asm ಸಿಪ್ಲೇಸ್ smt ಪ್ಲೇಸ್‌ಮೆಂಟ್ ಮೆಷಿನ್ x4s

SIPLACE X4S is an ultra-high-speed modular placement machine launched by ASM Assembly Systems (formerly Siemens Electronics Assembly Division). It is one of the flagship models of the SIPLACE X series. It focuses on ultra-high speed, high precision and intelligent production. It is suitable for large-scale and high-complexity electronic manufacturing fields, such as 5G communications, automotive electronics, high-end consumer electronics, etc.

2. Market positioning and core advantages

1. ಮಾರುಕಟ್ಟೆ ಸ್ಥಾನೀಕರಣ

Target industries:

Large-scale PCB assembly (such as server motherboards, smart phones).

High-precision demand fields (such as automotive radars, medical equipment).

ಅನ್ವಯಿಸುವ ಸನ್ನಿವೇಶಗಳು:

Massive production (>1 million points/day).

High-mix production (mixed placement of 01005 to large special-shaped components).

2. ಪ್ರಮುಖ ಅನುಕೂಲಗಳು

Ultra-high-speed placement: theoretical speed >150,000 CPH (configuration dependent).

Extreme precision: repeatability ±15μm @3σ, supporting 01005, 0.25mm pitch QFN.

Intelligent production: integrated with ASM OMS (Optimized Manufacturing Suite), supporting Industry 4.0.

Modular expansion: can be matched with multiple cantilevers and dual tracks to achieve parallel placement.

III. Hardware configuration and technical features

1. Placement system

Placement head:

SpeedStar head: specially designed for high-speed small components (such as 0402, 01005).

MultiStar head: supports special-shaped components (such as shielding covers, connectors).

ForceStar head: with pressure feedback to prevent component damage.

Cantilever configuration: optional 4 cantilevers (4D configuration), synchronous placement to improve efficiency.

2. Motion system

Linear motor drive: acceleration >5 m/s², reduce vibration.

High-rigidity gantry structure: ensure long-term stability (MTBF >10,000 hours).

3. Vision system

12MP HD camera: supports multi-spectral lighting (red, blue, infrared).

3D laser detection: used for component coplanarity measurement (such as BGA, QFN).

On-the-fly vision: dynamic correction, no need to stop the board.

4. Feeding system

Smart Feeder:

Dual-track design, no stopping for material change.

RFID automatically identifies tray information.

Material station capacity: supports up to 300+ 8mm belt feeders.

5. Substrate processing

PCB size range: 50mm × 50mm ~ 510mm × 460mm.

Dual-track option: supports dual-board synchronous transmission, increasing production capacity by 30%.

4. Software and intelligent functions

1. Control software

SIPLACE Pro:

Graphical programming, support CAD import (such as Gerber, Excel).

Real-time monitoring of placement quality (SPC data statistics).

2. ASM OMS (Optimized Manufacturing Suite)

Smart optimization: automatically assign placement tasks and reduce cantilever waiting time.

Predictive maintenance: Analyze equipment status through machine learning and warn of faults in advance.

Digital twin: Virtual commissioning to reduce production line downtime.

3. Industry 4.0 integration

SECS/GEM protocol: Seamless connection with MES/ERP system.

Remote diagnosis: ASM Cloud Support real-time remote troubleshooting.

5. Performance parameters (specification table)

Parameters X4S Specifications

Maximum placement speed >150,000 CPH (4-cantilever configuration)

Placement accuracy ±15μm @3σ

Component range 01005 ~ 150mm × 50mm

Feeder capacity 300+ (8mm tape)

ತಲಾಧಾರದ ಗಾತ್ರ 50mm × 50mm ~ 510mm × 460mm

Vision system 12MP + 3D laser

Power requirements Three-phase AC 400V, 15kVA

6. ವಿಶಿಷ್ಟ ಅಪ್ಲಿಕೇಶನ್ ಸನ್ನಿವೇಶಗಳು

5G communication module: high-density PCB (0.3mm pitch BGA).

Automotive electronics: radar board (3D coplanarity detection required).

Smartphone: high-speed placement of 01005 components.

Server motherboard: mixed placement of large BGA and tiny capacitors.

VII. ಸಾಮಾನ್ಯ ದೋಷಗಳು ಮತ್ತು ನಿರ್ವಹಣಾ ವಿಚಾರಗಳು

1. ಆರೋಹಿಸುವಾಗ ಆಫ್‌ಸೆಟ್

Reason: visual calibration deviation, nozzle wear, inaccurate PCB positioning.

ಪರಿಹಾರ:

Clean the camera lens and recalibrate.

Check the nozzle vacuum value (standard>90kPa).

2. High throwing rate

Reason: Feeder step error, vacuum leakage, component recognition failure.

ಪರಿಹಾರ:

Clean the feeder gear and adjust the stepper motor.

Optimize lighting parameters (such as adding infrared light).

3. Servo alarm (Axis Error)

Reason: Motor overload, encoder failure, mechanical jamming.

ಪರಿಹಾರ:

Check the lubrication of the guide rail.

Restart the drive and observe the error code.

4. ಫೀಡರ್ ಆಹಾರವನ್ನು ನೀಡುವುದಿಲ್ಲ

Reason: The material belt is stuck, the sensor is dirty, and the electrical fault.

ಪರಿಹಾರ:

Manually pull the material to eliminate the jam.

Replace the feeder signal line.

8. Maintenance and care strategy

1. ದೈನಂದಿನ ನಿರ್ವಹಣೆ

Daily: clean the nozzle and check the vacuum filter.

Weekly: lubricate the linear guide and calibrate the feeder.

2. Regular calibration

ಮಾಸಿಕ:

Visual system calibration (using standard calibration board).

ಪ್ಲೇಸ್‌ಮೆಂಟ್ ಹೆಡ್‌ನ Z- ಅಕ್ಷದ ಒತ್ತಡವನ್ನು ಪರಿಶೀಲಿಸಿ.

3. Key spare parts

ನಳಿಕೆ (01005/0402 ಗಾಗಿ ವಿಶೇಷ).

ನಿರ್ವಾತ ಜನರೇಟರ್.

Feeder motor.

9. ಸಾರಾಂಶ

ASM SIPLACE X4S is an ultra-high-speed placement machine for high-end electronic manufacturing. With a speed of 150,000 CPH, an accuracy of ±15μm and intelligent software, it has become a benchmark equipment for mass production. Its modular design can flexibly respond to different product requirements, and Industry 4.0 integration helps enterprises achieve digital upgrades.

Suggestions:

Contact our technical support first for complex faults.

Regularly back up machine parameters to avoid data loss.

For more detailed information, refer to the SIPLACE X4S Technical Manual or get remote support via ASM Live Expert.