxaso yesixhobo, i-ejector, umbono, amandla okuphatha kunye nemidiya yokuphuma.
Iifomathi ezinokwenzeka ziquka iitreyi, iityhubhu, imicu, iithwali, iifreyimu zefilimu, izitya, iteyiphu kunye nereyile, iiwafer ezakhiwe ngokutsha kunye neebhini ezininzi zokuhlunga. Akukho matshini kufuneka ucinge ukuba uxhasa zonke iifomathi ngaphandle kokuqinisekisa iimodyuli ezifakiweyo kunye neekhithi zokuguqula.
Izizathu eziqhelekileyo ziquka amandla okuthatha angafanelekanga, imilomo okanye iindlwane ezigugileyo, i-vacuum engalunganga, i-warpage yesixhobo, i-optics engcolisiweyo, intshukumo engazinzile, ukukhanya okungekho semgangathweni, idatha yeresiphi engalunganga kunye nezixhobo zokuguqula ezingahambelaniyo.
Ihlala injalo, kodwa ukuguqulwa kunokufuna iintloko ezintsha zokukhetha, ii-nozzles, iindlwane, ii-feeders, iitreyi, izikhokelo, izixhobo zoqhagamshelwano, iikhamera, isoftware okanye iimodyuli zokukhupha. Ixabiso lokuguqulwa kufuneka lihlolwe ngaphambi kokuba umatshini uthengwe.
Thumela umzobo wesixhobo okanye ubungakanani bephakheji, imidiya yokuqalisa, imisebenzi efunekayo, imidiya yokukhupha, imfuneko yomvavanyi okanye yokuhlolwa, uluhlu lobushushu, injongo yokukhupha, imeko ekhethwayo, ubungakanani kunye nendawo ekuyiwa kuyo.
Yabelana ngesixhobo, imidiya engenayo, izikhululo zokuhlola okanye zokuvavanya ezifunekayo, ifomathi yemveliso, injongo yokudlulisa kunye nendawo ekuyiwa kuyo. Siza kujonga izixhobo zokuphatha iitshiphusi ze-semiconductor ezikhoyo kunye nomsebenzi wokuguqula onokuthi ufuneke.
Kutheni abantu abaninzi bekhetha ukusebenza ngeGeekValue?
Uphawu lwethu lusasazeka ukusuka kwisixeko ukuya kwisixeko, kwaye abantu abangenakubalwa bandibuze, "Yintoni iGeekValue?" Ivela kumbono olula: ukuxhobisa ukusungulwa kweTshayina ngetekhnoloji ye-cutting-edge. Lo ngumoya wokuziphucula okuqhubekayo, ofihliweyo ekusukeleni kwethu iinkcukacha ezingayekiyo kunye nolonwabo lokugqithisa ebesikulindele ngalo lonke unikezelo. Obu buchule bobugcisa obuphantse bugqithise kunye nokuzinikela akukona nje ukuzingisa kwabaseki bethu, kodwa kunye nokubaluleka kunye nokufudumala kwe-brand yethu. Siyathemba ukuba uza kuqala apha kwaye usinike ithuba lokudala imfezeko. Masisebenze kunye ukwenza ummangaliso olandelayo othi "zero defect".
IinkcukachaQhagamshelana nengcali yokuthengisa
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